KR20010004911A - Method for forming reflective layer of reflective type LCD - Google Patents

Method for forming reflective layer of reflective type LCD Download PDF

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Publication number
KR20010004911A
KR20010004911A KR1019990025679A KR19990025679A KR20010004911A KR 20010004911 A KR20010004911 A KR 20010004911A KR 1019990025679 A KR1019990025679 A KR 1019990025679A KR 19990025679 A KR19990025679 A KR 19990025679A KR 20010004911 A KR20010004911 A KR 20010004911A
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South Korea
Prior art keywords
film
organic insulating
aluminum
etching
top molybdenum
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KR1019990025679A
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Korean (ko)
Inventor
강수웅
최도현
오계환
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김영환
현대전자산업 주식회사
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Priority to KR1019990025679A priority Critical patent/KR20010004911A/en
Publication of KR20010004911A publication Critical patent/KR20010004911A/en

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133553—Reflecting elements
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133345—Insulating layers

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Liquid Crystal (AREA)

Abstract

PURPOSE: A method for forming a reflecting board of a reflection type crystal liquid display device is provided to form a reflecting board, which has the unevenness of the surface and to control the form and the size of the unevenness. CONSTITUTION: A method for forming a reflecting board of a reflection type crystal liquid display device includes a few stages. In the first stage a source/drain metal film(30) which consists of a bottom molybdenum film(22), an aluminum film(23) and a top molybdenum film(24) is deposited. In the second stage a sensitive film pattern is formed on the top molybdenum film(24). In the third stage the groove(32) is formed in the layed metal film. In the fourth stage the sensitive film pattern is removed. In the fifth stage an organic insulating film(33) is formed on the top molybdenum film(24). In the sixth stage an unevenness is formed on the surface of the organic insulating film(33) by expanding the part of the organic insulating film(33) reclaimed in the groove(32). In the last stage an aluminum metal film(34) is formed along the surface on the organic insulating film(33).

Description

반사형 액정표시장치의 반사판 형성방법{Method for forming reflective layer of reflective type LCD}Reflective plate forming method of reflective liquid crystal display device {Method for forming reflective layer of reflective type LCD}

본 발명은 반사형 액정표시장치의 형성방법에 관한 것으로, 특히, 표면 요철을 갖는 반사판의 형성방법에 관한 것이다.The present invention relates to a method of forming a reflective liquid crystal display device, and more particularly, to a method of forming a reflecting plate having surface irregularities.

반사형 액정표시장치는 액정의 굴절율이방성(Δn)을 이용하여 소정의 화상을 표시하는 액정표시장치의 일종이다. 이러한 반사형 액정표시장치는 통상의 액정표시장치가 백라이트와 같은 광원을 요구하는 반면에, 자연광을 광원으로 이용하므로, 별도의 광원을 필요로 하지 않는다.The reflective liquid crystal display device is a kind of liquid crystal display device that displays a predetermined image by using the refractive index anisotropy (Δn) of the liquid crystal. Such a reflective liquid crystal display device requires a light source such as a backlight while a conventional liquid crystal display device uses natural light as a light source, and thus does not require a separate light source.

도 1은 종래의 반사형 액정표시장치를 개략적으로 도시한 도면으로서, 도시된 바와 같이, 반사형 액정표시장치는 대향·배치되는 하부 기판(1) 및 상부 기판(11)과 그들 사이에 개재되는 액정층(20)을 포함한다.1 is a view schematically showing a conventional reflective liquid crystal display device, and as shown, the reflective liquid crystal display device is disposed between the lower substrate 1 and the upper substrate 11 that are opposed to and disposed therebetween. The liquid crystal layer 20 is included.

