KR20010085961A - Identification label and method for producing said identification label - Google Patents

Abstract

The invention relates to an identification label (10) to be fastened on the surface or around articles. Said identification label has a multi-layer structure with an identification layer (11) for optically labeling, a reinforcement layer (12) for mechanically stabilizing the identification layer and an adhesive layer (13) for fastening the identification label on the article. The reinforcement layer serves as the substrate for arranging thereon a transponder unit (16).

Description

Identification label and method for producing said identification label}

The form of the above-mentioned identification label generally includes a so-called 'self-adhesive label' for marking an object. In particular, it is widely applied in the field of identifying the baggage of air baggage. Here, the label has three layer structures in a stacked state, i.e., with an optical marking, an identification layer located outward so as to be visible for the first purpose of identifying the associated baggage, mechanically stabilizing the identification layer and identifying the identification layer. It is essentially used with an optical layer which becomes the transport layer of the layer and an adhesive layer which is installed on the digest in contact with the surface of the associated extinguishant.

The advantage of the conventional identification label is that it has a variable consistency that is applicable not only on flat surfaces but also on severely curved surfaces such as handles of luggage.

In order to identify luggage with an identification label without contacting it from a distance, a transponder unit is added to the conventional identification label in addition to the optical marking by so-called 'barcode' and alphanumeric marking on the external identification layer of the identification layer. It is desirable to combine the so-called transponder units so that the information stored in the chip device can be known without contact. The chip device contacts the antenna coil to form a transponder unit. For this purpose the chip arrangement and antenna coil are provided on a common transponder substrate. Attempts to combine a transponder unit with a known identification label to create an overall identification label that also enables optical and electronic marking also lead to a complete label structure that complements the conventional identification label with the transponder unit located on the transponder substrate. Therefore, an additional layer is added to the multi-layer structure of the conventional identification label in the form of a substrate of the transponder unit. However, this change in the overall layer structure of the identification label can cause problems related to the thickness and variability of the identification label thus formed.

The present invention relates to an identification label installed on the periphery or surface of an article, and more particularly, having an identification layer for optical marking, a reinforcing layer for mechanical stabilization of the identification layer, and an adhesive layer for installing the identification label on the article. An identification label having a multi-layered layer structure and installed on the periphery or surface of an article. The present invention also relates to the identification label and a manufacturing method of a basic apparatus for manufacturing the identification label.

Figure 1 shows one embodiment of an identification label having an external identification layer and a transponder unit.

FIG. 2 shows a partial cross-sectional view of the identification label shown in FIG. 1 with a detailed view of the basic device.

Figure 3 shows the basic device shown in Figure 2 with a permanent adhesive layer.

4 shows an identification layer having a transponder unit integrated in a conventional layer structure according to the first embodiment.

5 shows a conventional identification label according to the prior art.

6 shows another identification layer with a modified structure of the transponder unit.

7 shows a basic device having a reinforcing layer provided between two adhesive layers.

Accordingly, an object of the present invention is to make an identification label having improved performance by a transponder unit without causing a negative change in the layer structure of the identification label.

This object is achieved by an identification label having the features of claim 1.

In the identification label according to the invention, the reinforcing layer serves as a substrate for arranging the transponder unit. Improvement of the identification label having electronic marking by the transponder unit without changing the layer structure of the identification label is made possible by using the reinforcing layer already provided in the layer structure of the conventional identification label as a substrate for arranging the transponder unit. This allows for a variable and unlimited application of the identification label to objects which are particularly recommended for the use of the identification label despite the combination of transponder units. Thus, a separate substrate for arranging the transponder unit which can change the mechanical and geometrical properties of the layer structure of the identification label can be omitted.

