KR20010110911A - A powder manufacturing apparatus for a solder paste using a centrifugal atomization method - Google Patents

Abstract

The present invention relates to a solder paste powder manufacturing apparatus by centrifugal spraying, and more particularly, to evenly mixed during the melting of the soldering metals such as lead, tin, and so that the molten metal introduced into the tundish is always maintained at an appropriate level. In addition, it prevents damage to high-speed motors that may occur due to power outages and system errors, improves airtightness when replacing the collection tank, prevents changes in the appearance of powders, and increases the breaking capacity of rotating disks. The present invention relates to a solder paste powder manufacturing apparatus using a centrifugal spraying method that enables the production of solder paste powder having a constant stability and particle size of the system by preventing the formation of residues on the surface.

To this end, the present invention is fixed by a high-speed motor as a support inside the chamber, and installed by the high-speed motor by a centrifugal spray method comprising an atomizer made of a rotating disk which is formed into a powder by crushing the melt to be dropped by centrifugal force In the powder manufacturing apparatus for paste, a powder level sensor is installed inside to collect the produced powder, and when the collected powder reaches a predetermined level, a collecting tank for generating a replacement signal, and installed in the upper center of the chamber And dropping the molten metal to a certain amount with a rotating disk, level sensing of the molten metal, a tundish for stopping the dropping of the molten metal when the high-speed motor stops due to a power failure and a system error, and a soldering element installed on the upper side of the chamber. Melt the solder to form and mix the melt evenly, and titrate according to the level detection of the tundish inner melt. A metal molten portion for discharging a quantity of molten metal, a cooling pipe installed at a predetermined length at the lower side of the chamber to sufficiently cool a large amount of powder and transfer the same without thermal accumulation, and installed at an end of the cooling pipe. Operated by the signal of the powder level sensor is characterized in that the switch is configured to maintain the airtight to block the inflow of external air when replacing the collection tank.

Description

A powder manufacturing apparatus for a solder paste using a centrifugal atomization method}

The present invention relates to a solder paste powder manufacturing apparatus by centrifugal spraying, and more particularly, to evenly mixed during the melting of soldering metals such as lead and tin, so that the molten metal introduced into the tundish is always maintained at an appropriate level. In addition, it prevents damage to high-speed motors that may occur due to power outages and system errors, improves airtightness when replacing the collection tank, prevents changes in the appearance of powders, and increases the breaking capacity of rotating disks. The present invention relates to a solder paste powder manufacturing apparatus using a centrifugal spraying method that enables the production of solder paste powder having a constant stability and particle size of the system by preventing the formation of residues on the surface.

In recent years, various electronic devices such as communication devices, imaging devices, computers, etc. have been miniaturized and highly functionalized, and integrated circuits (ICs), which are one of electronic components to have such a function, are mounted on the surface of a substrate to form an arbitrary circuit. have.

Such an integrated circuit forms a package 2 for protecting the chip on the outer circumference of the chip 1 as shown in FIG. 1A, and the lead pin 3 formed in a transverse shape is provided. The bending package of the structure that is installed to the outside of the package (2) is the main dominant, this bending package is a printed circuit by inserting the lead pin (3) in the inlet groove (5) formed in the printed circuit board 4 and soldered It is attached to the board | substrate 4.

In addition, as the package itself becomes light and thin in accordance with the demand for miniaturization and high functionality of various electronic devices, as shown in FIG. Surface-mount packages, which allow soldering on the surface as they are, have been developed and used for many years, which has the advantage of thinning the entire board without penetrating into the printed circuit board. This technology is called surface mounting technology (SMT). technology).

As described above, the solder paste used to mount the surface mount package on the surface of the printed circuit board using surface mount technology is solder alloy powder such as lead (Pb) and tin (Sn). ) It consists of a mixture consisting of about 90% flux and about 10% flux such as rosin, solvent, etc., and is applied to the electrode plate of the printed circuit board by stencil printer, screen printer, dispensing, etc. The mold package is mounted and mounted on the printed circuit board by soldering by various heating means.

2 (a) to (d) show an embodiment in which a solder paste is applied to a printed circuit board by stencil printing to mount a surface mount package, and as shown in (a), first, a printed circuit After placing a stencil 8 having a plurality of inflow grooves 9 formed on the upper surface of the substrate 4, the solder paste 7 is introduced into the inflow grooves 9 using the presser 10 as shown in (b). After removing the stencil 8 as shown in (c), the solder paste 7 is applied to the electrode wiring of the printed circuit board 4 and the surface-mount package 11 of the solder paste 7 is applied. When heat is applied while the lead pins 12 are seated, a phenomenon of instant melting and solidification of the solder paste 7 occurs, thereby fixing the surface-mount package 11 on the printed circuit board 4 as shown in (d). To be mounted.

