JPH1114690A - Guide pin holding mechanism for printed circuit board inspecting apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a guide pin holding mechanism for printed circuit board inspecting apparatus capable of making it difficult for the part between a guide pin and a guide pin plate to produce a backlash. SOLUTION: Being kept in contact with a top surface P1, a large-diameter part 25 is held with a fixing pipe 17 having the same diameter as the outside diameter d1 of the large-diameter part 25. Besides, since the diameter of a guide pin holding hole H15 is made smaller from the middle, and consequently it becomes possible to thicken the thickness of the small-diameter part B1, it is possible to provide a first threaded part S1 in this part. By screwing the first threaded part S1 into a second threaded part S2, it is possible to hold the large-diameter part 25 keeping it in contact with the top surface P1. Accordingly, it is possible to integrally move a guide pin plate 37 and a guide pin socket 15, so it is possible to provide a guide pin holding mechanism for printed circuit board inspecting apparatuses which makes it difficult for the part between the guide pin socket 15 and a guide pin plate 37 to produce a backlash.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a guide pin adjusting mechanism for a printed circuit board inspection apparatus, and more particularly to preventing a guide pin from rattling.

[0002]

2. Description of the Related Art As a method of relative positioning between a printed board and a probe in a printed board inspection apparatus, there are the following methods.
Two types of methods have been proposed. One is a method of fixing the position of the printed circuit board and moving the jig holding the probe to perform the positioning.
Another is to fix the jig holding the probe,
This is a method of performing the positioning by moving a printed circuit board.

A printed board inspection apparatus having a guide pin holding mechanism employing a printed board moving method will be described with reference to FIG. The guide pin holding mechanism of the printed circuit board inspection device 100 positions the guide pins 133 by moving the guide pin plate 107 in the directions of arrows 147 and 149.

In the printed board inspection apparatus 100, the printed board 103 is held by guide pins 133. The guide pins 133 are held by guide pin sockets 135. An E-ring 139 is attached to the guide pin 133 so that the guide pin 133 does not protrude from the guide pin socket 135.

[0005] A hole is formed in the guide pin plate 107. The guide pin socket 135 is press-fitted into this hole. Thus, the guide socket 135 is held by the guide pin plate 107.

Guide pin plate 107, guide pin 1
FIG. 8 shows the relationship between 33 and the guide socket 135 in more detail. The guide pin 133 is inserted into the guide pin socket 135. At this time, at the same time, a compression coil spring 139 is also inserted into the guide pin socket 133 as a buffer member (this compression coil spring 139).
Are not shown in FIG. 7 and are omitted).

[0007] Guide pin 133, compression coil spring 139
Is inserted into the hole of the guide pin plate 107 by press-fitting. Thereby, the guide pin socket 135 is held by the guide pin plate 107, and both can be moved integrally. Further, holes formed in the probe guide plate 105 and the probe base plate 109 into which the guide pin socket 135 is inserted have a diameter larger than the outer diameter of the guide pin socket 135.

Therefore, if the guide pin plate 107 is moved in the direction of arrow 143, the guide pin socket 1
35 can also be moved in the direction of arrow 143. If the guide pin plate 107 is moved in the direction of arrow 145,
The guide pin socket 135 can also be moved in the arrow 145 direction.

Returning to FIG. 7, the probe 123 is held by the probe base plate 109. The guide pin plate 10 is provided on the upper surface of the probe base plate 109.
7 are provided. Further, a probe guide plate 105 is provided on the upper surface thereof. Probe guide plate 10
Reference numeral 5 denotes a member for ensuring the positional accuracy of the pin portion of the probe 123.

The alignment arm 113 has an X
-Y-θ driving device is connected (not shown). Thus, the guide pin 133 can be moved to a desired position by moving the guide pin plate 107 via the alignment arm 113.

[0011]

The above-described guide pin holding mechanism of the printed circuit board inspection apparatus has the following problems. In the printed board inspection apparatus 100 in which the position of the probe is fixed and the printed board is moved to move the printed board, the thickness of the guide pin plate 107 is thin, usually about 2 mm. Therefore, the use of the guide pin 13
When the positioning of 3 is performed, the guide pin socket 1
There is play between the guide pin 35 and the guide pin plate 107. When the backlash occurs, the positions of the printed circuit board 103 and the probe 123 cannot be accurately adjusted, and an accurate inspection cannot be performed.

