KR20010058442A - Manufacturing method of poly(amide-imide) - Google Patents

Manufacturing method of poly(amide-imide) Download PDF

Info

Publication number
KR20010058442A
KR20010058442A KR1019990065655A KR19990065655A KR20010058442A KR 20010058442 A KR20010058442 A KR 20010058442A KR 1019990065655 A KR1019990065655 A KR 1019990065655A KR 19990065655 A KR19990065655 A KR 19990065655A KR 20010058442 A KR20010058442 A KR 20010058442A
Authority
KR
South Korea
Prior art keywords
polyamideimide
polyamide
imide
organic solvent
hours
Prior art date
Application number
KR1019990065655A
Other languages
Korean (ko)
Inventor
윤경근
강충석
Original Assignee
구광시
주식회사 코오롱
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 구광시, 주식회사 코오롱 filed Critical 구광시
Priority to KR1019990065655A priority Critical patent/KR20010058442A/en
Publication of KR20010058442A publication Critical patent/KR20010058442A/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/14Polyamide-imides
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)

Abstract

PURPOSE: Provided is a method for preparing a polyamide-imide which has uniform physical properties, and is thus used for heat-proof coating materials of a fry pan, an electric fry pan, insulating coating materials of wire and rigid plastic materials for substituting metals. CONSTITUTION: The method comprises steps of: (i) polymerizing 4-trimellitoyl anhydride chloride and at least one kinds of aromatic diamines in an equivalent ratio of 1:1.01-1.08 in the presence of an organic solvent at a temperature of -10-120 deg.C for 0.5-12 hours to prepare a polyamide amic acid; and (ii) imidizing the polyamide amic acid to prepare a polyamide-imide.

Description

폴리아미드이미드의 제조방법{Manufacturing method of poly(amide-imide)}Manufacturing method of poly (amide-imide)

본 발명은 베어링 등의 금속대체용 강성플라스틱 재료, 와이어선의 절연코팅재료, 후라이판, 전기후라이판의 내열코팅재료 등으로 유용한 폴리아미드이미드의 제조방법에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing polyamideimide useful as a rigid plastic material for replacing metals such as bearings, insulation coating materials for wire wires, heat resistant coating materials for frying plates, electric frying plates, and the like.

성형용의 폴리아미드이미드는 열변형온도가 278℃이며 장기사용온도가 200℃ 이상으로서 뛰어난 내열특성과 우수한 기계적 강도를 갖는다. 그밖에도 내마모성, 난연성, 내약품성, 내방사선성, 내크리프성 등의 특성이 요구되는 부품에 널리 사용되고 있다.The polyamideimide for molding has a heat deformation temperature of 278 ° C. and a long service temperature of 200 ° C. or more, and has excellent heat resistance and excellent mechanical strength. In addition, it is widely used in parts requiring properties such as wear resistance, flame resistance, chemical resistance, radiation resistance, creep resistance, and the like.

이와같이 폴리아미드이미드단독중합체와 폴리아미드이미드공중합체 및 그의 전구체고분자는 우수한 물성으로 인해 다양한 용도로 사용되고 있다.As such, polyamideimide homopolymers, polyamideimide copolymers, and precursor polymers thereof are used in various applications because of their excellent physical properties.

이와같은 폴리아미드이미드의 제조방법의 예로 미국특허 제4,016,140호 및 제4,136,085호에 개시되어 있는 바, 여기서는 우수한 물성을 갖는 폴리아미드이미드를 얻을 수는 있었으나 균일한 물성을 얻도록 하는 데에는 부족한 점이 있었다.As an example of a method for preparing such polyamideimide, disclosed in US Pat. Nos. 4,016,140 and 4,136,085, it was possible to obtain polyamideimide having excellent physical properties, but there was a shortage in obtaining uniform physical properties.

따라서, 본 발명의 목적은 균일한 물성을 얻을 수 있는 폴리아미드이미드의 제조방법을 제공하는 데 있다.Accordingly, it is an object of the present invention to provide a method for producing polyamideimide, which can obtain uniform physical properties.