As described above, the solder paste for mounting the surface-mount package on the printed circuit board is a solder alloy powder such as lead (Pb) and tin (Sn) (hereinafter referred to as "sol paste paste"). The solder paste powder has a finer sphericity and particle size as Type 2 (Type II: 45㎛ ~) as the pitch spacing of the lead pin is gradually narrowed due to the miniaturization and high functionality of the surface mount packager. 75 micrometers) is gradually decreasing from Type 3 (Type III: 25 micrometers to 45 micrometers).

The method used to produce such a solder paste powder is a gas spray method of pulverizing molten metal as an inert gas, a pressure spray method of spraying by pressing a molten metal through a small orifice, and dropping the molten metal on a disk rotating at high speed. There is a centrifugal spraying method which is obtained by scattering the powder, but the most widely used method is the centrifugal spraying method.

Thus, the prior art of the paste manufacturing apparatus for the paste by the centrifugal spray method is as follows.

3A is a method and apparatus for manufacturing a solder ball of Japanese Patent Application Laid-Open No. 9-10990, in which a spraying process of a molten metal is performed in a fluorine-containing gas atmosphere in order to eliminate a cleaning process of a circuit board with a solvent after soldering. The alloy is charged into the metal melting portion 21, heated and melted in the heating furnace 22, and then a constant tapping solder is dropped into the chamber 24 through the nozzle 23 and at the same time from the plur gas supply portion 25. Fluoride-containing gas is injected into the chamber 24, and the molten metal is crushed by rotating and rotating the rotating disk 26 by the high speed motor 27.

At this time, the rotation speed of the rotating disk 26 is adjusted by the high-speed motor 27, the molten solder dropped from the nozzle 23 is dispersed by collision with the rotating disk 26 while cooling to room temperature in the chamber 24 (Or shredded), fine spherical particles are produced under a fluorine-containing gas atmosphere to be collected through the recovery port 11.

3 (b) is a method for producing spherical metal particles in Japanese Patent Laid-Open No. 7-179912, which supplies 3-500 ppm of nitrogen 28 and oxygen 29 in the chamber 24 to supply the atmosphere in the chamber 24. The particles of the powder are made to be as spherical as possible.

3 (c) shows a method and apparatus for manufacturing a fine metal powder of Japanese Patent Laid-Open No. 6-264116, in which molten metal introduced into the metal melting part 21 is dropped on a rotating disk 26, and the rotating disk 26 of FIG. Crush the molten metal by centrifugal force, adjust the particle size of the nickel metal plated or stainless steel (SUS Mesh) heat treated it, or the fine metal powder produced around the rotating disk 26 by bonding glass fiber or silicon fiber to it It is to prepare a metal powder having a certain size.

3A to 3C, the apparatus for preparing solder paste powder by the centrifugal spray method has various configurations, but the basic structure of the overall system is as shown in FIG.

That is, Figure 4 is a partial cutaway perspective view of a conventional solder paste powder manufacturing apparatus by a typical centrifugal spray method, and the metal melting portion 40 for melting the soldering metal, such as lead (Pb) and tin (Sn) in large form; And a powder forming part 50 for forming solder molten metal (hereinafter referred to as "melt") discharged from the metal melted part 40 into solder paste powder (hereinafter referred to as "powder"), and the solder paste powder. The collecting tank 80 to collect, and the switch 70 which is a ball valve or a throttle valve to block the air inside the powder forming part 50 to maintain the airtight when the collection tank 80 is replaced, The configuration of the in more detail as follows.

The powder forming unit 50 is a high-speed motor 57 that is rotated at a high speed in the lower center of the chamber 51 is fixed by the support 58, the molten metal is installed on the rotating shaft of the high-speed motor 57 dropping The atomizer 59 which consists of the rotating disk 56 which is crushed by centrifugal force and formed into powder is provided.

A tundish 55 for constantly discharging the molten metal to the rotating disk 56 is installed at the upper center portion of the chamber 51, and a cooler 54 for cooling the powder formed by centrifugation at one outer circumference of the chamber 51. Is attached to form the powder forming part 50.