상기 하부 기판(1)의 내측면에는 하층 패턴, 예를 들어, 박막 트랜지스터(도시안됨)와 유기절연막(6) 및 화소전극(도시안됨) 등이 형성되고, 그 상부에는 알루미늄 금속막과 같은 계면 반사 특성이 우수한 금속막으로된 반사판(7)이 형성된다.A lower layer pattern, for example, a thin film transistor (not shown), an organic insulating layer 6, a pixel electrode (not shown), and the like are formed on an inner surface of the lower substrate 1, and an interface such as an aluminum metal film is formed thereon. A reflecting plate 7 made of a metal film having excellent reflecting properties is formed.

상부 기판(11)의 내측면에는 박막 트랜지스터와 대응하는 부분에 블랙 매트릭스(도시안됨)가 형성되며, 화소 영역에는 레드(R), 그린(G) 및 블루(B)의 컬러 필터들(6)이 형성되고, 블랙 매트릭스와 컬러 필터(12)의 상부 표면에는 공통 전극(도시안됨)이 형성된다.On the inner side of the upper substrate 11, a black matrix (not shown) is formed on a portion corresponding to the thin film transistor, and color filters 6 of red (R), green (G), and blue (B) are formed in the pixel area. Is formed, and a common electrode (not shown) is formed on the black matrix and the upper surface of the color filter 12.

또한, 상·하부 기판(1, 11) 사이에 개재되는 액정층(20) 내에는 네마틱 액정 분자와 입사된 광을 선택적으로 흡수 또는 차단하는 염색제가 포함되며, 이때, 액정층내에 입사된 빛은 염색제의 장축을 지날때는 상기 염색제에 흡수되고, 단축을 지날때는 투과된다.In addition, the liquid crystal layer 20 interposed between the upper and lower substrates 1 and 11 includes a dye agent that selectively absorbs or blocks the nematic liquid crystal molecules and incident light. When the silver dye passes the long axis, it is absorbed by the dye, and when the silver axis passes, it is permeated.

한편, 하부 기판(1)에 구비되는 반사판(7)의 표면에는, 도시된 바와 같이, 표면 요철이 구비된다. 이것은, 입사된 빛이 반사판(7)의 표면 요철에 의해 더 큰 반사각으로 반사되도록 함으로써, 반사형 액정표시장치의 시야각이 향상되도록 하기 위함이다.On the other hand, the surface of the reflecting plate 7 provided in the lower substrate 1 is provided with surface irregularities, as shown. This is to allow the incident light to be reflected at a larger reflection angle by the surface irregularities of the reflecting plate 7 so that the viewing angle of the reflective liquid crystal display device is improved.

그러나, 상기와 같은 종래의 반사형 액정표시장치는 반사판의 표면 요철이, 도 2에 도시된 바와 같이, 하층 패턴들에 의해 발생되는 것이므로, 하층 패턴들을 적층시키기 위해서는 위해서는 여러 번의 마스킹 공정을 필요로 하며, 특히, 이 과정에서 각 레이어들의 프로파일을 계산해야 하기 때문에, 재현성 및 신뢰성의 확보가 어려운 문제점이 있다.However, in the conventional reflective liquid crystal display device as described above, since surface irregularities of the reflecting plate are generated by lower layer patterns, as shown in FIG. 2, several masking processes are required to stack the lower layer patterns. In particular, in this process, it is difficult to ensure reproducibility and reliability because the profile of each layer has to be calculated.

또한, 반사 효율을 향상시키기 위해서는 표면 요철들의 크기 및 높이를 상이하게 만들어야 하고, 이를 위해서는 하층 패턴들의 크기를 서로 상이하게 해야 하므로, 공정 제어가 매우 어려운 문제점이 있다.In addition, in order to improve the reflection efficiency, the size and height of the surface irregularities must be made different, and for this purpose, the size of the lower layer patterns must be different from each other, so that process control is very difficult.

따라서, 상기와 같은 문제점을 해결하기 위하여 안출된 본 발명은, 반사판의 표면에 보다 용이하게 요철을 구비시킬 수 있도록 하는 반사형 액정표시장치의 반사판 형성방법을 제공하는데, 그 목적이 있다.Accordingly, an object of the present invention is to provide a reflective plate forming method of a reflective liquid crystal display device, which enables the surface of the reflective plate to have irregularities more easily.

