KR20020022079A - Electrical-mechanical connection between electronic circuit systems and substrates and method for the production thereof - Google Patents

Abstract

The present invention relates to an electromechanical connection between an electronic circuit system and a substrate and a method of manufacturing the connection. According to the invention, the electronic circuit system 10 and the substrate 20 are mechanically fixedly connected to each other at an electromechanical connection between the electronic circuit system 10 and the substrate 20, and the electronic circuit system 10 and the substrate ( The electrical connection elements 11, 21 provided above 20 are conductively connected by microcapsules 23-1, 23-2, and the microcapsules 23-1, 23-2 are connected to the dielectric 23-2. Conductive between the microcapsules 23-1 and 23-2 formed of coated at least partially conductive particles 23-1 and comprising the exploded dielectric 23-2 and the electrical connection elements 11 and 21. Solder joints 25 to 28 are provided.

Description

ELECTRICAL-MECHANICAL CONNECTION BETWEEN ELECTRONIC CIRCUIT SYSTEMS AND SUBSTRATES AND METHOD FOR THE PRODUCTION THEREOF}

In the scope of the present invention, an electronic circuit system is understood to be a solid state circuit system, in particular an integrated semiconductor circuit. In particular, the concept of a system in an integrated semiconductor circuit refers to a semiconductor material body including electronic circuit functional elements such as transistors, diodes, capacitors, etc., and metal conductor tracks and connecting elements connecting circuit functional elements present on the semiconductor material body.

The connection elements can be planar metal applications such as so-called pads or spherical metal elements such as so-called bumps.

In the context of the present invention, a substrate is understood to be a circuit plate, such as a printed circuit or a printed circuit board. Such a substrate also has connection elements of the type mentioned above, generally in the form of a pad.

It is known that electromechanical connections of the type to be discussed are made by adhesives containing conductive particles. Such an electromechanical connection is illustrated by FIG. 1 below.

1 schematically illustrates an integrated semiconductor circuit that is electromechanically connected to an electronic circuit system 10, for example, a substrate 20, such as a printed circuit board. Connection elements in the form of pads are provided on the circuit system 10, and connection elements 21 in the form of pads are likewise provided on the substrate 20.

The circuit system 10 and the substrate 20 are, by so-called flip chip techniques, so that the pads 11 and 21 face each other by the adhesives 24, which are shown in dashed lines, containing the conductive particles 22 and 23. Are connected to each other. The adhesive 24 is, for example, a polymer, and the conductive particles may be made of silver.

In the connection of the type mentioned above, the conductive particles labeled 22 are provided in the transverse gap between the pads 11 and 21 and the conductive particles labeled 23 are provided in the longitudinal gap between the pads 11 and 21 facing each other.

By compressing the circuit system 10 and the substrate 20, the conductive particles 23 between the pads 11 and 21 facing each other come together with the pads 11 and 21 into the conductive contact so that the circuit system 10 and Electrical connections between the substrates 20 can be made. In contrast, since the conductive particles 22 in the transverse gap between the pads 11 and 21 do not reach into the conductive connection with the pads 11 and 21, no short circuit connection is generated between the pads in this respect. Do not. The electrical connection of the type described is not made in the vertical direction by the conductive particles 22 between the pads 11 and 21 facing each other, but the conductive particles 22 in the transverse gap between the pads 11 and 21 are produced. ) Is anisotropically conducted when the conductive connection is made in the horizontal direction.

In order to show that the conductive particles 23 between the pads 11 and 21 facing each other can deform when compressed, the pads 11 and 21 are schematically shown as elliptical, transversely between the pads 11 and 21. Particles 22 in the directional gap are shown schematically circularly as they remain undeformed.

The following conditions must be met for reliable operation at the electromechanical connections of the type described above.

