KR20020009638A - Central processing unit cooler - Google Patents

Abstract

PURPOSE: A CPU cooler is provided to easily eliminate a heat generated from a CPU without a fan by using a multi step control method so that it can prevent a noise and simplify a structure. CONSTITUTION: The device comprises a condenser(1), a heat transfer block(33), a block fixture member(20), a fixture guide(21), a vacuum control valve, and a plurality of sensors. The condenser(1) transfers a heat, generated at a CPU, from a lower part to an upper part while evaporating inner fluid. The evaporated inner fluid falls at a bottom of the condenser if the heat transfer block(33) cools the upper part of the condenser(1). The vacuum control valve controls a vacuum degree within the condenser(1). The fixture guide(21) fixes the block fixture member(20) and a heat radiation fixture member. The sensors, installed at an upper cover of the condenser(1), senses a high temperature of the inner evaporated fluid.

Description

CIFRAL PROCESSING UNIT COOLER}

Due to the rapid development of the semiconductor industry, the prevalence of computers is also increasing rapidly. Personal computers (Personal Computers), starting with a variety of industrial computers, portable computers, PDAs.

Looking at the configuration of such a computer is divided into three. First input, second operation and third output. The input unit and output unit are variously developed and combined with various designs and image processing technologies, and the computing unit is composed of a CPU, a graphics card (VGA Card), and a motherboard (Main Board). As the performance of the computer is improved, a variety of technologies for the high speed processing of information have been developed and applied to the computational unit constituting the computer. In the early 1990s, the processing speed of the CPU was only a few hundred megahertz (MHz), but nowadays, a giga-GHz CPU is commercially available. This resulted in a growth rate of about 100 times based on processing speed alone.

As the processing speed of the CPU increases rapidly, the heat generated from the CPU causes a serious problem for the use of the computer. The general CPU is a semiconductor element, which is composed of silicon-based materials, and its operating temperature is determined to be 70 ~ 80 ℃. However, if the heat generated from a single CPU reaches 20 to 40 Watts and the cooling is not performed, the surface temperature of the CPU becomes overheated above 90 ° C, which causes the CPU to malfunction or become inoperable, making the computer impossible to operate. There was this.

In order to solve the above problems, devices introduced by using a fan or water or by mixing steam compression refrigeration cycles have been devised and used. However, such a device has a device size that is contrary to the miniaturization of a personal computer and is difficult to install due to its complicated structure. In addition, selecting a cooler suitable for a CPU having a different heating value for each user computer also causes user confusion.

The present invention devised to solve the above problems is provided with a condenser for converting the heat generated from the CPU into the phase change energy of the fluid, and fixed to the condenser by a heat transfer block fixing piece having elasticity to eliminate the condensation heat of the condenser In order to supply power to the heat transfer block, the thermoelectric element stacked on the upper side of the heat transfer block, and the heat sink and the thermoelectric element laminated by the heat sink fixing piece for effective heat dissipation of the thermoelectric element, It is a multi-stage control method for easy removal of heat generated from the CPU. Since there is no fan, there is no noise, the device is simple and easy to assemble, and it absorbs 20Watt ~ 100Watt of heat quantity by controlling the amount of fluid and pressure inside the condenser. To provide a CPU cooling device that can.

1 is an exploded perspective view of a condenser of a CPU cooler according to the present invention;

Figure 2 is an exploded perspective view of the expansion valve of the CPU cooler according to the present invention.

Figure 3 is an enlarged cross-sectional view of the main portion of the expansion valve of the CPU cooler according to the present invention.

Figure 4 is a cross-sectional view of the condenser top cover of the CPU cooler according to the present invention.

Figure 5 is an assembled perspective view of the heat transfer block and the condenser of the CPU cooler according to the present invention.

6 is a cross-sectional view of the fixing piece of the heat sink and the heat transfer block of the CPU cooler according to the present invention.

Figure 7 is an exploded perspective view of the condenser and the thermoelectric element, the heat sink of the CPU cooler according to the present invention.