In addition, a molten metal that supplies molten molten solder to the tundish 55 by injecting a soldering solder such as lead (Pb) and tin (Sn) into the upper portion of the chamber 51, which is the powder forming unit 50. 40 is installed, a collecting tank 80 for collecting the manufactured powder of the chamber 51 is installed, and the external air at the time of exchanging the collecting tank 80 between the collecting tank 80 and the cooling pipe 60. Switchgear 70 to block the inflow of is installed is configured.

Here, the molten metal 40 has a cover 42 having a solder inlet 43 formed on the upper portion of the cylindrical melting furnace 41a, as shown in the enlarged cross-sectional view shown in FIG. 5A, and the inside of the melting furnace 41a. A heating part 44 for melting the soldering metal is installed on one side of the wall surface, and the molten melt PS is melted in the lower center of the melting furnace 41a through the supply pipe 46. A first nozzle 45a for supplying to 55 is formed.

In addition, the tundish 55 is provided with a storage tank 41b for storing molten metal PS introduced through the supply pipe 46 as in the enlarged cross-sectional view of the conventional powder forming unit shown in FIG. 5B, and the storage tank 41b. The second nozzle 45b which discharges a fixed amount to the rotating disk 56 which rotates at high speed by the high speed motor 57 which is the atomizer 59 is formed in the lower side.

Reference numeral 52 is a sight glass and 53 is a manhole.

An operation process of the solder paste powder manufacturing apparatus according to the conventional centrifugal spray method configured as described above will be described with reference to FIGS. 4, 5A, and 5B.

First, the inside of the chamber 51 is made into a vacuum state, and a predetermined amount of nitrogen gas is added as an atmosphere gas, and a small amount of oxygen is added to prevent agglomeration of the powder.

In this state, when a soldering metal such as lead (Pb) and tin (Sn) in the form of lumps is introduced into the melting furnace 41a through the metal inlet 43 formed in the cover 42 of the molten metal part 40, the heating is performed. The brazing metal is melted by the high heat generated from the section 44 to form the molten metal PS. The molten metal PS is supplied to the supply pipe 46 through the first nozzle 45a formed in the melting furnace 41a. Discharged into the storage tank 41b of the tundish 55.

Therefore, the molten metal PS introduced into the storage tank 41b of the tundish 55 is discharged in a predetermined amount through the second nozzle 45b, and the molten metal PS discharged is a high speed atomizer 59. By dropping onto the rotating disk 56 rotating at a high speed of about 20,000 to 35,000 rpm by the motor 57, the molten metal PS is broken into small particles by centrifugal force and formed into powder. The powder is installed on the outer periphery of the chamber 51. After being cooled by the cooler 54, it is collected in the collection tank 80 through the switch 70.

In addition, when a certain amount of powder is collected in the collection tank 80, the ball valve or the throttle valve is switched off to block the inflow of outside air to maintain the vacuum state and the atmosphere gas in the chamber 51 as it is. In the new collection tank 80 will be replaced.

The conventional solder paste powder manufacturing apparatus by the centrifugal spraying method has many problems in each part.

That is, the biggest problem is the tundish 55, which is rotated from the tundish 55 when the high-speed motor 57 of the atomizer 59 is stopped due to occurrence of power failure and system error. The molten metal PS is continuously supplied to the disk 56, and as a result, the high-speed motor 57 is damaged by the solidification of the molten metal PS, as well as the tundish 55 in the molten metal 40. In the case of supplying the molten metal PS, the amount of the molten metal PS remaining in the tundish 55 cannot be kept constant, thereby uniformly dropping the amount of the molten metal PS supplied to the rotating disk 56. It is difficult to obtain a powder of one particle, there is a problem that can not be evenly mixed when the soldering metal such as lead (Pb) and tin (Sn) is injected into the metal melting portion 40.

In addition, the molten metal (PS) is supplied to the rotating disk 56, the powder is formed and then cooled by the cooler 54 installed on the outer periphery of the chamber 51 and then collected in the collection tank 80 through the switch 70, As the powder is not sufficiently cooled by the cooler 54 and the powders are entangled with each other in the collection tank 80, the use of the powder becomes impossible. Thus, the collection tank 80 itself is cooled to solve the problem. There is a method, but the cooling efficiency is reduced, there is a method of spraying the cooling gas directly into the capture tank 80, but this has the disadvantage that the device is complicated and the consumption of inert gas increases.

And since it is not possible to know exactly when to replace the collection tank 80, the manager must check through the naked eye from time to time, as well as cumbersome when replacing the collection tank 80, by closing the switch 70 made of a throttle valve or ball valve chamber ( 51) The new collection bottle is replaced while the inflow of external air is blocked. However, when fine powder is introduced into and attached to the throttle valve or the ball valve, which is a component of the switch 70, the airtightness may be insufficient. In addition, there is a problem that the productivity is reduced due to many defects to bring about a change in the shape of the powder during opening and closing.

