KR20010066812A - Manufacturing method of ink jet printer head - Google Patents

Abstract

PURPOSE: An ink jet printer head manufacturing method is provided to integrally forming an ink jet printer head by an electric chemical batch process for simplifying the mass-production, and remove the joining and assembling per part or the whole parts for reducing the lead time. CONSTITUTION: An ink jet printer head manufacturing method includes the steps of preparing a substrate, forming a crater layer(14) at a lower part of the substrate by photolithography and plating, forming a nozzle plate(18) at a lower part of the crater layer by photolithography and plating, forming a flow channel plate(22) at a lower part of the nozzle plate by photolithography and plating, forming a reservoir plate(26) at a lower part of the flow channel plate by photolithography and plating, forming a restricter plate(30) at a lower part of the reservoir plate by photolithography and plating, forming a vibration plate at a lower part of the chamber plate by plating, removing the substrate, removing all remaining photoresist, forming a piezoelectric/electro-striction film(40) which carries out actuating in response to power supply on to the vibration plate, forming upper electrodes on of the piezoelectric/electro-restriction film.

Description

Manufacturing method of ink jet printer head

The present invention relates to a print head, and more particularly, to a method of manufacturing an ink jet printer head.

As shown in FIG. 1, the inkjet printer head includes a nozzle plate 222 on which a nozzle 223 is formed, a reservoir plate 221 on which a reservoir 220 is formed, and a flow path plate 219 on which a flow path 218 is formed. And a restrictor plate 217 on which the restrictor 216 is formed, a chamber plate 215 forming the chamber 214, an upper electrode 210, a piezoelectric body 211, and a lower electrode 212. It is common for actuators to be formed by stacking one after another.

The ink jet printer head is formed in the inkjet printer head by the above configuration, such as nozzles 223, reservoirs 220, flow passages 218, restrictors 216, and chambers 214 having different sizes and shapes.

Ink supplied from an ink container (not shown) is stored in the reservoir 220 and flows into the chamber 214 through the flow path 218. At this time, the restrictor 216 formed between the flow path 218 and the chamber 214 maintains a constant rate at which ink flows into the chamber 214.

When a voltage is applied to the upper electrode 210 and the lower electrode 212 of the actuator formed on the chamber 214, the piezoelectric element 211 is actuated, the chamber by the actuation of the piezoelectric element 211 As the volume of 214 decreases momentarily, ink in the chamber 214 is injected onto the recording material through the nozzle 223 formed in the nozzle plate 222. Printing is performed by spraying ink.

In order to manufacture the ink jet printer head as described above, a nozzle plate having a nozzle, a reservoir plate having a reservoir, a flow path plate having a flow path, a restrictor plate having a restrictor, and a chamber plate having a chamber are separately formed and then assembled. Has been used.

In this method, each plate constituting the inkjet printer head is formed by a separate process, and a photoresist is applied to each separately formed plate and exposed, followed by micropatterning using a micro-punching or lithography process. To form guide holes for assembly and pile one by one. The guide holes are tightened with screws or the like to fix the plates, and then heat treated to bond the plates, thereby completing the inkjet printer head.

This conventional method has a problem in that the yield is low because the assembly tolerance is likely to occur because the size and the position of the guide hole do not exactly match when assembling each plate. In addition, the photoresist applied before bonding each plate has a disadvantage in that manufacturing cost increases because a photoresist having excellent adhesion and low reactivity with ink should be used.

SUMMARY OF THE INVENTION An object of the present invention for solving the above problems is to provide a method of manufacturing an inkjet printer head by collectively forming each part using an electrochemical process.

1 is a cross-sectional view showing a typical inkjet printer head,

2 to 26 is a process chart showing an embodiment of the present invention,

27 to 50 are process diagrams showing another embodiment of the present invention.

