KR200160812Y1 - A chip projection unit - Google Patents
A chip projection unit Download PDFInfo
- Publication number
- KR200160812Y1 KR200160812Y1 KR2019960068549U KR19960068549U KR200160812Y1 KR 200160812 Y1 KR200160812 Y1 KR 200160812Y1 KR 2019960068549 U KR2019960068549 U KR 2019960068549U KR 19960068549 U KR19960068549 U KR 19960068549U KR 200160812 Y1 KR200160812 Y1 KR 200160812Y1
- Authority
- KR
- South Korea
- Prior art keywords
- tip
- wafer
- protrusion
- present
- projection unit
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
본 고안은 소자 돌상 장치의 팁 부분의 금속성 물질을 연성 물질로 대체하여 돌상 작업중 소자이 손상되는 것을 방지할 수 있는 연성 물질을 이용한 소자 돌상 장치에 관한 것으로, 소자 돌상 장치에 있어서, 재질이 연성체인 팁(10), 상기 팁(10)이 삽입되는 원통형 삽입홈(21)이 형성된 핀(20)으로 구성되는 것을 특징으로 한다.The present invention relates to a device projection device using a flexible material that can prevent the damage of the device during the stone operation by replacing the metallic material of the tip portion of the device projection device with a soft material, in the device projection device, the material is a soft tip 10, the tip 10 is characterized in that consisting of a pin 20 is formed a cylindrical insertion groove 21 is inserted.
Description
본 고안은 소자 돌상 장치에 관한 것으로, 특히 소자 돌상 장치의 팁 부분의 금속성 물질을 연성 물질로 대체하여 돌상 작업중 소자가 손상되는 것을 방지할 수 있는 연성 물질을 이용한 소자 돌상 장치에 관한 것이다.The present invention relates to an element protrusion device, and more particularly, to an element protrusion device using a soft material capable of preventing damage to an element during a stone operation by replacing a metallic material of a tip portion of the element protrusion device with a soft material.
반도체를 제작함에 있어, 반도체를 대량 생산하기 위해서 일정 크기의 웨이퍼를 이용하여 다량의 소자를 만든 후에, 공정 종료후에 웨이퍼상에서 각각의 소자를 절단하여 개별의 소자로 조립하는 방법이 사용되고 있다. 이때 웨이퍼에서 각각의 소자를 절단하는 돌상 장치로서 종래에는 날카로운 금속성 물질을 사용한 팁을 이용하고 있어, 돌상 작업중 소자에 손상을 입히는 문제점이 있었다.In manufacturing a semiconductor, in order to mass-produce a semiconductor, a large number of devices are made by using a wafer of a certain size, and after completion of the process, each device is cut on the wafer and assembled into individual devices. At this time, a tip using a sharp metallic material is conventionally used as a protrusion device for cutting each device from the wafer, and there is a problem of damaging the device during the stone work.
본 고안은 상기의 문제점을 해결하기 위하여 안출된 것으로서, 소자의 돌상 장치에 사용하는 팁 부분을 연성 물질을 사용하여 웨이퍼에서 소자을 돌상하는 작업중에 소자에 손상을 주지 않는 연성 물질을 이용한 웨이퍼 돌상 장치를 제공하는 것을 목적으로 하고 있다.The present invention has been made in order to solve the above problems, a wafer protrusion device using a flexible material that does not damage the device during the process of projecting the device on the wafer using a flexible material in the tip portion used in the device of the device protrusion. It aims to provide.
상기의 목적을 달성하기 위하여 본 고안은, 소자 돌상 장치에 있어서, 재질이 연성체인 팁, 상기 팁이 삽입되는 원통형 삽입홈이 형성된 핀으로 구성됨을 특징으로 한다.In order to achieve the above object, the present invention, in the device projection device, characterized in that the material is composed of a tip formed of a flexible material, a pin formed with a cylindrical insertion groove is inserted into the tip.