The present invention is to solve the above problems by installing a stirring device and a discharge controller in the molten metal to be mixed evenly during the melting of the soldering metals such as lead, tin, when the molten metal introduced into the tundish is an appropriate level The control unit was to automatically supply and shut off the molten metal.

In addition, the discharge regulator and level sensor are installed inside the tundish to stop the supply of molten metal when the atomizer's high-speed motor is stopped due to power outages and system errors, thereby protecting the high-speed motor. The molten metal was kept within a certain range at all times.

In addition, by installing the powder level sensor inside the collecting tank, when the appropriate amount of powder is collected, it informs the timing of replacing the collecting tank, and when replacing the collecting tank, the switch is configured as a cylinder to block the inflow of external air into the chamber. The cylinder is automatically operated by the level sensor to improve the airtightness and increase the productivity by preventing the change of the appearance of the powder.The optimum performance of the rotating disk increases the crushing capacity of the molten metal. This was not formed.

As described above, the present invention allows the mixing of the soldering metals such as lead and tin evenly, and the molten metal introduced into the tundish is not only maintained at an appropriate level at all times but also caused by the occurrence of power failure and system error. Prevents damage to high speed motors, improves airtightness when replacing the collection tank, and improves productivity by preventing powder changes, and increases the breaking capacity of the rotating disk and prevents residue from forming on the surface. It is a technical problem to be able to manufacture a solder paste powder having a constant size.

In the solder paste powder manufacturing apparatus according to the centrifugal spraying method of the present invention, a high speed motor is fixed as a support on the inside of the chamber, and the atom is made of a rotating disk which is formed in powder by crushing the molten metal dropped into the high speed motor by centrifugal force. In the powder manufacturing apparatus for solder paste by the centrifugal spraying method including the lower part, the collecting tank which collects the powder manufactured by having a powder level sensor installed therein and generates a replacement signal when the collected powder reaches a predetermined level. And a tundish installed in the upper center portion of the chamber to drop the molten metal in a predetermined amount with a rotating disk, to sense the level of the molten metal, and to stop the dropping of the molten metal when the high speed motor stops due to a power failure and a system error. It is installed on the upper side of the chamber to melt the soldering solder introduced to form a molten metal and evenly mixed A metal molten part which blocks and discharges an appropriate amount of molten metal according to the level of the internal molten metal, a cooling pipe installed at a predetermined length at the lower side of the chamber to sufficiently cool a large amount of powder and transfer it without thermal accumulation, and the cooling It is installed in the end of the pipe is operated by a signal of the powder level sensor is characterized in that the switch is configured to maintain the airtight to block the inflow of external air when replacing the collection tank.

1 is an exemplary view of an integrated circuit mounted on a printed circuit board.

2 (a) to (d) shows the surface of the solder paste by stencil printing.

The process of mounting the package on the printed circuit board.

3 (a) to (c) is a solder paste powder prepared by a conventional centrifugal spray method

Schematic diagram of the device.

4 is a conventional solder paste powder manufacturing apparatus of a representative centrifugal spray method

Some incision views.

Figure 5a is an enlarged cross-sectional view of the conventional metal melting portion of FIG.

Figure 5b is an enlarged cross-sectional view of the conventional powder forming portion of FIG.

6 is a powder manufacturing apparatus for solder paste by the centrifugal spray method according to the present invention

Some incision views.

Figure 7a is an enlarged cross-sectional view of the molten metal portion of FIG.

7b is an enlarged cross-sectional view of the tundish and atomizer of FIG.

7C is an enlarged cross-sectional view of the switchgear of FIG. 6.

7D is an enlarged cross-sectional view of the rotating disk of FIG.

8 is a control block diagram of a solder paste powder manufacturing apparatus according to the present invention.

<Explanation of symbols for main parts of drawing>

40: melted metal part 41a: melting furnace 41b: reservoir

42 cover 43 metal inlet 44 heating part

45a: 1st nozzle 45b: 2nd nozzle 46: Supply pipe

51 chamber 55 tundish 56 rotating disk

57: high speed motor 58: support 59: atomizer

60: cooling pipe 70: switch 71: cylinder

72: piston 73: door 74: flange

75: through hole 76: hinge 80: collection tank

81: powder detection sensor 100: agitator

110, 120: 1st, 2nd discharge regulator 111, 121: 1st, 2nd drive part

113,123: 1st, 2nd Universal Joint

114, 124: first and second stopper 115: temperature sensor

125a, 125b: first and second level sensor

The present invention for achieving the above object will be described with reference to FIGS. 6 to 8.