It is preferable that the transponder unit extends to the boundary layer between the reinforcing layer and the adhesive layer, especially since the adhesive layer is provided to cover the transponder unit in a horizontal manner, in particular when the transponder unit is necessarily superposed on the reinforcement layer. Thus, not only the method of stacking the antenna coil on the surface, in particular to apply and / or build the antenna coil of the transpond unit, but also the manner in which the antenna coil is embedded in the reinforcement layer to some extent may be used. The application of and / or the new method is selected depending on the properties of the reinforcing layer material, that is, whether the reinforcing layer at least partially embeds the antenna coil or enables the antenna coil to only be surface laminated.

Another form of installing the identification label is that the adhesive layer is covered with a deadening layer and the reinforcing layer is provided with an installation device for installing the identification label on an object, such as an installation tape.

This object of the invention is realized by a basic apparatus for producing an identification label having the features of claim 4.

The basic device according to the present invention for producing an identification device installed on the periphery or surface of an article is provided as a basis for another layer structure in the manufacture of an identification label, and within the boundary layer formed between the reinforcement layer and this reinforcement layer and adhesive layer And an adhesive layer provided as a substrate for arranging the units.

The basic device according to the invention provides a semi-finished product in the manufacturing process of the identification label. The semi-finished product here is already equipped with a transponder unit and exhibits a layer structure, which is part of the overall layer structure of the conventional identification label. A further manufacturing step of completing the identification device known in the manufacture of a conventional identification device as devised in the basic device according to the invention can produce the identification label according to the invention in an invariant manner. Therefore, the basic apparatus according to the present invention has the advantage that the identification label manufacturer can introduce the basic apparatus into the manufacturing process of the identification labels, continuously stack and manufacture the external identification layer, and maintain the existing process of coding the external identification layer without change. There is this.

Most integrated arrangements of transponder units in the reinforcement layer preferably include a reinforcement layer having a window opening for at least partially adopting the chip device and a chip device in contact with the antenna coil of wire to implement the transponder unit. Do. This window opening allows the chip device to have a generally buried arrangement within the reinforcing layer, while the conditions of the wired antenna coil allow the antenna coil to be at least proportionally buried within the reinforcing layer by a moderate pressure effect. For this reason, even with a very thin adhesive layer, the entire portion of the transponder unit protruding from the surface of the reinforcing layer is made small in order to sufficiently coat the transponder unit in a horizontal manner.

It is desirable to have an additional opening in the reinforcement layer to extend to the contact area of the chip device and to contact the contact end of the antenna coil.

The chip device is preferably at least partly surrounded by a reinforcement device extending to the horizontal plane of the reinforcement layer to prevent reverse mechanical pressure from the chip device in the manufacture of the layer structure.

However, depending on the material of the reinforcing layer, the antenna coil of wire may be provided on the surface of the reinforcing layer, or the antenna coil may be coated in a horizontal manner by a somewhat thick adhesive layer.

When the basic device is to be used additionally in the manufacturing process of the identification label, the adhesive surface of the adhesive layer may be coated with an inactive layer so that the adhesive layer of the basic device is not accidentally bonded. This inactive layer can be implemented to be easily removable and laminated on the adhesive layer by, for example, a silicon paper layer.

Further, the inactive layer can be embodied on the transparent surface of the reinforcing layer of another base device, allowing at least this base device to be used continuously in the manufacture of the identification label. The inert layer embodied in this form simultaneously has rigid components temporarily stacked before separating and utilizing a plurality of basic devices in the manufacturing process of the identification label.

Another means for the purpose of the present invention is to carry out the process according to claim 12, wherein the basic device according to any one of claims 4 to 11 is used and successively the identification label is placed on the basic device. Are stacked on.

Thus, the process according to the invention provides for the manufacture of an identification label based on an already manufactured base unit, which is more complicated than the manufacture of a conventional identification label in which the manufacturer of the base unit identification label is only optically marked. This is to make an identification label capable of optical marking as well as electronic marking without a process.

Depending on the structure of the identification layer, the identification layer may be stacked directly on the base unit or as a transport layer of the identification layer subsequent to the previous stacking of the intermediate layer. For example, a paper layer can be used as the transport layer.

