KR20010060206A - Apparatus and method for cleaning semiconductors - Google Patents

Abstract

PURPOSE: A device and a method for cleaning a semiconductor are provided to effectively wash wafers that are accommodated based on a standard for placing the wafers horizontally while wafer pitches are reduced. CONSTITUTION: The first wafer retention pad base(320) having a plurality of shelves(310) for retaining wafers, and the second wafer retention pad base(430) having a plurality of shelves(410) for retaining wafers are arranged. wafers(300) are transferred in the horizontal direction from the first accommodation case to the shelves(310) for retaining wafers of the first wafer retention pad base(320). The second wafer retention pad base(430) is displaced for transferring wafers(400) in the horizontal direction from the second accommodation case to the shelves(410) for retaining wafers. After that, the distance between the wafers is adjusted before washing.

Description

Semiconductor cleaning device and semiconductor cleaning method {APPARATUS AND METHOD FOR CLEANING SEMICONDUCTORS}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor cleaning apparatus and a semiconductor cleaning method that enable a large number of wafers of large diameter to be efficiently handled.

More specifically, according to the present invention, particularly in the semiconductor cleaning apparatus using a 300 mm diameter wafer, the size of the cleaning tank of which the wafer pitch of the storage case is 10 mm is reduced, and the amount of chemical liquid and pure water used is reduced. For this purpose, a semiconductor cleaning device and a semiconductor cleaning method having a mechanism for changing the pitch between wafers to 5 mm, which is 1/2, can be obtained.

Conventionally, a cassette (wafer accommodating cassette) for storing wafers having a wafer diameter up to 200 mm in diameter has a V-shaped groove on the opposite side of the wafer entrance and exit port, and the wafer is taken out from the cassette while the wafer is upright. Fig. 6A is a front view of the wafer storage cassette up to 200 mm in diameter, and Fig. 6B is a side view. FIG. 7 is a diagram for explaining an example of moving stacking of a wafer having a diameter of 200 mm to the cleaning device. 6 and 7, reference numeral 100 denotes a wafer, 200 denotes a cassette, 201 denotes a wafer tack, and 202 denotes a wafer movement stacking hand.

As shown in Figs. 6A and 6B, in the state where the wafer 100 enters the cassette 200, the interval between the wafers 100 is 6.35 mm. 7 shows a method of taking out the wafer 100 from the cassette 200 to the cleaning apparatus. As shown in Figs. 7A and 7B, the wafer holder 201 is lifted from the lower side of the cassette 200, and 25 wafers 100 are pushed up to the top of the cassette 200. The wafer 100 is held. When it comes out from the side surface of the cassette 200, the wafer movement stacking hand 202 descends from the upper side, and the 25 wafers 100 are collectively conveyed to a washing tank and a cleaning jig. This mechanism is not necessarily employed by all cleaning apparatuses, but is frequently employed. As an example, wafer handling is shown in Shimada Rika Kogyo Co., Ltd. catalog, "Compact Wetting Station CWS Series", and Semi-Tul's catalogue, "MUGNUM".

In addition, the storage space of the wafer 100 in the cassette 200 is 6.35 mm in the case of the 200 mm wafer 100, and is washed at an interval of 6.35 mm without changing the space of the wafer 100 at the time of processing. The process is performed. In such a diameter of 200 mm, it is not necessary to change the interval of the wafer 100.

In the wafer 100 having a diameter of 300 mm, the wafer storage case is placed in a horizontal arrangement, that is, in a direction in which the processing surface of the wafer 100 is perpendicular to the direction of gravity, when the wafer 100 is loaded into the apparatus in the semiconductor manufacturing apparatus. Standard (J300, SEMI industry association). For this reason, most apparatuses, such as a sheet etching apparatus and a sputter apparatus, are the same as that of the conventional wafer load system.

As described in the prior art, the batch type of the cleaning apparatus differs in how the wafer 100 is loaded into the apparatus. This is because the cleaning apparatus erects the wafer 100 vertically at the time of cleaning to clean the entire surface of the wafer 100 with the flow of liquid from below the wafer 100 upward.

