KR200176366Y1 - Pcb forming hole for restraining stress - Google Patents
Pcb forming hole for restraining stress Download PDFInfo
- Publication number
- KR200176366Y1 KR200176366Y1 KR2019990018104U KR19990018104U KR200176366Y1 KR 200176366 Y1 KR200176366 Y1 KR 200176366Y1 KR 2019990018104 U KR2019990018104 U KR 2019990018104U KR 19990018104 U KR19990018104 U KR 19990018104U KR 200176366 Y1 KR200176366 Y1 KR 200176366Y1
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- South Korea
- Prior art keywords
- printed circuit
- circuit board
- hole
- screw
- casing
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1401—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means
- H05K7/1402—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards
- H05K7/1407—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards by turn-bolt or screw member
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10409—Screws
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Abstract
본 고안은, 소정의 케이싱에 스크류 체결되기 위한 스크류공을 갖는 인쇄회로기판에 관한 것으로서, 상기 스크류공의 둘레에 적어도 하나의 응력전달 차단용 관통공이 형성되어 있는 것을 특징으로 한다. 이에 의해, 스크류 체결시 발생하는 응력의 전달을 막아 부품의 솔더크랙을 방지할 수 있게 된다.The present invention relates to a printed circuit board having a screw hole for screwing into a predetermined casing, characterized in that at least one through hole for stress transmission blocking is formed around the screw hole. As a result, it is possible to prevent the transfer of the stress generated during screw fastening to prevent the solder crack of the component.
Description
본 고안은 응력 전달 방지용 관통공을 갖는 인쇄회로기판에 관한 것으로서, 보다 상세하게는, 소정의 케이싱에 스크류 결합에 의해 고정시 스크류의 조임력에 의해 부품이 응력을 받아 솔더크랙이 발생하는 것을 방지할 수 있도록 응력 전달 방지용 관통공을 갖는 인쇄회로기판에 관한 것이다.The present invention relates to a printed circuit board having a through hole for preventing stress transmission, and more particularly, to prevent the occurrence of solder cracks due to stress of a component by a screw tightening force when a screw is fixed to a predetermined casing. It relates to a printed circuit board having a through hole for preventing stress transmission.
일반적으로 인쇄회로기판에는 소정의 제어를 수행하기 위한 회로패턴이 형성되며, 인쇄회로기판상에는 소정의 소자들이 납땜되어 제품내에서 하나의 기능 블록으로 작용한다. 이러한 인쇄회로기판은 여러 가지 방식으로 제작되는데, 통상 수십 미크론 두께의 전해동박을 플라스틱 절연판 위에 접착시킨 다음, 소정의 배선 패턴의 레지스트를 프린트한다. 그리고, 에칭으로 불필요한 부분의 전해동박을 제거한 다음, 부품을 인쇄회로기판에 탑재한다.Generally, a circuit pattern for performing a predetermined control is formed on a printed circuit board, and predetermined elements are soldered on the printed circuit board to function as one functional block in the product. Such printed circuit boards are fabricated in various ways. Typically, an electrolytic copper foil of tens of microns thick is adhered onto a plastic insulating plate, and then a resist of a predetermined wiring pattern is printed. Then, the electrolytic copper foil of the unnecessary portion is removed by etching, and then the component is mounted on the printed circuit board.
이러한 인쇄회로기판은 텔레비젼,VCR, 전자렌지, 냉장고 등의 전자제품에 사용되며, 전자제품내에 수용될 때는 임의의 위치 또는 케이싱에 인쇄회로기판을 고정시키게 된다.Such printed circuit boards are used in electronic products such as televisions, VCRs, microwave ovens, refrigerators, etc., and when they are accommodated in electronic products, the printed circuit boards are fixed to arbitrary positions or casings.