<Description of the symbols for the main parts of the drawings>

10, 60: substrate 12, 62: first photoresist

13, 63: crater 14, 64: crater layer

16, 66: second photoresist 17, 67: nozzle

18, 68: nozzle plate 20, 70: third photoresist

21, 71: Euro 22, 72: Euro plate

24, 74: fourth photoresist 25, 75: reservoir

26, 76: reservoir plate 28, 78: fifth photoresist

29, 79: List of characters 30, 80: List of characters

32, 82: sixth photoresist 33, 83: chamber

34, 84: chamber plate 36, 86: diaphragm

38: lower electrode 40, 90: piezoelectric / electric distortion film

42, 92: upper electrode

The present invention for achieving the above object comprises the steps of providing a substrate; Forming a first photoresist layer by applying a photoresist on the lower portion of the substrate by the thickness of the crater layer; Patterning, exposing and etching the first photoresist layer to leave photoresist only in the crater portion; Plating the lower portion of the substrate to form a crater layer; Forming a second photoresist layer by applying a photoresist under the crater layer to a thickness of a nozzle plate; Patterning, exposing and etching the second photoresist layer to leave photoresist only in the nozzle portion; Plating under the crater layer to form a nozzle plate; Forming a third photoresist layer by applying a photoresist to the lower portion of the nozzle plate by the thickness of the flow path plate; Patterning, exposing and etching the third photoresist layer to leave photoresist only in the flow path portion; Plating the lower portion of the nozzle plate to form a flow path plate; Forming a fourth photoresist layer by applying a photoresist on the lower portion of the flow path plate to the thickness of the reservoir plate; Patterning, exposing and etching the fourth photoresist layer to leave photoresist only in the reservoir portion; Plating the lower portion of the flow path plate to form a reservoir plate; Forming a fifth photoresist layer by applying a photoresist under the reservoir plate to a thickness of the restrictor plate; Patterning, exposing and etching the fifth photoresist layer to leave photoresist only in the restrictive portion; Plating the lower portion of the reservoir plate to form a restrictor plate; Forming a sixth photoresist layer by applying a photoresist to the lower portion of the restrictor plate to a thickness of a chamber plate; Patterning, exposing and etching the sixth photoresist layer to leave photoresist only in the chamber portion; Plating the lower portion of the restrictor plate to form a chamber plate; Plating the lower portion of the chamber plate to form a diaphragm; Removing the substrate; Removing all of the remaining photoresist; Forming a piezoelectric / electric distortion film that is actuated as power is applied to an upper portion of the diaphragm; It relates to a method of manufacturing an inkjet printer head comprising forming an upper electrode on the piezoelectric / electric distortion film.

In another aspect, the present invention provides a method comprising the steps of providing a substrate made of piezoelectric / electrostrictive material; Plating the lower portion of the substrate to form a diaphragm; Forming a sixth photoresist layer by applying a photoresist on a lower portion of the diaphragm to a thickness of a chamber plate; Patterning, exposing and etching the sixth photoresist layer to leave photoresist only in the chamber portion; Plating the lower portion of the diaphragm to form a chamber plate; Forming a fifth photoresist layer by applying a photoresist under the chamber plate to a thickness of a restrictor plate; Patterning, exposing and etching the fifth photoresist layer to leave photoresist only in the restrictive portion; Plating the lower portion of the chamber plate to form a restrictor plate; Forming a fourth photoresist layer by applying a photoresist on the lower part of the restrictor plate to a thickness of a reservoir plate; Patterning, exposing and etching the fourth photoresist layer to leave photoresist only in the reservoir portion; Forming a reservoir plate by plating the lower part of the restrictor plate; Forming a third photoresist layer by applying a photoresist under the reservoir plate to a thickness of the flow path plate; Patterning, exposing and etching the third photoresist layer to leave photoresist only in the flow path portion; Plating the lower portion of the reservoir plate to form a flow path plate; Forming a second photoresist layer by applying a photoresist to the lower portion of the flow path plate by the thickness of the nozzle plate; Patterning, exposing and etching the second photoresist layer to leave photoresist only in the nozzle portion; Plating the lower portion of the flow path plate to form a nozzle plate; Forming a first photoresist layer by applying a photoresist on the lower portion of the nozzle plate by the thickness of the crater layer; Patterning, exposing and etching the first photoresist layer to leave photoresist only in the crater portion; Plating the lower portion of the nozzle plate to form a crater layer; Removing all of the remaining photoresist; Wrapping and etching the substrate to form a piezoelectric / distortion film; It relates to a method of manufacturing an inkjet printer head comprising forming an upper electrode on the piezoelectric / electric distortion film.

As a base material of the substrate, silicon (Si) wafer, metals such as stainless steel, high molecular compound or ceramic-based material such as aluminum oxide (Al ₂ O ₃ ), silicon dioxide (SiO ₂ ), PZT Can be used.

The first photoresist is applied to the lower portion of the substrate by the thickness of the crater layer, and then exposed and etched to shield the portion where the crater is to be formed with the first photoresist.

In the case of using a silicon wafer, a polymer material or a ceramic non-conductive material as a substrate, a seeding layer should be formed under the substrate. When metals are used as the substrate, it is not necessary to form the seeding layer, but a separate seeding layer may be formed in order to cause the plating to occur stably. As the seeding layer, a thin film is formed by sputtering or evaporating a conductive metal such as gold (Au) or nickel (Ni).

After shielding with the first photoresist, a crater layer is formed under the metal substrate or the substrate on which the seeding layer is formed.

The second photoresist is applied to the lower portion of the formed crater layer by the thickness of the nozzle plate, and then exposed and etched to shield the site where the nozzle is to be formed with the second photoresist. After shielding with the second photoresist, a nozzle plate is formed under the crater layer. The third photoresist is applied to the lower portion of the formed nozzle plate by the thickness of the flow path plate, and then exposed and etched to shield the portion where the flow path is to be formed with the third photoresist. A flow path plate is formed under the nozzle plate shielded with the third photoresist.

