KR20010083271A - Burn-in test module of semiconductor package - Google Patents

Abstract

PURPOSE: A burn-in test module of a semiconductor package is provided to increase integration of the semiconductor package and to improve a speed at which the semiconductor package is mounted in the burn-in test module, by making a tray having the semiconductor package inserted into the burn-in test module in a process for testing a defect of the semiconductor package. CONSTITUTION: Package pockets(111) in which a completed semiconductor package(200) is loaded, are installed on an upper surface of a tray(110), separated at a predetermined interval and having a matrix arrangement structure. An insertion hole(112) into which a lead(210) of the semiconductor package is inserted is formed on a bottom surface of the package pocket. A multilayered circuit pattern connected to the insertion hole is formed on a lower surface of the package pocket. A plurality of pockets into which the tray is inserted are formed on an upper surface of a main board(120). A connection pad(122) inserted into a slot of a burn-in test chamber for testing the semiconductor package is formed in a portion of the main board. Connection patterns to which a test signal is applied, are formed in the connection pad, having a predetermined interval. A multilayered circuit pattern electrically connected to the connection pattern is formed on a lower surface of the pockets. A burn-in test module of the semiconductor package includes the tray and the main board.

Description

Burn-in test module of semiconductor package

The present invention relates to a burn-in test module of a semiconductor package, and more particularly, a semiconductor package to be tested by inserting a tray having a circuit pattern electrically connected to a semiconductor package having a manufacturing process to a burn-in board and performing a reliability test. The present invention relates to a burn-in test module of a semiconductor package having improved integration.

In general, the semiconductor package is subjected to various reliability tests to confirm the reliability of the finished product. Reliability test consists of an electrical characteristic test that tests all the input and output terminals of the semiconductor package with the test signal generating circuit for normal operation and disconnection, and connects the input and output terminals such as the power input terminal of the semiconductor package with the test signal generating circuit for normal operating conditions. There is a burn-in test that checks the lifetime and defects of semiconductor packages by applying stress at higher temperatures, voltages and currents.

The burn-in test apparatus is most likely to fail within 1000 hours since most of the semiconductor packages that have been assembled are most likely to fail.So, the burn-in sockets of burn-in boards designed to suit the characteristics of each semiconductor package can be used to quickly identify the defective semiconductor packages that will occur within 1000 hours. ) Is a test apparatus for screening an initial defective semiconductor package by applying various methods such as applying various signals, stress voltage, and high temperature to the semiconductor package by inserting the semiconductor package into the semiconductor package.

In the conventional burn-in test module, a plurality of sockets into which a semiconductor package is accommodated is inserted into and installed on an upper surface of the main board, and the socket leads of the socket are electrically connected by a circuit pattern formed on the main board. And one side of the main board is formed with a connection pad is inserted into the slot of the chamber (chamber) of the burn-in test device.

When the semiconductor package having the manufacturing process is completed is inserted into the socket of the burn-in test module, the burn-in test module is received in the chamber of the burn-in test apparatus after performing the DC test, and the test signal is transferred to the semiconductor package through the circuit pattern formed on the main board. Delivered.

Therefore, in order to apply the test signals to the semiconductor packages stored in the sockets of the burn-in test module, the circuit patterns formed on the main board must be connected to the socket leads of the plurality of sockets.

That is, the conventional burn-in test module is manufactured by constructing a circuit pattern on the upper surface of the main board so that a test signal is transmitted to each semiconductor package inserted into a plurality of sockets. The integration degree of the semiconductor package inserted into the module is lowered, and thus, the productivity of the chamber of the burn-in test apparatus is lowered.

Meanwhile, the semiconductor package in which the manufacturing process is completed is stored in a tray and transferred to each test process, and the semiconductor packages stored in the tray transferred to the test process are inserted into sockets of the burn-in board one by one and then perform the test process.

