KR200158670Y1 - Transfer device for ink marking of ic package - Google Patents
Transfer device for ink marking of ic package Download PDFInfo
- Publication number
- KR200158670Y1 KR200158670Y1 KR2019940009056U KR19940009056U KR200158670Y1 KR 200158670 Y1 KR200158670 Y1 KR 200158670Y1 KR 2019940009056 U KR2019940009056 U KR 2019940009056U KR 19940009056 U KR19940009056 U KR 19940009056U KR 200158670 Y1 KR200158670 Y1 KR 200158670Y1
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- Prior art keywords
- package
- ink marking
- guide rail
- ink
- marking
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67282—Marking devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
본 고안은 집적회로 패키지의 잉크마킹을 위한 자재이송장치에 관한 것으로서 자재이송장치(6)의 일측 가이드레일(7) 전방에 상,하로 리드스크류A,B(11)(12)를 서보모터A,B(9)(10)의 구동에 회전되도록 설치하고, 리드스크류A(11)와 B(12)에는 이송구A,B(13)(17)를 좌우 이송되게 설치하며, 이송구A,B(13)(17)의 상부에는 고정구(15)(19)를 실린더(14)(18)에 각각 설치하여 실린더(14)(18)의 작동에 의해 고정구(15)(19)가 상,하로 이송되도록 일측 가이드레일(7) 상부에 위치시키고, 고정구(15)(19) 일단에는 복수개의 파일럿핀(16)(20)을 각각 하부로 설치하여 일측 가이드레일(7)상에 좌우로 형성된 가이드홈(8)에 위치되게 함으로서 잉크마킹부(21)의 공정으로 투입되는 자재(23)를 이송구A(13) 및 B(17)가 순차적으로 이송시킬 수 있도록 함으로서 패키지 마킹을 용이하게 시행하고, 오동작을 방지하며, 작업공정의 정확성으로 제품의 마킹품질을 높일 수 있도록 한 것이다.The present invention relates to a material transfer device for ink marking of an integrated circuit package, wherein the lead screws A, B (11) and (12) are moved up and down in front of one guide rail (7) of the material transfer device (6). , B (9) and 10 are rotated to drive, and the feed holes A, B (13) and 17 are left on the lead screws A (11) and B (12). It is installed to be conveyed rightly, and the fasteners 15 and 19 are installed on the cylinders 14 and 18 at the upper portions of the transfer ports A and B 13 and 17, respectively, by the operation of the cylinders 14 and 18. Position the upper side of the guide rail 7 so that the fixtures 15 and 19 are transported up and down, and a plurality of pilot pins 16 and 20 are installed at one end of the fixtures 15 and 19, respectively. Left on guide rail (7) By positioning the guide groove 8 formed at the right side, it is possible to sequentially transport the material 23 introduced in the process of the ink marking part 21 by the transfer ports A 13 and B 17 to facilitate package marking. It is designed to improve the marking quality of products with the accuracy of work process.
Description
제1도는 본 고안의 자재이송장치의 전체시스템.1 is a whole system of the material transfer device of the present invention.
제2도는 본 고안의 자재이송장치.2 is a material transfer device of the present invention.
제3도는 본 고안의 자재이송장치의 전체 시스템의 블록도.3 is a block diagram of the entire system of the material conveying apparatus of the present invention.
제4도는 본 고안의 자재이송장치로 이송되는 집적회로 패키지 자재.4 is an integrated circuit package material conveyed to the material conveying apparatus of the present invention.
제5도는 본 고안의 자재이송장치의 작용상태도.5 is a working state of the material transfer device of the present invention.
제6도는 본 고안의 자재이송장치의 이송구B의 요구전면도.6 is a required front view of the transfer port B of the material transfer device of the present invention.
제7도는 제6도의 이송구B의 요부확대 작용도.7 is an enlarged view of the main portion of the transfer tool B of FIG.
