KR200141280Y1 - Cooling plate fixing device for circuit board - Google Patents
Cooling plate fixing device for circuit board Download PDFInfo
- Publication number
- KR200141280Y1 KR200141280Y1 KR2019940009733U KR19940009733U KR200141280Y1 KR 200141280 Y1 KR200141280 Y1 KR 200141280Y1 KR 2019940009733 U KR2019940009733 U KR 2019940009733U KR 19940009733 U KR19940009733 U KR 19940009733U KR 200141280 Y1 KR200141280 Y1 KR 200141280Y1
- Authority
- KR
- South Korea
- Prior art keywords
- heat sink
- circuit board
- fixed
- circuit
- contact plate
- Prior art date
Links
- 238000001816 cooling Methods 0.000 title description 3
- 238000003780 insertion Methods 0.000 claims description 15
- 230000037431 insertion Effects 0.000 claims description 15
- 230000017525 heat dissipation Effects 0.000 claims description 3
- 230000014759 maintenance of location Effects 0.000 claims 1
- 239000000853 adhesive Substances 0.000 abstract description 5
- 230000001070 adhesive effect Effects 0.000 abstract description 5
- 238000000034 method Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4093—Snap-on arrangements, e.g. clips
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
본 고안은 회로기판의 방열판 고정장치에 관한 것이다.The present invention relates to a heat sink fixing device of the circuit board.
종래의 방열판은 회로부품을 나사, 접착제등으로 고정되고, 방열판도 회로기판에 나사로 체결됨에 따라 작업성과 생산성이 저하되는 원인이 되었다.In the conventional heat sink, the circuit parts are fixed with screws, adhesives, and the like, and the heat sink is also screwed to the circuit board, causing workability and productivity to be deteriorated.
본 고안은 이와 같은 문제점을 해결하기 위한 것으로 방열판(3)에 걸림턱(6)(6a)(6b)을 형성하여 회로 부품에 접촉되게 회로기판에 삽입하고 대향측에서 방열판(3)과 회로 부품을 말착시키는 제 1 탄성부(10)의 방열판에 결합되는 제 2 탄성부(11)를 가지고, 걸림턱(9)(9a)으로써 회로기판에 고정되는 밀착판(16)으로 구성하여 분해 조립이 가능하게 한 것이다.The present invention is to solve this problem is formed in the heat sink (3), the locking projection (6) (6a) (6b) is formed in the circuit board to be in contact with the circuit components and the heat sink (3) and the circuit components on the opposite side It has a second elastic portion 11 is coupled to the heat sink of the first elastic portion 10 for attaching the end, and is composed of a close contact plate (16) fixed to the circuit board by the locking jaw (9) (9a) It is possible.
Description
제1도는 본 고안 실시예의 조립상태 사시도1 is an assembled perspective view of the embodiment of the present invention
제2도는 본 고안 실시예의 분해사시도2 is an exploded perspective view of an embodiment of the present invention
제3도는 본 고안 실시예의 방열판이 회로기판에 고정되는 상태를 예시한 단면도3 is a cross-sectional view illustrating a state in which the heat sink of the embodiment of the present invention is fixed to the circuit board
제4도는 본 고안 실시예의 밀찰판이 회로기판에 고정되는 상태를 예시한 단면도4 is a cross-sectional view illustrating a state in which the smudge plate of the embodiment of the present invention is fixed to a circuit board
제5도는 본 고안 실시ㅖ의 조립상태 단면도5 is a cross-sectional view of the assembly state of the present invention implementation
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
3 : 방열판 4,4a,4b : 방열판 삽입홈3: heat sink 4,4a, 4b: heat sink insertion groove
5,5a : 밀착판 삽입홈 6,6a,6b : 걸림턱5,5a: Contact plate insertion groove 6,6a, 6b: Hanging jaw
9,9a : 걸림턱 10 : 제 1 탄성부9,9a: engaging jaw 10: first elastic portion
11 : 제 2 탄성부11: second elastic portion
본 고안은 방열판 고정장치에 관한 것으로, 특히 나사체결이나 접착제에 의하지 않고 조립식으로 고정될 수 있도록 한 회로기판의 방열판 고정장치에 관한 것이다.The present invention relates to a heat sink fixing device, and more particularly, to a heat sink fixing device of a circuit board to be fixed in a prefabricated manner by screw fastening or adhesive.
