KR100327251B1 - Inkjet printhead actuator and manufacturing method thereof - Google Patents

Abstract

The present invention relates to an actuator of an inkjet printhead and a method of manufacturing the same, wherein a protective thin film is integrally laminated between a diaphragm of a thin plate and a chamber plate, and thus a chamber can be formed more precisely by post-processing of a chamber plate. According to the present invention, a chamber plate and a vibration plate provided with a thin metal plate are integrally combined with a protective thin film, which is an etch stop layer, and then the chamber plate is patterned by a lithography process and an etching process to form a plurality of chambers in the chamber plate. In this case, the protective thin film interposed between the chamber plate and the diaphragm is used as an etch stop layer when forming the chamber, and applied to the product to prevent corrosion of the diaphragm due to contact with ink. By doing so, the production and product performance can be improved.

Description

Inkjet printhead actuator and manufacturing method

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an inkjet printhead actuator and a method of manufacturing the inkjet printhead actuator, and in particular, a chamber formed by etching on a chamber plate is formed by allowing a protective thin film, which is an etch stop layer, to be integrally deposited between a vibrating plate of a thin plate made of metal and a chamber plate. The present invention relates to an inkjet printhead actuator and a method of manufacturing the same, which are performed more precisely and economically, thereby preventing corrosion of the diaphragm by ink, thereby improving mechanical rigidity of the head.

In general, a method of ejecting ink from the head of an inkjet printer is mainly a thermal bubble jet type and a piezoelectric transducer type.

The dual thermal bubble jet type electrically heats the chamber so that ink in the chamber is injected through the nozzle by thermal expansion, and the piezoelectric method uses a piezoelectric actuator to drive the diaphragm to generate the vibration force. Ink in the chamber is to be ejected through the nozzle.

Ink sprayed in this way is required to have precise operability above all because the particles have a size of several tens of micrometers (about 40 micrometers) and a large number of particles are simultaneously sprayed simultaneously.

1 illustrates an embodiment of a piezoelectric method which is the most commonly used among the above-described injection methods, and the piezoelectric element at this time used PZT.

The inkjet print head of the piezoelectric injection method is largely divided into a nozzle plate 110, a reservoir plate 120, a reservoir plate 130, a restrictor plate 130, a restrictor plate, a chamber plate 140, and a vibration plate ( 150, vibration plates are sequentially stacked, and the lower electrode 161, the piezoelectric body 163, and the upper electrode 162 are sequentially stacked on the vibration plate 150 to form a piezoelectric actuator 160.

In the above configuration, the nozzle plate 110 is a discharge port through which ink is ejected substantially by forming a nozzle 111 having a small diameter to one side.

The reservoir plate 120 stacked on the nozzle plate 110 has a reservoir 121, which is a space for storing an appropriate amount of ink, formed at one side thereof, and the nozzle 111 of the nozzle plate 110 is formed at the other side thereof. The through hole 122 is formed so as to communicate with the ink to guide the nozzle 111 is formed.

In the restrictor plate 130 stacked on the reservoir plate 120, a restrictor 131 having a small diameter in which a predetermined amount of ink is guided from the reservoir 121 of the reservoir plate 120 communicates with the reservoir 121. It is formed to one side so as to communicate with the through hole 122 of the reservoir plate 120 to the other side is a portion to form a through hole 132 forming a flow path.

The chamber plate 140 stacked on the top of the restrictor plate 130 is formed such that the chamber 141 communicating with the restrictor 131 and the through hole 132 formed on both sides of the restrictor plate 130 is formed at the same time. The ink flows through the restrictor 131 and the ink flows out through the through hole 132 through the through hole 122 of the reservoir plate 120 and the nozzle 111 of the nozzle plate 110. It is a part to inject ink to the outside.