First, in order to ensure continuous compression and reliable mechanical connection of the circuit system 10 and the substrate 11, the adhesive 24 must be set to exhibit a sufficiently high retraction force when the circuit system 10 and the substrate 20 are operated. do. However, since the adhesive generally does not have good properties in adhesion and moisture resistance, such a connection is not so sure. This is particularly manifest during heat exchange loads for high shear forces in the adhesive joint, whereby the adhesive can burst and the electrical connection through the conductive particles 23 can be interrupted. Moisture permeated into the joint may also separate the entire area of the circuit system 10 from the substrate 20 upon heating. These disadvantages are opposed to the advantage that the adhesive does not need to be structured.

Second, on the one hand, the filling rate of the conductive particles 22 in the adhesive 24 must be large enough to ensure that at least one conductive particle 23 is present to ensure the conductive connection between the pads 11 and 21 facing each other. . On the other hand, the filling rate should not be so high that there is a risk of causing electrical shorts by the conductive particles 22 in the directional gap between the pads 11, 21.

As the integration rate increases, the conductive structure becomes smaller and the gap between the conductive structure and the structure provided in the substrate provided in the integrated semiconductor circuit and the substrate matched to the semiconductor circuit and connected to a circuit, such as a printed circuit board, for example, becomes smaller. The problems mentioned become more and more difficult.

In order to solve this problem, microcapsules embedded in an adhesive are used, and it is known that the microcapsule is made of conductive particles and a dielectric in the form of, for example, an insulating plastic surrounding the conductive particles, "Flip Chip Technologies", John H. Lau, McGraw-Hill 1996, pages 289-299. Such microcapsules made of conductive particles 22-1 (or 23-1) and dielectric 22-2 (or 23-2) surrounding the conductive particles 22-1 (or 23-1). Is shown enlarged in FIG.

Even in the electromechanical connection when using conductive particles surrounded by a dielectric provided in the adhesive, the circuit system 10 and the substrate 20 are compressed according to FIG. 1. Here, the microcapsules 23-1 and 23-2 between the pads 11 and 21 facing each other by the pressure generating the setting of the adhesive 24 are compressed, so that the dielectric 23-2 bursts and consequently the conductive particles. The conductive connection is produced by (23-1). This situation is schematically illustrated in the form of modified microcapsules 23-1, 23-2 between two pads 11, 21 in FIG. 3.

Even in such an electromechanical connection made by a microcapsule of the type described above, an electrical short circuit occurs in the transverse direction across the microcapsules 22-1 and 22-2 present in the transverse gap between the pads 11 and 21. Problems that arise are practically eliminated. However, the problems associated with the adhesives described above still remain.

The present invention relates to an electromechanical connection between an electronic circuit system according to the preamble of claim 1 and a substrate and to a method of manufacturing the connection according to claim 31.

1 to 3 are the known embodiments mentioned above,

4 is a schematic view of an electromechanical connection for explaining an embodiment according to the present invention.

It is an object of the present invention to provide an electromechanical connection of the type to be discussed, which is electromechanically stable and also resistant to electrical shorts, even in fine conductive structures provided on electronic circuit systems and substrates.

This object is achieved by an electromechanical connection made by a process according to the features of claim 1 according to the invention.

The method for producing an electromechanical connection according to the invention is characterized by the treatment of claim 31.

Improvements to the electromechanical connections according to the invention and to the method according to the invention are the subject of the corresponding dependent claims.

The invention is explained in more detail by the examples which follow in conjunction with the drawings.

The core of the present invention is that a metal solder joint is produced at least at the point of electrical connection to the compression connection for carrying out the electrical connection between the electronic circuit system and the substrate.

In FIG. 4, the same elements as in FIGS. 1 to 3 have the same reference numerals according to the embodiment of the present invention.

As already explained by FIG. 1, the arrangement according to FIG. 4 likewise exhibits an electromechanical connection between an electronic circuit system 10, for example an integrated semiconductor circuit system, and a substrate 20, for example a printed electrical circuit board. The electronic circuit system 10 and the substrate 20 again have connection elements in the form of pads 11 and 21.

The pure mechanical connection is made by an adhesive 24, for example a polymer, shown in dashed lines, but in the adhesive 24 is not purely mechanically conductive particles 22, 23 as in the known embodiment according to FIG. Microcapsules 22-1, 22-2, 23-1, 23-2 suitable for the soldering process are embedded. Examples of such microcapsules are described in more detail below.