도 1은 종래 반사형 액정표시장치의 단면도.1 is a cross-sectional view of a conventional reflective liquid crystal display device.

도 2는 종래 기술에 따른 반사판의 형성방법을 설명하기 위한 도면.2 is a view for explaining a method of forming a reflector according to the prior art.

도 3a 내지 도 3e는 본 발명의 실시예에 따른 반사판 형성방법을 설명하기 위한 각 공정별 단면도.3A to 3E are cross-sectional views for each process for explaining a method of forming a reflector according to an embodiment of the present invention.

(도면의 주요 부분에 대한 부호의 설명)(Explanation of symbols for the main parts of the drawing)

21 : 하부 기판 22 : 바텀 몰리브덴막21: lower substrate 22: bottom molybdenum film

23 : 알루미늄막 24 : 탑 몰리브덴막턴23: aluminum film 24: top molybdenum Maxton

30 : 소오스/드레인용 금속막 31 : 감광막 패턴30: source / drain metal film 31: photosensitive film pattern

32 : 홈 33 : 유기절연막32: groove 33: organic insulating film

A : 제1요철 34 : 알루미늄막A: 1st unevenness 34: aluminum film

B : 제2요철B: 2nd unevenness

상기와 같은 목적을 달성하기 위한 본 발명의 반사형 액정표시장치의 반사판 형성방법은, 소오스/드레인용 금속막으로서, 바텀 몰리브덴막과 알루미늄막 및 탑 몰리브덴막으로 이루어진 적층 금속막을 증착하는 단계; 상기 탑 몰리브덴막 상에 상기 탑 몰리브덴막의 소정 부분을 노출시키는 감광막 패턴을 형성하는 단계; 상기 감광막 패턴을 마스크로해서, 노출된 탑 몰리브덴막 부분과 그 하부의 알루미늄막 부분을 상이한 식각 선택비로 식각하여 상기 적층 금속막 내에 홈을 형성하는 단계; 상기 감광막 패턴을 제거하는 단계; 상기 탑 몰리브덴막 상에 상기 홈 내부를 완전히 매립시킬 정도의 두께로 유기절연막을 증착하는 단계; 열처리 공정으로 상기 홈 내에 매립된 유기절연막 부분을 팽창시켜, 상기 유기절연막의 표면에 요철을 형성하는 단계; 및 상기 표면 요철을 갖는 유기절연막 상에 그의 표면을 따라 알루미늄 금속막을 증착하는 단계를 포함하여 이루어진다.Reflective plate forming method of a reflective liquid crystal display device of the present invention for achieving the above object, the source / drain metal film, the step of depositing a laminated metal film consisting of a bottom molybdenum film, aluminum film and top molybdenum film; Forming a photoresist pattern on the top molybdenum film to expose a predetermined portion of the top molybdenum film; Using the photoresist pattern as a mask, etching the exposed top molybdenum film portion and the lower aluminum film portion at different etching selectivity to form grooves in the laminated metal film; Removing the photoresist pattern; Depositing an organic insulating film on the top molybdenum film so as to completely fill the inside of the groove; Expanding the portion of the organic insulating film embedded in the groove by a heat treatment process to form irregularities on the surface of the organic insulating film; And depositing an aluminum metal film along its surface on the organic insulating film having the surface irregularities.

본 발명에 따르면, 반사판의 재질인 알루미늄막의 증착 이전에 유기절연막의 표면에 표면 요철이 발생되도록 함으로써, 매우 용이하게 표면 요철을 갖는 반사판을 형성할 수 있다.According to the present invention, the surface irregularities can be formed on the surface of the organic insulating film prior to the deposition of the aluminum film, which is the material of the reflecting plate, so that the reflective plate having the surface irregularities can be formed very easily.