As one of the methods for preventing the play, it is conceivable to increase the thickness of the guide pin plate 107. However, the thickness of the guide pin plate 107 is conventionally about 2 mm. Therefore, if this thickness is changed, the conventional parts cannot be used, so that a large investment is required in terms of cost and time required for redesign. become.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a guide pin holding mechanism of a printed circuit board inspection apparatus in which play is less likely to occur between a guide pin and a guide pin plate.

[0014]

According to a first aspect of the present invention, a guide pin holding mechanism for a printed board inspection apparatus includes a guide pin for holding a printed board, and a guide pin holding hole for inserting and holding the guide pin. A guide pin holding mechanism of a printed circuit board inspection apparatus, comprising: a container, an insertion hole into which the guide pin holder is inserted and held, and a guide pin movable plate for positioning the guide pin with respect to an inspection jig. The guide pin retainer has a large-diameter portion that comes into contact with the first surface so that the guide pin retainer does not come off from the first surface side of the guide pin movable plate to the second surface side. A holding member for holding a state where the large-diameter portion is in contact with the first surface is provided on a second surface side of the guide pin movable plate facing the first surface. Features.

According to a second aspect of the present invention, there is provided a guide pin holding mechanism for a printed board inspection apparatus according to the first aspect, wherein the outer diameter of the holding member is equal to the diameter of the guide pin holder. The guide pin holding hole has a small-diameter portion in which the inside diameter of the guide pin holding hole is small at a portion away from the second surface; The retainer and the holding member are engaged with each other at the small-diameter portion, whereby the large-diameter portion is held in contact with the first surface.

According to a third aspect of the present invention, in the guide pin holding mechanism of the printed board inspecting apparatus according to the second aspect, a first screw is provided on a small diameter portion of the guide pin holder. Part is formed,
A second screw portion is formed on the holding member to be screwed with the first screw portion.

According to a fourth aspect of the present invention, there is provided a guide pin holding mechanism for a printed circuit board inspection apparatus, comprising: a guide pin for holding a printed circuit board; a cylindrical shaft; a head at one end of the shaft; A guide socket having a screw portion,
A guide socket through which the guide pin passes through the inside of the shaft portion, a fixed pipe having a screw portion to be screwed with a screw portion of the guide socket, a shaft portion of the guide socket capable of penetrating, and a head of the guide socket; A guide pin plate having a hole having a diameter through which the fixed pipe and the fixed pipe cannot pass, a guide pin position adjusting mechanism of a printed circuit board inspection device, wherein a shaft portion of the guide socket is inserted into a hole of the guide pin plate, The guide pin plate, the guide socket, and the fixed pipe are sandwiched by inserting a shaft portion of the guide socket protruding from the hole into the fixed pipe and screwing the two screw portions together. I do.

According to a fifth aspect of the present invention, a guide pin is inserted into a guide pin holding hole of a guide pin holder, and the guide pin holder into which the guide pin is inserted is moved to a guide pin movable plate. And the large diameter portion of the guide pin retainer is brought into contact with the first surface, and the guide pin retainer is moved from the first surface side of the guide pin movable plate to the second surface. A guide pin holding method in a printed circuit board inspection device for preventing the guide pin holder from being pulled out to the side, wherein the guide pin holder is held by the guide pin movable plate while the large-diameter portion is pressed against the first surface. To do.

[0019]

According to the first aspect of the present invention, the guide pin holding mechanism of the printed circuit board inspection apparatus has the large diameter portion contacting the first surface on the second surface side facing the first surface of the guide pin movable plate. And a holding member for holding the held state.

Thus, the guide pin movable plate and the guide pin holder can be integrally moved. Therefore, it is possible to provide a guide pin holding mechanism of the printed circuit board inspection device in which play is less likely to occur between the guide pin holder and the guide pin movable plate.

In the guide pin holding mechanism of the printed circuit board inspection apparatus according to the second aspect, the outer diameter of the holding member is substantially the same as the outer diameter of the large diameter portion of the guide pin holder, and the guide pin holding hole is The guide pin holding hole has a small diameter portion where the inside diameter is small at a portion away from the second surface, and the guide pin retainer and the holding member are engaged with each other at the small diameter portion, so that the large diameter portion is reduced. The first surface is kept in contact with the first surface.