It will be appreciated that the present invention is not limited to embodiments that include an adhesive 24 to effect pure mechanical connection of the electronic circuit system 10 and the substrate 20. Embodiments in which a connection is made by a soldering process executed without adhesive are also possible, which are described more precisely below. This can be done by the pads 11, 21 which are inactive for the intended operation of the electronic circuit system 10 and the substrate. In this regard, the concept of "inactive" means that the pad is not electrically connected within the electronic circuit system 10 or to the electronic functional elements provided on or in the substrate 20.

In the following a first embodiment of a solder joint in the sense according to the invention is described.

In this embodiment the microcapsule consists of conductive particles 22-1, 23-1 covered with dielectrics 22-2, 23-2, wherein the conductive particles 22-1, 23-1 are copper, It may consist of an insulator such as tin oxide covered with silver, which is a metal or a conductive metal selected from the group consisting of nickel, silver, gold, a solderable metal alloy. Methods of making microcapsules of the type mentioned later are known, for example, from JOURNAL OF MATERIALS SCIENCE 28 (1993), pages 5207-5210.

As the dielectrics 22-2 and 23-2, an insulating enamel that can also function as a solder liquefaction agent can be used.

Solder layers 25 and 27 are provided on the pads 11 and 21 to realize conductive connection between the electronic circuit system 10 and the substrate 20 in the soldering process, and the solder layers 25 and 27 are formed of tin. Metals selected from the group consisting of indium, gallium or metal alloys with low melting points can be used. The solder layers 25 and 27 are preferably manufactured by selective electroless deposition on the pad side, whereby a sufficiently flat surface can be produced.

The microcapsules 22-1, 22-2, 23-1, and 23-2 embedded in the adhesive 24 by the method according to the invention or into the polymer film not shown in FIG. 4 are produced by the electronic circuit system 10. And the dielectric 23-2 of the microcapsules 23-1 and 23-2 present between the pads 11 and 21 facing each other, are compressed so as to burst. This arrangement is compressed and then heated at a temperature higher than the melting temperature of the solder material of the solder layers 25, 27. Here, the molten solder is in contact with the material of the conductive particles 23-1 of the microcapsules 23-1 and 23-2, and a highly conductive metal connection is produced.

Since the microcapsules 22-1 and 22-2 provided in the transverse gap between the pads 11 and 21 are not affected by the compression process, the dielectric 22-2 thereof remains intact, thereby Directional short circuits are avoided. Thus, the electromechanical connections according to the invention are anisotropically conductive in the sense mentioned above.

Particular preference is given to using a diffusion soldering method when soldering. In this method, a metal junction with high temperature resistance is produced by solder having a low melting point, wherein the solder metal is resistant to high temperature by a metal to be connected having a high melting point and mechanically very stable intermetallic phase. to form an intermetallic phase. Here, the solder metal having a low melting point is completely converted, that is, completely converted to an intermetallic phase. Such a soldering method is known, for example, from US-PS 5 053 195.

In this way the solder layers 25 and 27 have a thickness of 10 μm, preferably less than 10 μm. The solder layers 25, 27 are made of tin, for example. The metal layer of particles in the form of conductive particles 23-1 or metal deposited insulators, and in some cases the pads 11 and 21, for example, consists of copper or nickel. During the diffusion soldering process, the tin is completely converted into an intermetallic phase upon contact between the grain metals, which are denoted by reference numerals 26 and 28 in FIG. 4. As already explained, the connections produced at this time have a higher melting point than the solder metal and have improved mechanical properties such as high tensile strength and creep resistance.

In a refinement of the invention, an important point in such a soldering process is that a single layer microcapsule layer is present between the pads 11 and 21 and the pad top surface is sufficiently flat. Then, all the microcapsules 23-1 and 23-2 present between the pads 11 and 21 facing each other are compressed to thereby form conductive particles 23-of the microcapsules 23-1 and 23-2. 2) or the conductive portion is in contact with the solder metal.