이와같은 목적을 달성하기 위한 본 발명의 폴리아미드이미드의 제조방법은 4-트리멜리토일안하이드라이드할라이드와 유기디아민의 당량비를 1:1.01~1.08로 중합하여 폴리아미드아믹산을 얻고, 이를 이미드화하는 것을 그 특징으로 한다.Method for producing a polyamideimide of the present invention for achieving the above object is obtained by polymerizing the equivalence ratio of 4- trimellitoyl anhydride halide and organic diamine in a ratio of 1: 1.01 ~ 1.08 to obtain a polyamide amic acid, and imidized it It is characterized by that.

본 발명은 유기용매 하에서 4-트리멜리토일안하이드라이드클로라이드와 유기다아민 1종 이상과의 반응을 통해 제조되는 바, 4-트리멜리토일안하이드라이드클로라이드와 유기디아민의 당량비를 1:1.01∼1.08로 한다.The present invention is prepared through the reaction of at least one of four trimellitoyl anhydride chloride and an organic polyamine in an organic solvent, the equivalent ratio of 4-trimelitoyl anhydride chloride and an organic diamine is 1: 1.01 to It is 1.08.

폴리아미드이미드의 중합에 사용되는 디아민은 일반적으로 방향족디아민이 사용되는 바, 구체적인 예로는 메타페닐렌디아민, 파라페닐렌디아민, p,p'-메틸렌비스아닐린, p,p'-술포닐비스아닐린,(p-아미노페닐)술폰 등이 있다.Diamines used for the polymerization of polyamideimide are generally aromatic diamines, and specific examples thereof include metaphenylenediamine, paraphenylenediamine, p, p'-methylenebisaniline, p, p'-sulfonylbisaniline , (p-aminophenyl) sulfone and the like.

한편, 중합에 사용되는 유기용제는 질소를 함유하며 비반응성 극성용제인 N-메틸피롤리돈, N,N'-디메틸아세트아마이드, N,N'-디메틸포름아마이드 등이 일반적으로 사용된다. 이외 페놀류 및 알킬기가 치환된 페놀류도 사용할 수 있는데 이때에는 o,m,p-크레졸, 자일레놀 등의 혼합용매가 사용된다. 상기한 용매 이외에도 중합할 때 비용제를 일부 첨가하여 중합점도를 낮출 수도 있다.On the other hand, the organic solvent used for the polymerization contains nitrogen and non-reactive polar solvents such as N-methylpyrrolidone, N, N'-dimethylacetamide, N, N'-dimethylformamide and the like are generally used. In addition, phenols and phenols substituted with alkyl groups may also be used. In this case, a mixed solvent such as o, m, p-cresol, xylenol is used. In addition to the solvents described above, the polymerization viscosity may be lowered by adding a part of a non-solvent at the time of polymerization.

한편, 상기 디아민류와 중합되는 4-트리멜리토일안하이드라이드할라이드는일반적으로 4-트리멜리토일안하이드라이드클로라이드를 사용하며, 이외에도 4-트리멜리토일안하이드라이드브로마이드, 4-트리멜리토일안하이드라이드아이오다이드 등도 사용할 수 있다.On the other hand, 4-trimellitoyl hydride halide to be polymerized with the diamines generally use 4- trimellitoyl hydride chloride, in addition to 4- trimellito yl hydride bromide, 4- trimellitoyl silane Hydride iodide etc. can also be used.

상기와 같은 화합물을 이용하여 폴리아미드이미드를 제조하는 방법은 2단계로 행해지는 바, 먼저 1단계는 4-트리멜리토일안하이드라이드클로라이드와 유기디아민의 급격한 발열반응으로 진행된다. 여기에서 생성되는 생성물은 폴리아미드이미드의 전구체인 폴리아미드아믹산이다.The method for producing a polyamideimide using the compound as described above is carried out in two steps. First, the first step proceeds by a rapid exothermic reaction of 4-trimelitoyl anhydride chloride and an organic diamine. The product produced here is polyamideamic acid which is a precursor of polyamideimide.