회로기판에 고정되는 트랜지스터나 IC 등과 같은 회로 부품들은 비교적 많은 열을 발생하게 되므로 방열판 등을 이용하여 열전도에 의한 냉각을 촉진하여 성능저하와 내부적 파손을 방지하고 있다.Circuit components such as transistors or ICs fixed to the circuit boards generate relatively much heat, thereby preventing cooling and internal damage by promoting cooling by heat conduction using a heat sink.
이러한 방열판은 회로 부품을 나사로 체결하거나 접착제로 고정하여 회로기판에 고정하였다.The heat sink was fixed to the circuit board by fastening the circuit components with screws or fixed with an adhesive.
상기 종래의 방열판은 회로부품이 나사와 접착제로 고정되고, 방열판도 회로기판에 나사로 체결됨에 따라 작업성과 생산성이 저하되고, 차후에 보수 및 수리할때의 작업을 어렵게 하는 원인이 되고 있다.In the conventional heat sink, the circuit components are fixed with screws and adhesives, and the heat sink is also fastened with screws to the circuit board, thereby reducing workability and productivity, which makes it difficult to perform maintenance and repair in the future.
본 고안은 이러한 문제점을 해결하여 별도의 고정물이 없이 조립식으로 방열판을 회로부품에 밀착 고정시킬 수 있는 방열판 고정장치를 제공하기 위한 것이다.The present invention is to provide a heat sink fixing device that can be fixed in close contact with the circuit components in a prefabricated assembly without a separate fixture to solve these problems.
이와 같은 목적을 달성하기 위한 본 고안은 회로부품에 접촉하면서 회로기판에 삽입고정되는 방열판과,The present invention for achieving the above object is a heat sink that is fixed to the circuit board while contacting the circuit component,
상기 방열판에 접촉하는 회로부품의 대향면 쪽에서 회로기판에 삽입고정되어 회로부품이 방열판에 밀착되도록 가입하는 밀착판으로 구성되는 것이다.It is composed of a close contact plate which is fixed to the circuit board is inserted into the circuit board on the opposite side of the circuit component in contact with the heat sink is joined to the heat sink.
회로기판에는 TR, IC 등과 같은 회로 부품이 고정되는 위치를 중심으로 양쪽방향으로 방열판과 밀착판이 고정될 수 있도록 적어도 두개이 삽입홈이 형성된다.At least two insertion grooves are formed in the circuit board so that the heat sink and the contact plate may be fixed in both directions around the position where the circuit components such as TR and IC are fixed.
방열판과 밀착판은 회로기판의 삽입홈에 삽입되는 걸림부위를 가지고 삽입홈에 삽입된 상태에서 측면으로 밀리면서 고정된다.The heat sink and the close contact plate are fixed while being pushed to the side while being inserted into the insertion groove with a locking portion inserted into the insertion groove of the circuit board.
밀착판의 주벽에는 회로 부품을 방열판에 밀착시키기 위한 제 1 탄성부를 가지고 있고, 상부에는 제 2 탄성부가 형성되어 방열판에 탄성으로 결합되면서 제1 탄성부가 회로 부품에 밀착된다.The main wall of the contact plate has a first elastic portion for closely contacting the circuit component to the heat sink, the second elastic portion is formed on the upper portion and the first elastic portion is in close contact with the circuit component while being elastically coupled to the heat sink.
이러한 본 고안에 의하여 방열판과 밀착판이 회로기판에 끼워져서 슬라이딩 이동하는 동작을 고정되고, 방열판에 탄성력을 가지고 결합되는 밀착판에 의해 회로 부품과의 전열면적이 증가되고, 보다 견고한 고정상태를 유지할 수 있게 되는 것이다.By the present invention, the heat sink and the contact plate are fixed to the sliding movement by being fitted to the circuit board, the heat transfer area with the circuit components is increased by the contact plate coupled with the elastic force to the heat sink, it is possible to maintain a more stable fixed state Will be.
