KR20020030184A - Equpimnet for fabricating semiconductor device - Google Patents

Abstract

PURPOSE: Equipment for fabricating a semiconductor is provided to minimize damage to the equipment, by preventing a fluid from rapidly flowing when a pipe switches over from an open state to a close state or from a close state to an open state. CONSTITUTION: A predetermined semiconductor process is performed in a process unit. A fluid flow generating unit generates flow of the fluid from the process unit. The pipe(200) connects the fluid flow generating unit with the process unit. At least two valve plates(423,433) are coupled to a valve body(410) by using a rotation axis as a medium. A valve plate opening/closing unit opens/closes the respective valve plates at different rates. A dual valve unit(400) includes the valve body and the valve plate opening/closing unit on the pipe.

Description

Semiconductor manufacturing equipment {Equpimnet for fabricating semiconductor device}

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a semiconductor manufacturing facility. In particular, when the inside of a pipe connected to a vacuum chamber and a process chamber through which a semiconductor manufacturing process is performed is switched from a closed state to an open state, a double fluid that prevents rapid fluid flow from occurring inside the pipe A semiconductor manufacturing facility having a valve unit.

In recent years, semiconductor products, which have been rapidly developed, are being developed in a highly integrated and high performance direction in which the number of integrated devices per unit area and the number of data that can be processed per unit time are increased.

Therefore, in order to produce such a high-density, high-performance semiconductor product, special conditions, such as high temperature, low pressure, as well as natural conditions, as well as chemicals having inherent properties are used.

In particular, in order to ensure that only the material used in the actual semiconductor manufacturing process among these conditions exists in a predetermined pattern form on the wafer, which is the parent material of the semiconductor product, most semiconductor products are completely discharged by the low pressure process environment and then actually The semiconductor process is performed.

This low pressure process environment is achieved by communicating the piping to the process chamber where the semiconductor process is directly performed and connecting an ultra-high vacuum pump to the piping.

At this time, in order to selectively open and close the pipe, a valve is installed on the pipe corresponding between the process chamber and the ultra-high vacuum pump.

However, when the valve for opening or closing the pipe is switched from the open state to the closed state, and the switch state from the closed state to the open state, the flow of the fluid is generated rapidly, which acts as a factor that puts a large load on the ultra-high vacuum pump.

Accordingly, the present invention has been made in view of such a conventional problem, and an object of the present invention is to improve the structure of a valve formed on a pipe connecting a process chamber and a vacuum pump so that rapid fluid flow in the pipe when opening or closing the valve is prevented. To minimize it.

Other objects of the present invention will become more apparent from the following detailed description of the invention.

1 is a conceptual diagram of a semiconductor manufacturing facility to which a double valve unit according to the present invention is applied.

2 is a partial cutaway perspective view of a double valve unit according to the present invention;

The semiconductor manufacturing equipment for realizing the object of the present invention comprises a process unit for performing a predetermined semiconductor process, a fluid flow generating means for generating a flow of fluid from the process unit, a pipe connecting the fluid flow generating means and the process unit And a double valve unit including a valve body having at least two or more valve plates coupled to each other via a rotating shaft, and valve plate opening / closing means for allowing each valve plate to open and close at different speeds. do.

Hereinafter, a preferred embodiment of a semiconductor manufacturing apparatus according to the present invention will be described with reference to the accompanying drawings.

1, an embodiment of a semiconductor manufacturing apparatus according to the present invention is shown.

Referring to FIG. 1, the semiconductor manufacturing equipment 500 according to the present invention is generally composed of a process chamber 100, a pipe 200, a vacuum pump 300, and a double valve unit 400 which is an essential part of the present invention. do.

When the coupling relationship thereof is described in more detail, the process chamber 100 performs a predetermined semiconductor process that proceeds in a low pressure environment, and an exhaust port 10 is installed in the process chamber 100, and the exhaust port 10 is provided. One end of the pipe 200 having a predetermined diameter is connected to the other end, and a vacuum pump 300 is installed at the other end of the exhaust port 10 so that the inside of the process chamber 100 has an ultra-vacuum pressure.