이하, 첨부된 도면에 의거하여 본 발명의 바람직한 실시예를 자세히 설명하도록 한다.Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

도 3a 내지 도 3e는 본 발명의 실시예에 따른 반사판 형성방법을 설명하기 위한 각 공정별 단면도로서, 이를 설명하면 다음과 같다.3A to 3E are cross-sectional views for each process for explaining a method of forming a reflector according to an embodiment of the present invention.

우선, 도 3a에 도시된 바와 같이, 하부 기판(21) 상에 바텀 몰리브덴막(22)과 알루미늄막(23) 및 탑 몰리브덴막(24)의 적층 구조로 이루어진 소오스/드레인용 금속막(30)을 증착한다. 그런다음, 상기 소오스/드레인용 금속막(30)의 탑 몰리브덴막(24) 상에 그의 소정 부분을 노출시키는 감광막 패턴(31)을 형성한다.First, as shown in FIG. 3A, the source / drain metal film 30 formed of a laminated structure of the bottom molybdenum film 22, the aluminum film 23, and the top molybdenum film 24 on the lower substrate 21. Deposit. Then, a photosensitive film pattern 31 is formed on the top molybdenum film 24 of the source / drain metal film 30 to expose a predetermined portion thereof.

다음으로, 도 3b에 도시된 바와 같이, 감광막 패턴(31)을 마스크로해서, 노출된 탑 몰리브덴막(24) 부분과 그 하부의 알루미늄막(23) 부분을, 예컨데, SF6, CF4, CCl4등의 가스와 He 및 O2/H2가스의 혼합 가스를 이용한 건식 식각 공정, 또는, 통상의 습식 식각 공정으로 식각한다. 이때, 몰리브덴막(24)과 알루미늄막(23)은 그들간의 식각 선택비가 상이하므로, 소오스/드레인용 금속막(30)에는 하측의 폭이 상측의 폭 보다 넓은 형태를 갖는 홈(32)이 형성된다. 여기서, 상기 몰리브덴막(24)과 알루미늄막(23)의 식각시에는, 예컨데, 그들간의 식각 선택비를 0.1∼2.0 정도로 한다.Next, as shown in FIG. 3B, the exposed top molybdenum film 24 portion and the aluminum film 23 portion below it are exposed using the photosensitive film pattern 31 as a mask, for example, SF 6 , CF 4 , and the like. Etching is performed by a dry etching process using a gas such as CCl 4 and a mixed gas of He and O 2 / H 2 gas, or a conventional wet etching process. At this time, since the etch selectivity between the molybdenum film 24 and the aluminum film 23 is different from each other, the groove 32 having a shape having a lower width than the upper width is formed in the source / drain metal film 30. do. Here, at the time of etching the molybdenum film 24 and the aluminum film 23, for example, the etching selectivity between them is about 0.1 to 2.0.

그 다음, 감광막 패턴을 제거한 상태에서, 도 3c에 도시된 바와 같이, 홈(32)이 구비된 소오스/드레인용 금속막(30) 상에 비씨비(BCB), 아크릴(Acryl), 에어로겔(Aerogel) 또는 마이크로포움(Microfoam) 중에서 선택되는 하나의 물질막으로 이루어진 유기절연막(33)을 증착한다.Then, with the photoresist pattern removed, BCB, Acryl, Aerogel on the source / drain metal film 30 with grooves 32 as shown in FIG. 3C. ) Or an organic insulating film 33 formed of one material film selected from microfoam is deposited.