이하 본 고안의 실시예를 첨부된 도면에 의하여 상세히 설명하면 다음과 같다.Hereinafter, an embodiment of the present invention will be described in detail with reference to the accompanying drawings.
회로기판(1)에 고정되는 회로부품(2)을 기준으로 하여 한쪽에는 방열판(3)을 고정하기 위한 방열판 삽입홈(4)(4a)(4b) 이 형성되어 있고, 반대쪽에는 방열판(3)을 회로기판(1)에 밀착시키기 위한 밀착판(16)이 고정되는 밀착판 삽입홈(5)(5a)이 형성되어 있다.Based on the circuit part 2 fixed to the circuit board 1, heat sink insertion grooves 4, 4a, 4b for fixing the heat sink 3 are formed on one side, and the heat sink 3 on the opposite side. The contact plate insertion grooves 5 and 5a to which the contact plate 16 for fixing the contact to the circuit board 1 are fixed.
방열판(3)의 하단에는 삽입홈(4)(4a)(4b)에 삽입되는 걸림턱(6)(6a)(6b)이 형성되어 있고, 상단에는 밀착판(16)이 걸릴 수 있도록 안쪽으로 절곡된 절곡편(7)이 형성되어 있다.The lower end of the heat sink 3 is formed with the engaging jaw (6) (6a) (6b) is inserted into the insertion groove (4) (4a) (4b), the upper end inward so that the close contact plate 16 can be caught A bent piece 7 is formed.
걸림(6)(6a) 삽입홈(4)(4a)에 삽입한 다음 한쪽 방향으로 밀을때 삽입홈(4)(4a)의 단부가 삽입되는 공간(8)(8a)을 형성하며 돌설되어 있다.When inserted into the hook (6) (6a) insertion groove (4) (4a) and then pushed in one direction to form a space (8) (8a) is inserted into the end of the insertion groove (4) (4a) have.
밀착판(16)의 하단에는 밀착판 삽입홈(5)(5a)에 삽입되는 걸림턱(9)(9a)이 방열판(3)의 걸림턱(6)(6a)과 엇갈리는 방향으로 형성되어 있고, 회로부품(2)에 접촉하는 제 1 탄성부(10)와, 방열판(3)에 결합되는 제 2 탄성부(11)가 형성되어 있다.At the lower end of the contact plate 16, engaging jaws 9 and 9a, which are inserted into the contact plate insertion grooves 5 and 5a, are formed in a direction crossing with the engaging jaws 6 and 6a of the heat sink 3. The first elastic portion 10 in contact with the circuit component 2 and the second elastic portion 11 coupled to the heat sink 3 are formed.
제 1 탄성부(10)는 회로 부품(2) 측면의 주벽(12)에서 대략 원호의 형상으로 회로부품(2)을 향해서 돌출되어 있다.The first elastic portion 10 protrudes toward the circuit component 2 in the shape of a circular arc on the circumferential wall 12 on the side of the circuit component 2.
제 2 탄성부(11)는 주벽(12)의 상부에서 방열판(3)을 향해서 절곡되는 제 1 절곡면(13)과, 방열판(3)의 절곡편(7) 선단에 걸릴 수 있도록 상기 제 1 절곡면(13)의 선단으로부터 안쪽으로 하향 절곡되는 제 2 절곡면(14)과, 상기 제 2 절곡면(14)이 절곡편(7)에 고정될 때 마찰을 최소화 시켜주기 위한 제 3 절곡면(15)이 형성되어 있다.The second elastic part 11 has a first bent surface 13 that is bent toward the heat dissipation plate 3 from the upper portion of the circumferential wall 12 and the first bent portion 7 so as to be caught on the tip of the bent piece 7 of the heat dissipation plate 3. The second bent surface 14 bent downward inward from the tip of the bent surface 13 and the third bent surface for minimizing friction when the second bent surface 14 is fixed to the bent piece 7. (15) is formed.