The fourth photoresist is applied to the lower portion of the formed flow path plate by the thickness of the reservoir plate, and then exposed and etched to shield the portion where the reservoir is to be formed with the fourth photoresist. The reservoir is formed under the flow path plate shielded with the fourth photoresist.

The fifth photoresist is applied to the lower portion of the formed reservoir plate by the thickness of the restrictor plate, and then exposed and etched to shield the portion where the restrictor is to be formed with the fifth photoresist. A restrictor plate is formed under the reservoir plate shielded with the fifth photoresist.

The sixth photoresist is applied to the lower portion of the formed restrictor plate by the thickness of the chamber plate, and then exposed and etched to shield the portion where the chamber is to be formed with the sixth photoresist. A chamber plate is formed below the restrictor plate shielded with the sixth photoresist.

The vibration plate is formed in the lower portion of the formed chamber plate.

The material of the crater layer, the nozzle plate, the flow path plate, the reservoir plate, the restrictor plate, the chamber plate, and the diaphragm is selected from a single metal, a composite metal, a ceramic, and a metal-ceramic composite. It is preferable to use nickel (Ni), copper (Cu) or the like as a single metal, and alloys such as nickel-chromium (Ni-Cr) and nickel-cobalt-tungsten (Ni-Co-W) may be used as the composite metal. It is preferable to use. As the ceramic, it is preferable to use silicon dioxide (SiO ₂ ), silicon nitride (Si ₃ N ₄ ), aluminum oxide (Al ₂ O ₃ ), silicon carbide (SiC), or the like. Metal-ceramic composites include nickel-aluminum oxide (Ni-Al ₂ O ₃ ), nickel-silicon dioxide (Ni-SiO ₂ ), nickel-titanium dioxide (Ni-TiO ₂ ), and nickel-silicon carbide (Ni-SiC) , Nickel-titanium carbide (Ni-TiC), nickel-tungsten carbide (Ni-WC), or the like is preferably used.

At this time, the characteristics of the finished inkjet print head may be changed according to the material of the material used. Therefore, the rigidity of the inkjet printer head, the reactivity of the inkjet printer head with the ink, the surface properties of the member, the external resistance such as corrosion resistance, etc. Consider and select the appropriate material.

In particular, in the case of a diaphragm, it is preferable to use a metal-ceramic composite. This is because these materials have high rigidity, which is excellent in frequency characteristics and can prevent crosstalk due to high integration of the inkjet print head.

In addition, the above-mentioned materials are plated to form a crater layer, a nozzle plate, a flow path plate, a reservoir plate, a restrictor plate, a chamber plate, and a diaphragm plate. Electroplating or electroless plating is used as the plating method.

After forming the diaphragm to complete the whole structure, the substrate is removed. After removing the substrate, the photoresist is removed by etching. When the photoresist included in the entire structure is removed, a crater, a nozzle, a flow path, a reservoir, a restrictor, and a chamber are formed.

It is also possible to proceed with the above process in reverse order. In the reverse order, each process is as described above, and the substrate is formed in the order of the vibration plate, the chamber plate, the restrictor plate, the reservoir plate, the flow path plate, the nozzle plate, and the crater layer. Remove the resist.

The piezoelectric / electrodistor film and the upper electrode, which are actuators, are formed on the diaphragm formed by the above methods, or the lower electrode, the piezoelectric / electric strain film, and the upper electrode are formed to complete the inkjet printer head. As a method of forming the actuator, methods generally used may be used.

When the piezoelectric / distortion material such as PZT is used as the substrate in the reverse method, the substrate may be used as a piezoelectric / distortion film by wrapping, patterning, and etching the substrate. In this case, the inkjet printer head is completed by forming only the upper electrode.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

2 to 26 illustrate one embodiment of the method of the present invention.

The first photoresist 12 is applied to the lower portion of the substrate 10 by the thickness of the crater layer, and then exposed and etched to shield the portion where the crater is to be formed by the first photoresist 12. After shielding with the first photoresist 12, the crater layer 14 is formed on the lower portion of the substrate.

The second photoresist 16 is applied to the lower portion of the formed crater layer 14 by the thickness of the nozzle plate, and then exposed and etched to shield the site where the nozzle is to be formed by the second photoresist 16. After shielding with the second photoresist 16, the nozzle plate 18 is formed under the crater layer 14.

The third photoresist 20 is applied to the lower portion of the formed nozzle plate 18 by the thickness of the flow path plate, and then exposed and etched to shield the portion where the flow path is to be formed by the third photoresist 20. The flow path plate 22 is formed under the nozzle plate 18 shielded by the third photoresist 20.