On the other hand, the diaphragm 150 stacked on the chamber plate 140 covers the upper portion of the chamber 141 opened to the upper portion of the chamber plate 140, so that the ink guided into the chamber 141 is the restrictor plate 130. While operating through the through hole 132 of the operation by substantially changing the volume of the chamber 141 by bending deformation while changing the pressure in the chamber 141 to allow the ink flow.

Since the bending deformation of the diaphragm 150 cannot be naturally generated, the piezoelectric actuator 160 is provided in the diaphragm 150 for the bending deformation of the diaphragm 150.

The piezoelectric actuator 160 includes a lower electrode 161, an upper electrode 162, and a piezoelectric member 163 coupled therebetween. The piezoelectric actuator 160 generates deformation of the piezoelectric member 163 by interrupting power supplied from the outside. It is a driving means to be made.

That is, the piezoelectric member 163 contracts and expands according to the energized state between the upper electrode 162 and the lower electrode 161, and the deformation force of the piezoelectric member 163 is transmitted to the diaphragm 150 as it is, and the bending of the diaphragm 150 is performed. Will cause deformation.

Therefore, when the piezoelectric actuator 160 is electrically driven, the diaphragm 150 is deflected while changing the volume in the chamber 141 of the chamber plate 140 to expand the reservoir 121 and the restrictor 131. Ink is introduced into the chamber 141 through the nozzle 141, and when the volume shrinks, the nozzle 111 of the nozzle plate 110 passes through the through holes 132 and 122 of the restrictor plate 130 and the reservoir plate 120, respectively. The ink is ejected to the outside through.

On the other hand, the conventional piezoelectric material requires a very high temperature (usually 800 ° C. to 1200 ° C.) due to its manufacturing characteristics, so that the lower electrode 161 and the diaphragm 150 provided at the bottom thereof are made of a high temperature material that is not deformed even at a higher temperature. Platinum, zirconium, etc.) had to be used, but in recent years, a method of manufacturing a low-temperature piezoelectric material has been introduced, and thus the material of the diaphragm 150 may be diversified.

However, the diaphragm 150 is deflected as the actual operating means that injects ink into the chamber 141 and injects it again through the nozzle 111, so that the most problematic is the diaphragm 150 and The coupling force between the chamber plates 140 is lowered.

In other words, in order to couple the chamber plate 140 to the diaphragm 150, the diaphragm 150 and the chamber plate 140 are each formed of a ceramic material. After being applied in a paste state, it may be bonded by a method of heat treatment. Alternatively, the chamber plate 140 and the diaphragm 150 may be manufactured, respectively, and then simply bonded to each other as an adhesive.

Particularly, as shown in FIG. 2, the non-metal mold 200 is attached to the diaphragm 150 to form the chamber 141, and the chamber plate 140 is moved out of the mold 200 by electroforming. After molding, the combined structure was manufactured by removing the mold 200.

However, as the coupling method between the diaphragm 150 and the chamber plate 140 by heat treatment or bonding as described above, it is difficult to maintain the mechanical rigidity when the diaphragm 150 is deflected as well as hundreds of the chamber plate 140. It is very difficult to form a plurality of chambers 141 having a thickness of about 200 µm (about 100 µm) at smaller intervals (about 100 µm), and in particular, expensive processing equipment is required for the formation of such a fine chamber 141. There is a problem that the manufacturing cost of the print head becomes excessive.

In addition, since the formation of the chamber 141 by the electroforming as shown in FIG. 2 has a slight difference depending on the shape in which the non-metal mold 200 is attached to the diaphragm 150, the chamber plate 140 is as shown in FIG. 3. It is difficult to always maintain a constant distance t2 between the outer periphery (t1) and the chamber 141 of the), in particular, the portion (t1) is formed wider than the interval t2 between the chambers (141) Since the thickness tends to be excessively large, there is a problem in that the adhesion strength between the contact surfaces with the restrictive plate 130 coupled at the bottom is different depending on the product.

