KR200198457Y1 - Chip holder apparatus for semiconductor analysis device - Google Patents
Chip holder apparatus for semiconductor analysis device Download PDFInfo
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- KR200198457Y1 KR200198457Y1 KR2019970040394U KR19970040394U KR200198457Y1 KR 200198457 Y1 KR200198457 Y1 KR 200198457Y1 KR 2019970040394 U KR2019970040394 U KR 2019970040394U KR 19970040394 U KR19970040394 U KR 19970040394U KR 200198457 Y1 KR200198457 Y1 KR 200198457Y1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting substrates others than wafers, e.g. chips
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/26—Electron or ion microscopes; Electron or ion diffraction tubes
- H01J37/28—Electron or ion microscopes; Electron or ion diffraction tubes with scanning beams
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
본 고안은 반도체 분석장비의 칩홀더장치에 관한 것으로, 종래 기술은 시편이 장착된 스터브의 교체시 매번 셋트피이스를 해체, 조립하여야 하며, 이와 같이 스터브를 셋트피이스의 고정홈에 고정시킬 경우 스크류를 풀었다 조였다 하는 과정을 반복할 경우 스크류에 마모가 발생하게 되는 바, 이에 본 고안은 홀더 몸체와, 그 홀더 몸체의 내측에 탄력 설치되며 수개의 나사산 형상의 고정홈이 구비된 판스프링을 포함하여 구성되는 것을 특징으로 하는 반도체 분석장비의 칩홀더장치를 제공함으로써, 셋트스크류를 조작하지 않고도 홀더 몸체에 시편이 장착된 스터브의 삽입 고정이 가능하므로 그 조작을 단순화시키며, 또한 셋트스크류의 마모를 방지할 수 있다.The present invention relates to a chip holder device of a semiconductor analysis device, and the prior art has to disassemble and assemble the set piece every time the replacement of the stub is equipped with the specimen, in this case to fix the stub to the fixing groove of the set piece When the screw is repeatedly loosened and tightened, wear occurs on the screw. Therefore, the present invention provides a holder spring and a leaf spring having elasticity installed inside the holder body and having several threaded fixing grooves. By providing a chip holder device of the semiconductor analysis equipment, characterized in that the configuration, including, it is possible to insert and fix the stub mounted on the specimen to the holder body without manipulating the set screw, simplifying its operation, and also wear the set screw Can be prevented.
Description
본 고안은 반도체 분석장비의 칩홀더장치에 관한 것으로, 특히 스터브(STUB)의 교체없이 평면 검사용 시편과 단면 검사용 시편을 겸용하여 사용할 수 있도록 한 반도체 칩 분석장치의 홀더어셈블리에 관한 것이다.The present invention relates to a chip holder device of a semiconductor analysis device, and more particularly to a holder assembly of a semiconductor chip analysis device that can be used in combination with a planar inspection specimen and a cross-sectional inspection specimen without replacing the stub (STUB).
일반적으로 웨이퍼 상태의 반도체 칩을 채취하여, 그 채취한 시편의 평면과 단면을 검사함으로써 칩의 불량여부를 판단하게 되는데, 이때 주로 사용하는 검사장비인 “BROKEN CD-SEM”의 홀더어셈블리가 제1도에 도시되어 있는 바, 이를 간단히 설명하면 다음과 같다.In general, the semiconductor chip in the wafer state is taken and the plane and the cross section of the sample are examined to determine whether the chip is defective. At this time, the holder assembly of the inspection equipment “BROKEN CD-SEM”, which is mainly used, is the first. As shown in FIG. 1, this is briefly described.
제1도는 종래 기술에 의한 반도체 분석장비의 칩홀더장치를 보인 사시도로서, 도시된 바와 같이, 종래 칩홀더장치는 분석장비의 홀더베이스(미도시) 상부에 설치되는 데, 상기 홀더 몸체(1)의 내측에는 셋트피이스(SET PICECE)(2)(2')가 스크류(3)(3')로 고정 설치되어 있고, 상기 셋트피이스(2)(2')의 내측에는 스터브(4)를 위치에 따라 고정시킬 수 있도록 수개의 고정홈(2a)(2'a)이 형성되어 있으며, 그 고정홈(2a)에는 검사하고자 하는 시편(C)이 장착된 스터브(4)가 삽입 고정된다.1 is a perspective view showing a chip holder device of a semiconductor analysis device according to the prior art, as shown, the conventional chip holder device is installed on a holder base (not shown) of the analysis device, the holder body (1) SET PICECE (2) (2 ') is fixed to the inside of the screw (3) (3'), the inside of the set piece (2) (2 ') stub (4) Several fixing grooves 2a and 2'a are formed so as to be fixed according to the position, and the stub 4 on which the specimen C to be inspected is inserted is fixed in the fixing groove 2a. .
