KR20010069169A - Method and apparatus for effluent gas treatment - Google Patents

Abstract

PURPOSE: A used gas disposing apparatus and method are provided to remove the toxic contents in the used gas which is generated in a semiconductor manufacturing device effectively. CONSTITUTION: The used gas disposing apparatus includes a canister(10). The canister includes an inlet and input hole, a lower plenum(12), an upper plenum and a concentrated bed(20). The lower plenum is coupled with the inlet by way of a distributive nozzle allocated inside thereof. The upper plenum is coupled with the input hole. The concentrated bed is implemented in the middle of the upper and lower plenums and includes the first and second screens which is near from the lower plenum and the upper plenum, respectively. The distributive nozzle includes a body and a slant terminal. The terminal further includes a plurality of first holes which are formed far from the terminal and inside of the input hole. The body further includes a plurality of second holes which are formed far from the body. The first and second holes face the bottom of the lower plenum.

Description

Waste gas treatment method and apparatus {Method and apparatus for effluent gas treatment}

The present invention relates to a gas purifier, and more particularly, to a filled resin or dry chemical bed gas dust collector system for treating waste gases generated in a semiconductor manufacturing process.

In the manufacture of semiconductor devices, toxic corrosive gases, including halogens, are used in etching and precipitation processes. After use in the process chamber, the waste gas stream must be treated before it is released to the outside world. Various dust collectors that are applicable to the discharge of the process chamber are known in the art.

Known dust collectors are generally of the following three types: devices for burning combustible components in waste gas streams, devices for decomposing soluble components in water in waste gas streams by wet methods, and adsorbents for chemically and physically decomposing toxic components. It consists of a device that adsorbs toxic components using. Adsorbent stand-alone dust collectors should be exchanged periodically as the adsorbent is used to adsorb toxic components and the adsorbent is inactivated by the reaction by-products between the adsorbent and the toxic components.

In describing the problem of deciding when to replace a stand alone dust collector, the prior art apparatus generally employs two techniques. The first technique tracks the weight change of the dust collector. Such technology is model No. of Ebara Corporation. 3-0 / 6-0- / 9-0. This technique provides a way of indicating the lifetime of the adsorbent, but it does not provide a way to accurately predict the lifetime of the adsorbent, and is particularly inaccurate because other causes of the change in the weight of the dust collector are not taken into account.

The second technique uses a method of detecting the color change of the absorbent resin that can be observed through the sight glass. This technology is actually a model No. Practical in PCF-60B-CT. As with the first technique, the second technique provides a way of indicating the lifetime of the adsorbent, but it does not provide a way to accurately predict the lifetime of the adsorbent. Furthermore, subjective factors are involved by the person who observes the color change, and ultimately, human error is involved in the judgment of exhaustion of life.

Another problem with known dust collectors is related to the flow of waste gas through the adsorption resin. The turbulent flow of these gases through the adsorption resin results in non-uniform distribution of the adsorption resin in the region where the chemical adsorption capacity of the resin is depleted. In addition, such flows create dead spaces in the resin when the adsorption capacity of the resin is not used. As a result, turbulence makes it more complicated to accurately determine the lifetime of the adsorption resin.

In general, it is known that the laminar flow through the filling resin eliminates the dead zone created by the turbulence and provides uniform movement of the heating head through the substantially filled bed. Exothermic wave movement is used to predict the life of a resin or dry chemical packed bed.

There is therefore a need for an independent gas precipitator system of the filling resin or dry chemical bed type that provides laminar flow through the packed bed. The dust collector system may preferably be in situ purified to remove accumulated particles, thereby facilitating laminar flow through the dust collector.

The present invention relates to a filled resin or dry chemical bed type dust collection system and method for the treatment of waste gases produced during semiconductor manufacturing processes. In a preferred embodiment, the system comprises a filling resin or dry chemical bed having a layer of a first resin or dry chemical filled between two layers of a second resin or dry chemical. The bottom and top screens are provided to support the filling resin or dry chemical bed in the canister and substantially provide laminar flow of waste gas through the filled resin or dry chemical bed.