1단계 폴리아미드아믹산의 제조조건은 중합시간이 0.5∼12시간이고 중합온도는 -10∼120℃이다. 좋게는 2∼4시간의 중합시간과 20∼50℃의 온도가 적당하다.The production conditions of the first stage polyamideamic acid were 0.5 to 12 hours in polymerization time and -10 to 120 ° C in polymerization temperature. Preferably, the polymerization time of 2-4 hours and the temperature of 20-50 degreeC are suitable.

1단계 반응에서는 또한 용제에 잔존하고 있는 수분함량이 1000ppm 이하인 것이 물성저하를 방지할 수 있는 측면에서 바람직하며 더욱 바람직하게는 400ppm이하인 것이다.In the one-step reaction, the water content remaining in the solvent is preferably 1000 ppm or less, and more preferably 400 ppm or less in terms of preventing physical property degradation.

그 다음, 2단계는 상기 1단계에서 생성된 폴리아미드아믹산을 이미드화시켜 폴리아미드이미드를 제조하는 단계이다. 2단계에서는 사용되는 용도에 적합하도록 이미드화율을 조정하여야 하는 바, 성형용으로 사용할 때에는 95∼100%의 이미드화율을 갖도록 하며, 코팅용으로 사용하고자 하면 이보다 낮은 0∼70%의 이미드화율을 유지하도록 하는 것이 바람직하다. 2단계인 이미드화는 2가지 방법으로 가능하다. 첫 번째 방법은 1단계가 끝난 반응상태에서 온도를 승온하여 이미드화하는 방법이고, 또 다른 한가지 방법은 유기용매에 녹아 있는 폴리아미드아믹산을 비용매에 침전시킨후 잔류 염화수소를 순수를 사용하여 중화시킨 후 열풍오븐에서 이미드화하는 것이다. 이 과정에서도 분자량이 증가된다.Next, step 2 is to prepare a polyamideimide by imidizing the polyamide amic acid produced in step 1. In the second step, the imidation rate should be adjusted to suit the intended use. When used for molding, the imidation rate should be 95 to 100%. It is desirable to maintain the rate of fire. Two-step imidization is possible in two ways. The first method is to imidize by raising the temperature in the reaction state after the first step, and another method is to precipitate polyamideamic acid dissolved in the organic solvent in the non-solvent and neutralize the remaining hydrogen chloride using pure water. It is then imidized in a hot air oven. This process also increases the molecular weight.

2단계반응의 2가지 방법중에 한가지 방법인 용액상태에서 이미드화하는 방법은 1단계 반응조건의 연장이다. 이 방법은 완전히 아믹산을 이미드화하기에는 부족한 방법으로 부분적인 이미드화가 사용되는 용도에 적용가능하다. 이 방법의 이미드화 중합온도는 20∼120℃가 적당하다.One of two methods of two-step reaction, imidization in solution, is an extension of one-step reaction conditions. This method is insufficient for fully imidating amic acid and is applicable to applications where partial imidation is used. As for the imidation polymerization temperature of this method, 20-120 degreeC is suitable.

2단계 반응을 수행하는 데 있어서 2가지 방법 중 반응액을 침전, 중화, 건조, 에이징을 통하여 이미드화하는 방법은 다음과 같다; 침전공정은 폴리아미드이미드 용액을 물에 침전하는 공정으로 침전과 동시에 분쇄 및 교반이 가능하여야 하므로 호모믹서와 같은 장치를 사용하여야 한다. 이때 사용되는 물은 저항치가 5 MΩ/㎠ 이상인 초순수를 사용하는 편이 좋은데 이 이유는 물속의 금속이온이 침전물에 흡착되어 최종제품의 물성에 영향을 주기 때문이다. 사용되는 용액과 물의 비율은 1:3∼1:10의 비가 적당하다.In performing the two-step reaction, the method of imidizing the reaction solution by precipitation, neutralization, drying, and aging is as follows; Precipitation process is a process of precipitating polyamideimide solution in water. It should be possible to grind and stir at the same time as precipitation, so a device such as homomixer should be used. At this time, it is better to use ultrapure water having a resistance value of 5 MΩ / ㎠ or more because the metal ions in the water are adsorbed on the precipitate and affect the properties of the final product. The ratio of the solution and water used is a ratio of 1: 3 to 1:10.