제8도는 종래의 자재이송장치 구조도.8 is a structure diagram of a conventional material transfer apparatus.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
1 : 잉크마킹 시스템 2 : 매거진 투입장치1: Ink Marking System 2: Magazine Feeding Device
3 : 흡착이송장치 4 : 브러싱장치3: adsorption transfer device 4: brushing device
5,7 : 가이드레일 6 : 자재이송장치5,7: guide rail 6: material transfer device
8 : 가이드홈 9,10 : 서보모터A,B8: Guide groove 9,10: Servo motor A, B
14,18 : 실린더 15,19 : 고정구14,18 Cylinder 15,19 Fixture
16,20 : 파일럿핀 21 : 잉크마킹부16,20: pilot pin 21: ink marking unit
23 : 자재 24 : 리드프레임23 material 24 leadframe
26 : 출력측구멍 27 : 투입측구멍26: output side hole 27: input side hole
28 : 패키지28: Package
본 고안은 집적회로 패키지의 잉크마킹을 위한 자재이송 시스템에 관한 것으로서, 특히 서보모터(SERVO MOTOR)의 가변 조작으로 회전하는 리드스크류(LEAD SCREW)에서 좌우로 이송되는 이송구A,B의 고정구가 잉크마킹부로 이송되는 집적회로 패키지의 자재를 원활하게 마킹할 수 있도록 순차적으로 이송시킬 수 있도록 한 패키지의 잉크마킹을 위한 자재 이송 장치에 관한 것이다.The present invention relates to a material transfer system for ink marking of an integrated circuit package, and in particular, the lead screw (LEAD SCREW) is rotated by a variable operation of the servo motor (SERVO MOTOR) The present invention relates to a material conveying apparatus for ink marking a package so that the fasteners of the conveying ports A and B conveyed to the right can be sequentially transferred to smoothly mark the material of the integrated circuit package conveyed to the ink marking unit.
일반적으로 반도체는 리드프레임(LEAD FRAME)을 와이어본딩(WIRE BONDING) 하고, 몰드(MOLDING)공정에서 에폭시(EPOXY)몰딩된 패키지 상부 표면을 정교하게 인쇄하기 위한 마킹 공정으로 자재를 공급시켜 잉크마킹 하도록 한 것으로서, 종래에는 도시된 도면 제8도에서와 같이 잉크마킹 시스템의 가이드(50) 상부에 자재(23)를 안치하여 이송시키는 이송구(51)를 설치하고, 이송구(51) 하부에는 실린더(53)를 설치하며, 상부에는 리드프레임(24)에 몰드성형된 다수개의 패키지(28)가 삽입되는 요홈(52)을 다수개 형성하여 잉크마킹되는 패키치(28)의 상부면을 마킹부(21)의 패드(22)가 콘트롤부에서의 제어명령에 따라 마킹되도록 이송구(51)를 이송시켜서 된 것이다.In general, semiconductors are wire-bonded to lead frames and the marking process for precisely printing the surface of the epoxy-molded package in the molding process to supply ink for marking. In one embodiment, as shown in FIG. 8, a conveyance port 51 is disposed on the upper portion of the guide 50 of the ink marking system in order to place the material 23 thereon, and a cylinder is disposed below the conveyance port 51. A 53 is installed, and a plurality of grooves 52 into which a plurality of packages 28 are molded into the lead frame 24 are formed on the upper portion of the marking portion to mark the upper surface of the package 28 to be ink-marked. The conveying port 51 is conveyed so that the pad 22 of 21 may be marked in accordance with a control command from the control unit.