In addition, in the said specification (J300, SEMI industry organization standard), the space | interval of the wafer 100 is 10 mm in pitch. In the case of the batch apparatus, the number of wafers to be processed is 50 or more. For example, when one batch of 50 wafers 100 is put into a cleaning tank at a pitch of 10 mm, the capacity of the cleaning tank is approximately 44 liters in the area of the wafer 100, and the interference of the hand is as much as that of the wafer 100 mounting table. Considering the margins of the front, rear, left, right, up, and down as much as the avoidance, the amount becomes 65 to 70 liters, and there is a problem that the amount of the material of the washing tank, the chemical liquid used, and the amount of pure water increases.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and the wafer pitch is 10 mm and the wafer pitch is reduced to 5 mm without departing from the specification of the wafer horizontal arrangement. An object of the present invention is to obtain a semiconductor cleaning apparatus capable of realizing (multiple lots) and a semiconductor cleaning method (combination method thereof).

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is an apparatus side view for explaining wafer movement stacking in a semiconductor cleaning device according to a first embodiment of the present invention.

Fig. 2 is an apparatus side view for explaining completion of wafer movement stacking in the semiconductor cleaning device of the first embodiment.

3 is a diagram for explaining a semiconductor cleaning device and a cleaning method according to a second embodiment of the present invention.

Fig. 4 is an apparatus side view showing the movement of each wafer holding pedestal up to wafer storage in the second embodiment of the present invention.

Fig. 5 is a perspective view for explaining a wafer holding shelf in a third embodiment of the present invention.

6 is a schematic view of a conventional wafer storage cassette up to 200 mm in diameter.

Fig. 7 is a diagram showing a wafer transfer example of a conventional cleaning apparatus having a diameter of 200 mm.

<Explanation of symbols for the main parts of the drawings>

100: wafer

200: cassette

201: wafer tack

202, 421: Hand for Wafer Transfer

300: wafer from first storage case

310: first wafer holding shelf

320: first wafer holding pedestal

400: wafer from second storage case

410: second wafer holding shelf

430: second wafer holding pedestal

500: semiconductor cleaning device

The semiconductor cleaning device according to the invention according to claim 1 of the present invention,

A wafer movement stacking robot having a wafer movement stacking hand for simultaneously taking out a plurality of wafers from a first storage case or a second storage case for storing a wafer;

A first wafer holding pedestal having a plurality of first wafer holding shelves in a horizontal direction in a vertical direction at predetermined intervals, and receiving a wafer from the first storage case that is moved and stacked from the mobile loading robot;

A second wafer holding pedestal having a plurality of second wafer holding shelves in a horizontal direction in a vertical direction at predetermined intervals, and receiving a wafer from the second storage case that is moved and stacked from the mobile loading robot;

By arranging the second wafer holding pedestal in the vicinity of the first wafer holding pedestal, the first wafer holding shelf and the second wafer holding shelf are alternately arranged in the vertical direction,

The distance between the first wafer holding shelf and the second wafer holding shelf is varied by moving the second wafer holding pedestal with respect to the first wafer holding pedestal.

The semiconductor cleaning apparatus according to the invention according to claim 2 of the present invention is the semiconductor cleaning apparatus according to claim 1, wherein the first wafer holding shelf of the first wafer holding pedestal is in three directions except the direction of receiving the wafer. To hold the wafer.

In the semiconductor cleaning apparatus according to the invention according to claim 3 of the present invention, in the semiconductor cleaning apparatus according to claim 1, the second wafer holding shelf of the second wafer holding pedestal is in three directions except the direction of receiving the wafer. To hold the wafer.

The semiconductor cleaning device according to the invention according to claim 4 of the present invention is the semiconductor cleaning device according to any one of claims 1 to 3, wherein the semiconductor cleaning device is horizontal to the first wafer holding shelf and the second wafer holding shelf. And a rotation mechanism for holding the wafers which are moved in the direction and rotating in the vertical direction.

Moreover, the semiconductor cleaning method which concerns on invention of Claim 5,

A first wafer holding pedestal having a plurality of first wafer holding shelves in a horizontal direction in a vertical direction at a predetermined interval, and a second having a plurality of second wafer holding shelves in a horizontal direction in a vertical direction at a predetermined interval; Arrange the wafer holding pedestal so that the first wafer holding shelf and the second wafer holding shelf are alternately positioned in the vertical direction;

A plurality of wafers are simultaneously taken out by the wafer transfer stacking hand of the wafer transfer stacking robot from the first storage case for storing the wafers, and are transferred to the first wafer holding pedestal,

Moving the second wafer holding pedestal with respect to the first wafer holding pedestal to adjust the distance between the first wafer holding shelf and the second wafer holding shelf;

A plurality of wafers are simultaneously taken out from the second storage case for storing the wafers by the wafer movement stacking hand of the wafer movement stacking robot, and are transferred to the second wafer holding pedestal,

It is to simultaneously wash the wafers that are moved and stacked on the first wafer holding pedestal and the second wafer holding pedestal.