Thus, the large diameter portion can be held in contact with the first surface by the holding member having substantially the same diameter as the outer diameter of the large diameter portion. Further, since the small-diameter portion can be made thick by reducing the inner diameter of the guide pin holding hole, a structure for engaging the guide pin retainer and the holding member with the small-diameter portion is formed. Can be. Therefore, it is possible to provide a guide pin holding mechanism of a printed circuit board inspection device which is compact and hardly causes backlash between the guide pin holder and the guide pin movable plate.

In the guide pin holding mechanism of the printed circuit board inspection apparatus according to the third aspect, the first screw portion is formed in the small diameter portion of the guide pin holder, and the first screw portion is formed in the holding member.
A second threaded portion to be screwed with the threaded portion is formed.

Thus, the large diameter portion can be kept in contact with the first surface by screwing the first screw portion and the second screw portion. Therefore, it is possible to provide a guide pin holding mechanism of a printed circuit board inspection device with a simple configuration in which play is less likely to occur between the guide pin holder and the guide pin movable plate.

According to a fourth aspect of the present invention, the guide pins hold the printed circuit board. The guide socket is a guide socket having a cylindrical shaft portion, a head at one end of the shaft portion, and a screw portion at the other end of the shaft portion, and a guide pin passes through the inside of the shaft portion.

The fixed pipe has a threaded portion that is screwed with the threaded portion of the guide socket. The guide pin plate has a hole that can penetrate the shaft portion of the guide socket, but cannot penetrate the head of the guide socket and the fixed pipe.

Further, the shaft of the guide socket is inserted into the hole of the guide pin plate, the shaft of the guide socket protruding from the hole is inserted into the fixed pipe, and the two threaded portions are screwed together to thereby guide the guide pin. The plate, guide socket and fixed pipe are clamped.

Thus, the guide pin plate, the guide socket and the fixed pipe can be clamped by screwing the screw portions of the guide socket and the fixed pipe. Therefore, it is possible to provide a guide pin holding mechanism of a printed circuit board inspection device with a simple configuration in which play is less likely to occur between the guide socket and the guide pin plate.

The guide pin holding method in the printed circuit board inspection device according to claim 5 is such that the large-diameter portion of the guide pin holder is brought into contact with the first surface, and the guide pin holder is connected to the first pin of the guide pin movable plate. Of the guide pin movable plate so that the large-diameter portion is fixed to the first surface by the holding member provided on the second surface side opposite to the first surface of the guide pin movable plate. A guide pin holding method in a printed circuit board inspection device for holding a contact state,
The guide pin holder is held by the guide pin movable plate in a state where the large-diameter portion is pressed against the first surface.

Thus, the large-diameter portion of the guide pin holder presses the first surface, so that the movable guide pin plate and the guide pin holder can be moved integrally. Therefore, it is possible to provide a guide pin holding method in a printed circuit board inspection device in which play is less likely to occur between the guide pin holder and the guide pin movable plate.

[0031]

FIG. 1 shows a first embodiment of a guide pin holding mechanism of a printed circuit board inspection apparatus according to the present invention.
This will be described with reference to FIG. The guide pin holding mechanism 1 includes a guide pin 13 and a guide pin socket 1 which is a guide pin holder.
5. It has a fixed pipe 17 as a holding member and a guide pin plate 37 as a guide pin movable plate. The guide pins 13, the guide pin socket 15, and the fixed pipe 17 are made of a metal material (for example, stainless steel).

FIG. 2 is a sectional view of main components of the guide pin holding mechanism 1 according to the present invention. Guide pin 1
3 has an outer diameter d0 substantially equal to the inner diameter d3 of the guide pin socket 15. The outer surface of the guide pin 13 is such that the guide pin 13 is
It is processed so that it can move smoothly within 5. The E-ring 21 is attached to the guide pin 13 so that the guide pin 13 does not protrude from the guide pin socket 15.

The guide pin socket 15 is provided for the guide pin 1
3 has a guide pin holding hole H15 into which is inserted and held.
The guide pin holding hole H15 is connected to the guide pin holding hole H1.
5 has a small-diameter portion B1 having a small diameter at a portion away from the lower surface P2 of the guide pin plate 37.

A first screw portion S1 is formed in the small diameter portion B1. Further, a compression coil spring 19 is inserted into the guide pin holding hole H15.