In this way, the semiconductor package should be stored in the tray and transferred to each test process, and the semiconductor packages transferred to the test process should be absorbed one by one from the tray and stored in the burn-in test module. This / insertion causes a problem that the semiconductor package is scratched or the external lead is bent.

Accordingly, an object of the present invention is to solve the above problems, and an object of the present invention is to form a pocket into which a tray for storing and transferring a semiconductor package is inserted on a main board of a burn-in test module, and a test signal is stored in the tray. The circuit pattern is formed in multiple layers so as to be applied to the semiconductor package, thereby improving the integration degree of the semiconductor package inserted into the burn-in test module.

Other objects of the present invention will become apparent from the following detailed description of the invention.

1 is a block diagram schematically showing the configuration of a burn-in test system applied to the present invention.

Figure 2 is a perspective view showing a burn-in test module according to the present invention.

3 is a cross-sectional view taken along line III-III of FIG. 2;

The burn-in test module of the semiconductor package according to the present invention for achieving the above object is installed on the top surface of the package pocket in which the semiconductor package has been completed the manufacturing process spaced apart by a predetermined interval in a matrix arrangement structure, the bottom surface of the package pocket An insertion hole into which a lead of the semiconductor package is inserted is formed, a tray having a multilayered circuit pattern connected to the insertion hole is formed in a lower surface of the package pocket, and a plurality of pockets in which the tray is inserted into the upper surface are formed, and a semiconductor is formed at one side. A connection pad is inserted into a slot of a burn-in test chamber for testing a package. A connection pattern for applying a test signal is formed on the connection pad at predetermined intervals, and a circuit pattern electrically connected to the connection pattern on the lower surfaces of the pockets. It includes the main board formed in multiple layers.

Hereinafter, the burn-in test module according to the present invention will be described in detail with reference to FIGS. 1 and 3.

Burn-in test system for testing the life and defect of the semiconductor package, as shown in Figure 1, the server (1) managing the entire system, the server 1 and the online via the communication line (2) the semiconductor package ( 200: burn-in test chambers 3 for testing initial failure by applying thermal and electrical stress to the main board 110 and the main board 110 (see FIG. 2) online through the server 1 and the communication line 2. Sorters for inserting the tray 120 (see FIG. 2) in which the semiconductor package 200 is accommodated or extracting and sorting the tray 120 from the main board 110 according to a burn-in test result of the burn-in test chambers 3. (4), and control the movement of the AGV (Automatic Guided Vehicle (hereinafter referred to as "AGV") 5), which loads the burn-in test module 100 and transports it to the burn-in test chamber (3). It includes an AGV controller (6).

In order to test the semiconductor package in the burn-in test system described above, the semiconductor package must be mounted and supplied to the burn-in test module 100.

Burn-in test module 100 according to the present invention is shown in detail in Figures 2 and 3, will be described with reference to this.

The burn-in test module 100 includes a tray 110 for receiving a semiconductor package 200 in which a manufacturing process is completed, and a main board 120 into which the tray 110 is inserted.

A package pocket 111 having a predetermined depth in which the semiconductor package 200 is accommodated is formed on the upper surface of the tray 110 at a predetermined interval with a matrix arrangement structure, and a bottom surface of the package pocket 111 of the semiconductor package 200 is formed. An insertion hole 112 into which the lead 210 is inserted is formed.

In addition, a circuit pattern (not shown) electrically connected to the lead 210 of the semiconductor package 200 inserted into the insertion hole 112 is formed on the lower surface of the package pocket 111 formed on the upper surface of the tray 110. It is formed in a multi-layer, the bottom surface of the tray 110 is formed with a ball-shaped connection pad 113 is connected to the circuit pattern formed in a multi-layer.

Meanwhile, a tray pocket 121 having a predetermined depth in which the tray 110 is accommodated is formed on the upper surface of the main board 120 at predetermined intervals, and on one side of the main board 120, a slot of the burn-in test chamber 3 is provided. Connection pads 122 are inserted into the connection pads, and connection pads 123 are formed in the connection pads 122 at predetermined intervals.

