KR20010043705A - 워크 스테이션간에 웨이퍼당 이송을 위한 웨이퍼 버퍼스테이션과 방법 - Google Patents

워크 스테이션간에 웨이퍼당 이송을 위한 웨이퍼 버퍼스테이션과 방법 Download PDF

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Publication number
KR20010043705A
KR20010043705A KR1020007012929A KR20007012929A KR20010043705A KR 20010043705 A KR20010043705 A KR 20010043705A KR 1020007012929 A KR1020007012929 A KR 1020007012929A KR 20007012929 A KR20007012929 A KR 20007012929A KR 20010043705 A KR20010043705 A KR 20010043705A
Authority
KR
South Korea
Prior art keywords
wafer
station
workstation
wafers
pod
Prior art date
Application number
KR1020007012929A
Other languages
English (en)
Korean (ko)
Inventor
즈비 라피닷
Original Assignee
조셉 제이. 스위니
어플라이드 머티어리얼스, 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 조셉 제이. 스위니, 어플라이드 머티어리얼스, 인코포레이티드 filed Critical 조셉 제이. 스위니
Publication of KR20010043705A publication Critical patent/KR20010043705A/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
KR1020007012929A 1998-05-18 1999-04-30 워크 스테이션간에 웨이퍼당 이송을 위한 웨이퍼 버퍼스테이션과 방법 KR20010043705A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US8022298A 1998-05-18 1998-05-18
US09/080,222 1998-05-18
PCT/US1999/009602 WO1999060614A1 (fr) 1998-05-18 1999-04-30 Poste tampon pour plaquettes et procede de transfert plaquette par plaquette entre des postes d'usinage

Publications (1)

Publication Number Publication Date
KR20010043705A true KR20010043705A (ko) 2001-05-25

Family

ID=22156019

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020007012929A KR20010043705A (ko) 1998-05-18 1999-04-30 워크 스테이션간에 웨이퍼당 이송을 위한 웨이퍼 버퍼스테이션과 방법

Country Status (4)

Country Link
EP (1) EP1082755A1 (fr)
JP (1) JP2002516485A (fr)
KR (1) KR20010043705A (fr)
WO (1) WO1999060614A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6506009B1 (en) * 2000-03-16 2003-01-14 Applied Materials, Inc. Apparatus for storing and moving a cassette
US20030131458A1 (en) * 2002-01-15 2003-07-17 Applied Materials, Inc. Apparatus and method for improving throughput in a cluster tool for semiconductor wafer processing
US7129694B2 (en) * 2002-05-23 2006-10-31 Applied Materials, Inc. Large substrate test system
US7578650B2 (en) * 2004-07-29 2009-08-25 Kla-Tencor Technologies Corporation Quick swap load port
US7075323B2 (en) 2004-07-29 2006-07-11 Applied Materials, Inc. Large substrate test system

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4693777A (en) * 1984-11-30 1987-09-15 Kabushiki Kaisha Toshiba Apparatus for producing semiconductor devices
JP2926798B2 (ja) * 1989-11-20 1999-07-28 国際電気株式会社 連続処理エッチング方法及びその装置
JP2644912B2 (ja) * 1990-08-29 1997-08-25 株式会社日立製作所 真空処理装置及びその運転方法
US5286296A (en) * 1991-01-10 1994-02-15 Sony Corporation Multi-chamber wafer process equipment having plural, physically communicating transfer means
US5516732A (en) * 1992-12-04 1996-05-14 Sony Corporation Wafer processing machine vacuum front end method and apparatus
US5928389A (en) * 1996-10-21 1999-07-27 Applied Materials, Inc. Method and apparatus for priority based scheduling of wafer processing within a multiple chamber semiconductor wafer processing tool

Also Published As

Publication number Publication date
WO1999060614A1 (fr) 1999-11-25
JP2002516485A (ja) 2002-06-04
EP1082755A1 (fr) 2001-03-14

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