8 is a cross-sectional view of a heat sink of a CPU cooler according to the present invention;

9 is an assembled cross-sectional view of the condenser and the heat transfer block of the CPU cooler according to the present invention;

10 is a perspective view of a cooler of a CPU cooler according to the present invention;

Figure 11 is a perspective view of the heat transfer block of the CPU cooler according to the present invention.

12 is a device control flowchart of a CPU cooler according to the present invention.

Figure 13 is an assembled perspective view of the cooler and the heat insulator of the CPU cooler according to the present invention.

14 is a state diagram in which the thermoelectric element is used in the CPU cooler according to the present invention.

15 is an exploded perspective view of a cooler and a CPU according to an exemplary embodiment of the present invention.

** Description of the main parts of the drawing **

One; Condenser 10; Condenser top cover

11; Condenser body 12; Condenser side cover

13; Expansion valve guide 14; Sensor Hall

15; Vacuum control valve 16; Side cover assembly hole

17; Expansion valve upper case 18; Expansion valve lower case

19; Expansion valve 20; Heat Block Block

20 '; heat sink fixing piece 21; Batten Guide

22; Fixing bolt 23; Batten Hole

30; Thermoelectric element 31; Heatsink

32; Heat sink fixing piece mounting groove 33; Electric Heat Block

34; Heat transfer block fixing groove 40; Control box

41; Sensor signal line 50; CPU fixed box

51; CPU 52; Assembly piece

60; insulator

The boiling point of a fluid containing water is closely related to the pressure of the fluid. Assuming that the heating is the same, the lower the pressure, the lower the boiling point of the fluid, and the higher the pressure, the higher the boiling point of the fluid. For example, the boiling point under one atmosphere of pure water is 100 ° C. However, at high altitudes, the boiling point is below 100 ° C. This is why it is often uncooked when food is cooked in high altitude mountains. In addition, the fluid boils when the calories are continuously applied, and the phase change is caused, and the calories applied are displayed in the form of different energy, which is miscellaneous heat. In the phase change, the fluid needs a large amount of energy. For example, when water boils, it has a heat buildup.

The present invention is applied to the above natural physical phenomenon, the condenser for converting the heat generated from the CPU into the phase change energy of the fluid is provided, in order to eliminate the heat of condensation of the condenser by the heat transfer block fixing piece having elastic In order to supply power to the fixed heat transfer block, the thermoelectric element stacked on the upper side of the heat transfer block, and the heat sink and the thermoelectric element laminated by the heat sink fixing piece for effective heat dissipation of the thermoelectric element, the temperature increase of the heat radiation side of the thermoelectric element is suppressed. It is a multi-stage control method to remove heat generated from the CPU easily. Since there is no fan, there is no noise. The device is simple and easy to assemble. The heat quantity of 20Watt ~ 100Watt is controlled by adjusting the amount of fluid and pressure inside the condenser. It is a CPU cooling device that can absorb heat.

In the heat transfer of the condenser 1 according to the present invention, when heat is transferred from the elements such as the CPU to the lower side of the condenser 1, the fluid inside the condenser 1 is evaporated to transfer heat to the upper side of the condenser 1, The heat transfer block 33 is transferred to the heat transfer block 33 stacked on the upper side of the condenser 1, and the heat transfer block 33 is cooled in contact with the endothermic side of the thermoelectric element 30. The process is repeated so that the liquid is liquefied and dropped to the lower part of the condenser 1 by the weight of the liquid.

The configuration of the present invention will be described in detail by the accompanying drawings.