The filled resin or dry chemical canister includes a lower plenum and an upper plenum positioned at both ends of the filled resin or dry chemical bed. The dispersion nozzle is located inside the lower plenum at the inlet formed in connection with the lower plenum. The dispersion nozzle includes a plurality of holes for directing the flow of waste gas from the semiconductor manufacturing device to the lower plenum. The hole has a shape and shape that eliminates back pressure to the semiconductor manufacturing device and diffuses waste gas into the lower plenum and continues to flow laminar flow into the filled resin or dry chemical bed.

The upper end of the canister includes an outlet connected to the upper plenum. The upper end includes a dome having a hemispherical cross section. This form is to optimize the provision of a substantial laminar flow of waste gas through the filled resin or dry chemical bed.

Observation windows are provided for observation of the lower plenum, the dispersion nozzle, and the lower screen. The viewing window is removable, thereby providing a canister with a hole through which the lower plenum can be accessed for reasons of purification, maintenance, and the like.

1 is a side view of a canister in accordance with the disclosed embodiment;

2 is a table showing a typical reaction of the first resin or dry chemical,

3 is a diagram showing a typical reaction of a second resin or dry chemical,

4 is a diagram showing an exemplary temperature as it passes through a bed of resin or dry chemical filled with exothermic wave;

5 is a partial cross-sectional view of the dispersion nozzle,

6 is a bottom view of the distal end of the dispersion nozzle,

7 is a side view of the dome,

8 is a plan view of the screen,

9 is a partial cross-sectional view of the observation window;

10 is a bottom view of the canister, and

FIG. 11 is a schematic showing in-situ cleaning of the lower plenum.

* Explanation of symbols for main parts of the drawings

10: canister 12: canister lower plenum

14: Canister upper plenum 20: Filling resin or dry chemical bed

30, 40: first and second screens 32, 42: first and second flanges

50,52,54: Thermocouple 60: Dispersion Nozzle

70: inlet port 80: dome

90: outlet port 100: observation window

110: caster

The life expectancy prediction system disclosed herein typically utilizes uniform movement of the exothermic wave through the resin or dry chemical bed at room temperature (eg, about 25 ° C.). Filled bed canister 10 is a component that promotes laminar flow of waste gas upwards from filled semiconductor or dry chemical bed 20 through canister 10 from the semiconductor manufacturing equipment to achieve this uniform movement. And forms. As expected in the prior art, various types of resins and dry chemicals may be used in the illustrated dust collector system, depending on the application and other factors. Accordingly, the resins or dry chemicals described are exemplary and do not limit the type of resin or dry chemical.

The filled resin or dry chemical bed 20 is installed between the first screen 30 and the second screen 40 which will be described in detail below. The filled resin or dry chemical bed 20 comprises a first cylinder layer consisting of a second resin or dry chemical bed, the first cylinder layer comprising a total volume of filled resin or dry chemical bed 20. Accounted for about 10% of the total. The second resin or dry chemical is of a type that pre-treats the halogen groups in the waste gas generated in the semiconductor manufacturing equipment (not shown). Second resins or dry chemicals are compositions that neutralize acids, consisting of metal hydroxides on extruded and atomized clay substrates. The second resin or dry chemical is commercialized as C & M Inc.'s CM2. 3 is a diagram showing a representative response of the first layer 22.

The first cylinder layer 24 made of the first resin or dry chemical comprises about 80% of the volume of the filled resin or dry chemical bed and the first layer 22 made of the second resin or dry chemical Located between two cylinder layers 26. The first resin or dry chemical is of the type that reacts with the halogen group and the perfluoro compound as shown in the table of FIG. 2. The first resin or dry chemical is a composition consisting of a nitrate compound on a carbon substrate that is released by vapor activation. The first resin or first dry chemical is commercialized as C & M Inc.'s CM1. The second cylinder layer 26 made of a second resin or dry chemical reacts with the chlorine ions (Cl ⁻ ) group in the waste gas discharged as it passes through the resin or dry chemical bed 20 filled with waste gas, This has a high adsorption capacity.

