KR200195087Y1 - Wet etching apparatus for semiconductor wafer - Google Patents

Wet etching apparatus for semiconductor wafer Download PDF

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Publication number
KR200195087Y1
KR200195087Y1 KR2019950003314U KR19950003314U KR200195087Y1 KR 200195087 Y1 KR200195087 Y1 KR 200195087Y1 KR 2019950003314 U KR2019950003314 U KR 2019950003314U KR 19950003314 U KR19950003314 U KR 19950003314U KR 200195087 Y1 KR200195087 Y1 KR 200195087Y1
Authority
KR
South Korea
Prior art keywords
semiconductor wafer
wet etching
etching apparatus
wet
omission
Prior art date
Application number
KR2019950003314U
Other languages
Korean (ko)
Other versions
KR960029728U (en
Inventor
김정태
Original Assignee
김영환
현대반도체주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김영환, 현대반도체주식회사 filed Critical 김영환
Priority to KR2019950003314U priority Critical patent/KR200195087Y1/en
Publication of KR960029728U publication Critical patent/KR960029728U/en
Application granted granted Critical
Publication of KR200195087Y1 publication Critical patent/KR200195087Y1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Weting (AREA)

Abstract

누락omission

Description

누락omission

누락omission

누락omission

누락omission

누락omission

Claims (1)

누락omission
KR2019950003314U 1995-02-27 1995-02-27 Wet etching apparatus for semiconductor wafer KR200195087Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019950003314U KR200195087Y1 (en) 1995-02-27 1995-02-27 Wet etching apparatus for semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019950003314U KR200195087Y1 (en) 1995-02-27 1995-02-27 Wet etching apparatus for semiconductor wafer

Publications (2)

Publication Number Publication Date
KR960029728U KR960029728U (en) 1996-09-17
KR200195087Y1 true KR200195087Y1 (en) 2000-10-02

Family

ID=19408502

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019950003314U KR200195087Y1 (en) 1995-02-27 1995-02-27 Wet etching apparatus for semiconductor wafer

Country Status (1)

Country Link
KR (1) KR200195087Y1 (en)

Also Published As

Publication number Publication date
KR960029728U (en) 1996-09-17

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