In addition, a circuit pattern 124 to which a signal for testing the semiconductor package 200 is applied is formed in a multilayer on the lower surface of the tray pocket 121 formed on the upper surface of the main board 120. ) Is connected to the connection pattern 123 formed on the connection pad 122.

In addition, a connection pad 125 corresponding to the connection pad 113 formed on the bottom surface of the tray 110 is formed on the bottom surface of the tray pocket 121, and the connection pad 125 is formed on the bottom surface of the tray 110. The test signal applied to the circuit pattern 124 formed in multiple layers on the lower surface of the tray pocket 121 is transmitted to the tray 110 in contact with the formed connection pad 113.

In addition, on both sides of the bottom surface of the tray pocket 121 in which the connection pad 125 is not formed, support bars 126 having a predetermined height are formed along the length direction, and the support bars 126 are tray pockets 121. The connection pads 113 formed on the bottom surface of the tray 110 and the connection pads 125 formed on the bottom surface of the tray pocket 121 are supported by the tray 110 inserted into the tray 110 so as to be spaced apart from each other by a predetermined interval. Keep your status. At this time, the support bar 126 is preferably formed of an elastic material.

Here, the support bar 126 may be formed at both ends of the bottom surface of the tray 110 inserted into the tray pocket 121, in which the connection pad 113 is not formed, and another embodiment may exist. .

In addition, in order to apply a test signal to the semiconductor package 200 accommodated in the tray 110, the connection pads 125 and the tray 110 formed on the bottom surface of the tray pocket 121 may be spaced apart from each other. The connection pad 113 formed on the bottom should be in contact.

To this end, a clamp may be configured. As an example of the clamp, the clamp may have a length equal to the length of one side of the main board 120 on which the connection pad 122 is formed, and both ends are bent. Clamp 130 having a shape may be configured. After the tray 110 is inserted into the tray pocket 121, the clamps 130 are fitted at both ends to closely contact the tray 110 at the upper surface of the main board 120.

Here, the clamp 130 is fitted to the main board 120 in the form of a clip to contact the tray pocket 121 and the respective connection pads 125 and 113 formed on the tray 110, but there may be various other embodiments.

The operation of the burn-in test module configured as described above is as follows.

The semiconductor package 200 in which the manufacturing process is completed is stored in the tray 110 and transferred to each test process. When the tray 110 is transferred to the burn-in test process, the shooters 4 move the tray 110 to the main board ( It is inserted into the tray pocket 121 of 120. The tray 110 inserted into the tray pocket 121 is spaced apart from the bottom surface of the tray pocket 121 by the support bar 126.

When the tray 110 is inserted into the tray pocket 121, the clamps 130 are fitted into contact with both ends of the tray 110 on the upper surface of the main board 120, thereby closely contacting the tray 110. Accordingly, elastic deformation occurs in the support bar 126 of the elastic material supporting the tray 110, and the connection pad 113 formed on the bottom of the tray 110 and the connection pad formed on the bottom surface of the tray pocket 121 ( 125) is contacted.

Subsequently, the AGV 5 receives the burn-in test module 100 under the control of the AGV controller 6 and transfers the burn-in test module 100 to the burn-in test chamber 3, and the loaded burn-in test module 100 is the burn-in test chamber 3. It is loaded in and burn-in test is performed.

At this time, the connection pad 122 of the main board 120 is inserted into a slot of the burn-in test chamber 3 so that the burn-in test module 100 and the burn-in test chamber 3 are electrically connected to each other. The test signal transmitted to test the package 200 is applied to the circuit pattern 124 formed in multiple layers on the main board 120 through the connection pattern 123 formed on the connection pad 122. The test signal applied to the circuit pattern 124 is multi-layered on the tray 110 through the connection pad 113 formed on the bottom surface of the tray 110 in contact with the connection pad 125 formed on the bottom surface of the tray pocket 121. The test signal applied to the circuit pattern formed by the circuit pattern and applied to the circuit pattern is transmitted to the lead 210 of the semiconductor package 200 accommodated in each package pocket 111.