The fourth photoresist 24 is applied to the lower portion of the flow path plate 22 formed by the thickness of the reservoir plate, and then exposed and etched to shield the portion where the reservoir is to be formed by the fourth photoresist 24. The reservoir plate 26 is formed under the flow path plate 22 shielded by the fourth photoresist 24.

The fifth photoresist 28 is applied to the lower portion of the formed reservoir plate 26 by the thickness of the restrictor plate, and then exposed and etched to shield the portion where the restrictor is to be formed by the fifth photoresist 28. The restrictor plate 30 is formed under the reservoir plate 26 shielded by the fifth photoresist 28.

The sixth photoresist 32 is applied to the lower portion of the formed restrictor plate 30 by the thickness of the chamber plate, and then exposed and etched to shield the portion where the chamber is to be formed by the sixth photoresist 32. The chamber plate 34 is formed below the restrictor plate 30 shielded by the sixth photoresist 32.

The diaphragm 36 is formed below the formed chamber plate 34 to complete the body structure, and then remove the substrate 10. After removing the substrate 10, the photoresist 12, 16, 20, 24, 28 and 32 are etched and removed. When the photoresist included in the overall structure is removed, the crater 13, the nozzle 17, the flow path 21, the reservoir 25, the restrictor 29, and the chamber 33 are formed to form a body of the inkjet printer head. Is completed.

A lower electrode 38, a piezoelectric / electric strain film 40, and an upper electrode 42 are formed on the diaphragm 36 in the body of the ink jet printer head to complete the ink jet printer head.

27-50 illustrate another embodiment of the method of the present invention.

First, the diaphragm 86 is formed by plating the lower portion of the substrate 60 made of piezoelectric / electric warp material.

The sixth photoresist 82 is applied to the lower portion of the formed diaphragm 60 by the thickness of the chamber plate, and then exposed and etched to shield the portion where the chamber is to be formed by the sixth photoresist 82. The chamber plate 84 is formed under the diaphragm 86 shielded by the sixth photoresist 82.

The fifth photoresist 78 is applied to the lower portion of the formed chamber plate 84 by the thickness of the restrictor plate, and then exposed and etched to shield the portion where the restrictor is to be formed by the fifth photoresist 78. The restrictor plate 80 is formed under the chamber plate 84 shielded by the fifth photoresist 78.

The fourth photoresist 74 is applied to the lower portion of the formed restrictor plate 80 by the thickness of the reservoir plate, and then exposed and etched to shield the portion where the reservoir is to be formed by the fourth photoresist 74. The reservoir plate 76 is formed under the restrictor plate 80 shielded by the fourth photoresist 74.

The third photoresist 72 is applied to the lower portion of the formed reservoir plate 76 by the thickness of the flow path plate, and then exposed and etched to shield the portion where the flow path is to be formed by the third photoresist 72. The flow path plate 72 is formed under the reservoir plate 76 shielded by the third photoresist 72.

The second photoresist 66 is applied to the lower portion of the formed flow path plate 72 by the thickness of the nozzle plate, and then exposed and etched to shield the site where the nozzle is to be formed by the second photoresist 66. The nozzle plate 68 is formed under the flow path plate 72 shielded by the second photoresist 66.

The first photoresist 62 is applied to the lower portion of the formed nozzle plate 68 by the thickness of the crater layer, and then exposed and etched to shield the portion where the crater is to be formed by the first photoresist 62. The crater layer 64 is formed under the nozzle plate 68 shielded by the first photoresist 62.

After the crater layer 64 is formed to complete the body structure, the photoresist 62, 66, 70, 74, 78, and 82 is etched and removed. When the photoresist is removed, the crater 63, the nozzle 67, the flow path 71, the reservoir 75, the restrictor 79, and the chamber 83 are formed to complete the body of the inkjet printer head.

After the body is completed, the substrate 60 is wrapped and etched to a predetermined thickness to form a piezoelectric / electrodistor film 90. An upper electrode 92 is formed on the formed piezoelectric / distortion film 90 to complete the inkjet printer head.

The method of the present invention as described above is easy to mass production of a large area because the inkjet printer head is molded in a batch by an electrochemical batch process, and the bonding and assembly processes of parts and whole parts as in the prior art This eliminates lead times.

In addition, the yield of each part is improved and the alignment error of the molded structure is minimized, so that high-precision arrangement is possible. Can be adjusted.