6 is a partially cutaway perspective view of the solder paste powder manufacturing apparatus according to the present invention, in which the high speed motor 57 is fixed as a support 58 inside the chamber 51, and the high speed motor 57 is shown in FIG. Atomizer 59 consisting of a rotating disk 56 formed by crushing the molten metal to be added dropwise by centrifugal force to form a powder, and the molten metal is dropped into the rotating disk 56 by a predetermined amount in the upper center portion of the chamber 51. And the level of the molten metal is made and the powder forming unit 50 is made of a tundish 55 to stop the dropping of the molten metal when the high-speed motor 57 stops due to power failure and system error occurs.

In addition, the upper part of the chamber 51 melts the soldered solder to form a molten metal and evenly mixes the metal molten part 40 for discharging and blocking an appropriate amount of molten metal according to the level detection inside the tundish 55. A lower portion of the chamber 51 is provided with a predetermined length, and a cooling pipe 60 is installed to sufficiently cool a large amount of powder and transfer it without heat accumulation. Between the cooling pipe 60 and the collection tank 80, When the exchange of the collection tank 80, the switch 70 is installed to block the inflow of external air to maintain the airtightness, the inside of the collection tank 80 detects the level of the powder to be collected to open the switch 70 The powder level sensor 81 which operates automatically is provided.

The above configuration will be described in more detail with reference to FIGS. 7A to 7D as follows.

FIG. 7A is an enlarged cross-sectional view of the metal melting part 40 in the apparatus for preparing a solder paste powder by the centrifugal spray method according to the present invention, wherein a cover 42 having an inlet 43 is formed at an upper side of the cylindrical melting furnace 41a. The heating unit 44 for melting the soldering metal is installed on one side of the inner wall surface of the melting furnace 41a, the supply pipe 46 is supplied to the molten molten metal (PS) in the lower center portion of the melting furnace 41a. A first nozzle 45a is formed to supply the tundish 55 of the powder forming unit 50 to the powder forming unit 50. The stirrer 100 for uniformly mixing the molten metal PS is installed at one side of the cover 42. The first discharge controller 110 for supplying and blocking the molten metal PS supplied to the tundish 55 in accordance with the level of the molten metal PS supplied into the tundish 55 in the central portion of the cover 42. And, the temperature sensor 115 for sensing the temperature of the molten metal (PS) is installed.

Here, the stirrer 100 is installed at the end of the rotating rod 103, the flopeller 104 to evenly mix the molten metal (PS), the stirring motor 101 for rotating the rotating rod 103, and the stirring motor It is comprised by the speed reducer 102 which decelerates by the rotation rate of 101, and keeps the rotating rod 103 at constant rotation speed.

The first discharge controller 110 has a first drive shaft 112 and a first stopper 114 connected to each other as a first universal joint 113, and a first stopper on one side of the first drive shaft 112. The first drive part 111 which raises and lowers 114, opens and closes the 1st nozzle 45a of the melting furnace 41a, and restricts discharge | emission of the molten metal PS is comprised.

FIG. 7B is an enlarged cross-sectional view of the tundish 55 and the atomizer 59 of FIG. 6, wherein the tundish 55 has a reservoir 41b for storing molten metal PS introduced through the supply pipe 46. The second nozzle 45b is provided at the lower side of the reservoir 41b to discharge a predetermined amount to the rotating disk 56 which rotates at high speed by the high speed motor 57 which is the atomizer 59. The second drive shaft 122 and the second stopper 124 are connected to each other as the second universal joint 123 on the upper side of the reservoir 41b, and the second stopper 114 is lifted on one side of the second drive shaft 122. A second discharge controller 120 including a second driving unit 11 configured to descend to open and close the second nozzle 45b of the reservoir 41b is installed, and the upper limit point of the molten metal PS is provided inside the reservoir 41b. First and second level detection sensors 125a and 125b are installed to detect the level of the lower limit and generate an electrical signal.

Here, the first and second driving units 111 and 121 may use pneumatics, cylinders, solenoids, agitation motors, etc. according to the design state of the system.

FIG. 7C is an enlarged cross-sectional view of the actuator 70 of FIG. 6, and includes a flange 74 having a through hole 75 formed at one side of the cooling pipe 60, and a hinge 76 at one side of the flange 74. The door 73 which is movable by the installation is provided, and one side of the door 74 is fixedly installed on the piston 72 which is mounted by the cylinder 71.