The present invention is to compensate for the above problems, the present invention is to make the diaphragm and the chamber plate of a thin metal plate while the protective thin film, which is an etch stop layer is formed integrally therebetween, more simple and uniform spacing and size The main purpose is to enable chamber formation in the furnace chamber plate.

Another object of the present invention is to allow the vibration plate to be integrally formed with the chamber plate, which is made of the same metal material, so that the mechanical rigidity of the vibration plate can be further enhanced, while maintaining uniform operability.

The present invention has another object to improve durability by preventing oxidation of the diaphragm by preventing direct ink contact with the diaphragm by the protective thin film having oxidation resistance when applied to a product.

1 is a cross-sectional structural view of a typical inkjet printer head,

2 is a coupling process diagram of the chamber plate and the vibration plate in FIG.

3 is a plan view of the chamber plate produced by FIG.

4 is a sectional view showing an actuator of the inkjet print head according to the present invention;

5 is another illustration of a chamber in accordance with the present invention;

6 to 14 show the manufacturing process of the first embodiment of the present invention,

6 illustrates a step of forming a diaphragm on a substrate,

7 illustrates a step of depositing a protective film on the diaphragm of FIG.

FIG. 8 illustrates depositing a chamber plate on the protective film of FIG. 7;

FIG. 9 illustrates a step of forming a photoresist film on the chamber plate of FIG. 8;

FIG. 10 illustrates a step of exposing the photoresist film in the step of FIG. 9;

FIG. 11 illustrates a step of removing an exposed portion of the photoresist film by FIG. 10.

FIG. 12 illustrates a step of supplying an etching solution to an exposed portion of the photoresist film removed in the step of FIG. 11;

FIG. 13 illustrates a step in which a chamber is formed by etching in the step of FIG. 12.

FIG. 14 illustrates a step of forming a chamber by removing the remaining photoresist film by the step of FIG. 13;

15 is an enlarged view showing a state in which the photoresist film shown in FIG. 11 is exposed;

16 to 18 show the manufacturing process of the second embodiment of the present invention,

16 illustrates a step of forming a chamber plate on a substrate,

17 illustrates depositing a protective thin film on the chamber plate of FIG.

FIG. 18 illustrates a step of depositing a diaphragm on the protective thin film of FIG. 17.

<Description of the symbols for the main parts of the drawings>

10: diaphragm 20: protective film

30 chamber plate 31 chamber

40: piezoelectric 50: electrode

In order to achieve the above object, the present invention combines a chamber plate and a diaphragm with a thin plate of metal integrally with a protective thin film, which is an etch stop layer, and then patternes the chamber plate by a lithography process and an etching process. Is formed at a uniform size and spacing, wherein the protective thin film intervening between the chamber plate and the diaphragm is used as an etch stop layer when forming the chamber, and is applied to the product by contact with ink. It is characterized in that the production and product performance can be improved by preventing corrosion of the diaphragm.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

In general, a practical operating configuration including a piezoelectric actuator in an inkjet print head, a diaphragm interlocked by the piezoelectric actuator, and a chamber plate coupled to the diaphragm is called a micro actuator in the inkjet print head.

In the micro-actuator, the present invention provides a diaphragm in which a part of a plate surface is mechanically deformed and a chamber plate formed of a thicker thickness than the diaphragm, respectively. By being integrally deposited, the chamber can be more precisely and easily formed only on the chamber plate by the etching prevention function of the protective thin film during the etching for forming the chamber on the chamber plate.

That is, the present invention is required by etching after forming the diaphragm 10 and the chamber plate 30 as a metal material as shown in Figure 4 while the protective thin film 20 of the precious metal material having an etching preventing function is deposited therebetween. The chamber 31 is formed so that ink flows in and out by the operation of the diaphragm in the shape and size of the diaphragm, and the upper portion of the diaphragm 10 is in the same line perpendicular to the chamber 31 of the chamber plate 30. The electrode 50 is stacked on the piezoelectric body 40 and at least the upper portion of the piezoelectric body 40, which is attached to the same number and is deformed in the longitudinal direction by the electric current, thereby interlocking the diaphragm 10, and is energized from the outside. This is a configuration to be deposited.