Claims (76)

Providing a substrate; Forming a first photoresist layer by applying a photoresist on the lower portion of the substrate by the thickness of the crater layer; Patterning, exposing and etching the first photoresist layer to leave the first photoresist only in the crater portion; Plating the lower portion of the substrate to form a crater layer; Forming a second photoresist layer by applying a photoresist under the crater layer to a thickness of a nozzle plate; Patterning, exposing and etching the second photoresist layer to leave a second photoresist only in the nozzle portion; Plating under the crater layer to form a nozzle plate; Forming a third photoresist layer by applying a photoresist to the lower portion of the nozzle plate by the thickness of the flow path plate; Patterning, exposing and etching the third photoresist layer to leave a third photoresist only in the flow path portion; Plating the lower portion of the nozzle plate to form a flow path plate; Forming a fourth photoresist layer by applying a photoresist on the lower portion of the flow path plate to the thickness of the reservoir plate; Patterning, exposing and etching the fourth photoresist layer to leave a fourth photoresist only in the reservoir portion; Plating the lower portion of the flow path plate to form a reservoir plate; Forming a fifth photoresist layer by applying a photoresist under the reservoir plate to a thickness of the restrictor plate; Patterning, exposing and etching the fifth photoresist layer to leave the fifth photoresist only in the restrictive portion; Plating the lower portion of the reservoir plate to form a restrictor plate; Forming a sixth photoresist layer by applying a photoresist to the lower portion of the restrictor plate to a thickness of a chamber plate; Patterning, exposing and etching the sixth photoresist layer to leave the sixth photoresist only in the chamber portion; Plating the lower portion of the restrictor plate to form a chamber plate; Plating the lower portion of the chamber plate to form a diaphragm; Removing the substrate; Removing all of the remaining photoresist; Forming a piezoelectric / electric distortion film that is actuated as power is applied to an upper portion of the diaphragm; And forming an upper electrode on the piezoelectric / distortion film. The method of claim 1, further comprising forming a lower electrode between the diaphragm and the piezoelectric / distortion film. 10. The method of claim 1, further comprising forming a seeding layer of metal to allow plating to be securely formed under the substrate. The method of claim 1, wherein the crater layer is selected from a single metal, a composite metal, a ceramic, and a metal-ceramic composite. The method of claim 4, wherein nickel (Ni) or copper (Cu) is used as the single metal. The method of claim 4, wherein the composite metal is nickel-chromium (Ni-Cr) or nickel-cobalt-tungsten (Ni-Co-W). The inkjet printer head of claim 4, wherein the ceramic is selected from silicon dioxide (SiO ₂ ), silicon nitride (Si ₃ N ₄ ), aluminum oxide (Al ₂ O ₃ ), and silicon carbide (SiC). Manufacturing method. The metal-ceramic composite according to claim 4, wherein the metal-ceramic composite is nickel-aluminum oxide (Ni-Al ₂ O ₃ ), nickel-silicon dioxide (Ni-SiO ₂ ), nickel-titanium dioxide (Ni-TiO ₂ ), nickel-carbonization A method of manufacturing an inkjet printer head, characterized in that it is selected from silicon (Ni-SiC), nickel-titanium carbide (Ni-TiC) and nickel-tungsten carbide (Ni-WC). The method of claim 1, wherein the nozzle plate is made of a single metal, a composite metal, a ceramic, and a metal-ceramic composite. 10. The method of claim 9, wherein nickel (Ni) or copper (Cu) is used as the single metal. The method of claim 9, wherein the composite metal is nickel-chromium (Ni-Cr) or nickel-cobalt-tungsten (Ni-Co-W). The inkjet printer head of claim 9, wherein the ceramic is selected from silicon dioxide (SiO ₂ ), silicon nitride (Si ₃ N ₄ ), aluminum oxide (Al ₂ O ₃ ), and silicon carbide (SiC). Manufacturing method. 10. The method of claim 9, wherein the metal-ceramic composite includes nickel-aluminum oxide (Ni-Al ₂ O ₃ ), nickel-silicon dioxide (Ni-SiO ₂ ), nickel-titanium dioxide (Ni-TiO ₂ ), and nickel-carbonization. A method of manufacturing an inkjet printer head, characterized in that it is selected from silicon (Ni-SiC), nickel-titanium carbide (Ni-TiC) and nickel-tungsten carbide (Ni-WC). The method of claim 1, wherein the flow path plate is selected from a single metal, a composite metal, a ceramic, and a metal-ceramic composite. 