이와 같이 구성된 반도체 분석장비의 칩홀더장치는 검사시 채취한 반도체 칩의 시편(C)이 장착된 스터브(4)를 설치하기 위하여 셋트피이스(2)(2')의 셋트스크류(3)(3')를 풀고, 상기 셋트피이스(2)(2')의 일측 고정홈(2a)(2'a)에 스터브 마운팅 툴(미도시)을 이용하여 스터브(4)를 삽입한 후, 일측 셋트피이스(2')가 고정된 몸체(1)를 타측 셋트피이스(2) 방향으로 가압하여 상기 스터브(4)를 고정홈(2a)(2'a)에 안착시키고 셋트스크류(3)(3')를 조여 스터브(4)를 고정한 상태에서 검사를 진행한다.The chip holder device of the semiconductor analysis device configured as described above is a set screw (3) of the set piece (2) (2 ') in order to install the stub (4) on which the specimen (C) of the semiconductor chip collected at the time of inspection is installed. 3 '), the stub 4 is inserted into one side fixing groove 2a and 2'a of the set piece 2 and 2' by using a stub mounting tool (not shown), and then one side. Pressing the body (1) fixed to the set piece (2 ') in the direction of the other set piece (2) to seat the stub (4) in the fixing groove (2a) (2' a) and set screw (3) Tighten (3 ') and test with the stub (4) fixed.
그러나, 상기와 같은 종래 반도체 분석장비의 칩홀더장치는 시편(C)이 장착된 스터브(4)의 교체시 매번 셋트피이스(2)(2')를 해체, 조립하여야 하며, 스터브(4)를 셋트피이스(2)(2')의 고정홈(2a)(2'a)에 고정시킬 경우 셋트스크류(3)(3')를 풀었다 조였다 하는 과정을 반복해야 하므로 상기 셋트스크류(3)(3')에 마모가 발생하게 되는 문제점이 있었다.However, the chip holder of the conventional semiconductor analysis equipment as described above should dismantle and assemble the set piece (2) (2 ') every time the replacement of the stub (4) equipped with the specimen (C), the stub (4) Is fixed to the fixing groove (2a) (2 'a) of the set piece (2) (2'), the set screw (3) (3 ') to loosen and tighten the process of the set screw (3) There was a problem that wear occurs in the (3 ').
따라서, 본 고안은 상술한 문제점을 감안하여 안출된 것으로, 셋트스크류를 이용하지 않고도 스터브를 셋트피이스에 고정홈에 고정하므로 셋트스크류의 마모를 방지하며, 신속하고 용이하게 스터브를 고정시키기 위한 반도체 분석장비의 칩홀더장치를 제공하는데 그 목적이 있다.Accordingly, the present invention is conceived in view of the above-described problems, and because the stub is fixed to the set groove in the set piece without using the set screw to prevent wear of the set screw, and to quickly and easily fix the semiconductor to the stub The purpose is to provide a chip holder device of the analysis equipment.
제1도는 종래 반도체 분석장비의 칩홀더장치를 보인 단면도.1 is a cross-sectional view showing a chip holder of the conventional semiconductor analysis equipment.
제2도는 본 고안에 의한 반도체 분석장비의 칩홀더장치를 보인 단면도.2 is a cross-sectional view showing a chip holder of the semiconductor analysis equipment according to the present invention.