The outer diameter of the guide pin socket 15 is substantially the same as the inner diameter of the fixed pipe 17. The guide pin socket 15 has a large-diameter portion 25 having a diameter d1 larger than the outer diameter of the guide pin socket 15.

Further, like the guide pin 13, the inner surface of the guide pin socket 15 is processed so that the guide pin 13 can move smoothly in the guide pin holding hole H15. The outer surface of the guide pin socket 15 is machined so that the guide pin socket 15 can be smoothly inserted into the fixed pipe 17.

The outer diameter d2 of the fixed pipe 17 is the same as the outer diameter d1 of the large diameter portion 25 of the guide pin socket 15. The fixed pipe 17 is formed with a second screw portion S2 that is screwed with the first screw portion S1. Further, similarly to the guide pin socket 15, the inner surface of the fixed pipe 17 is processed so that the guide pin socket 15 can be smoothly inserted into the fixed pipe 17.

The guide pin plate 37 has an insertion hole into which the guide pin socket 15 is inserted and held, and positions the guide pin 13 with respect to the inspection jig.

Here, a method of fixing the guide pin socket 15 to the guide pin plate 37 using the fixing pipe 17 will be described with reference to FIG. In FIGS. 3D to 3D, guide pins and compression coil springs are not shown.

First, as shown in FIG. 3A, the guide pin socket 15 is inserted into the insertion hole of the guide pin plate 37 from the upper surface P1 side of the guide pin plate 37 along the arrow 67.

Thus, the large-diameter portion 25 of the guide pin socket 15 is attached to the upper surface P1 of the guide pin plate 37.
, The guide pin socket 15 is held so as not to come off from the upper surface P1 side of the guide pin plate 37 to the lower surface P2 side.

In this state, as shown in FIG. 3B, the fixed pipe 17 is pushed from the lower surface P2 side of the guide pin plate 37 along the arrow 61 so as to cover the guide pin socket 15.

As shown in FIG. 3C, when the screw portion S1 of the guide pin socket 15 and the screw portion S2 of the fixed pipe 17 come into contact with each other, the fixed pipe 17 is rotated in the direction of arrow 63. Thereby, the screw part S1 and the screw part S2 are engaged.

Further, as shown in FIG. 3D, the fixed pipe 17 is rotated until the upper end of the fixed pipe 17 contacts the lower surface P2 of the guide pin plate 37. The guide pin socket 15 is held by the guide pin plate 37 while the large-diameter portion 25 is pressed against the upper surface P1.

FIG. 2 shows a state in which the guide pin 13, the guide pin socket 15, and the fixed pipe 17 are fixed to the guide pin plate 37 in this manner. The guide pin holding mechanism 1 according to the present invention includes a fixed pipe 17.
, The guide pin socket 15 is fixed to the guide pin plate 37. Accordingly, the guide pin plate 37 and the guide pin socket 15 can be integrally moved without causing backlash.

Further, by making the small-diameter portion B1 thick, the guide pin socket 15 and the fixed pipe 17 are engaged with each other at the small-diameter portion B1. Further, a first screw portion S1 is formed in the small diameter portion B1, and the first screw portion S1 and the second screw portion S1 are formed.
2 by screwing the large diameter portion 25 to the upper surface P1.
Is kept in contact with Therefore, with the fixed pipe 17 having the same diameter as the outer diameter d1 of the large-diameter portion 25, the large-diameter portion 2
5 can be held in contact with the upper surface P1, so that the guide pin holding mechanism 1 can be made compact.

Accordingly, it is possible to provide a guide pin holding mechanism of a printed circuit board inspection apparatus which is compact and does not easily cause backlash between the guide pin socket 15 and the guide pin plate 37.

Next, FIG. 4 shows a state in which the guide pin holding mechanism 1 of the printed board inspection apparatus according to the present invention is mounted on an actual printed board inspection apparatus. In the printed board inspection apparatus 50, the printed board 3 is held by the guide pins 13. The guide pins 13 are held by guide pin sockets 15.

The guide pin plate 37 has an insertion hole. The guide pin socket 15 is inserted into this insertion hole. The fixed pipe 17 is attached from the lower surface P2 side of the guide pin plate 37 so as to cover the guide pin socket 15.

The screw portions of the guide pin socket 15 and the fixed pipe 17 are screwed together, and the guide pin socket 15 is firmly held by the guide pin plate 37.