15. The method of claim 14, wherein nickel (Ni) or copper (Cu) is used as the single metal. The method of claim 14, wherein the composite metal is nickel-chromium (Ni-Cr) or nickel-cobalt-tungsten (Ni-Co-W). The inkjet printer head of claim 14, wherein the ceramic is selected from silicon dioxide (SiO ₂ ), silicon nitride (Si ₃ N ₄ ), aluminum oxide (Al ₂ O ₃ ), and silicon carbide (SiC). Manufacturing method. 15. The method of claim 14, wherein the metal-ceramic composite is nickel-aluminum oxide (Ni-Al ₂ O ₃ ), nickel-silicon dioxide (Ni-SiO ₂ ), nickel-titanium dioxide (Ni-TiO ₂ ), nickel-carbonization A method of manufacturing an inkjet printer head, characterized in that it is selected from silicon (Ni-SiC), nickel-titanium carbide (Ni-TiC) and nickel-tungsten carbide (Ni-WC). The method of claim 1, wherein the reservoir plate is made of a single metal, a composite metal, a ceramic, or a metal-ceramic composite. 20. The method of claim 19, wherein nickel (Ni) or copper (Cu) is used as the single metal. 20. The method of claim 19, wherein the composite metal is nickel-chromium (Ni-Cr) or nickel-cobalt-tungsten (Ni-Co-W). 20. The inkjet printer head of claim 19, wherein the ceramic is selected from silicon dioxide (SiO ₂ ), silicon nitride (Si ₃ N ₄ ), aluminum oxide (Al ₂ O ₃ ), and silicon carbide (SiC). Manufacturing method. 20. The method of claim 19, wherein the metal-ceramic composite includes nickel-aluminum oxide (Ni-Al ₂ O ₃ ), nickel-silicon dioxide (Ni-SiO ₂ ), nickel-titanium dioxide (Ni-TiO ₂ ), and nickel-carbonization. A method of manufacturing an inkjet printer head, characterized in that it is selected from silicon (Ni-SiC), nickel-titanium carbide (Ni-TiC) and nickel-tungsten carbide (Ni-WC). The method of claim 1, wherein the material of the restrictor plate is selected from a single metal, a composite metal, a ceramic, and a metal-ceramic composite. 25. The method of claim 24, wherein nickel (Ni) or copper (Cu) is used as the single metal. 25. The method of claim 24, wherein the composite metal is nickel-chromium (Ni-Cr) or nickel-cobalt-tungsten (Ni-Co-W). The inkjet printer head of claim 24, wherein the ceramic is selected from silicon dioxide (SiO ₂ ), silicon nitride (Si ₃ N ₄ ), aluminum oxide (Al ₂ O ₃ ), and silicon carbide (SiC). Manufacturing method. 25. The method of claim 24, wherein the metal-ceramic composite is nickel-aluminum oxide (Ni-Al ₂ O ₃ ), nickel-silicon dioxide (Ni-SiO ₂ ), nickel-titanium dioxide (Ni-TiO ₂ ), nickel-carbonization A method of manufacturing an inkjet printer head, characterized in that it is selected from silicon (Ni-SiC), nickel-titanium carbide (Ni-TiC) and nickel-tungsten carbide (Ni-WC). The method of claim 1, wherein the chamber plate is selected from a single metal, a composite metal, a ceramic, and a metal-ceramic composite. 30. The method of claim 29, wherein nickel (Ni) or copper (Cu) is used as the single metal. 30. The method of claim 29, wherein the composite metal is nickel-chromium (Ni-Cr) or nickel-cobalt-tungsten (Ni-Co-W). The inkjet printer head of claim 29, wherein silicon dioxide (SiO ₂ ), silicon nitride (Si ₃ N ₄ ), aluminum oxide (Al ₂ O ₃ ), or silicon carbide (SiC) is used as the ceramic. Way. 30. The method of claim 29, wherein the metal-ceramic composite is nickel-aluminum oxide (Ni-Al ₂ O ₃ ), nickel-silicon dioxide (Ni-SiO ₂ ), nickel-titanium dioxide (Ni-TiO ₂ ), nickel-carbonization A method of manufacturing an inkjet printer head, characterized in that it is selected from silicon (Ni-SiC), nickel-titanium carbide (Ni-TiC) and nickel-tungsten carbide (Ni-WC). The method of claim 1, wherein the diaphragm is made of a single metal, a composite metal, a ceramic, and a metal-ceramic composite. 35. The method of claim 34, wherein nickel (Ni) or copper (Cu) is used as the single metal. The method of claim 34, wherein the composite metal is nickel-chromium (Ni-Cr) or nickel-cobalt-tungsten (Ni-Co-W). 35. The inkjet printer head of claim 34, wherein the ceramic is selected from silicon dioxide (SiO ₂ ), silicon nitride (Si ₃ N ₄ ), aluminum oxide (Al ₂ O ₃ ), and silicon carbide (SiC). Manufacturing method. 