And the semiconductor cleaning method concerning invention of Claim 6 is

In the wafer cleaning method according to claim 5, after the wafers are placed on the first wafer holding pedestal and the second wafer pedestal, respectively,

The second wafer holding pedestal is moved relative to the first wafer holding pedestal to readjust the distance between the first wafer holding pedestal and the second wafer holding pedestal,

It is to simultaneously wash the wafers that are moved and stacked on the first wafer holding pedestal and the second wafer holding pedestal.

Moreover, the semiconductor cleaning method which concerns on invention of Claim 7 is

In the wafer cleaning method according to claim 1 or 6, the horizontal wafer, which is moved and stacked on the first wafer holding pedestal and the second wafer holding pedestal, is rotated in the vertical direction to be cleaned.

<First Embodiment>

EMBODIMENT OF THE INVENTION Hereinafter, 1st Embodiment of this invention is described in detail based on drawing.

BRIEF DESCRIPTION OF THE DRAWINGS It is a side view of the principal part of the apparatus for demonstrating the principle of wafer transfer in the semiconductor cleaning apparatus and semiconductor cleaning method which concerns on 1st Embodiment of this invention. In FIG. 1, reference numeral 300 denotes a wafer that is moved and stacked from a first storage case (not shown), and 310 denotes a first wafer holding shelf that holds the wafer 300 that is moved and stacked from a first storage case, 320. Is a first wafer holding pedestal for supporting the first wafer holding shelf 310, 400 is a wafer that is moved from a second storage case (not shown), and 410 is a wafer 400 that is transferred from a second storage case. Is a second wafer holding shelf for holding a wafer), 430 is a second wafer holding pedestal for holding a second wafer holding shelf 410, and 421 is a wafer moving loading for a wafer moving stacking robot (not shown). Yong hand, 420 represents a wafer push pin, and 500 represents a semiconductor cleaning device including the above components. In FIG. 1, the first wafer holding pedestal 320 and the second wafer holding pedestal 430 appear to overlap, but this is a separate member. In addition, the wafer push pin 420 prevents the fall of the wafer when the wafer is moved by the wafer movement stacking hand 421.

Wafers are lined up at intervals of 10 mm in a plurality of wafer storage cases (not shown) for storing the wafers. Among the plurality of wafer storage cases, the wafer (wafer 300 from the first storage case) taken out from the first storage case is used for holding the first wafer of the first wafer holding pedestal 320 which is a temporary stand for processing. It is conveyed to the shelf 310. At this time, the first wafer holding pedestal 320 receives the wafer at a wafer interval of 10 mm.

After conveying the whole wafer 300 of a 1st storage case to the 1st wafer holding stand 320, a wafer is similarly taken out from a 2nd storage case. This wafer (the wafer 400 from the second storage case) is conveyed to the second wafer holding shelf 410 of the second wafer holding pedestal 430. At this time, the wafer 400 from the second storage case is moved and stacked in the middle of the wafer at 10 mm intervals which is moved and stacked on the first wafer holding pedestal 320.

Accordingly, the wafer holding shelf 410 is positioned in the middle of the wafer at 10 mm intervals which is moved and stacked on the first wafer holding pedestal 320. On the other hand, the total height of the wafer transfer stacking hand 421 and the wafers for conveying the wafer 400 from the second storage case is 2 to 3 mm, and the movable height above and below the wafer transfer stacking hand 421 is 2. To 3 mm is required. Therefore, at the 5 mm position in the middle of the wafer where the wafer holding shelf 410 is 10 mm apart, the wafer moving hand 421 or the wafer to be loaded is moved from the wafer of the first wafer holding pedestal 320. There is a possibility of interference. When the positional accuracy of the teaching of the wafer movement stacking hand 421 is improved, handling is possible, but it is difficult to realize from the viewpoint of change over time and reliability.