도 1은 본 고안에 따른 소자 돌상 장치의 구성도1 is a block diagram of a device protrusion device according to the present invention
도 2는 본 고안에 따른 핀의 조립도2 is an assembly view of the pin according to the present invention
＜도면의 주요부분에 대한 부호의 설명＞<Description of the code | symbol about the principal part of drawing>
10:팁 20:핀10: Tip 20: Pin
도면을 참조하여 본 고안의 구성을 상세히 설명하면 다음과 같다.Referring to the drawings the configuration of the present invention in detail as follows.
도 2는 본 고안 소자 돌상 장치의 측면도로서, 소자 돌상 장치에 있어서, 재질이 연성체인 팁(10), 상기 팁(10)이 삽입되는 원통형 삽입홈(21)이 형성된 핀(20)으로 구성된다.FIG. 2 is a side view of the device protrusion device of the present invention, wherein the device protrusion device includes a tip 10 having a flexible material and a pin 20 having a cylindrical insertion groove 21 into which the tip 10 is inserted. .
상기와 같이 구성된 본 고안의 작용을 설명하면 다음과 같다.Referring to the operation of the present invention configured as described above are as follows.
다량의 소자를 제조함에 있어, 일정 크기의 웨이퍼(1)를 사용하여 웨이퍼(1)상에 소자를 제조한 후에 각각의 소자를 돌상하기 위해 소자 돌상 장치를 사용하게 된다. 웨이퍼(1)의 상부에서 흡착기(2)를 이용하여 웨이퍼(1)상에 형성된 소자를 흡입한다. 동시에 웨이퍼(1)의 하부에서 돌상 장치의 팁(10)이 소자를 상방으로 힘을 가하여 소자가 용이하게 돌상되도록 한다.In manufacturing a large amount of devices, after fabricating devices on the wafer 1 using a wafer 1 of a certain size, an element protrusion device is used to project each device. At the top of the wafer 1, the adsorber 2 is used to suck the elements formed on the wafer 1. At the same time, the tip 10 of the projection device at the bottom of the wafer 1 exerts an upward force on the device so that the device easily projections.
이때, 팁(10)은 연성 물질(예를 들어, 고무)로 되어 있어, 팁(10)에 많은 힘이 가해지더라도 웨이퍼(1)상의 소자에 손상을 주지 않는다.At this time, the tip 10 is made of a soft material (for example, rubber), so that even if a lot of force is applied to the tip 10, the tip on the wafer 1 is not damaged.
또한, 핀(20)과 팁(10)은 교체 가능한 구조로 되어 있어, 팁(10)의 반복된 사용으로 인해 팁(10)이 마모되면, 팁(10)만을 교체하도록 한다.In addition, the pin 20 and the tip 10 has a replaceable structure, so that only the tip 10 is replaced when the tip 10 wears due to repeated use of the tip 10.
상기와 같이 구성된 본 고안은 웨이퍼에서 소자을 돌상하는 돌상 장치의 팁을 연성 물질을 사용함으로써 소자 돌상 작업중 소자에 손상을 입히는 일이 없어지게 되어 생산 수율을 높이고, 팁의 교체가 용이하여 교체시간을 줄이는 효과가 있다.The present invention configured as described above uses a soft material for the tip of the protrusion on the wafer, which prevents damage to the device during the device protrusion, thereby increasing the production yield and reducing the replacement time by easily replacing the tip. It works.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019960068549U KR200160812Y1 (en) | 1996-12-30 | 1996-12-30 | A chip projection unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019960068549U KR200160812Y1 (en) | 1996-12-30 | 1996-12-30 | A chip projection unit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR19980055340U KR19980055340U (en) | 1998-10-07 |
| KR200160812Y1 true KR200160812Y1 (en) | 1999-11-15 |
Family
ID=19489509
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019960068549U KR200160812Y1 (en) | 1996-12-30 | 1996-12-30 | A chip projection unit |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR200160812Y1 (en) |
-
1996
- 1996-12-30 KR KR2019960068549U patent/KR200160812Y1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR19980055340U (en) | 1998-10-07 |
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