인쇄회로기판은, 통상 도 3에 도시된 바와 같이, 플라스틱 수지류로 형성된 케이싱(55)에 고정되며, 케이싱(55)은 인쇄회로기판(51)과 거의 동일한 크기의 케이싱면(56)과, 케이싱면(56)으로부터 연장절곡되어 상호 대응하는 적어도 한 쌍의 측면(57)을 포함한다. 여기서, 양 측면(57)에는 인쇄회로기판(51)의 안착을 위한 안착턱(58)이 형성되어 있으며, 케이싱면(56)에는 인쇄회로기판(51)과의 스크류 결합을 위한 고정보스(59)가 형성되어 있다. 고정보스(59)의 내경에는 스크류 결합을 위한 암나사산이 형성되어 있으며, 고정보스(59)는 안착턱(58)과 동일한 높이로 형성되도록 설계된다. 한편, 인쇄회로기판(51)에는 고정보스(59)에 대응하는 위치에 스크류의 관통을 위한 스크류공(53)이 형성되어 있다.As shown in FIG. 3, the printed circuit board is fixed to a casing 55 formed of plastic resin, and the casing 55 includes a casing surface 56 having a size substantially the same as that of the printed circuit board 51. It includes at least a pair of side surfaces 57 that extend from the casing surface 56 and correspond to each other. Here, the mounting jaw 58 for mounting the printed circuit board 51 is formed on both side surfaces 57, and the casing surface 56 has a high information 59 for screw coupling with the printed circuit board 51. ) Is formed. An internal thread of the screw thread is formed in the inner diameter of the high thread 59, and the high thread 59 is designed to be formed at the same height as the seating jaw 58. On the other hand, the printed circuit board 51 is formed with a screw hole 53 for penetrating the screw at a position corresponding to the high information 59.
이러한 케이싱(55)에 인쇄회로기판(51)을 고정하는 경우, 먼저, 인쇄회로기판(51)을 측면(57)의 안착턱(58)에 안착시킨 다음, 스크류공(53)과 고정보스(59)가 관통하도록 스크류를 결합시키게 된다. 그런데, 케이싱(55)을 정밀가공하지 아니하여 고정보스(59)의 높이가 안착턱(58)보다 낮을 경우, 스크류 결합시 스크류의 조임력에 의해 인쇄회로기판(51)에 스크류공(53)을 중심으로 한 영역에 휨이 발생하게 된다. 이 때, 스크류공(53)에 인접한 부품들은 인쇄회로기판(51)에 가해지는 응력로 인해 솔더크랙이 발생하게 된다는 문제점이 있다.When fixing the printed circuit board 51 to the casing 55, first, the printed circuit board 51 is seated on the seating jaw 58 of the side surface 57, and then the screw hole 53 and the high information ( 59 to engage the screw through. However, when the casing 55 is not precisely processed and the height of the high information 59 is lower than the seating jaw 58, the screw hole 53 is applied to the printed circuit board 51 by the tightening force of the screw when the screw is engaged. Warping occurs in the centered area. At this time, the parts adjacent to the screw hole 53 has a problem that the solder crack occurs due to the stress applied to the printed circuit board (51).
특히, BGA(Ball grid array)패키지나 반도체 칩을 직접 인쇄회로기판(51)상에 실장하여 형성한 COB(Chip on board)패키지, 리드를 패키지의 하면에 노출시킨 CSP(Chip Scale Package) 등과 같이 다수의 접속접들을 가지고 인쇄회로기판(51)에 밀접하게 실장되는 부품과, IC나 칩과 같이 소형의 부품은 힘을 많이 받아 솔더크랙이 발생하기 쉬우며, 인쇄회로기판(51)의 두께가 얇을수록 솔더크랙의 발생이 심해진다.In particular, such as a ball grid array (BGA) package, a chip on board (COB) package formed by directly mounting a semiconductor chip on a printed circuit board 51, a chip scale package (CSP) in which leads are exposed on a lower surface of the package, and the like. Parts that are closely mounted to the printed circuit board 51 having a plurality of connection contacts, and small parts such as ICs and chips are prone to solder cracks due to high force, and the thickness of the printed circuit board 51 is increased. The thinner it is, the harder the crack is.
따라서 본 고안의 목적은, 케이싱에 고정시 스크류 결합에 의한 응력으로 솔더크랙이 발생하는 것을 방지할 수 있도록 하는 응력 전달방지용 관통공을 갖는 인쇄회로기판을 제공하는 것이다.Therefore, an object of the present invention is to provide a printed circuit board having a through hole for preventing stress transmission to prevent the occurrence of solder cracks by the stress due to the screw coupling when fixed to the casing.
