KR20010070544A - PC omitted - Google Patents

PC omitted Download PDF

Info

Publication number
KR20010070544A
KR20010070544A KR1020010029175A KR20010029175A KR20010070544A KR 20010070544 A KR20010070544 A KR 20010070544A KR 1020010029175 A KR1020010029175 A KR 1020010029175A KR 20010029175 A KR20010029175 A KR 20010029175A KR 20010070544 A KR20010070544 A KR 20010070544A
Authority
KR
South Korea
Prior art keywords
notebook
notebook computer
external heatsink
performance
heatsink
Prior art date
Application number
KR1020010029175A
Other languages
Korean (ko)
Inventor
조병석
Original Assignee
조병석
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 조병석 filed Critical 조병석
Priority to KR1020010029175A priority Critical patent/KR20010070544A/en
Publication of KR20010070544A publication Critical patent/KR20010070544A/en

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20154—Heat dissipaters coupled to components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20172—Fan mounting or fan specifications

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE: An external heatsink of a notebook computer is provided to increase the performance of a notebook computer, and to prevent the degradation of a central processing unit by manufacturing and using an external heatsink mounted on the outside which can lower the temperature of the notebook. CONSTITUTION: The speed of a central processing unit gets lowered according to intense heat generated from using a notebook computer. A heat of the notebook computer is conducted to the external heatsink and absorbed through the external heatsink. So, the external heatsink mounted on the outside can lower the temperature of the notebook. Therefore, the performance of the notebook is increased. In addition, the life of a battery of the notebook computer can be lengthened.

Description

외부 장착용 노트북(PC) 방열판{omitted}Externally Mounted Notebook (PC) Heat Sink {omitted}

노트북(PC) 사용시 발생하는 고열로 인해 CPU성능이 저하되는 현상을 막고, 노트북의 성능을 향상시키는데 목적을 두고 있다.It aims to prevent the CPU performance from degrading due to the high heat generated when using a notebook PC and to improve the notebook performance.

노트북(PC)생산업체, 컴퓨터 주변기기 생산업체Notebook (PC) Producers, Computer Peripherals Producers

본 발명은 노트북의 바닥면 모양이 기종에 따라 다소 차이가 있게 됨으로 열전도율을 높이기 위해 노트북 밑면의 모양처럼 금형이 이루어 져야한다.According to the present invention, since the shape of the bottom surface of the notebook is somewhat different depending on the model, the mold must be made like the shape of the bottom of the notebook to increase the thermal conductivity.

노트북 밑면의 크기로 알루미늄 방열판을 만들어 그위에 노트북(PC)를 놓고 사용하여 노트북에서 발생하는 고열을 하단의 방열판으로 열이 전도되어 노트북의 온도를 낮출 수 있는 장치이다.It is a device that can reduce the temperature of the notebook by conducting the high heat generated from the notebook to the heat sink at the bottom by making an aluminum heat sink to the bottom of the notebook and placing the notebook (PC) on it.

대표 도면에 의해 상세히 설명하면 다음과 같다.It will be described in detail by the representative drawings as follows.

측면도를 보면 경사진 면으로 구성된 이유는 노트북 사용시 키보드사용을 원할이 할수 있도록 구성하였다.Looking at the side view, the reason for the inclined surface is configured so that you can easily use the keyboard when using the notebook.

배면도를 보면 전원 연결부와 중앙에 12V냉각팬이 설치되어 방열의 효과를 극대화 할수 있다.In the rear view, the 12V cooling fan is installed at the power connection part and the center to maximize the effect of heat dissipation.

정면도를 보면 상판의 모양을 노트북의 밑면의 모양과 일치하도록 금형제작(다이케스팅)을 할수도 있고 평면으로도 사용할수 있다.Looking at the front view, the shape of the top plate can be molded (die cast) to match the shape of the bottom of the notebook, or can be used as a flat surface.

이상에서 상술한 바와같이 본 발명은, 알루미늄 방열판을 통해 노트북의 열을 흡수하여 노트북의 성능을 향상시키며, 노트북의 충전용 밧데리의 수명을 연장할수 있다.As described above, the present invention improves the performance of the notebook by absorbing the heat of the notebook through the aluminum heat sink, and can extend the life of the notebook battery.

Claims (1)

외부 장착용 노트북PC 방열판으로 방열판과 전기로 구동하는 냉각팬으로 구성된 노트북PC 외부 장착용 방열판.A notebook PC heatsink for external mounting that consists of a heatsink and an electrically driven cooling fan.
KR1020010029175A 2001-05-10 2001-05-10 PC omitted KR20010070544A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020010029175A KR20010070544A (en) 2001-05-10 2001-05-10 PC omitted

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020010029175A KR20010070544A (en) 2001-05-10 2001-05-10 PC omitted

Publications (1)

Publication Number Publication Date
KR20010070544A true KR20010070544A (en) 2001-07-27

Family

ID=19709987

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020010029175A KR20010070544A (en) 2001-05-10 2001-05-10 PC omitted

Country Status (1)

Country Link
KR (1) KR20010070544A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020070208A (en) * 2002-07-29 2002-09-05 류재식 Apparatus for cooling a mobile computer
US7342783B2 (en) 2004-12-13 2008-03-11 Samsung Electronics Co., Ltd. Portable computer with docking station

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5671120A (en) * 1996-02-07 1997-09-23 Lextron Systems, Inc. Passively cooled PC heat stack having a heat-conductive structure between a CPU on a motherboard and a heat sink
JPH1097347A (en) * 1996-09-20 1998-04-14 Hitachi Ltd Portable information device
US5757615A (en) * 1996-07-01 1998-05-26 Compaq Computer Corporation Liquid cooled computer apparatus and associated methods
US5812372A (en) * 1996-06-07 1998-09-22 International Business Machines Corporation Tube in plate heat sink
JP2000349481A (en) * 1999-03-31 2000-12-15 Internatl Business Mach Corp <Ibm> Computer, cooling device therefor and computer assembly
KR200219091Y1 (en) * 2000-10-20 2001-04-02 케이엔하이텍주식회사 Rediator for Notebook computor

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5671120A (en) * 1996-02-07 1997-09-23 Lextron Systems, Inc. Passively cooled PC heat stack having a heat-conductive structure between a CPU on a motherboard and a heat sink
US5812372A (en) * 1996-06-07 1998-09-22 International Business Machines Corporation Tube in plate heat sink
US5757615A (en) * 1996-07-01 1998-05-26 Compaq Computer Corporation Liquid cooled computer apparatus and associated methods
JPH1097347A (en) * 1996-09-20 1998-04-14 Hitachi Ltd Portable information device
JP2000349481A (en) * 1999-03-31 2000-12-15 Internatl Business Mach Corp <Ibm> Computer, cooling device therefor and computer assembly
KR200219091Y1 (en) * 2000-10-20 2001-04-02 케이엔하이텍주식회사 Rediator for Notebook computor

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020070208A (en) * 2002-07-29 2002-09-05 류재식 Apparatus for cooling a mobile computer
US7342783B2 (en) 2004-12-13 2008-03-11 Samsung Electronics Co., Ltd. Portable computer with docking station

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Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E601 Decision to refuse application