The initial defect of the semiconductor package 200 is checked according to the test signal transmitted as described above, and the output signal for the result is transmitted to the server 1 again.

In the related art, semiconductor packages received in a pocket formed in a tray and transferred to a burn-in test process are inserted one by one into a socket formed in the burn-in test module. The test signal for testing the semiconductor package should be applied to each socket in which the semiconductor package is received. For this purpose, a circuit pattern electrically connected to the socket lead of each socket should be formed on the main board of the burn-in test module. Therefore, the ratio of the socket including the circuit pattern is increased, thereby decreasing the integration degree of the semiconductor package mounted on the burn-in test module.

However, in the present invention, a circuit pattern electrically connected to the lead 210 of the semiconductor package 200 is formed in a multilayer in the tray 110 in which the package pocket 111 in which the semiconductor package 200 is accommodated is formed. The tray 120 is formed in the board 120 so that the tray 110 for accommodating the semiconductor package 200 is inserted therein. In addition, the test signal applied to the circuit pattern 124 formed on the main board 120 may be formed on the bottom surface of the tray pocket 121 and the bottom surface of the tray 110 through the connection pads 125 and 113 contacting the semiconductor package ( 200).

Therefore, since the tray 110 having a circuit pattern formed in multiple layers is inserted into the burn-in test module 100, and the test signal is transmitted to the semiconductor package 200 stored in the tray 110 in a contact contact manner, the burn-in test module The degree of integration of the semiconductor package 200 mounted on the 100 is increased.

As described above, the burn-in test module of the semiconductor package according to the present invention has pockets in which a tray having a multi-circuit pattern electrically connected to a lead of the semiconductor package is inserted into an upper surface thereof, and pockets are inserted into the lower surface of the pocket from the server. A circuit pattern for applying the applied test signal to the tray is formed in multiple layers.

Then, when performing the process of testing whether the semiconductor package is defective, the tray containing the semiconductor package is inserted into the burn-in test module, so that the density of the semiconductor package is increased, thereby improving the productivity of the burn-in test apparatus and burn-in the semiconductor package. The speed of mounting to the module is improved.

In addition, since it is easy to insert / insert a tray from a tray pocket formed in the burn-in test module, maintenance of the burn-in test module is easy.

In addition, since the tray for storing and transferring the semiconductor package is mounted in the burn-in test module, it can be applied to other test processes without disassembly, and workability, work time, efficiency and risk of damage are reduced.

Claims (3)

Package pockets in which the semiconductor package, which has been manufactured in the manufacturing process is completed, are accommodated on the upper surface thereof and are spaced apart by a predetermined interval in a matrix arrangement structure, and insertion holes through which the leads of the semiconductor package are inserted are formed in the bottom surface of the package pocket. A tray having a multi-layered circuit pattern connected to the insertion hole at a lower surface of the tray; A plurality of pockets into which the tray is inserted is formed on an upper surface thereof, and connection pads are inserted into slots of a burn-in test chamber for testing the semiconductor package on one side thereof, and test signals are applied to the connection pads at predetermined intervals. The connection pattern is formed, the burn-in test module of the semiconductor package, characterized in that the lower surface of the pocket includes a main board formed in a multi-layer circuit pattern electrically connected with the connection pattern. The method of claim 1, Connection pads for applying the test signal to the semiconductor package are respectively formed on the bottom surface of the tray and the bottom surface of the tray pocket, and an elastic material spaced apart from each other by predetermined distances on both sides of the bottom surface of the tray pocket. Burn-in test module of the semiconductor package, characterized in that the support bar is formed. The method of claim 2, The burn-in test module causes the elastic deformation of the support bar to closely contact both ends of the tray inserted in the tray pocket to contact the connection pad formed on the bottom surface of the tray and the connection pad formed on the bottom surface of the tray pocket. Burn-in test module of a semiconductor package, characterized in that it comprises a clamp.