이와같이 구성된 종래의 잉크마킹을 위한 자재 이송장치는 가이드(50) 상부에 설치된 이송구(51)의 상부를 리드프레임(24)에 성형되는 패키지(28)의 수량에 맞도록 요홈(52)을 패키지(28)가 삽입되는 외부면보다 일정틈새(S)를 갖도록 조금 크게 형성하여 패키지(28)의 삽착성을 좋게 하였으나, 이송구(51)에 의해 이송되는 자재(23)가 틈새(S)에 의해 유동됨에 따라 마킹공정 수행시 마킹부(21)의 마킹패트(22;MARKING PAD)와 정위치로 셋팅되지 못하고, 패키치(28)의 위치가 틀려지므로 마킹불량이 발생되는 문제점이 있었다.The material conveying apparatus for the conventional ink marking configured as described above packages the groove 52 so that the upper portion of the conveying port 51 installed on the upper guide 50 matches the quantity of the package 28 formed on the lead frame 24. Forming a little larger to have a predetermined clearance (S) than the outer surface is inserted (28) to improve the insertability of the package 28, but the material 23 conveyed by the conveying port (51) by the clearance (S) As the fluid flows, the marking pad 22 of the marking part 21 may not be set to the correct position and the position of the package 28 is changed, thereby causing marking defects.
따라서, 본 고안은 상기와 같은 종래의 문제점을 해결하기 위하여 안출한 것으로서, 일측 가이드레일에 형성된 가이드홈에 자재를 이송시키는 이송구A,B에 연결되어 회전하는 리드스크류A,B에 이송구A,B를 좌우 이송되게 설치하여 잉크마킹 되는 자재를 안정되게 이송시킬 수 있도록 함으로서 패캐지표면에 잉크마킹을 정확하고 깨끗하게 할 수 있게 한 것을 목적으로 한다.Therefore, the present invention has been devised to solve the conventional problems as described above, the feed hole A to the lead screw A, B which is connected to the feed holes A, B to transfer the material to the guide groove formed on one side guide rail Left B The purpose is to make the ink marking on the package surface accurate and clean by installing it so that the material can be stably transferred.
이하, 본 고안의 구성을 상세히 설명하면 다음과 같다.Hereinafter, the configuration of the present invention in detail as follows.
리드프레임(24)에 패키지(28) 몰드된 자재(23)를 잉크마킹 시스템(1)의 입력측에 다수의 자재(23)를 적층시키는 매거진 투입장치(2)가 구성되고, 상부에는 자재(23)를 흡착하여 이송시키는 흡착이송장치(3)가 구성되며, 흡착이송장치(3)의 좌우 길이방향에는 가이드레일(5)(7)을 각각 설치하여 자재(23)가 흡착이송장치(3)에서 가이드레일(5)(7)을 따라 마킹부(21)로 이송되게 하고, 흡착이송장치(3)의 일측에는 브러싱장치(4:BRUSHING)를 구성하며, 브러싱장치(4) 이후의 일측 가이드레일(7)에는 길이방향으로 가이드홈(8)을 형성하고, 이일측 가이드레일(7) 전방의 상,하에는 리드스크류A,B(11)(12)를 서보모터A,B(9)(10)의 구동에 회전하도록 리드스크류A,B(11)(12) 양측을 브라켓(B)에 설치하여 리드스크류A(11)와 B(12)에 이송구A,B(13)(17)를 좌우로 이송되게 설치하며, 이송구A,B(13)(17)의 상부에는 고정구(15)(19)를 실린더(14)(18)에 각각 설치하여 실린더(14)(18)의 작동에 의해 고정구(15)(19)가 상,하로 이동되도록 일측 가이드레일(7) 상부에 위치시키고, 고정구(15)(19)의 일단에는 복수개의 파일럿핀(16)(20)을 각각 하부로 설치하여 일측 가이드레일(7)상에 형성된 가이드홈(8)에 위치시키므로 잉크마킹부(21)의 공정으로 투입되는 자재(23)를 이송구A(13) 및 B(17)가 순차적으로 안정되게 이송시킬 수 있도록 하며, 잉크마킹된 후에 공정에는 가이드레일(5)(7)로 출력되는 자재(23)의 패키지(28) 마킹의 상태를 비젼시스템에 의해 검사한 후, 건조장치(30)에서 건조되도록 구성하고, 자재(23)를 출력시키는 출력매거진(31)이 구비된 것이다.A magazine injector 2 is formed which stacks a plurality of materials 23 on the input side of the ink marking system 1 with the material 23 molded in the package 28 on the leadframe 24, and the material 23 on top. ) Is composed of an adsorption conveying apparatus (3) for adsorbing and conveying Guide rails (5) and (7) are respectively installed in the longitudinal direction so that the material (23) is transferred from the adsorption transfer device (3) to the marking portion (21) along the guide rails (5) and (7). One side of the device (3) constitutes a brushing device (4: