KR200159409Y1 - Error correction device of rotary table for semiconductor package marking machine - Google Patents
Error correction device of rotary table for semiconductor package marking machine Download PDFInfo
- Publication number
- KR200159409Y1 KR200159409Y1 KR2019970014580U KR19970014580U KR200159409Y1 KR 200159409 Y1 KR200159409 Y1 KR 200159409Y1 KR 2019970014580 U KR2019970014580 U KR 2019970014580U KR 19970014580 U KR19970014580 U KR 19970014580U KR 200159409 Y1 KR200159409 Y1 KR 200159409Y1
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- KR
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- rotary table
- semiconductor package
- plate
- hole
- marking
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67282—Marking devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
본 고안은 반도체 패키지 마킹장비용 로타리 테이블의 오차 보정장치에 관한 것으로, 스텝모터에 의해 분활 회전되는 플레이트에 원주방향으로 4등분 된 위치로 각각 안착홈을 형성하여서 된 로타리 테이블에 있어서, 상기한 플레이트의 분할 회전시 오차를 보정하도록 플레이트의 저면에 원주방향으로 4등분 된 위치에 각각 홀을 형성하고, 이 홀에 삽입되는 홀더를 하부에 실린더에 의해 상하로 작동되도록 설치한 것이다.The present invention relates to a device for compensating errors of a rotary table for semiconductor package marking equipment, wherein the rotary table is formed by forming seating grooves in four circumferential directions on a plate that is divided by a step motor. In order to compensate for the error in the divided rotation of the plate, each hole is formed at a position circumferentially divided into the bottom of the plate, and the holder inserted into the hole is installed to be operated up and down by a cylinder at the bottom.
Description
본 고안은 반도체 패키지 마킹장비용 로타리 테이블의 오차 보정장치에 관한 것으로, 더욱 상세하게는 반도체 패키지의 일면에 문자 및 기호(자재의 고유번호, 회사명, 날짜 등)를 인쇄하는 마킹공정시 로타리 테이블을 이용하여 분할 회전시키면서 마킹 및 검사를 실시할 때 상기한 로타리 테이블의 분활 회전시 오차를 보정하도록 함으로서 불량을 방지하고, 생산성을 향상시켜 품질을 높이도록 된 것이다.The present invention relates to an error compensator for a rotary table for semiconductor package marking equipment, and more particularly, to a rotary table during a marking process of printing letters and symbols (material unique number, company name, date, etc.) on one surface of a semiconductor package. When the marking and inspection while performing a divided rotation by using to correct the error in the rotation of the rotary table is to prevent the defect, improve the productivity by improving the productivity.
일반적으로 반도체 패키지는 여러 단계의 공정(원자재검사, 소잉공정, 다이본딩공정, 와이어본딩공정, 몰딩공정, 마킹공정 등)을 거쳐 반도체 패키지의 제품으로 출고된다.In general, the semiconductor package is shipped as a product of the semiconductor package through a multi-step process (material inspection, sawing process, die bonding process, wire bonding process, molding process, marking process, etc.).
상기에 있어서, 마킹고정은 자재를 몰딩 성형한 후에 그 표면에 정교한 인쇄를 하는 것으로, 이러한 마킹공정을 위해서는 자재를 한 피치씩 이송시켜 정확한 위치에 고정시킨 상태로 마킹를 하는 것이다.In the above, the marking fixing is a precise printing on the surface of the molding after molding the material, for this marking process is to transfer the material by a pitch to the marking in a fixed position.
그러나, 이와같이 자재를 이송시켜 정확한 위치에서 고정시켜 마킹을 하기에는 많은 어려움이 수반되었던 것이다. 즉, 마킹공정 수행시에 자재의 유동이 발생되는 등의 이유로 마킹패드(MARKING PAD)와 정확한 셋팅이 되지 못하고, 자재의 위치가 틀려지므로 마킹불량이 발생되는 문제점이 있었다.However, it was accompanied by a lot of difficulties to transport the material and fix the marking in the correct position. That is, there is a problem in that marking defects occur because the marking pad cannot be accurately set due to the flow of the material during the marking process, and the position of the material is incorrect.
본 고안의 목적은 이와같은 문제점을 해소하기 위하여 안출된 것으로서, 반도체 패키지의 일면에 마킹할 때 로타리 테이블을 이용하여 분할 회전시키면서 마킹 및 검사를 실시하고, 상기 로타리 테이블이 정확한 위치로 분할 회전되도록 함으로서 불량을 방지하고, 생산성을 향상시켜 품질을 높이도록 된 반도체 패키지 마킹장비용 로타리 테이블의 오차 보정장치를 제공함에 있다.An object of the present invention is to solve the above problems, and when marking on one surface of the semiconductor package by marking and inspecting while rotating using a rotary table, by rotating the rotary table to the correct position by The present invention provides an error compensator for a rotary table for semiconductor package marking equipment to prevent defects and improve productivity.