FIG. 7D is an enlarged cross-sectional view of the rotating disk 56 of FIG. 6, wherein the upper surface of the rotating disk 56 is formed in a “V” shape within a range of 110 to 130 degrees.

FIG. 8 is a block diagram of a control unit in the apparatus for manufacturing a solder paste powder according to the present invention, which controls various aspects of the system by the operation unit 135 and displays the display unit 136 such as a lamp or a liquid crystal display (LCD). The gas supply unit 131, the vacuum pump 132, the stirring stirring motor 101, the high speed motor 57, the first and second driving units 111 through the drive 133 are output to the output terminal of the control unit 134 indicating various kinds of information. 112, the cylinder 71 is connected, and the control unit 134 through the signal processing unit 137 at the output terminal of the first and second level sensor (125a) (125b) and the powder sensor (81) It is connected to the input terminal of.

The operation of the solder paste powder manufacturing apparatus according to the centrifugal spraying method of the present invention configured as described above will be described in detail with reference to FIGS. 6 to 8 as follows.

First, an appropriate amount of metal for forming the solder paste powder is introduced into the melting furnace 41a through the metal inlet 43 of the metal melting part 40, and the vacuum pump 132 is operated to operate the metal melting part 40 and the chamber. (51), the cooling pipe (60), the inside of the collecting tank (80) to a vacuum state to 10 ^-3 Torr, and then the gas supply unit 131 is controlled to fine oxidation on the powder surface during the powder formation in the chamber 51 In order to remove the entanglement between powders by coating and to facilitate the final classification process, high-purity nitrogen (N ₂ ) gas is supplied as the atmospheric gas at the same level as the internal pressure of the chamber 51, and oxygen of about 100 to 200 ppm Is initially supplied, and when the atmosphere gas is diffused, the oxygen content in the chamber 51 is maintained at 10 to 30 ppm.

In addition, in the case of a soldering solder metal in which a lumped lead and tin are mixed in the molten metal 41 in the melting furnace 41a of the molten metal 40, carbon monoxide (Co) and nitrogen gas are added in a 1: 9 mole fraction. In the case of monometals such as lead and tin in the form of agglomerate, carbon monoxide and nitrogen gas are added in a 2: 8 mole fraction, and carbon monoxide and nitrogen gas are added in a 5: 5 mole fraction when remelting powders that have already been formed.

In this state, when the heating unit 44 is operated as shown in FIG. 7A, the metal introduced into the melting furnace 41a is melted by the high temperature heat generated from the heating unit 44, and the stirring motor, which is the stirrer 100, is melted. The propeller 104 installed on the rotating rod 103 rotates at a constant speed by the action of the 101 and the reducer 102 to uniformly mix the molten metal, and the temperature of the molten metal is continuously maintained by the temperature sensor 115. Is being sensed.

After a certain time has elapsed, all of the metal introduced into the melting furnace 41a is melted to change into a liquid molten metal PS, and the temperature of the molten metal PS detected by the temperature sensor 115 reaches a predetermined value or more. The control unit 134 drives the high speed motor 57, which is the atomizer 59, to rotate the rotating disk 56 at a speed of 20,000 to 35,000 rpm, and at the same time, the first driving unit of the first discharge controller 110. By operating the 111 to raise the first stopper 114, the first nozzle 45a is opened so that the molten metal PS melted inside the melting furnace 41a is formed through the supply pipe 46. 50 is introduced into the reservoir 41b which is installed inside the chamber 51 and constitutes the tundish 55.

Therefore, as shown in FIG. 7B, a part of the molten metal PS supplied to the reservoir 41b constituting the tundish 55 is rotated at a high speed through the second nozzle 45b formed under the reservoir 41b. By dropping onto the disk 56, it is broken into small particles to form a powder, and the rest is continuously stored in the reservoir 41b.

At this time, when the molten metal PS continuously stored in the storage tank 41b reaches the position where the second level sensor 125b is installed, the controller 134 detects the melted pressure PS and the first discharge controller 110 shown in FIG. 7A. By operating the first drive unit 111 of the first stopper 114 to lower the molten metal (PS) melted in the melting furnace (41a) is blocked from entering the reservoir 41b, and further into the reservoir (41b) When the introduced molten metal PS is consumed and reaches the position where the first level sensor 125a is installed, the first stopper 114 is raised again to resume the inflow of the molten metal PS so that the storage tank 41b is constantly fixed. It is possible to maintain a constant amount of the melt (PS) supplied to the rotating disk 56 by solving the problem of excessive supply or exhaustion by allowing the melt (PS) within the range.