A permanent adhesive layer may be laminated on the base, identification or transport layer to produce an adhesive layer between the base and the identification or transport layer. In addition, instead of this permanent adhesive layer, another adhesive layer may be provided alongside the initial adhesive layer.

At the end of the manufacturing process of the identification label, it is desirable that the common coding process takes place from the common process to the coding of the transponder unit and / or the chip device of the transponder unit as well as the coding of the external identification device. Therefore, not only the chip data stored by the electronic reader but also the identification label capable of recognizing the identification data by the optical reader based on the coding of the external identification layer can be manufactured in an easy and economical manner. This identification label may also be used equally in conjunction with optical and electrical reading devices, depending on facility standards.

Hereinafter, the implementation of the identification label according to the present invention and the modification of the identification label production according to the process of the present invention will be described in detail with reference to the drawings.

1 shows an identification label 10 having an external identification layer 11 stacked on the reinforcement layer 12 to mechanically protect the identification layer 11. The bottom of the reinforcing layer 12 is provided with an adhesive layer 13 formed by laminating an adhesive, which is firmly bonded to the bottom of the reinforcing layer 12. The adhesive layer 13 also has an adhesive surface 14 with an inactive layer 15 for inactivation, i.e., to prevent adhesion to the surface.

In order to better show the separation layers of the layer structure, the identification label 10 shown in FIG. 1 has a partially laminated layer, that is, an adhesive layer that is separated from each other in a partial region, that is, adhered to the identification layer 11. The reinforcing layer 12 and the inactive layer 15 having are shown.

However, the left half of the identification label 10 shown in FIG. 1 has a closed layer component with a separation layer and, although not shown in detail, the inactive layer 15 has an adhesive layer (or layers) for laying on the surface of the object to be marked. 13 are arranged directly on top of each other in the same manner as the original state of the identification label 10 before being separated from it.

As can be seen from the layered structure of the identification label 10 in the partially laid state of FIG. 1, the reinforcement layer 12 mechanically protects the identification label 10 and / or the identification layer 11 and at the same time the transponder unit. It serves as a substrate for arranging 16. The transponder unit 16 in the present invention comprises an antenna coil 18 which contacts the chip device implemented as the chip module 17 and the chip module 17 made of copper wire in the present invention.

The reinforcement layer 12 is made of a transparent material to better illustrate the arrangement of the transponder unit 16 on the reinforcement layer 12 provided as a substrate in FIG. FIG. 2 also shows a partially enlarged cross-sectional view of the reinforcing layer 12 having the inactive layer 15 in order to detail the arrangement of the transponder unit 16 on the reinforcing layer 12. 15 is in contact with the adhesive layer 13 laminated on the bottom of the reinforcing layer 12. The layer component between the reinforcement layer 12 of FIG. 2 and the adhesive layer 13 laminated on the bottom of the reinforcement layer 12 constitutes the basic device 19 constituting the identification label 10 and shown in FIG. The identification layer 11 is reinforced to constitute the identification label 10. Here, when forming the identification layer 11 made of a material that can be directly stacked on the basic device, for example, forming the identification layer 10 under the influence of temperature and pressure, as in the case of the identification label 10 shown in FIG. This identification layer 11 can be deposited directly on the superstructure surface 20 of the reinforcement layer 12.