In this case, one of the diaphragm 10 and the chamber plate 30 may be manufactured by a rolling process or the like, or may be formed as a structure deposited by electroforming.

In addition, the chamber plate 30 is formed in the chamber plate 30 by etching at a predetermined size and intervals. In particular, the chamber 31 has a width narrowed while one side is recessed inward as shown in FIG. It is also possible to have the restrictor 32 formed so that can be adjusted.

In the piezoelectric body 40 and the electrode 50 to be deposited on the diaphragm 10, in particular, the electrode 50 usually includes both an upper electrode and a lower electrode, but the diaphragm 10 in the present invention is made of a metal material as a conductor. Therefore, when the diaphragm 10 is used as the common electrode, the lower electrode can be omitted, and thus the upper electrode of the piezoelectric body 40 can be manufactured even in a structure in which only the upper electrode is formed.

The micro actuator of such a structure is manufactured by the following method.

6 to 14 illustrate the manufacturing process of the actuator according to the first embodiment of the present invention. First, a separate substrate 60 for manufacturing a multilayer plate structure is provided.

And the diaphragm 10 is formed in this board | substrate 60 as shown in FIG. In this case, the diaphragm 10 may be formed of a metal plate which is rolled and manufactured separately from the substrate 60, and may be formed in a structure in which the diaphragm 10 is easily bonded to the substrate 60, and is deposited by electroforming on the substrate 60. It can also be formed as a structure, and alternatively, it can also be formed on the substrate 60 by vacuum deposition such as sputtering or evaporation.

The diaphragm 10 thus formed is made of nickel (Ni) or copper (Cu) or chromium (Cr) or tin (Sn) or iron (Fe), and among them, nickel (Ni) as a main component. Most preferably, the thickness of the diaphragm 10 is most suitably 3 μm to 50 μm.

On the diaphragm 10 formed on the substrate 60, the protective thin film 20, which is an etch stop layer of a noble metal material, is deposited to a minute thickness. At this time, the protective film 20 is formed by deposition by electroforming and vacuum deposition such as sputtering or evaporation. The main component of the protective film 20 may be formed of the same material as the diaphragm 10 but may be formed of gold. More preferably, (Au) or a material of a noble metal such as platinum (Pt) or palladium (Pd) or a stainless steel sheet is used, and the thickness thereof is most preferably 0.05 µm to 2 µm.

In addition, the protective film 20 is deposited with a metal plate 30 thicker than the diaphragm 10, and the chamber plate 30 is formed by vacuum deposition such as electroforming, sputtering, or evaporation. The chamber plate 30 is made of nickel (Ni) or copper (Cu) or chromium (Cr) or tin (Sn) or iron (Fe), which are the same materials as the diaphragm 10, but also nickel It is most preferable to use (Ni) as a main component, and the thickness is 10 micrometers-500 micrometers most suitably.

In this manner, the diaphragm 10, the protective thin film 20, and the chamber plate 30 are sequentially stacked on the substrate 60 to form a multilayer plate. Then, the substrate 60 is separated from the multilayer plate, and the chamber plate 30 is separated from the substrate 60. The chamber 31 is formed in the order of FIGS. 9 to 14.

The chamber 31 forms a photoresist film 70 by uniformly applying a photoresist to a back surface corresponding to the surface on which the protective thin film 20 of the chamber plate 30 is deposited, and forms the photoresist film 70. After curing by soft baking for a predetermined time, exposure and development are performed using a shadow mask 80 having a plurality of holes 81 formed on the surface at regular intervals as shown in FIG. 10. The exposed portion of the photoresist film 70 is cleaned using a cleaning solution so that unnecessary portions of the photoresist film 70 are removed.