On the other hand, the molten metal PS introduced into the reservoir 41b is dropped onto the rotating disk 56 which rotates at high speed through the second nozzle 45b, so that the molten metal PS is broken into powder of small particles. As shown in FIG. 7D, the upper surface is formed in a cone shape within a range of 110 to 130 ° angle so as to receive the centrifugal force as much as possible, thereby improving the crushing capacity of the molten metal by implementing the optimum state. An unbroken residue was not formed on the surface.

Here, the rotating disk 56 will be described in more detail.

As a spraying condition factor for determining the characteristics of the powder produced by the centrifugal spraying method, there are known diameters, rotational speeds, materials, shapes, and the like of the rotating disks. In particular, the shape has a flat rotating body (Flat), a mesh (Mesh), a bowl (Bowl), a cup (Cup), or a shape having a groove (Vane), but an important problem occurs in practical applications.

That is, the flat type is a situation in which the melt fracture rate is reduced due to slippage and the surface is unused due to the unstable spray state due to the growth of the oxide film by the reaction with the molten metal. ) Is complicated in structure and difficult to manufacture, and there is a problem that the operation failure rate is high as well as the maintenance failure due to the residual tapping or the metal oxide blocking the mesh when the initial tapping and operation stop.

In addition, bowl, groove, and cup are solidified without breaking the inside of the rotating disk during initial tapping, and are often attached to the inner wall of the rotating disk. (57) has a problem that a lot of load.

In view of the combination of the above, when the surface of the rotating disk 56 is configured in the shape of a cone having an internal angle of about 110 to 130 °, replacement of the rotating disk can be easily removed because only the remaining liquid solidified on the inner wall of the rotating disk is easily removed. Almost unnecessary, and experimental measurements compared to other types of rotating discs showed that the crushing capacity and powder appearance were improved over the conventional ones.

Therefore, the powder crushed by the rotating disk 56 hits the inner wall of the chamber 51 by centrifugal force. At this time, the cooling pipe 54 is first cooled by the cooling unit 54 and then dropped by a load. By passing through 60), the second cooling was performed to prevent agglomeration of the powder which may occur when the solid amount of the solder paste powder is not solidified sufficiently without thermal accumulation, and the powder via the cooling pipe 60 is Through the switch 70 is collected in the collection tank (80).

When the powder collected in the collecting tank 80 reaches the position where the powder level sensor 81 is installed through the above process, the powder level sensor 81 controls the electrical signal through the signal processor 137. 137, and the control unit 137 controls the cylinder 71 of the switch 70 by determining that the collection tank 80 is a replacement time when a signal is input from the powder level sensor 81. 72 is leaked, and the door 73 coupled to the flange 74 as the hinge 76 is rotated upward to block the through-hole 75 formed in the flange 74 to the collection tank 80 Prevent further powder from entering.

Therefore, the new collection tank 80 is vacuum-treated and combined with nitrogen to control the cylinder 71 of the switchgear 70 so that the piston 72 flows into the cylinder 71, thereby causing the flange 74 to enter. The door 73 coupled as the hinge 76 is rotated downward to open the through hole 75 formed in the flange 74 so that powder is introduced into the collection tank 80 so that the chamber 51 may be replaced when the collection tank 80 is replaced. ) In order to improve the airtightness by preventing the inflow of external air inside and increase the productivity by preventing the change of the appearance of powder.

In addition, when the high speed motor 57 of the atomizer 59 is stopped due to a power failure or a system error, the second driving unit of the second discharge controller 120 installed in the tundish 55 as shown in FIG. 7B ( As the second stopper 124 is lowered by operating the control unit 134 to close the first nozzle 45a installed under the tundish 55, the molten metal PS is dropped onto the rotating disk 56. It was to prevent the expensive high-speed motor 57 to be prevented.

As described above, the present invention evenly melts the solder metal such as lead and tin by forming the stirring device and the discharge controller in the molten metal, the discharge controller and the level sensor in the tundish, and the switch as a cylinder. It ensures that the molten metal flowing into the tundish is always kept at an appropriate level, and also prevents damage to the high-speed motor that may occur due to power outages and system errors, and automatically recognizes when to replace the collection tank. To improve the airtightness of the collection tank and to prevent changes in the appearance of the powder, and to increase the breaking capacity of the rotating disk and to prevent the formation of scum on the surface to produce solder paste powder with constant system stability and particle size. There is an effect that can be done.