The basic installation device 19 constructed from the layer components of the reinforcing layer 12 and the adhesive layer 13 shown in FIG. 2 is transduced in the region of the boundary layer 21 formed between the reinforcing layer 12 and the adhesive layer 13. The fender unit 16 is provided. A chip module 17 having a chip body and / or a structure 22 and called a "module" by those skilled in the art and adopting the chip is inserted into the opening 23 of the reinforcing layer 12 to adopt the chip module to be buried. do. Here, the contact carrier 24 of the chip module 17 is an antenna coil 18 made of a coil wire 28 while limiting the arrangement of the chip module 17 on the laminated surface 25 of the reinforcement layer 12. Is provided to be in contact with the free contact ends 26, 27 of. As can be better seen in FIG. 2, the contact carrier 24 of the chip module 17 is brought into contact with the contact ends 26, 27 via the bumps 30, 31 provided on the contact surface 29. For example, the antenna coil 18 formed on the laminated surface 25 of the reinforcing layer 12 so that all other regions or portions of the transponder unit 16 except for the reinforcement layer 12 are necessarily located in the reinforcing layer 12 may have a laminated surface ( 25) to be buried inside. As a result, the contact layer 13 of the transponder unit 16 and / or the chip module 17 is sufficiently flat even in a considerably thin layered implementation on the laminated surface 25 of the reinforcement layer 12. 24 can be completely covered by forming the horizontal bonding surface 14 of the adhesive layer 13. In the present invention, silicon paper is provided as the inactive layer 15 to deactivate the adhesive surface of the adhesive layer 13. In addition, the inactive layer 15 can be easily removed to activate the adhesive surface 14.

FIG. 3 is a partial cross-sectional view showing the basic device 19 at the beginning of the process of manufacturing the identification label 32 shown in FIG. The basic device 19 shown in Fig. 3 is provided as a semi-finished product for manufacturing the identification label 32, i.e., an intermediate product prepared in advance in an independent process, and the apparatus for manufacturing the identification label 32, i.e., the whole to be manufactured. It is used as one layer of the layer structure. In order to make the entire layer structure 36 forming the identification label 32 shown in Fig. 4, the structural surface 20 is provided with a permanent adhesive layer 33, which is, for example, hot-melt. Layer) and may be evenly distributed on the structural surface 20 of the reinforcement layer 12 by blade coating. Here, the free space 34 remaining after the chip module 17 is inserted into the opening 23 is filled with the adhesive material of the permanent adhesive layer 33 at least partially.

4 shows a further structure of the layer. When comparing the layer structure shown in Fig. 5 with the conventional identification label 35 according to the prior art, the layer structure 36 of the conventional identification label 35 having only the external identification layer 11 in the present invention is the external identification label. The transponder unit 16 in addition to the layer 11 is the same as the layer structure 36 of the identification label 32 according to the embodiment of the present invention shown in FIG. As is apparent from FIG. 4, the transponder unit 16 is necessarily provided in the boundary layer 21 between the reinforcing layer 12 and the adhesive layer 13 and thus does not affect the overall layer structure 36.

An additional layer of the entire layer structure 36 formed on the permanent adhesive layer 33 is implemented as a paper layer 37, for example, a so-called 'thermo-layer' in the present invention, and an adhesive layer for adhering the identification layer 11 ( 38 and a sealing layer 39 provided for surface protection of the identification layer 11.

The identification label 32 shown in FIG. 4 has the same overall structure as the overall layer structure 36 of the conventional identification label 35 so that the external identification layer can be displayed or read by thermal printing process after the manufacture of the whole layer structure 36. There is an advantage to this. In addition, even if the transponder unit 16 is located within the entire layer structure, since the conventional overall layer structure 36 is maintained, the overall thickness enables conventional printing of the identification label 32 by a thermal printing process without any problem.

FIG. 6 shows a schematic diagram of the identification label 32 which is the same as the schematic form of FIG. 4, and is implemented in the same manner as the identification layer 32 shown in FIG. Unlike the identification label 32, the identification layer 40 has a transponder unit 41 arranged differently, but as can be seen by comparing FIGS. 4 and 6, the transponder unit 41 is still a reinforcing layer ( It is located in the boundary layer 21 between 12 and the adhesive layer 13. Also, unlike the identification label 32, the antenna coil 42 in contact with the transponder unit 41 via the transponder unit 41 and / or the chip module 17 is in the material of the reinforcing layer 12. It is located on the laminated surface 25 of the reinforcement layer 12 without being buried. The difference between arranging the antenna coils 42 of the identification device 40 compared to arranging the antenna coils 18 of the identification device 32 is not only due to the material of the reinforcing layer 12 which is not buried but also the antenna coils. It may also occur due to the process form used when laminating (42). In any case, however, the antenna coil 42 is covered by the adhesive layer 13 in order to maintain the overall layer structure 36, in particular the layer structure of the basic device 19, when forming the horizontal adhesive layer 14.