As described above, the exposure surface area M of the photoresist film 70 exposed by the shadow mask 80 is defined as W when the area of the chamber to be formed on the chamber plate is W. Most preferably.

FIG. 11 illustrates a state in which an exposed portion of the photoresist film 70 is completely removed by the cleaning liquid. In this state, the chamber plate 30 is partially exposed at the removed exposed region after hard baking. The etching solution is supplied to the chamber plate 30 to be etched.

During the etching of the chamber plate 30, the etching solution is etched to the thickness of the chamber plate 30, and when the protective film 20 reaches the etch stop layer, the etching is no longer performed. Then, the side etching is automatically stopped to form a chamber 31 of a required size.

In particular, when the etching time is actually performed for a longer time than the time H required for the etching up to the protective thin film 20 during etching, the sidewall angle of the chamber can be formed in a straight line that is almost vertical.

When the chamber 31 is formed in the shape as shown in FIG. 12 by etching, the end surfaces of the etched chamber 31 are refined by stripping using a stripper, and finally, the chamber plate ( 30) By removing the upper photoresist film 50 chemically, a multilayer plate as shown in FIG.

When the piezoelectric body 40 and the electrode 50 are formed on the diaphragm 10 in such a multilayer plate, an actuator of a desired inkjet printhead can be obtained.

On the other hand, the piezoelectric body 40 and the electrode 50 formed on the diaphragm 10 are to be deposited by screen printing, molding or coating in the case of the piezoelectric body as before, and in the case of the electrode 50 by electroforming or vacuum deposition. It can be deposited by a variety of methods can be implemented.

In particular, since the diaphragm 10 is a metal material, the electrode 50 provided as the lower electrode and the upper electrode may use only the upper electrode, and the lower electrode may use the diaphragm 10 as the common electrode.

In this way, the diaphragm 10 and the chamber plate 30 is made of nickel (Ni), copper (Cu) or chromium (Cr) or tin (Sn) or iron (Fe) if the main component is very easy to manufacture.

If the protective thin film 20 is formed of gold (Au), a precious metal such as platinum (Pt) or palladium (Pd), or a material containing stainless steel as a main component, the chamber plate 30 may be etched when the chamber plate 30 is etched. 30) It prevents corrosion by contact with ink when applied to products while preventing etching anymore.

Meanwhile, FIGS. 16 to 18 show a second embodiment of the present invention, which is characterized in that the stacking order of the multilayer board is performed differently from the first embodiment.

That is, in the first embodiment, the diaphragm 10 is formed on the first substrate 60, whereas in the present embodiment, the chamber plate 30 is first formed on the substrate 60.

At this time, the chamber plate 30 may be formed of a metal plate which is rolled and manufactured separately from the substrate 60, and may be formed in a structure in which the chamber plate 30 is easily bonded to the substrate 60, and is deposited by electroforming on the substrate 60. It can also be formed as a structure, or alternatively, it can be formed on the substrate 60 by vacuum deposition such as sputtering or evaporation.

The chamber plate 30 thus formed is made of nickel (Ni) or copper (Cu) or chromium (Cr) or tin (Sn) or iron (Fe). Most preferably, the thickness of the chamber plate 10 is most suitably 10 µm to 500 µm.

In the chamber plate 30 formed on the substrate 60, the protective thin film 20, which is an etch stop layer of a noble metal material, is deposited to a minute thickness. In this case, the protective thin film 20 is formed by deposition by electroforming and vacuum deposition such as sputtering or evaporation. The main component of the protective thin film 20 is the same nickel (Ni) as the chamber plate 30. Or copper (Cu) or chromium (Cr) or tin (Sn) or iron (Fe) or silver (Au), but may be made of gold (Au) or precious metals such as platinum (Pt) or palladium (Pd) It is more preferable to use a stainless steel sheet, and its thickness is most suitably 0.05 µm to 2 µm.