The monolayer structure can be realized particularly well if the microcapsules 22-1, 22-2, 23-1, 23-2 have already been embedded into the polymer film-as already described. Individual structures and methods of making such films in which microcapsules are embedded are known, for example, from "IEEE", 1992, 473-480, and pages 487-491. Such a film ensures the horizontal insulation of the microcapsules 22-1, 22-2, 23-1, and 23-2 and functions as a spacer. Shaped parts matching the face to be connected can be manufactured. Then, the adhesive 24 may be omitted in some cases.

It will be mentioned once again that the embodiment described above is not explicitly shown in FIG. 4. In addition, the solder joint between the pads 11 and 21 and the microcapsules 23-1 and 23-2, which are inactive in the above-mentioned sense when no adhesive 24 is present, is not clearly shown in FIG. However, in FIG. 4, for example, both pads 11, 21 on the right side of the figure may be considered "inactive" pads, and both pads 11, 21 on the left side may be considered "active" pads.

In a further embodiment of the invention microcapsules 22-1, 22-2, 23-1, 23-2, which are at least partially made of solder metal, may be used.

According to a variation of this embodiment, the conductive particles 22-1 and 23-1 are made entirely of solder metal, and a solder metal or soft solder alloy selected from the group consisting of tin, indium and gallium is used. Can be. Then, as a material for the pads 11 and 21 of the electromagnet circuit system 10 and the substrate 20, a solderable metal such as a metal selected from the group consisting of copper, nickel, silver and gold is used. Here, the solder layers 25 and 27 provided on the pads 11 and 21 may be omitted.

The conductive particles 22-1, 23-1 of the microcapsules 22-1, 22-2, 23-1, 23-2 are also dielectrics 22-2, 23- in the form of an insulating enamel layer in this embodiment. 2) surrounded by The insulating enamel layer is soldered in particular by the conductive particles 22-1 provided in the transverse gap between the electronic circuit system 10 and the pads 11 and 21 of the substrate 20 as well as the transverse insulating action described above. It prevents fusion when heated during the process, and thus shorts in the transverse direction.

Since the solder material of the conductive particles 23-1, 23-2 of the microcapsules 22-1, 22-2, 23-1, 23-2 flows during the soldering process, the insulating enamel layer is easily broken, The high pressure as in the first embodiment of the microcapsules mentioned above is not required when this insulating enamel layer bursts between the facing pads 11 and 21. Solder joints and electromechanical contacts are created when the solder material is in contact with the material of the pads 11, 21.

Since the microcapsules 22-1 and 22-2 provided in the transverse gaps between the pads are not compressed, its insulating enamel layer 22-2 remains intact. Such microcapsules are bound by the adhesive 24 in the use of adhesive 24 or by the polymer membrane when embedded into the polymer membrane in the sense described above. At this time, the microcapsules cannot flow out.

Therefore, the diffusion soldering method described above is particularly preferable even in this embodiment. Here, the conductive particles 22-1, 23-1 of the microcapsules 22-1, 22-2, 23-1, 23-2 may be made of, for example, tin and the electronic circuit system 10 and the substrate 20. Pads 11 and 21 may be made of copper or nickel. When the conductive particles of the microcapsules have a diameter smaller than 10 μm, the tin is completely converted into the intermetallic phases 26 and 28 upon contact of the solder metal and the pad metal. Again an electromechanical connection is produced which has a much higher melting point than the melting point of the solder metal and special mechanical properties such as high tensile strength and creep resistance.

On many grounds small size conductive particles having a diameter of less than 10 μm, preferably less than 10 μm, are preferred.

First, the process of chemical conversion when diffusion soldering takes place, the thicker the conductive particles, the longer. For example, at a diameter of 40 μm, the reaction lasts for 30 minutes. Reaction times at diameters smaller than 10 μm occur in approximately a few minutes.

Second, the pads 11 and 21 must be thick enough to allow sufficient metal to be supplied for the conversion reaction. Since relatively few solder metals can be used in the conductive particles having the desired diameter, correspondingly less pad metal needs to be used for complete conversion.