A preferred embodiment for the burnout detection and prediction system includes a plurality of thermocouples installed in a first layer 24 composed of a first resin or dry chemical. Each thermocouple is installed at an edge location (not shown) in the first layer 24. Thermocouples are preferably of pt 100 ohm type. Preferably, the first thermocouple 50 is the distance between the bottom surface adjacent to the bottom screen 30 and the top surface adjacent to the top screen 40 in the first layer 24 of the first resin or dry chemical. It is installed in a first position located at about 4/10 of the points. The second thermocouple 52 is preferably located at a point 6/10 from the bottom screen 30 to the top screen 40 in the first layer 24 of the first resin or dry chemical. Is installed in position. The third thermocouple 54 is preferably present at a point 8/10 from the bottom screen 30 to the top screen 40 in the first layer 24 of the first resin or dry chemical. Is installed in position. In this arrangement the distance between the first position and the second position is equal to the distance between the second position and the third position. Furthermore, the distance between the third position and the interface between the first layer 24 of the first resin or dry compound and the second layer 26 of the second resin or dry compound is Half of the distance between.

The thermocouples 50, 52, 54 are processors (not shown) that operate to detect the movement of the exothermic wave moving through the resin or dry chemical bed 20 filled with waste gas as it flows through the canister 10. Works in conjunction with The wavefront is kept as uniform as possible by promoting laminar gas flow upward through the system. A plurality of wall-shaped connectors (not shown) in which the cables connecting the thermocouples 50, 52, and 54 to the processor are built is formed in the canister 10. FIG. According to the prior art, a processor may include a microprocessor, a programmable logic controller and individual elements or other devices or circuits. The processor operates to sample the thermocouples 50, 52, 54 over time and to record the temperature at each of the first to third locations to detect movement of the heating head. By way of non-limiting example, a method of predicting the lifespan of the first layer 24 made of the first resin or dry chemical will be described with reference to the table by FIG. 4. Here, the actual temperature will be simplified to explain the embodiment.

In FIG. 4, at the initial time T1, the first thermocouple 50, the second thermocouple 52, and the third thermocouple 54 are 50 ° C. and 25 ° C. at the first position, the second position, and the third position, respectively. And a temperature of 20 ° C. At time T2, the first thermocouple 50, the second thermocouple 52 and the third thermocouple 54 are at temperatures of 25 ° C., 50 ° C. and 25 ° C. at the first position, the second position and the third position, respectively. To indicate. At time T3, the first thermocouple 50, the second thermocouple 52 and the third thermocouple 54 are at temperatures of 20 ° C, 25 ° C and 50 ° C at the first, second and third positions, respectively. To indicate. According to the prior art, it is expected that the elevated temperature (50 ° C.) at the first, second or third position in the first layer 24 of the first resin or dry chemical will indicate the location of the exothermic head surface. Can be. The processor operates to calculate DELTA T21 = T2-T1 and DELTA T32 = T3-T2. ΔT21 is expected to be approximately equal to ΔT32. Next, the lifetime of the first layer 24 consisting of the first resin and the dry chemical is calculated as ΔT 21/2. This is because the exothermic wave is expected to pass through the remaining portion of the first layer 24 composed of the first resin and the dry chemical for half of that time.

Laminar flow of waste gas through the resin or dry chemical bed 20 filled from the semiconductor manufacturing equipment is provided to facilitate uniform movement of the exothermic wavefront through the filled resin or dry chemical bed 20. The laminar flow through the filled resin or dry chemical bed 20 communicates with the canister inlet port 70 to diffuse the waste nozzles 60 in the canister bottom plenum 12 to disperse the waste gas, and inside the canister 10. And the hemispherical dome 80 covering the upper plenum 14 of the canister and the first and second screens 30 and 40 for distributing and distributing the waste gas.

Referring to FIG. 5, the dispersion nozzle 60 includes a cylinder portion 62 extending from the canister inlet port 70 and a distal end portion 64 inclined downward. A plurality of holes 66 are formed spaced apart along the expansion portion 62, a plurality of holes (not shown) are formed on the opposite side. The aperture 66 is also formed in the extension 62 below the equator to direct the incoming waste gas towards the bottom of the lower plenum (12 in FIG. 1).

As shown in FIG. 6, a pair of holes 68 are formed in the distal end portion 64 inclined downward. Waste gas flowing through the hole 68 by the direction of the distal end 64 inclined downward is directed to the bottom of the lower plenum 12.

The sum of the areas of the hole 66 and the hole 68 is larger than the cross-sectional area of the expanded cylinder portion 62, which increases the back pressure, thereby lowering the probability that the waste gas is returned to the semiconductor manufacturing equipment.