BRUSHING), one side guide rail (7) after the brushing device (4) to form a guide groove (8) in the longitudinal direction, two-sided guide rail (7) Both sides of the lead screws A and B (11) and 12 are rotated so that the lead screws A and B (11) and 12 are rotated to drive the servo motors A and B (9) and (10). To the lead screws A (11) and B (12). It is installed to be conveyed to the right side, and the fasteners 15 and 19 are installed in the cylinders 14 and 18 at the upper portions of the transfer ports A and B 13 and 17, respectively, by the operation of the cylinders 14 and 18. Position the upper side of the guide rail 7 so that the fixtures 15 and 19 are moved up and down, and a plurality of pilot pins 16 and 20 are installed at one end of the fixtures 15 and 19, respectively. Since it is located in the guide groove (8) formed on one side of the guide rail (7), the conveying port A (13) and B (17) to the material 23 is introduced into the process of the ink marking portion 21 in order to stably transfer After the ink marking process, the state of marking the package 28 of the material 23 output to the guide rails 5 and 7 is inspected by the vision system, and then dried in the drying apparatus 30. It is configured so that the output magazine 31 for outputting the material 23 is provided.
이와같이 구성된 본 고안이 작용 및 효과를 첨부된 도면에 의하여 상세하게 설명하면 다음과 같다.The present invention configured as described above will be described in detail with reference to the operation and effects as follows.
제1도는 본 고안의 전체 구성도로서 리드프레임(24)에 패키지(28) 몰드된 자재(23)를 잉크마킹 시스템(1)의 입력측에 다수의 자재(23)를 적층시키는 매거진 투입장치(2)의 상부에 설치된 자재 흡착 이송장치(3)가 자재(23)를 흡착하여 좌우로 형성된 가이드레일(5)(7)상에 안치되도록 한후 일측으로 형성된 브러싱장치(4)로 자재(23)를 이송시켜 자재(23)의 이물질 및 불순물을 브러싱에 의하여 자재(패키지 리드프레임:23)를 세척한다.1 is an overall configuration diagram of the present invention, a magazine feeding device 2 for stacking a plurality of materials 23 on the input side of the ink marking system 1 with the material 23 molded into the package 28 on the leadframe 24. Material adsorption transfer device (3) installed on top of the The material 23 is transferred to the brushing device 4 formed on one side after being placed on the guide rails 5 and 7 formed on the right side, and the foreign matter and impurities of the material 23 are brushed to remove the material (package lead frame: 23). )).
브러싱장치(4)에서 세척된 자재(23)는 흡착 이송장치(3)에 의해 가이드레일(5)(7)을 따라 이송하여 자재 이송장치(6)인 이송구A(13)의 고정구(15) 셋팅위치 하부에 접근하면 콘트롤부(C)의 작업공정 메모리 셋팅된 제어명령에 따라 순서적으로 실린더(14)가 하부로 작동하여 고정구(15)를 하부로 이동시켜 복수개의 파일럿핀(16)을 자재(23)의 리드프레임(24) 양측에 구비된 사이드레일(25)에 형성된 투입측구멍(27)에 삽입하게 된다.The material 23 washed by the brushing device 4 is transported along the guide rails 5 and 7 by the suction feeder 3 so that the fastener 15 of the feeder A 13, which is the material feeder 6, is transported. When approaching the lower setting position, the cylinder 14 moves downward in order according to the control command set by the work process memory of the control unit C to move the fixture 15 downward so that the plurality of pilot pins 16 Is inserted into the input side hole 27 formed in the side rails 25 provided on both sides of the lead frame 24 of the material 23.