The guide pin plate 37 and the alignment arm 43 are connected by a screw 45. Also,
An XY-θ driving device is connected to the alignment arm 43 (not shown).

Thus, the guide pin plate 17 can be moved via the alignment arm 43. The guide pin plate 37 has a guide pin socket 1
Since the guide pin 5 is firmly fixed, the guide pin socket 15 can be moved along with the movement of the guide pin plate 37, and the guide pin 13 inserted into the guide pin socket 15 can be moved. .

Another embodiment of the guide pin holding mechanism of the printed circuit board inspection apparatus according to the present invention is shown in FIGS. FIG. 5Α uses a guide pin socket 15 having the same structure as that of the first embodiment. However, the difference from the first embodiment is that the fixed pipe is changed to a combination of the auxiliary pipe 71 and the fixed nut 73.

In this embodiment, the auxiliary pipe 71 and the fixing nut 73 correspond to the holding member. The outer diameter d4 of the auxiliary pipe 71 and the fixing nut 73 is the same as the outer diameter d1 of the large diameter portion 25 of the guide pin socket 15. The fixing nut 73 has a second screw portion S that is screwed with the first screw portion S1.
2 are formed.

The embodiment shown in FIG. 5B is different from the first embodiment in that the fixed pipe is changed to a combination of the auxiliary pipe 71 and the fixed ring 77. In this embodiment, the auxiliary pipe 71 and the fixing ring 77 correspond to a holding member.

In the guide pin socket 79, a ring groove is formed on the entire circumference or a part instead of the threaded portion S1 formed at the end of the guide pin socket 15 in the embodiment of FIG. .

The outer diameter d5 of the auxiliary pipe 71 and the outer diameter d6 of the fixing ring 77 are the same as the outer diameter d1 of the large diameter portion 25 of the guide pin socket 79. The guide pin holding hole H79 has a small-diameter portion B2 in which the inner diameter d3 of the guide pin holding hole 79 becomes smaller at a portion away from the lower surface P2 of the guide pin plate 37. By engaging the guide pin socket 79 and the fixing ring 77 at the small diameter portion, the large diameter portion 25 is kept in contact with the upper surface P1 of the guide pin plate 37.

In the embodiment shown in FIG. 6A, the shape of the fixed pipe and the shape of the guide pin socket are changed from those of the first embodiment. The wedge fixed pipe 81 is
At one end thereof, a wedge-shaped portion K1 is provided so that the thickness is reduced in the direction of arrow 65.

On the other hand, the guide pin socket 83 has a wedge-shaped portion K2 at the end where the large-diameter portion 25 does not exist so that the thickness increases in the direction of arrow 65.
By engaging the wedge-shaped portions K1 and K2, the large-diameter portion 25 is kept in contact with the upper surface P1 of the guide pin plate 37.

In the embodiment shown in FIG. 6B, the shape of the fixed pipe and the shape of the guide pin socket are changed from those of the first embodiment. The guide pin socket 87
The small diameter portion B4 has a groove for a rib on the entire circumference or a part thereof.

On the other hand, the fixed pipe 85 with a rib is provided with a rib R near its one end so as to engage with the aforementioned groove for the rib.
One. By engaging the rib groove and the rib R1, the large-diameter portion 25 is
7 is kept in contact with the upper surface P1.

In the embodiment shown in FIGS. 5A and 5B, each component is made of a metal material, as in the first embodiment. On the other hand, in the embodiment shown in FIGS. 6A and 6B, each component is made of a somewhat elastic material (for example, plastic or the like). This is shown in FIG.
To be easily inserted into the guide pin socket 83,
In FIG. 6B, this is because the fixed pipe 85 with ribs can be easily inserted into the guide pin socket 87.

In each of the above-described embodiments, the guide pin socket is engaged with the place where the first screw portion and the second screw portion are screwed, the fixing ring, the wedge pipe, the ribbed pipe, and the like. The place to be touched is performed at an end of the guide pin socket or the like, but is not limited to the illustrated one as long as the place is away from the lower surface, which is the second surface of the guide pin plate. That is, screwing of each screw portion may be performed at an intermediate portion of the guide pin socket.

In the above-described first embodiment, the outer diameter d2 of the fixed pipe 17 is the same as the outer diameter d1 of the large-diameter portion 25 of the guide pin socket 15, but if the outer diameter d2 is substantially the same. However, the present invention is not limited to the example.