제조된 분말을 필터한 후 이분말을 저항치가 5 MΩ/㎠ 이상인 초순수를 사용하여 증화한다. 산도가 3이상이 될 때까지 필터와 순수세정을 반복한다. 이렇게 세정된 분말은 아스피레이터를 사용한 60℃ 건조오븐에서 12시간 건조한다. 건조된 분말은 70∼200℃의 열풍오븐에서 0.5∼4시간 에이징(aging)하여 최종적으로 폴리아미드이미드를 제조한다.After filtering the prepared powder, this powder was subjected to resistance of 5 MΩ / ㎠ The ultrapure water is used for the increase. Repeat the filter and pure wash until the acidity is above 3. The powder thus washed is dried in a 60 ° C. drying oven using an aspirator for 12 hours. The dried powder is aged in a hot air oven at 70 to 200 ° C. for 0.5 to 4 hours to finally prepare a polyamideimide.

얻어진 폴리아미드이미드의 고유점도는 0.2∼1.0dL/g이다.The intrinsic viscosity of the obtained polyamideimide is 0.2-1.0 dL / g.

이하, 본 발명을 실시예에 의거 상세히 설명하면 다음과 같은 바, 본 발명이실시예에 의해 한정되는 것은 아니다.Hereinafter, the present invention will be described in detail with reference to Examples, but the present invention is not limited by the Examples.

실시예에서 평가방법은 다음과 같다;In the Examples the evaluation method is as follows;

1)고유점도1) intrinsic viscosity

폴리아미드이미드 분말 0.1g을 N,N'-디메틸아세트아미드 10㎖에 녹여 30℃로 유지되는 항온조에서 케논-펜스케 점도계로 측정한다.0.1 g of polyamideimide powder is dissolved in 10 ml of N, N'-dimethylacetamide and measured with a Kenon-Penske viscometer in a thermostat maintained at 30 ° C.

2)용액점도2) solution viscosity

25℃에서 브루크너 점도계로 측정한다.Measured with a Bruckner viscometer at 25 ° C.

3)수분함량3) moisture content

칼-피션 수분측정기로 측정한다.Measure with a Karl-Fitness Moisture Meter.

4)파단신도, 인장강도4) Elongation at break, tensile strength

ASTM D1708 방법으로 측정한다.It is measured by ASTM D1708 method.

실시예 1Example 1

교반기, 질소퍼징장치, 온도계, 냉각장치를 갖춘 2L 반응기에 메타페닐렌디아민 4.39g(0.0406몰), p,p'-옥시비스아닐린 32.36g(0.1626몰)과 수분함량이 350ppm인 N-트리멜리토일안하이드라이드클로라이드 42.11g(0.20몰)을 온도가 50℃를 넘지 않는 범위내에서 1시간에 걸쳐 여러차례 나누어 첨가하였다. 4-트리멜리토일안하이드라이드클로라이드 첨가가 완료된 후 3시간 동안 교반을 계속하였다. 25℃에서 브룩크너 점도계로 측정한 값이 12200cps였다.2-liter reactor with stirrer, nitrogen purge, thermometer, and chiller 4.39 g (0.0406 mole) of metaphenylenediamine, 32.36 g (0.1626 mole) of p, p'-oxybisaniline and 350 ppm of water 42.11 g (0.20 mol) of toil anhydride chlorides were added several times over 1 hour, within the range which temperature does not exceed 50 degreeC. Stirring was continued for 3 hours after the addition of 4- trimellitoyl anhydride chloride was complete. The value measured with the Brookner viscometer at 25 degreeC was 12200 cps.

반응이 완료된 후 반응액을 호모믹스를 가동하며 초순수 1000㎖에 천천히 부어 침전물을 얻는다. 필터를 한 후 침전물을 다시 1000㎖ 초순수에 투입하여 30분간 교반하였다.After the reaction was completed, the reaction solution was slowly poured into 1000 ml of ultrapure water while running a homomix to obtain a precipitate. After filtering, the precipitate was added to 1000 ml of ultrapure water and stirred for 30 minutes.