Third, the small diameter of the conductive particles is advantageous for the contact of the microstructure, which provides particular advantages for integrated semiconductor circuits having a high integration rate.

Fourth, the diameter of the conductive particles determines the thickness of the braze joint. Thin solder joints have improved fracture properties. At thicknesses less than 5 μm, the joints are elastic when wheeling, and when they are larger than 10 μm, they are brittle, so stress cracking can easily occur.

In a variant of the embodiment described above, the conductive particles 22-1, 22-2 of the microcapsules 22-1, 22-2, 23-1, 23-2 are not entirely made of a solder material, but are solder materials. It can be made of a metal core covered by. It may be for example a copper core covered by a tin solder layer. When the tin solder layer is electrolessly deposited in a tin-exchange bath, the top layer of the copper core is replaced with a corresponding thin tin layer. Typical thickness of the tin layer is 200 nm.

The use of conductive particles of this type for use in the electromechanical connection of objects is known, for example, from "Electronic Components and Technology Conference", 1996, pages 565-570. The document describes a conductive adhesive powder consisting of a conductive filler powder covered with a low melting point metal (solder metal), a thermoplastic polymer plastic, and a small amount of additional organic additives. Here, the filler particles are coated with a metal having a low melting point when the connection between objects is made, and the metal is melted on the object to be connected to realize metallurgical connection between adjacent filler particles and between the filler particles and the metal connecting element. . This connection corresponds to the arrangement according to FIG. 1. Here too, the problems described above, namely, the problems related to the filling rate of the adhesive particles and the conductive particles formed from the polymer plastics, appear.

As in the two embodiments described above, these conductive particles 22-1 and 22-2 are covered by dielectrics 22-2 and 23-2 provided in the form of insulating enamel layers. It will be mentioned that the fact that the conductive particles can be formed in two parts is not clearly shown in FIGS.

The advantage of the conductive particles 22-1, 23-1 provided in the form of a metal core covered with solder metal is that the soldering process, preferably in the form of a diffusion soldering process, is carried out very quickly and accurately due to the very thin solder layer as a whole. There is. An additional advantage is that even in microcapsules 22-1, 22-2, which are not in contact with the pads 11, 21, provided in the transverse gap between the pads 11, 21, the solder reacts to the core metal and the intermetallic phase is present. Is converted to. Thus, these microcapsules are stable to temperatures higher than the melting temperature of the solder. This is because the microcapsules can no longer be liquefied.

The thickness of the pads 11 and 21 can also be reduced because of the small thickness of the solder layer of conductive particles and the resulting relatively small amount of solder metal. This is because a correspondingly small amount of pad material is required to completely convert the amount of solder. An additional cause for the thickness of the solder layer to be small is that the pads should no longer be raised because the solder of the conductive particles can no longer "flow" when the insulating enamel layer bursts. At this time, the solder adheres to the metal core surface when the wet state of the metal core surface is good because of the small layer thickness.

In view of the above, the transverse spaces between pads 11 and 21 in all microcapsules 22-1, 22-2, 23-1 and 23-2, and between opposite pads at the operating temperature of the device Within the directional gap, liquid solder causing short circuits can no longer be formed.

Electromechanical contact with the pads 11, 21 is produced by the reaction of the solder of the conductive particles 23-1, 23-2 with the metal of the pads 11, 21.

In particular, conductive particles 22-1 and 23-1 made of solder metal and other metals and solder layers 25 and 27, provided on the pads 11 and 21, and conductive particles made of a metal core covered with a solder layer, An additional advantage in the incorporating embodiment is that in the diffusion soldering method, a particularly well controllable thin solder layer provided in the form of intermetallic phases 26, 28 can be produced.

In the above-described embodiment, the microcapsules 22-1, 22-2, 23-1, 23-2 are variations in which an insulating liquid such as the polymer 24 or the liquefiing agent mentioned in the polymer film is embedded. Apart from this, it can be treated as a paste. In the case of adhesives, the advantages of adhesive bonds and solder joints can be combined with each other. This adhesive bond ensures additional mechanical stability and solder joints of the safe electrical connections.