도 1은 본 고안에 따른 인쇄회로기판의 케이싱 고정시 측단면도,1 is a side cross-sectional view of fixing the casing of the printed circuit board according to the present invention,
도 2는 도 1의 인쇄회로기판의 부분 확대 평면도,FIG. 2 is a partially enlarged plan view of the printed circuit board of FIG. 1;
도 3은 종래의 인쇄회로기판의 케이싱 고정시 측단면도이다.3 is a side cross-sectional view of fixing a casing of a conventional printed circuit board.
<도면의 주요부분에 대한 부호의 설명><Explanation of symbols for main parts of the drawings>
1 : 인쇄회로기판 3 : 스크류공1: printed circuit board 3: screw hole
5 : 케이싱 6 : 케이싱면5: casing 6: casing surface
7 : 측면 8 : 안착턱7: side 8: seating jaw
9 : 고정보스 10 : 관통공9: high information 10: through hole
상기 목적은, 본 고안에 따라, 소정의 케이싱에 스크류 체결되기 위한 스크류공을 갖는 인쇄회로기판에 있어서, 상기 스크류공의 둘레에 적어도 하나의 응력전달 차단용 관통공이 형성되어 있는 것을 특징으로 하는 인쇄회로기판에 의해 달성된다.The above object is, according to the present invention, in a printed circuit board having a screw hole for screwing into a predetermined casing, at least one stress transmission blocking hole is formed around the screw hole is printed Achieved by a circuit board.
여기서, 상기 관통공은 원호상으로 형성된 것이 바람직하다.Here, the through hole is preferably formed in an arc shape.
이하, 도면을 참조하여 본 고안을 상세히 설명한다.Hereinafter, the present invention will be described in detail with reference to the drawings.
인쇄회로기판이 고정되는 케이싱은, 도 1에 도시된 바와 같이, 인쇄회로기판(1)과 거의 동일한 크기의 평면으로 형성되는 케이싱면(6)과, 케이싱면(6)의 연부로부터 절곡되어 연장되어 상호 마주보는 적어도 한 쌍의 측면(7)을 가진다. 각 측면(7)에는 인쇄회로기판(1)의 연부가 안착되도록 케이싱(5)의 내측으로 돌출한 안착턱(8)이 형성되어 있으며, 케이싱면(6)에는 인쇄회로기판(1)을 향해 내측으로 돌출한 적어도 하나의 고정보스(9)가 형성되어 있다. 고정보스(9)는 그 높이가 안착턱(8)의 높이와 거의 동일하게 설계되며, 내경부에는 스크류와의 결합을 위한 암나사산이 형성되어 있다.The casing to which the printed circuit board is fixed, as shown in FIG. 1, is bent from the casing surface 6 and the edge of the casing surface 6 and formed in a plane having substantially the same size as the printed circuit board 1. To have at least one pair of sides 7 facing each other. Each side surface 7 has a seating projection 8 protruding into the casing 5 so that the edge of the printed circuit board 1 is seated, and the casing surface 6 faces the printed circuit board 1. At least one high intelligence 9 protruding inward is formed. The high information 9 is designed so that the height thereof is almost the same as the height of the seating jaw 8, and the internal thread is formed with a female thread for coupling with the screw.
한편, 인쇄회로기판(1)에는, BGA패키지와 COB패키지 및 CSP패키지, IC 등의 부품이 실장되어 있으며, 고정보스(9)에 대응하는 위치에 인쇄회로기판(1)을 관통하는 스크류공(3)이 형성되어 있다. 통상적으로 BGA패키지와 COB패키지, CSP 등과 같이 다수의 접속점들을 가지고 인쇄회로기판(1)에 밀접하게 실장되는 부품이나 IC등과 같은 소형 부품은 작은 응력에도 민감하므로 스크류공(3)으로부터 소정의 이격거리를 두고 실장해야 하며, BGA패키지와 COB패키지, CSP는 스크류공(3)으로부터 적어도 10mm 이상의 이격거리를 두어야 하고, IC나 칩부품은 적어도 5mm 이상의 이격거리를 두어야 한다.On the other hand, the printed circuit board 1 is mounted with components such as a BGA package, a COB package, a CSP package, and an IC, and a screw hole penetrating the printed circuit board 1 at a position corresponding to the high information 9 ( 3) is formed. In general, a small component such as an IC or a component that is closely mounted to the printed circuit board 1 having a plurality of connection points such as a BGA package, a COB package, and a CSP is sensitive to small stresses, and thus has a predetermined distance from the screw hole 3. The BGA package, the COB package, and the CSP should be separated by at least 10mm from the screw hole (3), and the IC or chip components should be separated by at least 5mm.