Therefore, in this embodiment, as shown in FIG. 1, the 2nd wafer holding shelf 410 is moved to the position near upward rather than the middle of the space | interval of the wafer 300 from a 1st storage case. At this position, the wafer 400 from the second storage case is received. By receiving the wafer 400 from the second storage case at this position, the distance between the wafer movement stacking hand 421 and the wafer 300 from the lower first storage case is ensured and the wafer movement stacking hand ( The wafer 400 from the second storage case can be conveyed stably because the 421 and the wafer 300 from the first storage case below do not touch each other.

The interval between the wafer holding shelf 410 and the wafer 300 from the upper first storage case may be such that the wafer 400 from the second storage case can be inserted therein. In this embodiment, a wafer can be inserted as long as the thickness of a wafer is 750 micrometers or more. In addition, the wafer space | interval below the wafer holding shelf 4 can ensure the space | interval of a maximum of 9.25 mm. Actually, in consideration of the margin of the conveying position accuracy, the distance between the wafer holding shelf 410 and the wafer 300 from the upper first storage case is about 2 mm, and the wafer holding shelf 410 and the lower portion are separated. The gap with the wafer 300 from the first storage case can secure an interval of about 8 mm.

2 is an apparatus side view for explaining wafer transfer stacking completion in the semiconductor cleaning device 500 of the first embodiment. After the above transfer is completed and the wafer movement stacking hand 421 is removed, the wafer holding shelf 410 moves downward, and then moves to a middle point of 5 mm at a 10 mm interval of the first wafer, 10 mm. The wafers at intervals are converted to 5 mm intervals. This state is shown in FIG.

As mentioned above, in this embodiment, the wafer from the rear can be conveyed without touching the wafer conveyed previously.

In addition, the plurality of wafers 300 that are moved and stacked on the first wafer holding shelf 310 are one lot, and the plurality of wafers 400 that are moved and stacked on the second wafer holding shelf 410 are provided. With one lot, a total of two lots, that is, a plurality of wafers can be processed.

After the knitting is completed, the wafer processing surface can be made parallel to gravity by rotating the whole 90 degrees in the direction of gravity. For example, the first wafer holding shelves 310 on both sides in FIG. 2 are moved in the direction of the wafer 300, and the wafer 300 is pressed and held from both sides to rotate. Moreover, when conveying in this state, a wafer can be vertically conveyed to a washing tank, and it can wash | clean in the state which hold | maintained the wafer vertically. In this case, the whole wafer is held by a separate holding mechanism and collectively conveyed. In addition, since the washing | cleaning in a washing tank is the same as that of the past, description is abbreviate | omitted.

In addition, if the wafer 300 from the first storage case maintains the state at the time of conveyance after the entire conveyance and is rotated 180 degrees before the wafer 400 from the second storage case shown in FIG. The processing surfaces of the wafer 400 from the storage case and the wafer 300 from the first storage case can be opposed to each other.

The present embodiment described above is summarized and described again as follows.

The first storage case has a wafer spacing of 10 mm, and the taken out wafer 300 is conveyed to the first wafer holding pedestal 320 which is a temporary pedestal for processing preparation, and the first wafer holding pedestal 320 is wafer spacing 10. Receive the wafer in mm. After conveying the whole wafer of a 1st storage cassette to the 1st wafer holding stand 310, a wafer is similarly taken out from a 2nd storage cassette. The wafer 400 is conveyed to the second wafer holding pedestal 430.

In this embodiment, the wafer holding shelf 410 which loads the wafer of the 2nd wafer holding stand 430 is made into the position near upper rather than the middle of the wafer space | interval of a 2nd storage case. By receiving the wafer 400 of the second storage case at this position, the distance between the wafer transfer stacking hand 421 and the wafer below is secured, and the wafer transfer stacking hand 421 and the wafer below do not touch. The wafer can be conveyed stably.

After the conveyance, after the wafer movement stacking hand 421 is removed, the wafer holding shelf 410 of the second wafer holding pedestal 430 moves downward to have an intermediate point of 5 mm at a 10 mm interval of the first wafer. The wafer at 10 mm intervals can be converted to 5 mm intervals.

According to this embodiment, the wafer of the horizontal arrangement is handled by vertical stacking, and the wafer pitch is changed from 10 mm to 5 mm before the wafer housed in the industry-standard wafer horizontal arrangement and wafer pitch 10 mm is put into the cleaning tank. In this way, a method of compositely knitting wafers of a plurality of wafer storage cases, a semiconductor cleaning device and a cleaning method based thereon can be obtained.