제3도는 본 고안의 다른 실시예를 보인 단면도.Figure 3 is a cross-sectional view showing another embodiment of the present invention.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
10 : 홀더 몸체 11, 11' : 판스프링10: holder body 11, 11 ': leaf spring
11a, 11'a : 고정홈 12, 12' : 셋트스크류11a, 11'a: fixed groove 12, 12 ': set screw
13 : 스터브 C : 시편13: stub C: specimen
상기와 같은 본 고안의 목적을 달성하기 위하여 홀더 몸체와, 그 홀더 몸체의 내측에 탄력 설치되며 수개의 나사산 형상의 고정홈이 구비된 판스프링을 포함하여 구성되는 것을 특징으로 하는 반도체 분석장비의 칩홀더장치가 제공된다.In order to achieve the object of the present invention as described above, the chip of the semiconductor analysis device comprising a holder body and a leaf spring elastically installed inside the holder body and provided with several threaded fixing grooves. A holder device is provided.
또한, 홀더 몸체와, 그 홀더 몸체의 내측에 일정 간격을 복수개 설치되는 스프링과, 그 스프링의 단부에 탄지 결합되는 볼베어링을 포함하여 구성되는 것을 특징으로 하는 반도체 분석장비의 칩홀더장치를 제공하여 본 고안의 목적을 달성할 수도 있다.In addition, the present invention provides a chip holder device for semiconductor analysis equipment, comprising a holder body, a spring having a plurality of predetermined distances installed inside the holder body, and a ball bearing that is tangentially coupled to an end of the spring. It may also achieve the purpose of the design.
이하, 본 고안에 의한 반도체 분석장비의 칩홀더장치의 실시예를 첨부된 도면에 의거하여 설명하면 다음과 같다.Hereinafter, an embodiment of a chip holder of a semiconductor analysis device according to the present invention will be described with reference to the accompanying drawings.
제3도는 본 고안에 의한 반도체 분석장비의 칩홀더장치를 보인 사시도로서, 도시된 바와 같이, 본 고안에 의한 반도체 분석장비의 칩홀더장치는 홀더 몸체(10)의 내부에 수직 방향으로 판스프링(11)(11')이 설치되는데, 그 판스프링(11)(11')에는 스터브(13)를 고정시킬 수 있도록 나사산 형상의 고정홈(11a)(11'a)을 복수개 형성한다.3 is a perspective view showing a chip holder device of the semiconductor analysis device according to the present invention, as shown, the chip holder device of the semiconductor analysis device according to the present invention is a plate spring in a vertical direction to the inside of the holder body (10) 11) 11 'is provided, and a plurality of threaded fixing grooves 11a and 11'a are formed in the leaf springs 11 and 11' to fix the stub 13.
그리고 상기 나사산 형상의 고정홈(11a)(11'a)에는 검사하고자 하는 시편(C)이 장착된 스터브(13)가 삽입 고정되며, 상기 판스프링(11)(11')은 홀더 몸체(10)에 셋트스크류(12)(12')로 고정된 상태를 유지한다.In addition, a stub 13 mounted with a specimen C to be inspected is inserted into and fixed to the threaded fixing grooves 11a and 11'a, and the leaf springs 11 and 11 'are holder bodies 10. It is maintained in the set screw (12) (12 ') fixed to.
상기와 같이 구성된 반도체 분석장비의 칩홀더장치를 이용하여 시편을 검사하는 작용을 설명하면 다음과 같다.Referring to the operation of inspecting the specimen using the chip holder device of the semiconductor analysis equipment configured as described above are as follows.
홀더 몸체(10)의 내부에 설치된 판스프링(11)(11')이 셋트스크류(12)(12')에 의해 고정된 상태에서, 복수개로 구분된 일측 고정홈(11a)(11'a)에 시편(C)이 장착된 스터브(13)를 삽입하는데, 이때 상기 스터브(13)를 삽입시 판스프링(11)(11')의 탄력으로 인해 나사산 형상의 돌출부가 밀려나게 되고 일측 고정홈(11a)(11'a)에 위치 되었을 때, 상기 판스프링(11)(11')의 탄력에 의해 스터브(13)는 안착 고정되는 것이다.In a state where the leaf springs 11 and 11 'installed inside the holder body 10 are fixed by the set screws 12 and 12', one side fixing groove 11a and 11'a divided into a plurality of pieces. Insert the stub (13) equipped with the specimen (C) in this case, when inserting the stub 13 is pushed in the thread-shaped protrusion due to the elasticity of the leaf spring (11) (11 ') and one side fixing groove ( When positioned at 11a) (11'a), the stub 13 is seated and fixed by the elasticity of the leaf spring (11, 11 ').