35. The method of claim 34, wherein the metal-ceramic composite is nickel-aluminum oxide (Ni-Al ₂ O ₃ ), nickel-silicon dioxide (Ni-SiO ₂ ), nickel-titanium dioxide (Ni-TiO ₂ ), nickel-carbonization A method of manufacturing an inkjet printer head, characterized in that it is selected from silicon (Ni-SiC), nickel-titanium carbide (Ni-TiC) and nickel-tungsten carbide (Ni-WC). Providing a substrate made of piezoelectric / distortion material; Plating the lower portion of the substrate to form a diaphragm; Forming a sixth photoresist layer by applying a photoresist on a lower portion of the diaphragm to a thickness of a chamber plate; Patterning, exposing and etching the sixth photoresist layer to leave the sixth photoresist only in the chamber portion; Plating the lower portion of the diaphragm to form a chamber plate; Forming a fifth photoresist layer by applying a photoresist under the chamber plate to a thickness of a restrictor plate; Patterning, exposing and etching the fifth photoresist layer to leave the fifth photoresist only in the restrictive portion; Plating the lower portion of the chamber plate to form a restrictor plate; Forming a fourth photoresist layer by applying a photoresist on the lower part of the restrictor plate to a thickness of a reservoir plate; Patterning, exposing and etching the fourth photoresist layer to leave a fourth photoresist only in the reservoir portion; Forming a reservoir plate by plating the lower part of the restrictor plate; Forming a third photoresist layer by applying a photoresist under the reservoir plate to a thickness of the flow path plate; Patterning, exposing and etching the third photoresist layer to leave a third photoresist only in the flow path portion; Plating the lower portion of the reservoir plate to form a flow path plate; Forming a second photoresist layer by applying a photoresist to the lower portion of the flow path plate by the thickness of the nozzle plate; Patterning, exposing and etching the second photoresist layer to leave a second photoresist only in the nozzle portion; Plating the lower portion of the flow path plate to form a nozzle plate; Forming a first photoresist layer by applying a photoresist on the lower portion of the nozzle plate by the thickness of the crater layer; Patterning, exposing and etching the first photoresist layer to leave the first photoresist only in the crater portion; Plating the lower portion of the nozzle plate to form a crater layer; Removing all of the remaining photoresist; Wrapping, patterning, and etching the substrate to form a piezoelectric / distortion film; And forming an upper electrode on the piezoelectric / distortion film. 40. The method of claim 39, further comprising forming a lower electrode under the substrate. 40. The method of claim 39, further comprising forming a seeding layer made of metal to allow plating to be securely formed under the substrate. 40. The method of claim 39, wherein the diaphragm is selected from a single metal, a composite metal, a ceramic, and a metal-ceramic composite. 43. The method of claim 42, wherein nickel (Ni) or copper (Cu) is used as the single metal. 43. The method of claim 42, wherein the composite metal is nickel-chromium (Ni-Cr) or nickel-cobalt-tungsten (Ni-Co-W). 43. The inkjet printer head of claim 42, wherein the ceramic is selected from silicon dioxide (SiO ₂ ), silicon nitride (Si ₃ N ₄ ), aluminum oxide (Al ₂ O ₃ ), and silicon carbide (SiC). Manufacturing method. 43. The method of claim 42, wherein the metal-ceramic composite is nickel-aluminum oxide (Ni-Al ₂ O ₃ ), nickel-silicon dioxide (Ni-SiO ₂ ), nickel-titanium dioxide (Ni-TiO ₂ ), nickel-carbonization A method of manufacturing an inkjet printer head, characterized in that it is selected from silicon (Ni-SiC), nickel-titanium carbide (Ni-TiC) and nickel-tungsten carbide (Ni-WC). 40. The method of claim 39, wherein the chamber plate is selected from a single metal, a composite metal, a ceramic, and a metal-ceramic composite. 48. The method of claim 47, wherein nickel (Ni) or copper (Cu) is used as the single metal. 48. The method of claim 47, wherein the composite metal is nickel-chromium (Ni-Cr) or nickel-cobalt-tungsten (Ni-Co-W). The inkjet printer head of claim 47, wherein the ceramic is selected from silicon dioxide (SiO ₂ ), silicon nitride (Si ₃ N ₄ ), aluminum oxide (Al ₂ O ₃ ), and silicon carbide (SiC). Manufacturing method. 48. The method of claim 47, wherein the metal-ceramic composite is nickel-aluminum oxide (Ni-Al ₂ O ₃ ), nickel-silicon dioxide (Ni-SiO ₂ ), nickel-titanium dioxide (Ni-TiO ₂ ), nickel-carbonization A method of manufacturing an inkjet printer head, characterized in that it is selected from silicon (Ni-SiC), nickel-titanium carbide (Ni-TiC) and nickel-tungsten carbide (Ni-WC). 40. The method of claim 39, wherein the material of the restrictor plate is selected from a single metal, a composite metal, a ceramic, and a metal-ceramic composite. 