그런다음, 도 3d에 도시된 바와 같이, 200∼350℃에서 열처리 공정을 수행하여, 홈(32) 내에 매립된 유기절연막 부분을 팽창시켜, 그 부분에 제1요철(A)을 발생시킨다. 여기서, 열팽창 계수가 큰 유기절연막이 이용된 경우, 도시된 바와 같이, 제1요철(A)은 볼록한 형태를 갖지만, 열팽창 계수가 작은 유기절연막인 이용된 경우, 제1요철은 오목한 형태를 갖게 된다.Then, as illustrated in FIG. 3D, a heat treatment process is performed at 200 to 350 ° C. to expand the portion of the organic insulating film embedded in the groove 32 to generate the first unevenness A in the portion. Here, when the organic insulating film having a large thermal expansion coefficient is used, as shown, the first unevenness A has a convex shape, but when the organic insulating film having a small thermal expansion coefficient is used, the first unevenness has a concave shape. .

이후, 도 3e에 도시된 바와 같이, 제1요철(A)을 갖는 유기절연막(33) 상에 계면 반사 특성이 우수한 알루미늄막(34)을 증착한다. 이때, 알루미늄막(34)은 유기절연막(33)의 표면을 따라 증착되므로, 상기 알루미늄막(34)의 표면에는 상기 유기절연막(33)의 제1요철(A) 상부에 제2요철(B)이 발생하게 된다. 따라서, 상기한 알루미늄막(34)으로 이루어지는 반사판은 표면 요철을 갖게 된다.3E, an aluminum film 34 having excellent interfacial reflection characteristics is deposited on the organic insulating film 33 having the first unevenness A. Referring to FIG. In this case, since the aluminum film 34 is deposited along the surface of the organic insulating film 33, the second unevenness B may be formed on the surface of the aluminum insulating film 34 on the first uneven portion A of the organic insulating film 33. This will occur. Accordingly, the reflecting plate made of the aluminum film 34 has surface irregularities.

이상에서와 같이, 본 발명은 소오스/드레인용 금속막의 재질인 탑 몰리브덴막과 알루미늄 금속막간의 식각 선택비를 이용함과 동시에, 유기절연막의 열팽창을 이용하여 상기 유기절연막의 표면에 요철이 발생되도록 함으로써, 이러한 유기절연막 상에 형성되는 알루미늄막 재질의 반사판이 표면 요철을 갖도록 할 수 있다.As described above, the present invention utilizes the etch selectivity between the top molybdenum film and the aluminum metal film, which are materials of the source / drain metal film, and at the same time, by using the thermal expansion of the organic insulating film to cause irregularities on the surface of the organic insulating film. The reflective plate made of an aluminum film formed on the organic insulating film may have surface irregularities.

따라서, 비교적 용이하게 표면 요철을 갖는 반사판을 형성할 수 있으며, 또한, 유기절연막의 팽창 정도를 조절하면 표면 요철의 형태 및 크기를 조절할 수 있기 때문에, 재현성 및 신뢰성을 향상시킬 수 있다.Therefore, the reflection plate having the surface irregularities can be formed relatively easily, and since the shape and size of the surface irregularities can be adjusted by adjusting the degree of expansion of the organic insulating film, the reproducibility and reliability can be improved.

기타, 본 발명은 그 요지를 일탈하지 않는 범위에서 다양하게 변경하여 실시할 수 있다.In addition, this invention can be implemented in various changes within the range which does not deviate from the summary.

Claims (6)