In addition, the diaphragm 10 is deposited on the protective thin film 20, and the diaphragm 10 may be formed by vacuum deposition such as electroforming, sputtering, or evaporation, and the diaphragm 10 may include a chamber plate ( It is most preferable to use nickel (Ni), copper (Cu), chromium (Cr), tin (Sn), or iron (Fe) as the main components, and nickel (Ni) as the main component. 3 micrometers-50 micrometers are the most suitable thickness.

As described above, after the chamber plate 30, the protective thin film 20, and the vibration plate 10 are laminated on the substrate 60 to form a multilayer plate, the substrate 60 is separated from the multilayer plate. The chamber 31 is formed in the order of FIGS. 9 to 14 in the same manner as in the first embodiment.

When the piezoelectric body 40 and the electrode 50 are laminated on the diaphragm 10 in the multilayer plate on which the chamber 31 is formed, an actuator having a shape as shown in FIG. 4 required can be obtained. In this case, the first embodiment The piezoelectric body 40 and the electrode 50 formed on the diaphragm 10 are deposited by screen printing, molding or coating in the case of the piezoelectric body 40, and in the case of the electrode 50, electroforming or vacuum deposition. To be deposited by.

As described above, the present invention allows the diaphragm 10 and the chamber plate 30 to be formed of thin metal plates, respectively, thereby enabling the formation of an actuator with a desired minimum thickness.

In addition, when etching to form a shape that one side is recessed when forming the chamber 31, the restrictor 32 can be directly formed integrally on the chamber plate 30, so that the separate restrictor plate can be omitted. The effect is also expected.

This omission of the restrictor plate is consequently advantageous for the production cost of the print head, miniaturization, and expansion of the layout space.

In the state in which the diaphragm 10, the protective film 20, and the chamber plate 30 are integrally stacked, the chamber plate 30 is post-processed by a lithography process and an etching process to form the chamber 31. Since the positional tolerance between 31 is almost eliminated, more uniform ink jetting efficiency can be provided, and the bonding force with other members of the chamber plate 30, that is, the tight contact with the restrictor plate, the reservoir plate, or the nozzle plate becomes uniform. It is possible to maintain a more firm adhesion.

In addition, the expensive manufacturing equipment required for etching, such as a high-precision puncher, has been eliminated, and the manufacturing cost of the print head can be drastically reduced, while mass production is easier.

Therefore, the present invention increases the mechanical rigidity of the diaphragm by allowing the protective thin film of the precious metal to be integrally formed between the diaphragm and the chamber plate of the metal material, and facilitates the formation of the chamber by post-processing, as well as the equipment and material costs. The same manufacturing cost is reduced and at the same time, it is possible to prevent corrosion of the diaphragm due to ink in the chamber when it is applied to the product, thereby increasing the durability of the actuator.

Claims (30)