<2nd embodiment>

EMBODIMENT OF THE INVENTION Hereinafter, 2nd Embodiment of this invention is described in detail based on drawing with reference to FIG. 3 and FIG. This second embodiment is an example of a further embodiment of the first embodiment.

FIG. 3A is a top view of the apparatus for explaining the semiconductor cleaning apparatus and the semiconductor cleaning method according to the second embodiment of the present invention, and FIG. 3B is a side view of the XX 'cross section of FIG. It is the figure seen from. In Fig. 3, reference numeral 320 denotes a first wafer holding pedestal, and 430 denotes a second wafer holding pedestal. In addition, reference numeral 310 denotes a plurality of first wafer holding shelves installed at a predetermined interval in the vertical direction on the first wafer holding pedestal 320, and 300 is moved and stacked from a first storage case (not shown) to form a first The wafer held by the wafer holding shelf 310 is shown. In addition, reference numeral 410 denotes a plurality of second wafer holding shelves installed at a predetermined interval in the vertical direction on the first wafer holding pedestal 430, and 400 is moved and stacked from a second storage case (not shown) to form a second one. The wafer held by the wafer holding shelf 410 is shown.

In addition, the first wafer holding pedestal 320 and the second wafer holding pedestal 430 hold wafers 300 and 400 from the first storage case or the second storage case in three directions, and simultaneously hold the wafer. It is equipped with the structure as the direction without a support stand becomes a direction which moves a wafer in and out from a storage case.

The first wafer holding pedestal 320 and the second wafer holding pedestal 430 are alternately arranged in directions opposite to the direction in which the wafer is moved in and out and in both directions crossing the direction of entry and exit.

As shown in the top view of Fig. 3 (a), five sets of the first wafer holding pedestals 320 are fixed, and these are fixed or integrated. In addition, five second wafer holding pedestals 430 are also formed in one set, and these can be integrated to move up and down. The plurality of wafer holding shelves 310 or 410 in the same horizontal plane of each of the five wafer holding pedestals 320 or 430 jointly hold one wafer, respectively.

Although the distance between the wafer holding shelf 310 and the wafer holding shelf 410 shown in XX 'cross section of FIG. 3B is 10 mm, the wafer from the first storage case in the initial state is 10 mm. Until the 300 is moved to the first wafer holding pedestal 320, the first wafer holding pedestal 320 and the second wafer holding pedestal 430 are positioned at 5 mm intervals.

Fig. 4 is a side view of the apparatus showing the movement of each wafer holding pedestal up to wafer storage in the second embodiment. In the present embodiment, first, as shown in FIG. 4A, the wafer 300 from the first storage case is moved to the first wafer holding shelf 310 of the first wafer holding pedestal 320. do. Thereafter, the second wafer holding pedestal 430 rises to the top, and the second wafer holding shelf 410 moves to the top, whereby the wafer 400 can be inserted from the second storage case.

Subsequently, as shown in Fig. 4B, the wafer movement stacking hand 421 of the wafer 400 from the second storage case does not interfere with the wafer 300 from the lower first storage case. It raises to a position which does not, and moves and stacks the wafer 400 from a 2nd storage case.

When the insertion of all the wafers 400 from the second storage case is completed, the second wafer holding pedestal 430 as shown in Fig. 4C is in the initial position shown in Fig. 4A. That is, it descends to the position where all the wafer spaces become 5 mm. Thereby, knitting of the process wafer with a pitch of 5 mm is completed.

As described above, in the present embodiment, the wafer is taken out from the first storage case and the second storage case, and the wafer intervals are changed using the wafer holding pedestals 320 and 430 shown in FIG. Can be organized.

After the knitting is completed, the entire wafer is rotated by 90 degrees in the direction of gravity, whereby the wafer processing surface becomes parallel with gravity, and when conveyed in this state, the wafer can be vertically conveyed to the cleaning tank. Therefore, the wafer can be held and cleaned in the vertical direction. At this time, for example, the wafer holding shelves 310 and 410 are provided with a means for pressing the wafer to hold the wafers 300 and 400 so as not to fall.

This embodiment described above can be summarized and described as follows.