As can be better seen in FIG. 6, the reinforcement layer 12 has a window opening 43 adapted to the adjoining contour of the formation 22 of the module 17. In addition, in the present invention, the forming body 22 is formed so that the free space does not necessarily remain in the opening 43 and the structural surface 20 of the reinforcing layer 12 and / or the basic device 19 is necessarily horizontal. The height is adjusted according to the thickness of the reinforcement layer 12.

As the material of the reinforcing layer 12, as shown in the embodiment of the identification label 32 in Fig. 4, it is preferable to use polypropylene which can embed the antenna coil 18 particularly easily. 6 and 6, however, it is also possible to somewhat superficially stack the antenna coil 42 on the laminated surface 25 of the reinforcing layer 12, so that the entire layer structure 36 It does not have to have similar material properties because it does not affect it. Therefore, any material can be selected as the reinforcement layer 12 as long as the initial mechanical stability of the reinforcement layer 12 is maintained.

Also, although not shown in detail here, it is possible to use a transponder unit in which the antenna coil and / or the contact end of the antenna coil are in direct contact with the chip, for example the transponder unit 16 and / or shown in FIGS. 4 and 6. Alternatively, unlike 41), the chip contact surface directly includes bumps to connect the contact ends of the antenna coils, and contacts the antenna coils 18 or the antenna coils 42, respectively, and attaches them to the chip module 17. Therefore, the contact carrier 24 of the chip module 17 is omitted in the implementation of such a transponder unit. However, it is preferable that the transponder unit manufactured by directly connecting the chip to the antenna coil has a separate reinforcement device that surrounds the chip so that there is no reverse mechanical stress from the chip during chip structure production, for example, a lamination process. However, such a reinforcement device is preferable in the case of using the chip module 17 shown as an example in Figs. 4 and 6 and protects the chip provided in the forming body 22. 4 shows, in dotted line, a possible embodiment of the reinforcement device implemented with a circular support bush 44. In order to install this support bush 44, it is inserted into the opening 23 before inserting the formation 22 of the chip module 17 as shown in FIG.

Unlike the base 19 with the permanent adhesive layer 33 of FIG. 3, FIG. 7 shows the base 45 with the reinforcement layer 46 with the second adhesive layer 47 on the structural surface 20. It may be buried by an adhesive layer like the adhesive layer 13 in the same composition as the adhesive layer 13 as shown.

As shown in more detail in FIG. 7, the reinforcement layer 46 has two additional openings 49 and 50 in addition to the opening 48 for adopting the formation 22 of the chip module 17 surrounding the chip. ) To approach and contact the contact ends 26, 27 of the antenna coil 18 embedded in the reinforcement layer 46 at the time of forming the basic device 45. Therefore, before stacking the adhesive layers 13 and 47, the chip module 17 is laminated on the stacking surface 25 of the reinforcing layer 46 in succession to the embedding of the antenna coil 18 and at the same time into the window opening 48. The formed body 22 is inserted into it.

The contact ends 26, 27 of the antenna coil 18 are the areas of the contact surfaces 51, 52 via the window openings 49, 50 on the contact surface 29 of the contact carrier 24 of the chip module 17. It is accessible within and allows the contact ends 26 and 27 to be contacted by these contact surfaces 51 and 52 and the contact surface 20 of the reinforcing layer 46 is arranged by a suitable coupling member, although not described above. . Successively, the adhesive layers 13 and 17 may be laminated on the laminated surface 25 of the structural surface 20 and the reinforcing layer 46. The adhesive material used to form the adhesive layers 13 and 17 may be used to level the uneven plane and fill at least a portion of the hollow space.