이와 같이 판스프링(11)(11')의 고정홈(11a)(11'a)에 스터브(13)를 안착 고정한 상태에서, 상기 스터브(13)에 장착된 시편(C)을 검사한다.As described above, the test piece C mounted on the stub 13 is inspected while the stub 13 is seated and fixed in the fixing grooves 11a and 11'a of the leaf springs 11 and 11 '.
한편, 제3도는 본 고안의 다른 실시예를 보인 단면도로서, 이에 도시된 바와 같이, 본 고안의 다른 실시예는 홀더 몸체(10)의 내측에 서로 대응되도록 수개의 스프링(14)(14')을 수평방향으로 설치하며, 그 스프링(14)(14')의 단부에는 소정 직경의 볼베어링(15)(15')을 회전 가능하도록 구비하여 수직 방향으로 소정의 간격을 두고 설치된 볼베이링(15)(15')과 볼베어링(15)(15') 사이에는 소정의 고정홈(15a)(15'a)이 형성된다.On the other hand, Figure 3 is a cross-sectional view showing another embodiment of the present invention, as shown in this, another embodiment of the present invention is several springs (14, 14 ') to correspond to each other inside the holder body (10) Ball bearings 15 are installed in a horizontal direction, and ball bearings 15 and 15 'having a predetermined diameter are rotatably provided at ends of the springs 14 and 14'. The predetermined fixing grooves 15a and 15'a are formed between the 15 'and the ball bearings 15 and 15'.
따라서, 상기 수직 방향으로 설치된 볼베어링(15)(15')과 볼베어링(15)(15') 사이에 형성된 소정의 고정홈(15a)(15'a)에 반도체 칩의 시편(C)이 장착된 스터브(13)를 삽입하면, 상기 볼베어링(15)(15')에 연결되어 그 볼베어링(15)(15')을 탄력 지지하는 스프링(14)(14')의 힘에 의해 상기 스터브(13)는 고정홈(15a)(15'a)에 고정되는 것이다.Therefore, the specimen C of the semiconductor chip is mounted in the predetermined fixing grooves 15a and 15'a formed between the ball bearings 15 and 15 'installed in the vertical direction and the ball bearings 15 and 15'. When the stub 13 is inserted, the stub 13 is connected to the ball bearings 15 and 15 'by the force of the springs 14 and 14' which elastically support the ball bearings 15 and 15 '. Is fixed to the fixing groove (15a) (15 'a).
이상에서와 같이 본 고안에 의한 반도체 분석장비의 칩홀더장치는, 셋트스크류를 조작하지 않고도 홀더 몸체에 시편이 장착된 스터브를 삽입 고정 가능하므로 그 조작을 단순화시키며, 또한 셋트스크류의 마모를 방지할 수 있다.As described above, the chip holder device of the semiconductor analysis device according to the present invention can insert and fix a stub mounted with a specimen on a holder body without manipulating the set screw, thereby simplifying the operation and preventing wear of the set screw. Can be.
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019970040394U KR200198457Y1 (en) | 1997-12-24 | 1997-12-24 | Chip holder apparatus for semiconductor analysis device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019970040394U KR200198457Y1 (en) | 1997-12-24 | 1997-12-24 | Chip holder apparatus for semiconductor analysis device |
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| KR19990027792U KR19990027792U (en) | 1999-07-15 |
| KR200198457Y1 true KR200198457Y1 (en) | 2000-10-02 |
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|---|---|---|---|---|
| KR101398455B1 (en) | 2013-09-13 | 2014-05-27 | 히타치하이테크놀로지즈코리아 주식회사 | Specimen holder for observing cross section of specimen and method for controlling thereof |
| KR101398456B1 (en) | 2013-09-13 | 2014-05-27 | 히타치하이테크놀로지즈코리아 주식회사 | Specimen holder for observing top section of specimen and method for controlling thereof |
-
1997
- 1997-12-24 KR KR2019970040394U patent/KR200198457Y1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR19990027792U (en) | 1999-07-15 |
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