침전과 교반을 5회 반복하여 pH가 3.9가 되었다. 이렇게 중화되 폴리아미드아믹산을 아스피레이터로 진공이 걸리는 60℃ 건조오븐에서 12시간 건조하였다. 건조한 분말의 고유점도는 0.26dL/g이다. 건조된 분말을 220℃ 열풍오븐에서 4시간 에이징하여 고유점도는 0.55dL/g의 폴리아마이드이미드 분말을 얻었다. 이 분말을 압축성형기를 이용하여 350℃ 온도에서 10∼100Ton의 압력으로 시편을 제조하였다. 측정한 물성은 다음 표 1과 같다.Precipitation and stirring were repeated five times, resulting in a pH of 3.9. The neutralized polyamide amic acid was dried in a 60 ° C. drying oven under vacuum with an aspirator for 12 hours. The intrinsic viscosity of the dry powder is 0.26 dL / g. The dried powder was aged in a hot air oven at 220 ° C. for 4 hours to obtain a polyamideimide powder having an intrinsic viscosity of 0.55 dL / g. This powder was prepared using a compression molding machine at a temperature of 350 ° C. at a pressure of 10 to 100 tons. The measured physical properties are shown in Table 1 below.

실시예 2Example 2

상기 실시예 1과 같은 방법으로 실시되었는 바, 다만 메타페닐렌디아민 5.623g(0.052몰), p,p'-옥시비스아닐린 31.236g(0.156몰)을 첨가하였다. 25℃에서 브룩크너 점도계로 측정한 값이 9800cps, 에이징 후의 고유점도가 0.51dL/g이다. 측정한 물성은 다음 표 1과 같다.In the same manner as in Example 1, 5.623 g (0.052 mol) of metaphenylenediamine and 31.236 g (0.156 mol) of p, p′-oxybisaniline were added thereto. The value measured by the Brookner viscometer at 25 degreeC is 9800 cps, and the intrinsic viscosity after aging is 0.51 dL / g. The measured physical properties are shown in Table 1 below.

비교실시예 1Comparative Example 1

상기 실시예1과 같은 방법으로 실시되었는 바, 다만 메타페닐렌디아민 4.758g(0.044몰), p,p'-옥시비스아닐린 35.241g(0.176몰)을 첨가하였다. 25℃에서 브룩크너 점도계로 측정한 값이 6500cps, 에이징 후의 고유점도가 0.41dL/g이다. 측정한 물성은 다음 표 1과 같다.In the same manner as in Example 1, 4.758 g (0.044 mol) of metaphenylenediamine and 35.241 g (0.176 mol) of p, p'-oxybisaniline were added thereto. The intrinsic viscosity after aging was 6500 cps and the value measured by the Brookner viscometer at 25 degreeC is 0.41 dL / g. The measured physical properties are shown in Table 1 below.

비교실시예 2Comparative Example 2

상기 실시예1과 같은 방법으로 실시되었는 바, 다만 메타페닐렌디아민4.325g(0.04몰), p,p'-옥시비스아닐린 32.037g(0.16몰), 4-트리멜리토일안하이드라이드클로라이드 42.11g(0.215몰)을 첨가하였다. 25℃에서 브룩크너 점도계로 측정한 값이 7700cps, 에이징후의 고유점도가 0.44dL/g이다. 측정한 물성은 다음 표 1과 같다.In the same manner as in Example 1, except that 4.325 g (0.04 mol) of metaphenylenediamine, 32.037 g (0.16 mol) of p, p'-oxybisaniline, and 42.11 g of 4-trimelitoylanhydride chloride (0.215 mol) was added. The value measured with the Brookner viscometer at 25 degreeC is 7700 cps, and the intrinsic viscosity after aging is 0.44 dL / g. The measured physical properties are shown in Table 1 below.