Although the basic device 45 provided with the other adhesive layer 47 shown in FIG. 7 is not described above, the inert layer may be laminated in the easiest form to be transformed into a "transponder tag", and an installation means such as a tape may be used. It can be installed on the object having.

As described above, the identification label and the manufacturing method thereof according to the present invention not only recognize the chip data stored by the electronic reader but also easily identify the identification label capable of recognizing the identification data by the optical reader based on the coding of the external identification layer. It can be manufactured in an economical way.

As described above, the present invention has been described only with respect to specific examples, but it will be apparent to those skilled in the art that various changes and modifications can be made within the technical spirit of the present invention based on the above specific examples. And modifications belong to the appended claims.

Claims (16)

In the identification label installed on the periphery or the surface of the article, a multi-layered layer structure having an identification layer for optical marking, a reinforcing layer for mechanical stabilization of the identification layer and an adhesive layer for installing the identification label on the article. , The reinforcing label (12, 46) is provided as a substrate for arranging transponder units (16,41). The method of claim 1, And said transponder unit (16,41) extends up to a boundary layer (21) formed between said reinforcing layer (12,46) and said adhesive layer (13). The method according to claim 1 or 2, The identification layer is characterized in that the adhesive layer (13) is covered with an inactive layer (15) and the reinforcement layers (12, 46) have an installation device for installing the identification label on the article. In the basic apparatus for manufacturing the identification label installed on the periphery or the surface of the article and including the reinforcing layer and the adhesive layer, The reinforcement layers 12 and 46 are provided as a substrate for arranging the transponder units 16 and 41 in the boundary layer 21 formed between the reinforcement layers 12 and 46 and the adhesive layer 13. Basic device. The method of claim 4, wherein The reinforcement layers 12, 46 have window openings 23, 43, 48 for suitably receiving the chip device 17 to form the transponder units 16, 41, wherein the chip device The basic device, characterized in that contact with the antenna coil (18, 42) consisting of a wire (28). The method of claim 5, The reinforcement layer (12) is characterized in that the additional opening (49, 50) is provided to access the contact area (51, 52) of the chip device (17). The method according to claim 5 or 6, The chip arrangement (17) characterized in that the chip arrangement (17) surrounds the chip arrangement and is partially surrounded by a reinforcement (44) extending to the horizontal position of the reinforcement layer (12, 46). The method according to any one of claims 5 to 7, Said antenna coil (41) is located on said reinforcement layer (12) and is covered with said adhesive layer (13) to form a planar adhesive surface (14). The method according to any one of claims 5 to 7, The antenna coil 18 is embedded in the reinforcement layers 12 and 46 in proportion, and is covered with the adhesive layers 13 and 47 to form a planar adhesive surface 14. Base unit. The method according to any one of claims 4 to 9, The basic device, characterized in that the adhesive surface (14) of the adhesive layer (13, 47) is covered by an inactive layer (15). The method of claim 10, The inert layer is characterized in that the inert layer is implemented by the transparent surface of the reinforcing layer (12, 46) of another base unit (19). The method according to any one of claims 1 to 3, 12. Method according to any one of claims 4 to 11, characterized in that the base device (19) is provided and the identification layer (11) is bonded onto the base device (19). The method of claim 12, And a transport layer (37) on the base unit (19, 45) before stacking the identification layer (11) to form the intermediate layer. The method according to claim 12 or 13, The permanent adhesive layer 33 is installed between the base unit 19 and the identification layer 11 or the transport layer 37 so that the base unit 19, the identification device 11, or the transport layer 37. The identification label manufacturing method characterized in that the adhesive to the phase. The method according to claim 12 or 13, The additional adhesive layer 47 is provided between the base device 45, the identification layer 11, or the transport layer 37 so that the base device 45, the identification layer 11, or the transport layer 37. The identification label manufacturing method characterized in that the adhesive on the phase. The method according to any one of claims 12 to 15, The coding of the identification layer (11) and the coding of the transponder unit (16, 41) are characterized in that a common coding process occurs.