소오스/드레인용 금속막으로서, 바텀 몰리브덴막과 알루미늄막 및 탑 몰리브덴막으로 이루어진 적층 금속막을 증착하는 단계;A metal film for source / drain, comprising: depositing a laminated metal film made of a bottom molybdenum film, an aluminum film, and a top molybdenum film; 상기 탑 몰리브덴막 상에 상기 탑 몰리브덴막의 소정 부분을 노출시키는 감광막 패턴을 형성하는 단계;Forming a photoresist pattern on the top molybdenum film to expose a predetermined portion of the top molybdenum film; 상기 감광막 패턴을 마스크로해서, 노출된 탑 몰리브덴막 부분과 그 하부의 알루미늄막 부분을 상이한 식각 선택비로 식각하여 상기 적층 금속막 내에 홈을 형성하는 단계;Using the photoresist pattern as a mask, etching the exposed top molybdenum film portion and the lower aluminum film portion at different etching selectivity to form grooves in the laminated metal film; 상기 감광막 패턴을 제거하는 단계;Removing the photoresist pattern; 상기 탑 몰리브덴막 상에 상기 홈 내부를 완전히 매립시킬 정도의 두께로 유기절연막을 증착하는 단계;Depositing an organic insulating film on the top molybdenum film so as to completely fill the inside of the groove; 열처리 공정으로 상기 홈 내에 매립된 유기절연막 부분을 팽창시켜, 상기 유기절연막의 표면에 요철을 형성하는 단계; 및Expanding the portion of the organic insulating film embedded in the groove by a heat treatment process to form irregularities on the surface of the organic insulating film; And 상기 표면 요철을 갖는 유기절연막 상에 그의 표면을 따라 알루미늄 금속막을 증착하는 단계를 포함하여 이루어지는 것을 특징으로 하는 반사형 액정표시장치의 반사판 형성방법.And depositing an aluminum metal film along the surface thereof on the organic insulating film having the surface irregularities. 제 1 항에 있어서, 상기 탑 몰리브덴막과 알루미늄막의 식각은 0.1∼2.0의 식각 선택비로 식각하는 것을 특징으로 하는 반사형 액정표시장치의 반사판 형성방법.The method of claim 1, wherein the etching of the top molybdenum film and the aluminum film is performed at an etching selectivity of 0.1 to 2.0. 제 1 항에 있어서, 상기 탑 몰리브덴막과 알루미늄막의 식각은The method of claim 1, wherein the etching of the top molybdenum film and aluminum film SF6, CF4, CCl4등의 가스와 He 및 O2/H2가스의 혼합 가스를 이용한 건식 식각 공정으로 수행하는 것을 특징으로 하는 반사형 액정표시장치의 반사판 형성방법.Method for forming a reflector of a reflective liquid crystal display device, characterized in that performed by a dry etching process using a mixture of a gas such as SF 6 , CF 4 , CCl 4 and He and O 2 / H 2 gas. 제 1 항에 있어서, 상기 탑 몰리브덴막과 알루미늄막의 식각은 습식 식각 공정으로 수행하는 것을 특징으로 하는 반사형 액정표시장치의 반사판 형성방법.The method of claim 1, wherein the etching of the top molybdenum film and the aluminum film is performed by a wet etching process. 제 1 항에 있어서, 상기 유기절연막은 비씨비(BCB), 아크릴(Acryl), 에어로겔(Aerogel) 또는 마이크로포움(Microfoam) 중에서 선택되는 하나의 물질막인 것을 특징으로 하는 반사형 액정표시장치의 반사판 형성방법.The reflective plate of claim 1, wherein the organic insulating layer is one of a material layer selected from BCB, acryl, aerogel, and microfoam. Formation method. 제 1 항에 있어서, 상기 열처리는 200∼350℃에서 수행하는 것을 특징으로 하는 반사형 액정표시장치의 반사판 형성방법.The method of claim 1, wherein the heat treatment is performed at 200 to 350 ° C.
KR1019990025679A 1999-06-30 1999-06-30 Method for forming reflective layer of reflective type LCD KR20010004911A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100570404B1 (en) * 2001-08-06 2006-04-11 엔이씨 엘씨디 테크놀로지스, 엘티디. Transflective Type LCD and Method for Manufacturing the Same
KR100939848B1 (en) * 2002-09-11 2010-01-29 하이디스 테크놀로지 주식회사 Method for manufacturing of reflective plate of reflective liquid crystal display

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100570404B1 (en) * 2001-08-06 2006-04-11 엔이씨 엘씨디 테크놀로지스, 엘티디. Transflective Type LCD and Method for Manufacturing the Same
KR100939848B1 (en) * 2002-09-11 2010-01-29 하이디스 테크놀로지 주식회사 Method for manufacturing of reflective plate of reflective liquid crystal display

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