1 is an exploded perspective view of a condenser of a CPU cooler according to the present invention. A predetermined space for filling the fluid with a material having excellent heat transfer characteristics is formed, and a fluid causing phase change upon heating to the bottom of the condenser body 11 is filled, and the condenser 1 is disposed on one side of the condenser body 11. A vacuum control valve 15 capable of adjusting an internal vacuum degree of the side and a fixing piece guide 21 for fixing the heat transfer block fixing piece 20 and the heat sink fixing piece 20 'which will be described later in the present specification are provided. The condenser side cover 12, which is assembled with the usual bolts in the cover assembly hole 16, and the condenser upper cover 10, which is covered with a sealing structure on the upper side of the condenser main body 11, have a plurality of sensor holes 14. When the phase of the fluid is changed from the liquid phase to the gas phase to evaporate to the upper portion of the condenser (1) to transfer the high heat of the lower condenser (1) at this time to sense the temperature, both sides of the bottom of the condenser body (11) "B" shaped expansion edge An id 13 is formed to have an expansion edge formed in a structure in which the expansion side upper case 17 and the expansion side lower case 18 do not pressurize the expansion side 19. The expansion side is inserted into the expansion side guide 13.

2 and 3 are exploded perspective views of expansion sides of the CPU cooler according to the present invention and enlarged cross-sectional views of main parts of the expansion sides of the CPU cooler. The expansion valve 19 has a structure in which the expansion valve upper case 17 and the expansion valve lower case 18 are vertically coupled, and the expansion valve 19 is seated between the expansion valve upper case 17 and the expansion valve lower case 18. Under normal pressure, it can be squeezed and fixed to the upper and lower casings.

4 is a cross-sectional view of the condenser top cover of the CPU cooler according to the present invention. The condenser upper cover 10 which is laminated and fixed to the condenser main body 11 has a predetermined number of sensor holes 14 for inserting a sensor, and the depth of the sensor holes 14 depends on the shape and size of the condenser 1. Can be configured by fluctuation.

5, 6, 9, and 11 are assembled perspective views of the heat transfer block and the condenser of the CPU cooler according to the present invention, and a cross sectional view of the fixing piece of the heat sink and the heat transfer block, and an assembled cross sectional view of the heat transfer plate and the heat transfer block fixing element, and a heat transfer block perspective view. . The heat transfer block fixing piece 20 and the heat sink fixing piece 20 'for fixing the heat sink 31 and the heat transfer block 33 to the condenser 1 are made of a metal-based material having excellent elasticity and rigidity. When the part is inclined by "A °" on the horizontal line and presses both sides of the fixing piece to fix it, the middle part of the fixing piece is pressed with a constant force, so that the fixing piece hole 23 is inserted into the fixing piece guide 21 and the fixing bolt is fixed. (22) is fixed to the condenser (1). Meanwhile, a predetermined fluid capable of phase change is filled in the condenser 1, and the degree of phase change is changed by the pressure inside the condenser 1, so that the fluid inside the condenser 1 is controlled by a vacuum pressure. In order to facilitate the phase change of the vacuum control valve 15 is installed. In addition, the heat transferred to the upper side of the condenser 1 is transferred to the heat transfer block 33 stacked on the upper side of the condenser 1, and the heat transfer block 33 is an intermediate portion of the heat transfer block fixing piece 20. It consists of a structure fitted into the fixing piece mounting groove 34 is fixed to the condenser (1).

7 and 8 are exploded and assembled perspective views and cross-sectional views of a condenser, a thermoelectric element, and a heat sink of a CPU cooler according to the present invention. The thermoelectric element 30 stacked on the upper part of the condenser 1 formed by "FIG. 5" according to the present invention is useful as a means for cooling when a temperature difference is generated between both ends when a DC power is applied. The heat absorbing side of the thermoelectric element 30 is stacked in contact with the upper side of the heat transfer block 33 to cool the heat transfer block 33, to dissipate heat generated from the heat dissipation side of the thermoelectric element 30 The heat dissipation plate 31 has a predetermined space formed by removing the heat dissipation fin in the middle portion, and the heat dissipation plate fixing groove 34 is installed at the center of the position, and the condenser 1 is in contact with the middle portion of the heat dissipation plate 20 '. The fixing piece guide 21 provided at both sides of the fitting is fixed to the bolt.