Referring to FIG. 7, the dome 80 has a hemispherical contour. The dome 80 generally includes an outlet port 90 to which a fan or a vacuum source (not shown) is connected to remove waste gas passing through the canister 10. The dome 80 reduces blind spots in the filled resin or dry chemical bed 20 in the region proximate the second layer 26 and contributes to the enhancement of laminar flow of waste gas through the canister 10. It has a form.

As shown in FIG. 1, the first and second screens 30, 40 respectively enclose a filled resin or dry chemical bed 20 in the canister 10. As shown in FIG. 8, the first screen 30 has a thickness of 10 mm and includes a round member having a plurality of holes 32. The hole 32 is shaped and sized to hold the resin bed 20 filled over the first screen 30. Since the second filled resin or dry chemical bed has a diameter of 3 mm or more, the hole 32 preferably has a diameter within 3 mm. As shown in FIG. 1, the first screen 30 supports a first layer 22 consisting of a second resin or dry chemical bed, further extending between the filled resin or dry chemical 20 and the lower plenum 12. To provide a boundary. As expected in the prior art, the aperture 32 further disperses the waste gas dispersed by the dispersion nozzle 60, thereby providing laminar flow through the filled resin or dry chemical bed 20.

The second screen 40 is the same size or shape as the first screen 30 and is located at the top of the second layer 26 made of a second fill resin or dry chemical. The second screen 40 further forms the bottom of the upper plenum 14. The second screen additionally provides laminar flow through the fill resin or dry chemical bed 20.

As shown in Figure 1, the canister 10 is composed of three zones. The first zone 16 surrounds the lower plenum 12. The first zone 16 is preferably connected with a second zone 18 surrounding the resin or dry chemical bed 20 filled in the first flange 32. The dome 80 is connected to the second zone 18 at the second flange 42. As shown, the first and second screens 30, 40 are located in the first and second flanges 32, 42, respectively.

A frequent problem with filled resin or dry chemical bed dust collectors relates to the blockage of the device by particles produced by the reaction of the resin or dry chemical with waste gases. According to a preferred embodiment, the viewing window 100 is provided as shown in FIGS. 1, 9 and 10. The observation window 100 may be located at the lower end of the canister 10 to observe the dispersion nozzle 60. The flange 102 formed on the outside of the canister 10 includes a claw clamp 104 to protect the removable glass member 106 from the flange 102.

By installing the observation window 100, visual observation of the lower plenum 12, the dispersion nozzle 60, and the first screen 30 is possible. If particle formation is observed in any of the lower plenum 12, the dispersing nozzle 60, or the first screen 30, the glass member 106 is removed from its original position and these components are accumulated particles. The vacuum cleaner 120 shown in FIG. 11 may be accessed for the removal of. Particle removal from the dispersion nozzle 60 prevents an increase in back pressure in the semiconductor manufacturing device and prevents the particles from reaching the semiconductor manufacturing device. As mentioned above, since the first screen 30 ensures laminar flow through the filling resin or dry chemical bed 20, removal of the particles is important to maintain such laminar flow.

In practice, the waste gas of the semiconductor manufacturing apparatus flows into the canister 10 through the inlet port 70. The pressure difference between the upper plenum 14 and the lower plenum 12 is formed by an outlet or vacuum source connected to the outlet port 90. Preferably, the pressure of the upper plenum 14 is as low as several hundred millimeters of pressure relative to atmospheric pressure, and the pressure of the lower plenum 12 is less than several hundred millimeters of pressure relative to atmospheric pressure. The pressure difference between 12 is set to several orders of 5 mm. The waste gas is dispersed by the dispersion nozzle 60 and flows to the bottom of the lower plenum 12. The waste gas then flows through the bottom screen 30 and the filled resin or dry chemical bed 20. Laminar flow through the filled resin or dry chemical bed 20 passes through the filled resin or dry chemical bed 20 in accordance with the reaction of the components and waste gas in the filled resin or dry chemical bed 20. Provides even heat generation. Thermocouples 50, 52, and 54 coupled to the processor detect the movement of the heating head, and the processor predicts the end of life of the filled resin or dry chemical bed 20.