53. The method of claim 52, wherein nickel (Ni) or copper (Cu) is used as the single metal. 53. The method of claim 52, wherein the composite metal is nickel-chromium (Ni-Cr) or nickel-cobalt-tungsten (Ni-Co-W). The inkjet printer head of claim 52, wherein the ceramic is selected from silicon dioxide (SiO ₂ ), silicon nitride (Si ₃ N ₄ ), aluminum oxide (Al ₂ O ₃ ), and silicon carbide (SiC). Manufacturing method. 53. The method of claim 52, wherein the metal-ceramic composite includes nickel-aluminum oxide (Ni-Al ₂ O ₃ ), nickel-silicon dioxide (Ni-SiO ₂ ), nickel-titanium dioxide (Ni-TiO ₂ ), nickel-carbonization A method of manufacturing an inkjet printer head, characterized in that it is selected from silicon (Ni-SiC), nickel-titanium carbide (Ni-TiC) and nickel-tungsten carbide (Ni-WC). 40. The method of claim 39, wherein the reservoir plate is selected from a single metal, a composite metal, a ceramic, and a metal-ceramic composite. 58. The method of claim 57, wherein nickel (Ni) or copper (Cu) is used as the single metal. 59. The method of claim 57, wherein the composite metal is nickel-chromium (Ni-Cr) or nickel-cobalt-tungsten (Ni-Co-W). 59. The inkjet printer head of claim 57, wherein the ceramic is selected from silicon dioxide (SiO ₂ ), silicon nitride (Si ₃ N ₄ ), aluminum oxide (Al ₂ O ₃ ), and silicon carbide (SiC). Manufacturing method. 58. The method of claim 57, wherein the metal-ceramic composite is nickel-aluminum oxide (Ni-Al ₂ O ₃ ), nickel-silicon dioxide (Ni-SiO ₂ ), nickel-titanium dioxide (Ni-TiO ₂ ), nickel-carbonization A method of manufacturing an inkjet printer head, characterized in that it is selected from silicon (Ni-SiC), nickel-titanium carbide (Ni-TiC) and nickel-tungsten carbide (Ni-WC). 40. The method of claim 39, wherein the flow path plate is selected from a single metal, a composite metal, a ceramic, and a metal-ceramic composite. 63. The method of claim 62, wherein nickel (Ni) or copper (Cu) is used as the single metal. 63. The method of claim 62, wherein the composite metal is nickel-chromium (Ni-Cr) or nickel-cobalt-tungsten (Ni-Co-W). 63. The inkjet printer head of claim 62, wherein the ceramic is selected from silicon dioxide (SiO ₂ ), silicon nitride (Si ₃ N ₄ ), aluminum oxide (Al ₂ O ₃ ), and silicon carbide (SiC). Manufacturing method. 63. The method of claim 62, wherein the metal-ceramic composite is nickel-aluminum oxide (Ni-Al ₂ O ₃ ), nickel-silicon dioxide (Ni-SiO ₂ ), nickel-titanium dioxide (Ni-TiO ₂ ), nickel-carbonization A method of manufacturing an inkjet printer head, characterized in that it is selected from silicon (Ni-SiC), nickel-titanium carbide (Ni-TiC) and nickel-tungsten carbide (Ni-WC). 40. The method of claim 39, wherein the nozzle plate is selected from a single metal, a composite metal, a ceramic, and a metal-ceramic composite. 69. The method of claim 67, wherein nickel (Ni) or copper (Cu) is used as the single metal. 67. The method of claim 67, wherein the composite metal is nickel-chromium (Ni-Cr) or nickel-cobalt-tungsten (Ni-Co-W). The inkjet printer head of claim 67, wherein the ceramic is selected from silicon dioxide (SiO ₂ ), silicon nitride (Si ₃ N ₄ ), aluminum oxide (Al ₂ O ₃ ), and silicon carbide (SiC). Manufacturing method. 68. The method of claim 67, wherein the metal-ceramic composite is nickel-aluminum oxide (Ni-Al ₂ O ₃ ), nickel-silicon dioxide (Ni-SiO ₂ ), nickel-titanium dioxide (Ni-TiO ₂ ), nickel-carbonization A method of manufacturing an inkjet printer head, characterized in that it is selected from silicon (Ni-SiC), nickel-titanium carbide (Ni-TiC) and nickel-tungsten carbide (Ni-WC). 40. The method of claim 39, wherein the crater layer is selected from a single metal, a composite metal, a ceramic, and a metal-ceramic composite. 73. The method of claim 72, wherein nickel (Ni) or copper (Cu) is used as the single metal. 73. The method of claim 72, wherein the composite metal is nickel-chromium (Ni-Cr) or nickel-cobalt-tungsten (Ni-Co-W). 73. The inkjet printer head of claim 72, wherein the ceramic is selected from silicon dioxide (SiO ₂ ), silicon nitride (Si ₃ N ₄ ), aluminum oxide (Al ₂ O ₃ ), and silicon carbide (SiC). Manufacturing method. 73. The method of claim 72, wherein the metal-ceramic composite includes nickel-aluminum oxide (Ni-Al ₂ O ₃ ), nickel-silicon dioxide (Ni-SiO ₂ ), nickel-titanium dioxide (Ni-TiO ₂ ), nickel-carbonization A method of manufacturing an inkjet printer head, characterized in that it is selected from silicon (Ni-SiC), nickel-titanium carbide (Ni-TiC) and nickel-tungsten carbide (Ni-WC).