실시예 1Example 1 실시예 2Example 2 비교실시예 1Comparative Example 1 비교실시예 2Comparative Example 2 투입몰수(TMAc/ODA/m-PDA)Input Mole (TMAc / ODA / m-PDA) 0.20/0.1626/0.04060.20 / 0.1626 / 0.0406 0.20/0.156/0.0520.20 / 0.156 / 0.052 0.20/0.176/0.0440.20 / 0.176 / 0.044 0.215/0.160/0.00400.215 / 0.160 / 0.0040 브록크너점도(cps)Brockner Viscosity (cps) 1220012200 98009800 65006500 77007700 고유점도(dL/g)Intrinsic viscosity (dL / g) 0.550.55 0.510.51 0.410.41 0.440.44 인장강도(kg/㎠)Tensile Strength (kg / ㎠) 11501150 12001200 520520 770770 파단신도(%)Elongation at Break (%) 9.19.1 9.99.9 2.42.4 4.44.4

이상에서 상세히 설명한 바와 같이, 본 발명에 따라 4-트리멜리토일안하이드라이드클로라이드와 방향족디아민을 일정 당량비로 중합시켜 폴리아미드아믹산을 중간체로 얻은 다음 이를 이미드화시켜 폴리아미드이미드를 제조하는 경우 점도가 높고 강도가 우수한 성형용 폴리아미드이미드를 얻을 수 있으며, 이를 후라이판의 내열코팅재료, 전선의 절연코팅재료로 뿐만 아니라 압축성형이나 사출을 통해 강성플라스틱 재료, 금속대체용 등으로 사용할 수 있다.As described above in detail, according to the present invention, when 4-trimelyltoyl hydride chloride and aromatic diamine are polymerized at a constant equivalent ratio, a polyamideamic acid is obtained as an intermediate and then imidized to produce a polyamideimide. It is possible to obtain a molding polyamideimide having high strength and excellent strength, and it can be used as a heat-resistant coating material of a frying plate and an insulating coating material of an electric wire, as well as a rigid plastic material or a metal substitute through compression molding or injection.

Claims (5)

4-트리멜리토일안하이드라이드클로라이드와 1종 이상의 방향족 디아민을 당량비 1:1.01∼1.08로 유기용매의 존재하에 -10∼120℃에서 0.5∼12시간 동안 중합시켜 폴리아미드아믹산을 제조하는 제1단계; 및A first process for preparing polyamideamic acid by polymerizing 4-trimelyltoylanhydride chloride and at least one aromatic diamine in an equivalence ratio of 1: 1.01 to 1.08 in the presence of an organic solvent for 0.5 to 12 hours. step; And 상기 폴리아미드아믹산을 이미드화시켜 폴리아미드이미드를 제조하는 제2단계로 이루어진 폴리아미드이미드의 제조방법.A method for producing a polyamideimide comprising a second step of imidating the polyamide amic acid to produce a polyamideimide. 제 1 항에 있어서, 방향족디아민은 메타페닐렌디아민, p,p-옥시비스아닐린, p,p'-메틸렌비스아닐린으로 이루어진 군으로부터 선택된 1종 이상의 것임을 특징으로 하는 폴리아미드이미드의 제조방법.The method according to claim 1, wherein the aromatic diamine is at least one member selected from the group consisting of metaphenylenediamine, p, p-oxybisaniline, and p, p'-methylenebisaniline. 제 1 항에 있어서, 이미드화는 상기 제1단계가 끝난 반응상태에서 승온하는 방법으로 수행되는 것을 특징으로 하는 폴리아미드이미드의 제조방법.The method for preparing polyamide-imide according to claim 1, wherein the imidization is performed by heating in the reaction state after the first step. 제 1 항에 있어서, 이미드화는 유기용매에 녹아 있는 폴리아미드아믹산을 비용매에 침전시킨후 잔류 염화수소를 순수를 사용하여 중화시킨 후 열풍오븐에서 이미드화하는 방법으로 수행되는 것을 특징으로 하는 폴리아미드이미드의 제조방법.2. The polyimide according to claim 1, wherein the imidization is carried out by precipitating polyamideamic acid dissolved in an organic solvent in a non-solvent, neutralizing residual hydrogen chloride with pure water, and then imidizing it in a hot air oven. Method for producing amideimide. 제 1 항의 방법에 따라 제조된 고유점도 0.2∼1.0dL/g인 폴리아미드이미드.Polyamideimide having an intrinsic viscosity of 0.2 to 1.0 dL / g prepared according to the method of claim 1.
KR1019990065655A 1999-12-30 1999-12-30 Manufacturing method of poly(amide-imide) KR20010058442A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019990065655A KR20010058442A (en) 1999-12-30 1999-12-30 Manufacturing method of poly(amide-imide)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019990065655A KR20010058442A (en) 1999-12-30 1999-12-30 Manufacturing method of poly(amide-imide)