In a preferred embodiment the canister 10 is made of stainless steel and has a height of 1370 mm and an inner diameter of 444 mm. The dome 80 has a radius of 222 mm and is coupled to the top of the canister at a position corresponding to the position of the second screen 40. Filled resin or dry chemical bed 20 has a depth of 876 mm and bottom plenum 12 has a depth of 151.5 mm. The first and second screens 30 and 40 have a diameter of 440 mm. As shown in FIG. 1, a plurality of casters 110 are included at the bottom of the canister 10 to be movable.

The dispersion nozzle 60 preferably has a length of 260 mm and a diameter of 38.1 mm, and the bent portion 64 extends while inclining downward from the end of the dispersion nozzle to finish at a 38 mm position at the end of the dispersion nozzle. .

As described above, according to the present invention, it is possible to efficiently remove the toxic components in the waste gas generated in the semiconductor manufacturing apparatus in the filled resin or dry chemical bed type independent dust collector system.

As can be seen by the various embodiments described above, the present invention is disclosed by way of example, but is not limited thereto. Thus, the scope of the disclosed embodiments should not be limited by the above-described exemplary embodiments, but should be defined by the following claims and their equivalents.

Claims (18)

In the gas dust collector for removing toxic components in the waste gas generated in the semiconductor manufacturing apparatus, the canister, Inlet and outlet; A lower plenum connected to the inlet through a dispersion nozzle located therein; An upper plenum connected to the outlet; And And a packed bed positioned between the lower plenum and the upper plenum and bounded by a first screen adjacent the lower plenum and a second screen adjacent the upper plenum. The dispersion nozzle of claim 1, wherein the dispersion nozzle comprises a body and an inclined end portion, the end portion having a plurality of first holes spaced apart from each other and positioned at the inlet, and the body having a plurality of second holes spaced apart from each other. And a plurality of the first holes and the second holes to face the bottom of the lower plenum. The gas dust collector of claim 2, wherein the inclined end portion faces the bottom of the lower plenum. The gas dust collector according to claim 3, wherein the body is cylindrical and a plurality of the second holes are formed on both sides of the body length below the equator line. The gas dust collector of claim 1, wherein the canister is cylindrical and the top plenum has a substantially hemispherical shape. The gas of claim 1, wherein the first screen has a plurality of third holes formed therein, and the second screen has a plurality of fourth holes formed therein. Dust Collector. 7. The gas dust collector according to claim 6, wherein the third and fourth holes each have a diameter of 3 mm or less. The gas dust collector of claim 1, wherein the canister further includes an observation window, and the observation window has a glass member attached to and removed from a flange formed in the canister. The gas dust collector of claim 8, wherein the flange has a round shape and an access port connected to the lower plenum is formed in the canister. In the method for removing toxic components in waste gas generated from a semiconductor manufacturing apparatus, An inlet and an outlet, a lower plenum connected to the inlet through a dispersion nozzle located therein, an upper plenum connected to the outlet, and located in the middle of the lower plenum and the upper plenum; Providing a canister comprising a packed bed bounded by an adjacent first screen and a second screen adjacent the upper plenum; And And promoting the flow of waste gas through the inlet, the canister, and the outlet. The dispersing nozzle of claim 10, wherein the dispersing nozzle comprises a body and an inclined distal end, the distal end having a plurality of first holes spaced apart from the inlet, and spaced apart from the inlet. And a plurality of second holes disposed so that the plurality of first holes and the second holes face the bottom of the lower plenum. 12. The method of claim 11 wherein the slanted end faces the bottom of the lower plenum. The method of claim 12, wherein the body is cylindrical, and a plurality of the second holes are formed on both sides of the body length below the equator line. 12. The method of claim 10, wherein the canister is cylindrical and the top plenum is substantially hemispherical in shape. 11. The waste gas of claim 10, wherein the first screen has a plurality of third holes formed through the inside thereof, and the second screen has a plurality of fourth holes formed through the inside thereof. How to get rid of toxic substances from 16. The method of claim 15, wherein the third and fourth holes each have a diameter of 3 mm or less. 11. The method of claim 10, further comprising providing a removable glass member attached to a flange formed on the canister, and removing the glass member to provide an access port in communication with the lower plenum. A method for removing toxic substances from waste gas. 18. The method of claim 17, further comprising inserting a vacuum device in the lower plenum, wherein the vacuum device is adapted to remove accumulated particles from the lower plenum, the dispersion nozzle and the first screen. How to remove toxic substances from waste gas.