이때 투입측구멍(27)으로 삽입되는 파일럿핀(16)은 일측 가이드레일(7)의 길이방으로 형성된 가이드홈(8)에 의해 자재(23)의 투입측구멍(27)에 용이하게 삽입하도록 하였고, 이송구A(13)의 고정구(15) 파일럿핀(16)은 제4도에서와 같이 자재(23)의 입력측(29)에서 선두의 복수개 출력측 구멍(26)이후로 형성된 투입측구멍(27)에 삽입되도록 하여 서보모터A(9)의 작동에 따라 회전하는 리드스크류A(11)에 의해 이송구A(13)가 도시된 도면 제5도에서와 같이 일측의 화살표 방향으로 진행하므로서 자재(23)가 일정위치까지 이송되도록 하였다.At this time, the pilot pin 16 inserted into the input side hole 27 is easily inserted into the input side hole 27 of the material 23 by the guide groove 8 formed in the longitudinal direction of the one side guide rail 7. As shown in FIG. 4, the pilot pin 16 of the fixture 15 of the feeder A 13 is formed on the input side hole formed after the plurality of leading output side holes 26 at the input side 29 of the material 23. 27, the feed hole A 13 is moved in the direction of the arrow on one side by the lead screw A 11 which rotates according to the operation of the servo motor A 9, as shown in FIG. 23 was to be conveyed to a certain position.
이렇게 이송구A(13)의 진행에 따라 이송되는 자재(23)는 자재 이송장치(6)의 상부에 구성된 마킹부(21)의 패드(22)가 패키지(28) 표면에 접촉되어 연속적으로 잉크마킹을 시행하도록 한 것이다.In this way, the material 23 conveyed in accordance with the progress of the conveying port A 13 has the pad 22 of the marking portion 21 formed on the upper portion of the material conveying apparatus 6 in contact with the surface of the package 28 to continuously ink. Marking is to be done.
이와같이 이송구A(13)의 진행과 동시에 이동되어 잉크마킹된 자재(23)는 출력축구멍(26)이 이송구B(17)의 세팅위치에 접근하게 되면 이송구B(17)의 실린더(18)에 의해 고정구(19)가 하부로 이동되어 복수개의 파일럿핀(20)이 출력축구멍(26)에 삽입되어 서보모터B(10)의 작동으로 회전하는 리드스크류B(12)가 회전하여 이송구B(17)를 출력측으로 이송시키는 동시에 이송구A(13)의 고정구(15)는 실린더(14)가 상부로 이송되어 파일럿핀(16)을 투입축구멍(27)에서 해제되어 서보모터A(9)의 역회전에 따라 리드스크류A(11)에서 이송구A(13)가 원위치로 복귀하여 브러싱장치(4)에서 투입되어지는 자재(23)를 순차적으로 이송시키도록 준비한다.In this way, the material 23 moved and ink-marked at the same time as the delivery port A 13 proceeds is moved to the cylinder 18 of the delivery port B 17 when the output shaft hole 26 approaches the setting position of the delivery port B 17. The fastener 19 is moved downward by a plurality of pilot pins 20 are inserted into the output shaft hole 26 so that the lead screw B 12 rotated by the operation of the servo motor B 10 rotates. At the same time as the B 17 is transferred to the output side, the fastener 15 of the feed hole A 13 has the cylinder 14 moved upwards, and the pilot pin 16 is released from the feed shaft hole 27 so that the servo motor A ( In accordance with the reverse rotation of 9), the lead screw A (11) is returned to its original position in the lead screw A (11) to prepare to sequentially transport the material (23) fed from the brushing device (4).