제1도는 본 고안에 따른 반도체 패키지 마킹장치의 정면도.1 is a front view of a semiconductor package marking apparatus according to the present invention.
제2도는 본 고안에 따른 반도체 패키지 마킹장치의 구성을 나타낸 평면도.Figure 2 is a plan view showing the configuration of a semiconductor package marking apparatus according to the present invention.
제3도는 본 고안에 따른 로타리 테이블의 오차 보정장치를 나타낸 평면도.3 is a plan view showing an error correction apparatus for a rotary table according to the present invention.
제4도는 본 고안에 따른 로타리 테이블의 오차 보정장치를 나타낸 정면도.Figure 4 is a front view showing the error correction device of the rotary table according to the present invention.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
1 : 플레이트 2 : 안착홈1: plate 2: seating groove
3 : 스텝모터 4 : 홀3: step motor 4: hole
5 : 홀더 6 : 실린더5: holder 6: cylinder
이하, 본 고안을 첨부된 도면을 참조하여 상세히 설명하면 다음과 같다.Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.
제1도는 본 고안에 따른 반도체 패키지 제조용 마킹장치의 정면도이고, 제2도는 본 고안에 따른 반도체 패키지 제조용 마킹장치의 전체 구성을 나타낸 평면도이다. 도시된 바와같이 본 고안에 따른 마킹장치의 구성은, 몰드 성형된 다수개의 자재(7)를 순차적으로 공급하는 자재공급부(A)와, 상기한 자재공급부(A)에서 공급된자재(7)를 이송시키는 자재이송부(B)와, 상기한 자재이송부(B)에 의해 이송되는 자재(7)의 상면을 흡착하여 순차적으로 이송시키는 흡착이송부(C)와, 상기한 흡착이송부(C)에 의해 이송된 자재(7)의 배면에 마킹을 하도록 상기한 자재를 180°회전이송시켜 분할 회전되는 로타리 테이블(10)에 안착시키는 제1 회전이송부(D)와, 상기한 제1 회전이송부(D)에 의해 이송되어 로타리 테이블(10)에 안착된 자재(7)의 배면에 마킹하는 마킹부(F)와, 상기한 마킹부(F)에서 마킹된 상태를 검사하는 검사부(G)와, 상기한 검사부(G)에서 검사 완료된 자재(7)를 180°회전이송시켜 자재이송부(B)로 회전 이송시키는 제2 회전이송부(E)와, 상기한 제2 회전이송부(E)에 의해 마킹된 자재(7) 중에서 마킹불량의 자재(7)를 흡착이송하여 배출하는 불량자재배출부(I)와, 마킹 완료된 자재(7)의 마킹부위를 큐(Qure)시키는 건조부(H)와, 상기한 건조부(H)를 통과한 자재(7)를 배출시키는 자재배출부(J)로 이루어진 것이다.1 is a front view of a marking apparatus for manufacturing a semiconductor package according to the present invention, and FIG. 2 is a plan view showing the overall configuration of the marking apparatus for manufacturing a semiconductor package according to the present invention. As shown in the configuration of the marking apparatus according to the present invention, the material supply unit (A) for sequentially supplying a plurality of mold-formed material (7), and the material 7 supplied from the material supply unit (A) To the material conveying unit (B) for conveying, the adsorption conveying unit (C) for adsorbing and sequentially transferring the upper surface of the material (7) conveyed by the material conveying unit (B), and the adsorption conveying unit (C). A first rotational transfer part (D) for seating on the rotary table (10) which is rotated by 180 ° so as to mark the back surface of the material (7) transferred by the rotary table (10), and the first rotational transfer part Marking part (F) for marking on the back of the material (7) transported by (D) and seated on the rotary table 10, and the inspection unit (G) for inspecting the state marked by the marking part (F); , The second rotation to rotate the conveyed material (180) 180 ° by the inspection unit (G) to the material transfer unit (B) Defective material discharging unit (I) for absorbing and discharging the material (7), which is not marked, by the sending unit (E), the material (7) marked by the second rotary transfer unit (E), and the finished material. It consists of the drying part H which queues the marking part of (7), and the material discharge part J which discharge | releases the material 7 which passed the said drying part H.