Publications (1)

Publication Number Publication Date
KR20010058442A true KR20010058442A (en) 2001-07-06

Family

ID=19632840

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019990065655A KR20010058442A (en) 1999-12-30 1999-12-30 Manufacturing method of poly(amide-imide)

Country Status (1)

Country Link
KR (1) KR20010058442A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20040009254A (en) * 2002-07-23 2004-01-31 주식회사 코오롱 Manufacturing method of poly(amideimide) with the improved adhesion strength
KR100883263B1 (en) * 2003-01-14 2009-02-10 주식회사 코오롱 Manufacturing method of polyamideimide with the improved adhesion strength and heat resistance

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20040009254A (en) * 2002-07-23 2004-01-31 주식회사 코오롱 Manufacturing method of poly(amideimide) with the improved adhesion strength
KR100883263B1 (en) * 2003-01-14 2009-02-10 주식회사 코오롱 Manufacturing method of polyamideimide with the improved adhesion strength and heat resistance

Similar Documents

Publication Publication Date Title
US3920612A (en) Preparation of film forming polymer from carbocyclic aromatic diamine and acyl halide of trimellitic acid anhydride
US20190292338A1 (en) Method for preparing polyimide film having low dielectric constant and high fracture toughness
KR20180092300A (en) Polyamide-imide film and preparation method thereof
US5231162A (en) Polyamic acid having three-dimensional network molecular structure, polyimide obtained therefrom and process for the preparation thereof
CN107698759A (en) Polyimides, polyamic acid, polyamic acid solution and polyimide film
KR101992576B1 (en) Polyimide Varnish for Improving Heat Resistance of Polyimide Coating Article and Polyimide Coating Article Prepared Therefrom
EP0082724B1 (en) A polyamide acid, a process for its production and a polyimide produced therefrom
CN115260491B (en) Alkali-resistant hydrolysis-resistant polyimide engineering plastic and preparation method thereof
KR0161313B1 (en) Polyimide amicester and process for preparing the same
TWI656148B (en) Method for preparing a polyamidamine-imine film
Sheng et al. Organosoluble, low‐dielectric‐constant fluorinated polyimides based on 9, 9‐bis [4‐(4‐amino‐2‐trifluoromethyl‐phenoxy) phenyl] xanthene
KR20180106212A (en) Polyimide Resin, Polyimide Film and Display Device Comprising Thereof
KR20170079114A (en) Transparent Polyamide-imide film with improved Solvent Resistance
Wang et al. Novel fluorinated polyimides derived from an unsymmetrical diamine containing trifluoromethyl and methyl pendant groups
US6046303A (en) Soluble polyimide resin having alkoxy substituents and the preparation method thereof
KR20010058442A (en) Manufacturing method of poly(amide-imide)
KR100689182B1 (en) Manufacturing method of polyamideimide
US6162893A (en) Soluble polyimide resin having a dialkyl substituent for a liquid crystal alignment layer, the monomers and manufacturing methods thereof
EP0418889B1 (en) Polyamic acid having three-dimensional network molecular structure, polyimide obtained therefrom and process for the preparation thereof
KR100883263B1 (en) Manufacturing method of polyamideimide with the improved adhesion strength and heat resistance
US5162454A (en) Polyamide-polyimide block copolymers
JP2895113B2 (en) Method for producing polyimide film
US5569738A (en) Melt processable etherimideimide/etherimide copolymer
KR20040013691A (en) Manufacturing method of poly(amideimide) varnish with the improved adhesion strength
KR20040009254A (en) Manufacturing method of poly(amideimide) with the improved adhesion strength

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E601 Decision to refuse application