The semiconductor cleaning apparatus of this embodiment is equipped with the wafer movement loading robot which has the wafer movement loading hand 421 which simultaneously takes out several wafer from the 1st storage case or 2nd storage case which accommodates a wafer, respectively.

Furthermore, the first wafer holding device includes a plurality of first wafer holding shelves 310 in a horizontal direction in the vertical direction at predetermined intervals, and receives the wafer 300 from the first storage case that is moved and stacked from the mobile stacking robot. The support base 320 is provided.

And the 2nd wafer holding | maintenance which receives the wafer 400 from the 2nd storage case moved from a mobile loading robot which has a several 2nd wafer holding shelf 410 in a horizontal direction at predetermined intervals at predetermined intervals. A pedestal 430 is provided.

In addition, the second wafer holding pedestal 430 is disposed near the first wafer holding pedestal 320 so that the first wafer holding shelf 310 and the second wafer holding shelf 410 are in the vertical direction. The first wafer holding shelf 310 and the second wafer holding shelf 310 by moving the second wafer holding pedestal 430 relative to the first wafer holding pedestal 310. The interval with 410 can be varied.

Next, in the wafer cleaning method of the present embodiment, the first wafer holding pedestal 320 having a plurality of first wafer holding shelves 310 in the horizontal direction in the vertical direction at predetermined intervals, and the second in the horizontal direction. The first wafer holding shelf 310 and the second wafer holding shelf 410 may include a second wafer holding pedestal 430 having a plurality of wafer holding shelves 410 in a vertical direction at predetermined intervals. Position them alternately in the vertical direction.

Further, a plurality of wafers are simultaneously taken out by the wafer movement stacking hand 421 of the wafer movement stacking robot from the first storage case for storing the wafers, and are transferred to the first wafer holding pedestal 320.

Next, the second wafer holding pedestal 430 is moved relative to the first wafer holding pedestal 320 to space the first wafer holding shelf 310 from the second wafer holding shelf 410. Adjust it.

Next, a plurality of wafers are simultaneously taken out of the second storage case for storing the wafers by the wafer movement stacking hand 421 of the wafer movement stacking robot and moved to the second wafer holding pedestal 430.

Then, the wafers 300 and 400 moved and stacked on the first wafer holding pedestal 320 and the second wafer holding pedestal 430 are simultaneously cleaned.

In the wafer cleaning method of the present embodiment, in the wafer cleaning method described above, the wafers are moved to the first wafer holding pedestal 320 and the second wafer holding pedestal 430, respectively, and then the first wafer is held. After moving the second wafer holding pedestal 430 with respect to the support pedestal 320 to readjust the gap between the first wafer holding shelf 310 and the second wafer holding shelf 410, the first wafer holding pedestal 430 is then adjusted. The wafers 300 and 400 moved and stacked on the wafer holding pedestal 320 and the second wafer holding pedestal 430 are simultaneously cleaned.

According to the present embodiment as described above, the following effects can be obtained.

In the case of a 300 mm diameter wafer, in accordance with J300 and SEMI industry standards, the wafer storage case is arranged horizontally, that is, the wafer is stored horizontally, and the processing surface of the wafer is provided in a direction perpendicular to the direction of gravity. In this standard, the storage space of a wafer is 10 mm in pitch. In the case of a batch cleaning apparatus, the number of wafers to process is 50 sheets or more, and a large capacity cleaning tank is needed.

Moreover, the arrangement | positioning type of a washing | cleaning apparatus differs in the loading method of a wafer. This is because the cleaning apparatus vertically holds the wafer at the time of cleaning to clean the entire wafer surface with the flow of liquid from the lower side of the wafer upward.

According to this embodiment, this industry standard wafer horizontal arrangement, the handling method of making a wafer of a horizontal arrangement a vertical arrangement, and a wafer pitch from 10 mm to 5 mm before putting a wafer accommodated in a washing tank at a wafer pitch of 10 mm You can get the handling method to convert. Moreover, the knitting method which composites and knits the wafer of several wafer storage case can be obtained. In other words, a knitting method and a semiconductor cleaning device for simultaneously processing a plurality of wafers can be obtained.

Third Embodiment

EMBODIMENT OF THE INVENTION Hereinafter, 3rd Embodiment of this invention is described in detail based on drawing. Fig. 5 is a perspective view for explaining a wafer holding pedestal and a wafer holding shelf according to an embodiment of the present invention, showing an example of an actual wafer holding shelf 310 and a wafer holding shelf 410. It is shown.