10 and 12 are a perspective view of the cooler of the CPU cooler according to the present invention, the flow chart of the device control. The heat transfer block 33, the thermoelectric element 30, and the heat dissipation plate 31 fixed to the condenser 1 by the heat dissipation plate fixing piece 20 ′ and the heat transfer block fixing piece 20 are on the condenser upper cover 10 side. And a temperature value generated from a sensor built into the sensor hole 14 are transmitted to the control box 40 by the sensor signal line 41, and the control of the control box operates when the CPU generates heat. Sensor 1, one of the sensors, senses the temperature T1 and sets the known saturation temperature value inside the condenser 1 as the set threshold temperature value T0. If it is lower than T0), the power of the thermoelectric element is cut off and only the condenser is operated.If it is higher than the set threshold temperature value (T0), the thermoelectric element is driven at low power, for example, 6V, and after the predetermined time has elapsed twice The sensor detects the temperature (T2) and resets it to the set threshold temperature value (T0). When the temperature is lower than the set threshold temperature value (T0) through the operation, the thermoelectric power is cut off to operate only by the condenser. When the temperature is higher than the set threshold temperature value (T0), the thermoelectric element is driven at high power, for example, 12V. .

On the other hand, Figure 13 is an assembled perspective view of the cooler and the heat insulating material of the CPU cooler according to the present invention. The heat insulating material 60 for blocking heat transfer between the condenser 1 and the outside is charged with all devices except the heat sink 31, and is configured differently according to the shape and size of the condenser and forms a frame using porous foam material. And then foamed.

14 is a state diagram in which the thermoelectric element is used in the CPU cooler according to the present invention. In general, cooling in a place where high heat generation amount is not required may be performed only by the condenser 1 and the heat sink 31 except for the thermoelectric element 30 of the components of the present invention.

In addition, Figure 15 is an exploded perspective view of the cooler and the CPU of the CPU cooler according to an embodiment of the present invention. An assembling piece 52 for fixing a conventional CPU unit composed of a CPU 51 and a CPU fixing box 50 to a main board of a computer is formed on one side of the condenser 1 to form a normal bolt. Assembly is fixed.

As described above, the present invention easily removes heat generated from the CPU and does not use a fan, so there is no noise, the device is simple, easy to assemble, and the amount of heat from 20Watt to 100Watt is controlled by the amount of fluid and pressure inside the condenser. It is possible to provide a flexible CPU cooling device capable of absorbing heat.

On the other hand, the cooling function is performed by the configuration of the present invention, in the coupling structure with the CPU, a person having ordinary knowledge in addition to the above-described method using the condenser according to the present invention can be changed to various structures Will be possible.

Claims (12)