In summary, in the preferred diffusion soldering, the solder material as a thin layer provided over the microcapsule or electronic circuit system and the connecting element on the substrate is completely converted into an intermetallic phase, i.e., no residue of the solder material remains, It will be mentioned once again that a connection with creep resistance can thus be produced. This thin layer of solder material also ensures that the soldering process runs relatively quickly.

The high filling rate of the microcapsules also ensures good thermal conduction and safe electrical connection even when the size of the connection element structure is small, and because of the mechanical solder joints by the soldered microcapsules-a much safer mechanical connection than a pure adhesive bond. Guaranteed.

Finally, the stability of the electromechanical connections is ensured, since the connection process can be formed so that the insulating residue, which consists entirely of metal oxide, glass or ceramic or binder, does not remain in the connection.

Claims (34)

The electronic circuit system 10 and the substrate 20 are mechanically fixed to each other, and the electrical connection elements 11 and 21 provided on the electronic circuit system 10 and the substrate 20 are microcapsules 23-1 and 23. -2), the microcapsules 23-1, 23-2 are formed of at least partially conductive particles 23-1 coated with a dielectric 23-2, and the microcapsules 23 Dielectrics 23-2 of -1, 23-2 are formed between the electronic circuit system 10 and the substrate 20, which are formed to burst by mechanical pressure to at least partially expose the conductive particles 23-1. In the mechanical connection, A conductive solder joint 25 to 28 is provided between the microcapsules 23-1 and 23-2 and the conductive connecting elements 11 and 21 of the electronic circuit system 10 and the substrate 20. Electromechanical connections. The method of claim 1, Electromechanical connections, characterized in that the mechanically fixed connection between the electronic circuit system (10) and the substrate (20) is provided by an adhesive (24). The method according to claim 1 and 2, Electromechanical connection, characterized in that a polymer is used as the adhesive (24). The method according to any one of claims 1 to 3, And the microcapsule (23-1, 23-2) is embedded into the adhesive (24). The method of claim 1, The mechanically fixed connection between the electronic circuit system 10 and the substrate 20 is between the connection elements 11, 21 which are inactive with respect to the intended electronics operation of the electronic circuit system 10 and the substrate 20. An electromechanical connection, characterized in that it is formed from a soldered joint. The method according to any one of claims 1 to 5, As the microcapsules 23-1 and 23-2, conductive metal particles 23-1 selected from a metal group consisting of copper, nickel, silver and gold, covered with the dielectric 23-2, are used. Characterized by an electromechanical connection. The method according to any one of claims 1 to 5, Electromechanical connection, characterized in that as the microcapsules (23-1, 23-2), conductive metal particles (23-1) made of a solderable metal alloy covered with the dielectric (23-2) are used. The method according to any one of claims 1 to 5, The microcapsule (23-1, 23-2) is an electromechanical connection, characterized in that metal deposited insulating particles (23-1) covered with the dielectric (23-2) are used. The method of claim 8, Electro-mechanical connection portion, characterized in that the tin oxide particles plated with silver is used as the metal-deposited insulating particles (23-1). The method according to any one of claims 6 to 9, Insulation enamel is used as the dielectric (23-2) of the microcapsules (23-1, 23-2). The method of claim 10, The insulating enamel is an electromechanical connection, characterized in that a brazing liquefier is used. The method according to any one of claims 1 to 11, Under the formation of the intermetallic phases 26, 28 made of the material of the microcapsules 23-1, 23-2 and the conductive particles 23-1 of the solder layers 25, 27, the connection elements 11, 21 Conductive solder joints 25 to 28 are formed between the electronic circuit system 10 and the connection elements 11 and 21 of the substrate 20 by the soldering of the solder layers 25 and 27 provided above. Electromechanical connections. The method of claim 12, Electromechanical connection, characterized in that a metal selected from the group consisting of tin, indium and gallium is used as the material for the solder layer (25, 27). The method of claim 12, Electromechanical connection, characterized in that a metal alloy having a low melting point is used as the material for the solder layer (25, 27). The method according to claim 13 or 14, And the solder layers (25, 27) are