KR20010081623A - Wafer loading apparatus with a surface for loading a wafer - Google Patents

Abstract

PURPOSE: A wafer loading apparatus with a face for loading a wafer is provided to prevent a local defect of a wafer generated by particles on a surface of a wafer loading system in an exposure process. CONSTITUTION: A wafer loading system(10) has an upper face(20) for locating a wafer(50). A contact face including the first face(25), the second face(30), and the third face(35) is formed on the upper face(20). The contact face is higher than the upper face(20) of the wafer loading system(10). The first face(25) has an external diameter less than a diameter of the wafer(50) and an internal diameter less than an external diameter of the wafer(50). The second face(30) is an inner face of the contact face. The first face(25) is connected with the second face(30) by the third face(35). An ejector pin(40) is installed between the multitude of third face(35).

Description

Wafer loading apparatus having a surface for placing a wafer {WAFER LOADING APPARATUS WITH A SURFACE FOR LOADING A WAFER}

The present invention relates to a wafer loading apparatus, and more particularly, to a wafer loading apparatus having a surface for loading a wafer in an exposure process during a semiconductor manufacturing process.

BACKGROUND OF THE INVENTION An exposure system that is generally used is a series of additional devices such as an apparatus for applying a resist on a wafer, an apparatus for performing an exposure process on the wafer, an apparatus for performing a developing process on the exposed wafer, and a heating apparatus. It is configured to be made in-line system. Therefore, since a plurality of processes proceed in succession, a problem occurring in each process also affects a process proceeding later.

One of the problems occurring in such an exposure system is a problem in which local focus defects appear on the wafer. This partial local focus failure occurs in the exposure process, such as when the wafer is contaminated in the process performed before the exposure process, or by particles on the stage on which the wafer is placed. As described above, in order to prevent partial focus failure generated on the wafer in the exposure process, the cleaning of the surface of the wafer loading apparatus on which the wafer is placed is repeatedly performed. However, this method not only reduces the efficiency of the installation but also is not a fundamental solution.

The present invention is to solve such a conventional problem, a new type of wafer loading device that can prevent partial local focus failure on the wafer caused by the particles on the surface of the wafer loading device on which the wafer is placed during the exposure process. To provide.

1 is a plan view of a wafer loading apparatus according to a preferred embodiment of the present invention;

FIG. 2 is a side view of the wafer loading apparatus, taken along line 2-2 of FIG. 1.

* Explanation of symbols for the main parts of the drawings

10: wafer stage 20: top surface

25: first side 30: second side

35: third side 50: wafer

According to a feature of the present invention for achieving the above object, the present invention provides a wafer loading apparatus in which a wafer is placed in a semiconductor manufacturing process. The wafer loading apparatus includes a surface on which the wafer is located; And a contact surface formed to protrude to a predetermined height on the surface, wherein the contact surface is formed to contact a portion of the wafer so that the wafer is placed.

In such a wafer loading apparatus, in the preferred embodiment, the contact surface may have a first surface having an outer diameter smaller than the diameter of the wafer and having an inner diameter smaller than the outer diameter. In addition, the contact surface is a second surface formed in the center with a diameter smaller than the inner diameter of the first surface; It may have at least one third surface connecting the first surface and the second surface.

According to the wafer loading apparatus of the present invention as described above, since the contact between the wafer and the surface on which the wafer is placed can be reduced, process defects caused by foreign matter between the wafer and the surface on which the wafer is placed can be reduced.

Hereinafter, embodiments of the present invention will be described in detail with reference to FIGS. 1 and 2, and like reference numerals denote like elements for performing the same function.

1 and 2, the wafer loading apparatus 10 of the present invention has an upper surface 20 on which the wafer 50 is located. The upper surface 20 is formed with a contact surface consisting of a first surface 25, a second surface 30, and a third surface 35. This contact surface is formed to protrude higher than the upper surface 20 of the wafer loading apparatus 10, as shown in FIG. The protruding height of this contact surface can be easily set according to working conditions, processing degree, etc. The first surface 25, which is the outer surface of the contact surface, is formed to have an outer diameter smaller than the diameter of the wafer 50 placed on the contact surface, and is formed to have an inner diameter smaller than the outer diameter to have a circular band shape. The second surface 30 formed at the center of the contact surface is the inner surface of the contact surface. This second face 30 has an inner diameter smaller than the first face 25. The first surface 25 and the second surface 30 have the same center as the center of the upper surface 20.

The first surface 25 and the second surface 30 are connected by a third surface 35 which is a connection surface. The third surface 35 may be made in various numbers. In the present embodiment, three third surfaces 35 are formed, and a width thereof is smaller than a radius of the second surface 30. In addition, as shown in FIG. 1, an ejector pin 40 or the like may be installed between the third surfaces 35.

Although not shown in FIGS. 1 and 2, various devices for fixing or rotating the wafer 50 may be combined with the wafer loading apparatus 10 according to the present invention. For example, the wafer loading apparatus 10 according to the present invention may be used for an exposure process, an ash process and a spinning process. That is, the wafer loading apparatus according to the present invention may be provided with a vacuum adsorption apparatus, an electronic fixing apparatus, a rotating apparatus and a mechanical fixing apparatus.

According to the present invention, it is possible to prevent the wafer from being partially lifted due to contaminants such as particles between the wafer and the surface on which the wafer is placed. In particular, by applying the present invention to the wafer stage used in the exposure process, partial local focus defects generated on the wafer can be improved.

Claims (3)

A wafer loading apparatus in which a wafer is placed during a semiconductor manufacturing process, A surface on which the wafer is located; Including a contact surface formed to protrude to a predetermined height on the surface, And the contact surface is in contact with a portion of the wafer such that the wafer is placed. The method of claim 1, And the contact surface includes a first surface having an outer diameter smaller than the diameter of the wafer and having an inner diameter smaller than the outer diameter. The method of claim 2, The second contact surface is formed at the center with a diameter smaller than the inner diameter of the first surface; And at least one third surface connecting the first surface and the second surface.