[Brief description of the drawings]

FIG. 1 is a partially sectional bird's-eye view of a guide pin holding mechanism 1 of a printed board inspection apparatus according to the present invention.

FIG. 2 is a cross-sectional view of the guide pin holding mechanism 1 according to FIG.

FIG. 3 is a view for explaining how to use the guide pin holding mechanism 1 according to FIG. 1;

FIG. 4 is a sectional view of a main part of a printed circuit board inspection apparatus 50 having the guide pin holding mechanism 1 according to FIG.

FIG. 5 is a plan view showing a guide pin holding mechanism of a printed circuit board inspection apparatus according to another embodiment of the present invention;
Is a fixing nut 73, B is a fixing ring 77
FIG.

FIG. 6 is a plan view showing a guide pin holding mechanism of a printed circuit board inspection apparatus according to another embodiment of the present invention;
It is a figure which shows what uses the fixed pipe 81 with a wedge, and B shows what uses the fixed pipe 85 with a rib.

FIG. 7 is a sectional view of a main part of a conventional printed circuit board inspection apparatus.

FIG. 8 is a sectional view of a main part of a conventional guide pin holding mechanism.

[Explanation of symbols]

 13 guide pin 15 guide pin socket H15 holding hole 17 fixed pipe 25 large diameter part 37 guide pin plate B1 small diameter part S1 first screw part S2 second screw part

Claims (5)

[Claims] A guide pin for holding a printed circuit board; a guide pin holder having a guide pin holding hole for inserting and holding the guide pin; and an insertion hole for inserting and holding the guide pin holder.
A guide pin holding mechanism for a printed circuit board inspection device, comprising: a guide pin movable plate for positioning the guide pin with respect to an inspection jig; wherein the guide pin holder includes the guide pin. A second portion facing the first surface of the movable guide pin plate, having a large-diameter portion that comes into contact with the first surface so as not to come off from the first surface side of the movable pin plate to the second surface side; A guide pin holding mechanism for a printed circuit board inspection apparatus, wherein a holding member for holding a state where the large-diameter portion is in contact with the first surface is provided on the surface side. 2. The guide pin holding mechanism according to claim 1, wherein an outer diameter of said holding member is substantially equal to an outer diameter of a large diameter portion of said guide pin holder. The holding hole has a small-diameter portion in which the inner diameter of the guide pin holding hole becomes smaller at a portion away from the second surface, and the guide pin retainer and the holding member are connected by the small-diameter portion. The guide pin holding mechanism of the printed circuit board inspection device, wherein the large diameter portion is held in a state of being in contact with the first surface by joining. 3. A guide pin holding mechanism for a printed board inspection apparatus according to claim 2, wherein a first screw portion is formed in a small diameter portion of said guide pin holder, and said holding member is provided with said first screw portion. A guide pin holding mechanism for a printed circuit board inspection device, wherein a second screw portion to be screwed with the first screw portion is formed. 4. A guide socket having a guide pin for holding a printed circuit board, a cylindrical shaft portion, a head at one end of the shaft portion, and a screw portion at the other end of the shaft portion, wherein the guide pin is A guide socket axially passing through the inside of the shaft portion, a fixed pipe having a screw portion screwed with a screw portion of the guide socket, a shaft portion of the guide socket can penetrate, and a head of the guide socket and the fixing portion A guide pin position adjusting mechanism for a printed circuit board inspection device, comprising: a guide pin plate having a hole whose diameter cannot be penetrated by the pipe, wherein a shaft portion of the guide socket is inserted into the hole of the guide pin plate and protrudes from the hole. The shaft portion of the guide socket is inserted into the fixed pipe, and the screw portions of the two are screwed together, whereby the guide pin plate, the guide socket, and the like are connected. The fine said fixed pipe is clamped, the guide pin position adjusting mechanism of the printed circuit board inspection apparatus according to claim. 5. A guide pin is inserted into a guide pin holding hole of a guide pin holder, and the guide pin holder into which the guide pin is inserted is inserted into an insertion hole of a guide pin movable plate, and the guide pin holder has A guide pin in a printed circuit board inspection device for contacting a large diameter portion with the first surface so that the guide pin retainer does not come off from the first surface side of the guide pin movable plate to the second surface side. A holding method, wherein the guide pin holder is held on the guide pin movable plate in a state where the large-diameter portion is pressed against the first surface. Retention method.