A diaphragm in which a part of the plate surface is a thin plate of metal material which is mechanically deformed by an external force; A chamber plate formed of a thicker thickness than the diaphragm, and having a plurality of chambers formed at regular intervals on the plate surface by etching so that ink may flow in and out by the operation of the diaphragm; It is integrally interposed between the diaphragm and the chamber plate to have an etching prevention function when forming a chamber to the chamber plate, and to prevent corrosion of the diaphragm by disconnecting direct contact between the ink guided into the chamber and the diaphragm. Protective thin film; A piezoelectric body which is attached to the surface corresponding to the chamber plate of the diaphragm in the same number on the same line perpendicular to the chamber and is deformed in the longitudinal direction by electric current so as to interlock the diaphragm; At least an electrode stacked on top of the piezoelectric body and configured to allow an electric power input from the outside to be energized; The chamber is inkjet printhead actuator, characterized in that to form a restrictor to adjust the flow rate of the ink passing through the chamber by narrowing the width as one side is inwardly inward. Claim 2 has been deleted. Forming a vibrating plate of a thin metal plate on a substrate to a predetermined thickness; Stacking a protective thin film as an anti-etching layer of a noble metal on the diaphragm; Stacking a chamber plate made of a metal on the protective film; Applying a photoresist film to the surface of the chamber plate; Exposing and developing using the applied photoresist film; Washing unnecessary portions of the photoresist film to remove unnecessary portions; Supplying an etchant to the exposed chamber plate through a portion where the photoresist film is partially removed to etch to a desired size; Removing the photoresist film remaining on the chamber plate; Removing the substrate and depositing a piezoelectric body and an electrode on the diaphragm; The diaphragm is manufactured by rolling to easily bond to the substrate, the inkjet printhead actuator manufacturing method characterized in that. Claim 4 has been deleted. Claim 5 has been deleted. Claim 6 has been deleted. Claim 7 has been deleted. Claim 8 has been deleted. Claim 9 has been deleted. 4. The diaphragm of claim 3, wherein the diaphragm A method of manufacturing an inkjet printhead actuator, which is a metal material containing nickel (Ni) as a main component. The method of claim 3, wherein the protective thin film A method of manufacturing an inkjet printhead actuator whose main component is gold (Au). The method of claim 3, wherein the chamber plate A method for producing an inkjet printhead actuator containing a nickel (Ni) as a main component. 4. The diaphragm of claim 3, wherein the diaphragm A method of manufacturing an inkjet printhead actuator formed to a thickness of 3 μm to 50 μm. The method of claim 3, wherein the protective thin film A method of manufacturing an inkjet printhead actuator formed to a thickness of 0.05 μm to 2 μm. The method of claim 3, wherein the chamber plate A method of manufacturing an inkjet printhead actuator formed to a thickness of 10 μm to 500 μm. 4. The surface area M of the photoresist film of claim 3, wherein A method of manufacturing an inkjet printhead actuator wherein M? W when the area of the chamber to be formed is W. Forming a chamber plate of the thin metal plate on the substrate; Stacking a protective thin film as an anti-etching layer of a noble metal on the chamber plate; Stacking a diaphragm made of a metal on the protective film; Removing the substrate and applying a photoresist film to the surface of the chamber plate; Exposing and developing using the applied photoresist film; Washing unnecessary portions of the photoresist film to remove unnecessary portions; Supplying an etchant to the exposed chamber plate through a portion where the photoresist film is partially removed to etch to a desired size; Removing the photoresist film remaining on the chamber plate; Removing the substrate and depositing a piezoelectric body and an electrode on the diaphragm; The chamber plate is a method of manufacturing an inkjet printhead actuator, characterized in that the metal sheet is rolled and produced to be easily bonded to the substrate. Claim 18 has been deleted. Claim 19 has been deleted. Claim 20 has been deleted. Claim 21 has been deleted. Claim 22 has been deleted. Claim 23 has been deleted. The method of claim 17, wherein the chamber plate A method for producing an inkjet printhead actuator containing a nickel (Ni) as a main component. The method of claim 17, wherein the protective film A method of manufacturing an inkjet printhead actuator whose main component is gold (Au). 18. The diaphragm of claim 17, wherein the diaphragm is A method for producing an inkjet printhead actuator containing a nickel (Ni) as a main component. The method of claim 17, wherein the chamber plate A method of manufacturing an inkjet printhead actuator formed to a thickness of 10 μm to 500 μm. The method of claim 17, wherein the protective film A method of manufacturing an inkjet printhead actuator formed to a thickness of 0.05 μm to 2 μm. 18. The diaphragm of claim 17, wherein the diaphragm is A method of manufacturing an inkjet printhead actuator formed to a thickness of 3 μm to 50 μm. 18. The surface area M of the photoresist film of claim 17, wherein A method of manufacturing an inkjet printhead actuator wherein M? W when the area of the chamber to be formed is W.