제2도와 제3도는 본 고안에 따른 로타리 테이블의 오차 보장장치를 나타낸 평면도와 장면도이다. 도시된 바와같이 로타리 테이블의 오차 보정장치의 구성은, 스텝모터(3)에 의해 분활 회전되는 플레이트(1)에 원주방향으로 4등분 된 위치로 각각 안착홈(2)을 형성하여서 된 로타리 테이블에 있어서, 상기한 플레이트(1)의 분할 회전시 오차를 보정하도길렀 플레이트(1)의 저면에 원주방향으로 4등분 된 위치에 각각 홀(4)을 형성하고, 이 홀(4)에 삽입되는 홀더(5)를 하부에 실린더(6)에 의해 상하로 작동되도록 설치한 것을 특징으로 하는 것이다.2 and 3 are plan and scene views showing an error guarantee device of a rotary table according to the present invention. As shown in the figure, the configuration of the error compensator of the rotary table is formed in the rotary table formed by forming the seating grooves 2 in the circumferential direction, respectively, on the plate 1 that is divided by the step motor 3. In this case, a hole 4 is formed at a position circumferentially divided into the bottom surface of the plate 1, and the holder is inserted into the hole 4. (5) is characterized in that installed in the lower portion to be operated up and down by the cylinder (6).
상기한 홀(4)은 플레이트(1)의 저면에서 상부로 직경이 좁아지는 테이퍼로 형성되고, 이 홀(4)에 삽입되는 홀더(5)는 상기한 홀(4)에 형성된 테이퍼와 대응하는 테이터가 형성된 것이다.The hole 4 is formed of a taper narrowing in diameter from the bottom of the plate 1 to the upper portion, and the holder 5 inserted into the hole 4 corresponds to the taper formed in the hole 4. Data is formed.
이와같이 구성된 본 고안은 자재(7)가 플레이트(1)의 안착홈(2)에 위치하면 상기한 플레이트(1)는 스텝모터(3)에 의해 분활 회전되면서 자재에 마킹 및 마킹된 상태를 검사하는 것으로, 이와같이 상기한 플레이트(1)를 분활 회전시킬 때 상기한 플레이트(1)는 기계적인 구성으로 동작함으로서 기계 자체가 가지고 있는 오파(빽래쉬)에 의한 정확도가 떨어짐으로서, 이러한 오차를 보정하도록 실린더(6)에 의해 상승하는 흘더(5)가 플레이트(1)에 형성된 홀(4)에 삽입되어 오차를 조정하는 것이다. 이때, 상기한 홀더(5) 및 홀(4)에는 서로 대응하는 테이퍼가 형성되어 있음으로서 상기한 흘더(5)가 정확하게 상기한 홀(4)에 삽입되어 오차를 보정하는 것이다.When the material 7 is located in the seating groove 2 of the plate 1, the present invention configured as described above may inspect the state in which the plate 1 is marked and marked on the material while being divided by the step motor 3. In this way, when the plate 1 is divided and rotated in this way, the plate 1 operates in a mechanical configuration, and thus the accuracy of the machine itself is lowered by the backlash, so that the cylinder is corrected. The holder 5 which rises by (6) is inserted into the hole 4 formed in the plate 1, and an error is adjusted. At this time, since the taper corresponding to each other is formed in the holder 5 and the hole 4, the holder 5 is accurately inserted into the hole 4 to correct an error.
이상의 설명에서 알 수 있듯이 본 고안에 의하면, 반도체 패키지의 마킹공정시 자재가 안착된 로타리 테이블을 분할 회전시키면서 마킹공정을 하고, 상기 로타리 테이블이 정확하게 분할 회전되도록 오차를 보정함으로서 불량을 방지하고, 생산성을 향상시켜 품질을 높일 수 있는 효과가 있다.As can be seen from the above description, according to the present invention, the marking process is performed while rotating the rotary table on which the material is seated during the marking process of the semiconductor package, and the defect is prevented by correcting the error so that the rotary table is correctly divided and rotated. Improve the quality is effective.
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019970014580U KR200159409Y1 (en) | 1997-06-17 | 1997-06-17 | Error correction device of rotary table for semiconductor package marking machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019970014580U KR200159409Y1 (en) | 1997-06-17 | 1997-06-17 | Error correction device of rotary table for semiconductor package marking machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR19990001171U KR19990001171U (en) | 1999-01-15 |
| KR200159409Y1 true KR200159409Y1 (en) | 1999-10-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019970014580U KR200159409Y1 (en) | 1997-06-17 | 1997-06-17 | Error correction device of rotary table for semiconductor package marking machine |
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| Country | Link |
|---|---|
| KR (1) | KR200159409Y1 (en) |
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1997
- 1997-06-17 KR KR2019970014580U patent/KR200159409Y1/en not_active IP Right Cessation
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| Publication number | Publication date |
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| KR19990001171U (en) | 1999-01-15 |
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