A condenser for converting heat generated from the CPU into the phase change energy of the fluid is provided, the heat transfer block is fixed to the condenser by the elastic heat transfer block fixing piece for eliminating the heat of condensation of the condenser, and is stacked on the upper side of the heat transfer block In order to supply power to the thermoelectric element, the heat sink and the thermoelectric element laminated by the heat sink fixing piece for effective heat dissipation, the heat generated from the CPU is eliminated by a multi-stage control method for suppressing the temperature rise on the heat dissipation side of the thermoelectric element. CIF oil cooler that can absorb 20Watt ~ 100Watt of heat by controlling the amount of fluid and pressure inside condenser. The heat transfer of the condenser is transferred from the elements such as CPU to the lower side of the condenser, the fluid inside the condenser evaporates and transfers the heat to the upper side of the condenser, and is transferred to the heat transfer blocks stacked on the upper side of the condenser. A coolant cooler having a heat transfer process in which the upper end of the condenser is cooled because it is cooled in contact with the endothermic side of the device, and the fluid that is evaporated is deprived of heat and liquefied to fall to the lower part of the condenser by the weight of the liquid. Insulation for blocking heat transfer between the condenser and the outside is loaded with all devices except heat sink and is configured differently according to the shape and size of the condenser and foamed after forming a frame using porous foam material. Seed oil cooler. Cooling in a place that does not require a high calorific value CIF oil cooler that can perform cooling only by the condenser and the heat sink except the thermoelectric elements of the present invention. The condenser of claim 1, wherein a predetermined space for filling the fluid is formed with a material having excellent heat transfer characteristics, and a fluid causing phase change upon heating to the bottom of the condenser body is filled, and a condenser is formed on one side of the condenser body. A vacuum control valve for adjusting the degree of vacuum of the inside and a fixing guide for fixing the heat transfer block fixing piece and the heat sink fixing piece is provided with a condenser side cover assembled with a regular bolt in the side cover assembly hole, and the condenser body The condenser top cover, which is covered with an encapsulation structure on the upper side, has a plurality of sensor holes, and when the phase of the fluid changes from the liquid phase to the vapor phase and evaporates to the upper part of the condenser, the high temperature of the condenser is transferred. An “c” shaped expansion valve guide is formed at both bottom surfaces of the condenser body, so C. A cooler having a structure in which the expansion side formed in the structure that the lower side of the window side does not pressure the expansion side is inserted into the expansion side guide. The condenser top cover according to claim 5, wherein the condenser top cover which is laminated and fixed to the condenser main body has a predetermined number of sensor holes for inserting a sensor, and the depth of the sensor hole 14 is determined by the shape and size of the condenser. CIF oil cooler which can be configured with fluctuations. The method of claim 5, wherein the expansion valve has a structure in which the upper side of the expansion valve and the lower side of the expansion valve is combined with the upper and lower sides, and the expansion valve is compressed between the upper side of the expansion valve and the lower side of the expansion valve when the expansion valve is not pressed and fixed to the upper and lower cases, respectively. Seed oil cooler. The heat transfer block fixing piece and the heat sink fixing piece are made of a metal-based material having excellent elasticity and rigidity, and the middle portion of the fixing piece is inclined by "A °" on the horizontal line to press and fix both sides of the fixing piece. When the intermediate part of the fixing piece is pressed with a constant force, the seed oil hole is inserted into the fixing piece guide and is fixed to the condenser with the fixing bolt. The method of claim 5, wherein the vacuum control valve is filled with a predetermined fluid capable of phase change inside the condenser, the degree of phase change is changed by the pressure inside the condenser, so that the pressure inside the condenser is adjusted to a fluid CIF oil cooler is equipped with a vacuum control valve to facilitate the change of phase. The heat transfer block of claim 5, wherein the heat transferred to the upper side of the condenser is transferred to the heat transfer block stacked on the upper side of the condenser, the heat transfer block is a structure that is fitted to the intermediate portion of the heat transfer block fixing piece mounting groove mounting groove. CIF oil cooler which is composed and fixed to the condenser. The heat sink of claim 1, wherein the heat sink is a heat sink for dissipating heat generated from the heat dissipation side of the thermoelectric element. A CIF oil cooler fitted with bolts fixed to guide pieces provided on both sides of the condenser in contact with an intermediate portion of the convenience. According to claim 1, In the multi-stage control method, the temperature value generated in the sensor built into the sensor hole is transmitted to the control box by the sensor signal line, and the control of the control box causes the condenser to operate when the CPU generates heat. One sensor, one, senses the temperature and the thermoelectric element is measured if the temperature (T1) of the sensor (1) is lower than the set threshold temperature value (T0) by using the known saturation temperature value inside the condenser as the set threshold temperature value (T0). The power is cut off to operate only by the condenser, and when it comes out higher than the set threshold temperature value (T0), the thermoelectric element is driven at low output, for example, 6V, and the sensor 2 detects the temperature (T2) after a predetermined time has elapsed. When the temperature is lower than the set threshold temperature value T0 through a comparison operation with the set threshold temperature value T0, the power of the thermoelectric element is cut off to operate only by the condenser. When out above the (T0) ssipiyu condenser, the thermal element is driven in high power, for example 12V.