그런데, 인쇄회로기판(1)의 설계상 부품과 스크류공(3) 사이에 충분한 이격거리를 두지 못하는 경우, 도 2에 도시된 바와 같이, 스크류공(3)과 부품의 사이에 스크류공(3)의 원주방향을 따라 인쇄회로기판(1)이 절개된 관통공(10)을 형성하게 된다. 이 관통공(10)은 부품과 스크류공(3) 사이에 스크류공(3)에 결합되는 스크류의 결합시 발생하는 인쇄회로기판(1)의 휨에 따른 응력의 전달을 방지할 수 있도록 충분한 길이로 형성되어야 한다.By the way, when the design of the printed circuit board 1 does not provide a sufficient separation distance between the component and the screw hole 3, as shown in Figure 2, the screw hole 3 between the screw hole 3 and the component A through hole 10 through which the printed circuit board 1 is cut is formed along the circumferential direction. The through hole 10 is of sufficient length to prevent the transfer of stress due to the bending of the printed circuit board 1 generated when the screw coupled to the screw hole 3 is engaged between the part and the screw hole 3. It should be formed as
이러한 구성에 의하여, 케이싱(5)에 인쇄회로기판(1)을 고정할 때, 인쇄회로기판(1)의 스크류공(3)과 케이싱(5)의 고정보스(9)를 관통하여 스크류를 체결하면 스크류의 조임력에 의해 인쇄회로기판(1)의 휨이 발생하며, 이 때, 인쇄회로기판(1)의 휨으로 인해 형성되는 응력은 관통공(10)에 의해 그 전달이 차단되게 된다.With this configuration, when fixing the printed circuit board 1 to the casing 5, the screw is fastened through the screw hole 3 of the printed circuit board 1 and the high information 9 of the casing 5. When the printed circuit board 1 is bent due to the tightening force of the lower surface screw, the stress generated due to the bending of the printed circuit board 1 is blocked by the through hole 10.
이에 따라, 인쇄회로기판(1)을 스크류로 케이싱(5)에 고정할 때 발생하는 응력로 인해 인쇄회로기판(1)에 실장된 부품의 솔더크랙이 발생하는 것을 방지할 수 있게 된다.Accordingly, it is possible to prevent the solder crack of the component mounted on the printed circuit board 1 due to the stress generated when the printed circuit board 1 is fixed to the casing 5 with a screw.
이상 설명한 바와 같이, 본 고안에 따르면, 스크류 체결을 위한 스크류공과 부품 사이에 관통공을 형성함으로써, 스크류 체결시 발생하는 응력의 전달을 막아 부품의 솔더크랙을 방지할 수 있게 된다.As described above, according to the present invention, by forming a through hole between the screw hole for screw fastening and the component, it is possible to prevent the transfer of the stress generated during screw fastening to prevent solder cracking of the component.
Claims (2)
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KR2019990018104U KR200176366Y1 (en) | 1999-08-28 | 1999-08-28 | Pcb forming hole for restraining stress |
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KR2019990018104U KR200176366Y1 (en) | 1999-08-28 | 1999-08-28 | Pcb forming hole for restraining stress |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101061092B1 (en) | 2009-07-07 | 2011-09-01 | 후지쯔 가부시끼가이샤 | Semiconductor device, method for manufacturing semiconductor device and electronic device |
KR101433454B1 (en) * | 2012-07-25 | 2014-08-28 | (주)엠제이티 | manufacture method of printed circuit board having teflon |
-
1999
- 1999-08-28 KR KR2019990018104U patent/KR200176366Y1/en not_active IP Right Cessation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101061092B1 (en) | 2009-07-07 | 2011-09-01 | 후지쯔 가부시끼가이샤 | Semiconductor device, method for manufacturing semiconductor device and electronic device |
KR101433454B1 (en) * | 2012-07-25 | 2014-08-28 | (주)엠제이티 | manufacture method of printed circuit board having teflon |
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