In this case, the double valve unit 400 is installed on the pipe 200 corresponding to the space between the process chamber 100 and the vacuum pump 300, and the double valve unit 400 will be described with reference to FIG. 2. As follows.

The dual valve unit 400 includes a tubular valve body 410, at least one valve unit, and a valve drive 440.

In the present invention, two valve units are used as preferred embodiments, and these will be defined as first valve units 420 and second valve units 430, respectively.

More specifically, the valve body 410 has a cylindrical shape in which both ends are open in a cylindrical shape, and the first valve unit 420 and the second valve unit 430 are coupled to both ends of the valve body 410.

The first valve unit 420 rotates through a first valve body 421 having a ring shape, a first rotating shaft 422 passing through the first valve body 421, and a first rotating shaft 422. The valve body 421 includes a first valve plate 423 to be in an open and closed state.

Like the first valve unit 420, the second valve unit 430 includes a second valve body 431 having a ring shape, a second rotation shaft 432 passing through the second valve body 431, and a second rotation shaft ( And a second valve plate 433 which allows the second valve body 431 to be in an open or closed state while rotating through the 432.

The end and the second valve of the first rotary shaft 422 of the first valve unit 420 in a state where the first valve unit 420 and the second valve unit 430 having such a configuration are installed in the valve body 410 The valve driving device 440 is installed at the end of the second rotation shaft 432 of the unit 430.

The valve driving device 440 is again connected to the first gear 441, the second gear 442, the first gear 441 and the second gear coupled to the second rotation shaft 432. The drive device 445 which rotates any one of the intermediate gear 443, the 1st gear 441, or the 2nd gear 442 which makes the rotation direction of 442 the same is comprised.

More specifically, the number of teeth of the first gear 441 and the second gear 442 is different, so that the number of teeth of the second gear 442 is greater than the number of teeth of the first gear 441.

As a result, a difference occurs in the rotation angles of the first rotation shaft 422 and the second rotation shaft 432, and thus the rotation angles of the first valve plate 423 and the second plate 433 are different.

In the present invention, when the first valve plate 423 rotates by 2 °, the second valve plate 433 is rotated by 1 °.

In order to implement this, all of the first gear 441-the intermediate gear 443-the second gear 442 having tooth number differences are gear-coupled, and in the present invention, the second gear 442 is coupled to the second gear 442 in a preferred embodiment. The shaft of the motor that is the driving device 445 is coupled to the second rotating shaft 432.

Thereafter, both the first valve unit 420 and the second valve unit 430 of the double valve unit 400 according to the present invention are coupled to both ends of the pipe 200 via a screw or the like.

The dual valve unit 400 configured as described above has a second gear (when the second valve plate 433 is rotated by a predetermined angle while power is applied to the motor and the second rotation shaft 432 and the second gear 442 are rotated. 442, the first valve plate 423 rotated in dependence on the first gear 441 by the intermediate gear 443 is rotated only about 1/2 of the rotation angle of the second valve plate 433. The flow of the fluid passing through the double valve unit 400 according to the present invention is not suddenly made.

As described in detail above, it is possible to prevent the rapid flow of fluid generated when the pipe is switched from the open state to the closed state and from the closed state to the open state, thereby minimizing equipment damage and equipment damage.

Claims (2)

A process unit for performing a predetermined semiconductor process; Fluid flow generating means for generating a flow of fluid from the process unit; A pipe connecting the fluid flow generating means and the process unit, On the pipe A double valve unit comprising a valve body having at least two valve plates coupled via a rotating shaft, and valve plate opening / closing means for allowing each of the valve plates to open and close at different speeds. The method of claim 1 wherein said valve plate opening / closing means Gears having different tooth ratios respectively coupled to the rotational shafts and tooth-coupled to each other; Semiconductor manufacturing equipment comprising a drive means for rotating the rotating shaft.