상기한 이송구B(17)는 패키지(28)에 잉크마킹된 자재(23)를 출력측으로 이송시켜 출력매거진(31)으로 출력시키도록 한 후 서보모터B(10)의 역회전에 따라 최초의 위치로 회복되게 함으로서 자재(23)의 잉크마킹 공정이 완료되도록 한 것이다.The transfer port B 17 transfers the ink-marked material 23 to the output side of the package 28 to be output to the output magazine 31, and then, according to the reverse rotation of the servo motor B 10, By returning to the position, the ink marking process of the material 23 is completed.
이렇게 마킹부(21)의 패드(22)로 마킹된 자재(23)가 출력매거진(31)으로 출력될 때 상기자재이송장치(6)의 공정에서는 비젼시스템에 의한 마킹상태를 검사하고 이어 적외선 건조장치(30)를 통과하여 마킹된 자재(23)를 건조시키도록 하였다.When the material 23 marked by the pads 22 of the marking part 21 is output to the output magazine 31, the marking state by the vision system is examined in the process of the material transfer device 6, and then infrared drying is performed. The marked material 23 was allowed to dry through the device 30.
상술한 바와같이 본 고안은 자재의 패키지에 잉크마킹하는 시스템에서 자재 이송장치를 일측 가이드레일 전방에 상,하로 리드스크류A,B를 서보모터A,B의 구동에 회전되게 설치하고, 리드스크류A 및 B에는 이송구A,B를 좌우 이송되게 설치하며, 이송구A,B의 상부에는 고정구를 실린더에 각각 설치하여 실린더의 상,하 작동에 의해 고정구가 상,하 이동되도록 일측 가이드레일 상부에 위치시키고, 고정구에는 복수개의 파일럿핀을 각각 하부로 설치하여 가이드홈에 일치되게 함으로서 잉크마킹부의 공정으로 투입되는 자재를 이송구A,B가 순차적으로 이송시킴에 따라 자재의 패키지 표면에 용이하게 잉크마킹되도록 함으로서 마킹작업의 오동작을 방지하고, 작업공정의 정확성으로 인하여 제품의 마킹품질을 높일 수 있도록 한 효과가 있다.As described above, the present invention installs the lead screw A and B to rotate the drive of the servomotors A and B in a system for ink-marking a material package up and down in front of one side of the guide rail. And B are left for the feed holes A and B. It is installed to be conveyed rightly, and the fasteners are installed on the cylinders at the upper portions of the transport ports A and B, respectively, and are positioned on the upper side of the guide rails so that the fasteners can be moved up and down by the up and down operation of the cylinders. To the bottom of the guide grooves to match the guide grooves to transfer the material introduced by the process of the ink marking part in order to transfer ink sequentially to the surface of the material package to prevent ink from malfunctioning marking work And, due to the accuracy of the work process has an effect to increase the marking quality of the product.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019940009056U KR200158670Y1 (en) | 1994-04-27 | 1994-04-27 | Transfer device for ink marking of ic package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019940009056U KR200158670Y1 (en) | 1994-04-27 | 1994-04-27 | Transfer device for ink marking of ic package |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR950031508U KR950031508U (en) | 1995-11-22 |
| KR200158670Y1 true KR200158670Y1 (en) | 1999-10-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019940009056U KR200158670Y1 (en) | 1994-04-27 | 1994-04-27 | Transfer device for ink marking of ic package |
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| Country | Link |
|---|---|
| KR (1) | KR200158670Y1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100453690B1 (en) * | 1997-12-30 | 2005-02-24 | 앰코 테크놀로지 코리아 주식회사 | Material transfer gripper of loading apparatus for bga semiconductor package to smoothly transfer material and plan transfer precision |
-
1994
- 1994-04-27 KR KR2019940009056U patent/KR200158670Y1/en not_active IP Right Cessation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100453690B1 (en) * | 1997-12-30 | 2005-02-24 | 앰코 테크놀로지 코리아 주식회사 | Material transfer gripper of loading apparatus for bga semiconductor package to smoothly transfer material and plan transfer precision |
Also Published As
| Publication number | Publication date |
|---|---|
| KR950031508U (en) | 1995-11-22 |
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