Claims (7)

The high speed motor 57 is fixed to the inside of the chamber 51 as the support base 58, and the ato consisting of the rotating disk 56 formed in the powder by crushing the molten metal installed in the high speed motor 57 by dropping by centrifugal force. In the powder manufacturing apparatus for solder paste by the centrifugal spraying method which includes the optimizer 59, A collecting tank 80 which collects the powder prepared by being installed inside the powder level sensor 81 and generates a replacement signal when the collected powder reaches a predetermined level; It is installed in the upper center portion of the chamber 51 to drop the molten metal to a certain amount by the rotating disk 56, the level of the molten metal is made, the dropping of the molten metal when the high-speed motor 57 stops due to power failure and system error Tundish 55 to stop, A metal molten part 40 which melts the soldering solder installed and installed on the upper side of the chamber 51 to form and evenly melt the molten metal and discharge and shut out an appropriate amount of molten metal according to the level detection inside the tundish 55; , A cooling pipe (60) installed at a lower side of the chamber (51) to a predetermined length to sufficiently cool a large amount of powder and transfer the same without thermal accumulation; It is installed in the end of the cooling pipe 60 and is operated by a signal of the powder level sensor 81 is composed of a switchgear 70 for maintaining the air tightness by blocking the inflow of external air when replacing the collecting tank 80 Powder paste manufacturing apparatus for solder paste by the centrifugal spray method characterized in that. According to claim 1, wherein the molten metal 40 is a melting furnace (41a) for melting the brazing metal such as lead, tin, A cover 42 installed above the melting furnace 41a and having a metal inlet 43; A heating part 44 installed on an inner wall surface of the melting furnace 41a to melt solder; Supply pipe 46 for supplying molten metal (PS) to the tundish 55 through the first nozzle (45a) formed in the lower center portion of the melting furnace 41a, A temperature sensor 115 installed inside the melting furnace 41a to sense an electric temperature of the molten metal PS and generate an electrical signal; A stirrer 100 installed on the cover 42 to uniformly mix the molten molten metal PS in the melting furnace 41a, The first discharge controller 110 is installed in the cover 42 to open and close the first nozzle (45a) according to the level of the melt (PS) introduced into the tundish (55) to adjust the discharge of the melt (PS) Powder manufacturing apparatus for solder paste by the centrifugal spray method characterized by consisting of). According to claim 1, The tundish 55, Storage tank (41b) for storing the molten metal (PS) flowing through the supply pipe 46, A second nozzle 45b formed at a lower center portion of the reservoir 41b to drop the molten metal PS onto the rotating disk 56; First and second level detection sensors 125a installed inside the reservoir 41b to sense the upper and lower limit levels of the molten metal PS to drive the first discharge controller 110 of the molten metal 40. 125b, The second discharge controller 120 is installed in the upper central portion of the chamber 51 to close the first nozzle 45a in the event of a power failure or a system error to prevent the molten metal PS from dropping onto the rotating disk 56. Powder paste manufacturing apparatus for solder paste by the centrifugal spray method characterized in that the configuration. According to claim 1, The switchgear 70 is provided with a flange (74) formed in one end portion of the cooling pipe (60), the through hole (75), A door (73) rotatably coupled to a hinge (76) on one side of the flange (74); One side of the door (74) is a solder paste powder manufacturing apparatus according to the centrifugal spraying method, characterized in that the piston 72 is fixedly installed to be mounted by the cylinder (71). The apparatus of claim 1, wherein the surface of the rotating disk 56 is formed in a “V” shape within a range of 110 ° to 130 °. The melting furnace (41a) according to claim 1, wherein the melting furnace (41a) is in a vacuum of 10 ^-3 Torr If the metal to be introduced is a brazing alloy in which lead and tin are mixed, carbon monoxide (Co) and nitrogen gas are added in a 1: 9 mole fraction. If the input metal is a single metal such as lead or tin, carbon monoxide and nitrogen gas are added in a 2: 8 mole fraction. In the case where the injected metal is a powder to be reused, the apparatus for producing a paste for solder paste by centrifugal spraying, characterized in that carbon monoxide and nitrogen gas are added at a 5: 5 mole fraction. The method of claim 2 or 3, wherein the first and second discharge regulators 110 and 120, The first and second stoppers 114 and 124 and the first and second driving shafts 112 and 122 having one end portion formed sharply are connected to each other as the first and second universal joints 113 and 123. The first and second stoppers 114 and 124 are moved up and down to form the first and second drive parts 111 and 121 to open and close the first and second nozzles 45a and 45b. Powder paste manufacturing apparatus for solder paste by the centrifugal spray method, characterized in that.