이왁 같이 구성되는 본 고안은 제 3 도에서 보는 바와 같이 방열판(3)의 걸림턱(6)(6a)(6b)을 회로기판(1)의 방열판 삽입홈(4)(4a)(4b)에 삽입하여 가상선 A 의 일점쇄선의 상태로 안착한 다음 가상선 B의 이점쇄선 상태로 밀면 걸리턱(6)(6a)이 형성하고 있는 공간(8)(8a)으로 방열판 삽입홈(4)(4a)의 단부가 삽입되어 고정된다.The present invention, which is configured as an ewak, has a locking jaw (6) (6a) (6b) of the heat sink (3) to the heat sink insertion groove (4) (4a) (4b) of the circuit board 1 as shown in FIG. When inserted and seated in the state of the one-dot chain line of the virtual line A, and then pushed in the state of the two-dot chain line of the virtual line B, the heat sink insertion grooves 4 and 4a are formed in the spaces 8 and 8a formed by the latching jaws 6 and 6a. End) is inserted and fixed.
이렇게 방열판(3)이 회로기판에 고정되면 이번에는 밀착판(16)의 걸림턱(9)(9a)을 회로기판(1)의 나머지 밀착판 삽입홈(5)(5a)에 넣어 방열판(3)과 같은 방식을 밀어 끼우되, 방열판(3)의 이동 방향과 반대 방향으로 밀어서 이동시킨 다음 절곡편(7)을 향해서 밀착판(16)의 상단을 밀면 탄성을 축적하여 제 3 절곡면(15)이 절곡편(7)의 경사진 상부면을 타고 이동하게 되고 제 2 절곡면(14) 내측에 도달하였을 때 탄성력을 방열판(3)을 아래쪽으로 누르는 힘이 작용하게 되면서 제 1 탄성부(10)가 회로부품(2)을 측면으로 밀어서 방열판(3)의 측벽과 밀착시키게 된다.When the heat sink 3 is fixed to the circuit board in this manner, the latching jaws 9 and 9 a of the contact plate 16 are inserted into the remaining contact plate insertion grooves 5 and 5 a of the circuit board 1. Push the same method, but in the direction opposite to the movement direction of the heat sink (3) and then push the upper end of the contact plate 16 toward the bending piece (7) to accumulate the elasticity to the third bent surface (15) ) Is moved along the inclined top surface of the bent piece (7) and the first elastic portion (10) acts as a force to press the heat sink (3) downward when the elastic force reaches the inside of the second bent surface (14). ) Pushes the circuit component 2 to the side to be in close contact with the side wall of the heat sink (3).
이와 같은 본 고안은 나사, 접착제 등의 고정방법에 의하지 않고 부품간 조립에 의해 방열판을 설치 할 수 있게 되어 조립과 분해 작업이 매우 간편하게 되는 효과가 있는 것이다.The present invention as described above is able to install the heat sink by assembling the parts, regardless of the fixing method, such as screws, adhesives, so that the assembly and disassembly operation is very easy.
Claims (4)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019940009733U KR200141280Y1 (en) | 1994-04-28 | 1994-04-28 | Cooling plate fixing device for circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019940009733U KR200141280Y1 (en) | 1994-04-28 | 1994-04-28 | Cooling plate fixing device for circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR950031766U KR950031766U (en) | 1995-11-22 |
| KR200141280Y1 true KR200141280Y1 (en) | 1999-05-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019940009733U KR200141280Y1 (en) | 1994-04-28 | 1994-04-28 | Cooling plate fixing device for circuit board |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR200141280Y1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102580830B1 (en) * | 2016-07-13 | 2023-09-20 | 삼성전기주식회사 | Printed circuit board |
-
1994
- 1994-04-28 KR KR2019940009733U patent/KR200141280Y1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR950031766U (en) | 1995-11-22 |
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