In this embodiment, since the wafer holding place occupies a large area of the arc of the wafer, the wafer holding shelf 310 and the wafer holding shelf 410 are arranged so as to have an arc corresponding to the arc of the position where the wafer is loaded. do. This makes it possible to reduce the area in contact with the wafer.

In addition, this invention is not limited to each said embodiment, It is clear that each embodiment can be changed suitably within the range of the technical idea of this invention. In addition, the number, position, shape, etc. of the said structural member are not limited to the said embodiment, The number, position, shape, etc. which are suitable for implementing this invention can be made.

Since this invention is comprised as mentioned above, the semiconductor cleaning apparatus and the washing | cleaning method which can handle many large diameter wafers efficiently can be obtained.

Specifically, according to the present invention, a wafer accommodated in a wafer pitch of 10 mm and a wafer horizontal arrangement standard is vertically held in a state in which the wafer pitch is reduced to 5 mm, and a cleaning apparatus having a conventional diameter of 200 mm and The same washing can be realized.

Claims (7)

A wafer movement stacking robot having a wafer movement stacking hand for simultaneously taking out a plurality of wafers from a first storage case or a second storage case for storing a wafer; A first wafer holding pedestal having a plurality of first wafer holding shelves in a horizontal direction in a vertical direction at predetermined intervals, and receiving a wafer from the first storage case that is moved and stacked from the mobile loading robot; A second wafer holding pedestal having a plurality of second wafer holding shelves in a horizontal direction in a vertical direction at predetermined intervals, and receiving a wafer from the second storage case that is moved and stacked from the mobile loading robot; By arranging the second wafer holding pedestal in the vicinity of the first wafer holding pedestal, the first wafer holding shelf and the second wafer holding shelf are alternately positioned in the vertical direction, The semiconductor cleaning device characterized by varying the distance between the first wafer holding shelf and the second wafer holding shelf by moving the second wafer holding pedestal with respect to the first wafer holding pedestal. 2. The semiconductor cleaning apparatus according to claim 1, wherein the first wafer holding shelf of the first wafer holding pedestal is disposed in three directions except for the direction of receiving the wafer to hold the wafer. 2. The semiconductor cleaning apparatus according to claim 1, wherein the second wafer holding shelf of the second wafer holding pedestal is disposed in three directions except for the direction of receiving the wafer to hold the wafer. The rotating mechanism according to any one of claims 1 to 3, wherein the rotating mechanism for holding and rotating the wafers which are horizontally stacked on the first wafer holding shelf and the second wafer holding shelf in a horizontal direction. A semiconductor cleaning device comprising: A first wafer holding pedestal having a plurality of first wafer holding shelves in a horizontal direction in a vertical direction at a predetermined interval, and a second having a plurality of second wafer holding shelves in a horizontal direction in a vertical direction at a predetermined interval; Arrange the wafer holding pedestal so that the first wafer holding shelf and the second wafer holding shelf are alternately positioned in the vertical direction; A plurality of wafers are simultaneously taken out by the wafer transfer stacking hand of the wafer transfer stacking robot from the first storage case for storing the wafers, and are transferred to the first wafer holding pedestal, Move the second wafer holding pedestal with respect to the first wafer holding pedestal to adjust a distance between the first wafer holding pedestal and the second wafer holding pedestal; A plurality of wafers are simultaneously taken out from the second storage case for storing the wafers by the wafer movement stacking hand of the wafer movement stacking robot, and are transferred to the second wafer holding pedestal, A wafer cleaning method comprising: simultaneously cleaning a wafer that is moved and stacked on the first wafer holding pedestal and the second wafer holding pedestal. The wafer according to claim 5, wherein the wafers are placed on the first wafer holding pedestal and the second wafer holding pedestal, respectively. The second wafer holding pedestal is moved relative to the first wafer holding pedestal to readjust the distance between the first wafer holding pedestal and the second wafer holding pedestal; A wafer cleaning method comprising: simultaneously cleaning a wafer that is moved and stacked on the first wafer holding pedestal and the second wafer holding pedestal. The wafer cleaning method according to claim 5 or 6, wherein the horizontal wafer, which is moved and stacked on the first wafer holding pedestal and the second wafer holding pedestal, is rotated in the vertical direction and then cleaned.