alternately electrolessly deposited. The method according to any one of claims 1 to 15, As a material for the connection elements 11 and 21 of the electronic circuit system 10 and the substrate 20, matching with the metal material of the conductive particles 23-1 of the microcapsules 23-1 and 23-2. Electromechanical connection, characterized in that a metal material is used. The method of claim 16, Electromechanical connection, characterized in that copper or nickel is used as material for the connection element (11, 21). The method according to any one of claims 1 to 17, An electromechanical connection, characterized in that the same sized layer formed of a single layer embedded in a polymer film is provided, consisting of the microcapsules (23-1, 23-2). The method according to any one of claims 1 to 5, As the microcapsules 23-1 and 23-2, conductive metal particles 23-1 covered with insulating enamel 23-2 are used, and the metal particles 23-1 are at least partially solder metal. Electromechanical connection, characterized in that made. The method of claim 19, And the conductive particles (23-1) of the microcapsules (23-1, 23-2) are made entirely of solder metal. The method of claim 19 or 20, Electromechanical connection, characterized in that for the conductive particles (23-1) a solder metal selected from the group consisting of tin, indium and gallium is used. The method of claim 19 or 20, An electromechanical connection, characterized in that a solder alloy is used for the conductive particles (23-1). The method according to any one of claims 19 to 22, An electromechanical connection, characterized in that a solderable metal is used for the connection element (11, 21) of the electronic circuit system (10) and the substrate (20). The method of claim 23, wherein Electromechanical connection, characterized in that a metal selected from the group consisting of copper, nickel, silver and gold is used as the solderable metal for the connection element (11, 21). The method of claim 19, Electromechanical connection, characterized in that the conductive particles (23-1) of the microcapsules (23-1, 23-2) are formed of a conductive metal core covered with solder material. The method of claim 25, And the copper is used as the material for the conductive metal core. The method of claim 25, Electromechanical connection, characterized in that tin is used as the core covering solder material. The method according to any one of claims 1 to 27, Electromechanical connection, characterized in that the conductive particles (23-1) of the microcapsules (23-1, 23-2) have a diameter smaller than 10 mu m, preferably 10 mu m. The method of claim 27, And wherein said tin core covering has a thickness of 200 nm. The method of claim 1, wherein An electromechanical connection, characterized in that the solder layer provided on the connection element (11, 21) has a thickness of less than 10 mu m, preferably 10 mu m. In the method of manufacturing an electromechanical connection according to any one of claims 1 to 30, After inserting the microcapsules 23-1 and 23-2 embedded in the adhesive 24 or the polymer film between the electronic circuit system 10 and the substrate 20, between the connecting elements 11 and 21 facing each other. The dielectric 23-2 provided on the conductive particles 23-1 present in the ruptures so that the solder joints 25 to 28 between the microcapsules 23-1 and 23-2 are manufactured by diffusion soldering. Method for compressing the capsule (23-1, 23-2) strongly. The method of claim 31, wherein On the connection elements 11 and 21, the solder metal is completely metal during the diffusion soldering process performed between the conductive particles 23-1 or the metal of the particles 23-1, in the form of metal deposited insulators and solder metals. Providing a solder metal layer (25, 27) that is thick enough to be converted to an inter phase (26, 28). The method of claim 31, wherein When using microcapsules 23-1, 23-2 having conductive particles 23-1 made entirely of solder metal, and connecting elements having no solder metal provided on the electronic circuit system 10 and the substrate 20 When using (11, 21) the thickness of the connection element (11, 21) is selected such that sufficient material for the conversion process in diffusion soldering can be used. The method of claim 31, wherein Solder metal provided on the electronic circuit system 10 and the substrate 20 and when using the microcapsules 23-1, 23-2 having the conductive particles 23-1 made of a conductive metal core covered with solder metal. The thickness of the connecting elements 11 and 21 and the solder metal when using the connecting elements 11 and 21 which do not have a thickness thereof is determined in diffusion soldering for the conversion process between the connecting element material and the core metal including the solder metal. Selecting enough material.