KR20010002696A - polymeric polishing pad containing hollow polymeric microelements bundle of cellular tissue and manufacturing method there of - Google Patents

Abstract

PURPOSE: A polishing pad having a minute polymeric microelement bundle of cellular tissue structure and a manufacturing method thereof are provided to collect efficiently and fix slurry particles through an opened part of polymeric microelements, so that the efficiency of polishing is improved and the time for work is reduced. CONSTITUTION: In a polishing pad, a polymeric microelement is formed in a bundle of a minute polymeric microelement(36), and a large quantity of polymeric microelements are impregnated in a polymeric matrix(32) in which urethane and hardener are mixed. The part of a minute polymeric microelement bundle(34) exposed to a surface course of the polymeric matrix by grinding forms the cellular tissue structure, so that the collection and the transmission of slurry are facilitated. The size of the minute polymeric microelement bundle is 10-300μm.

Description

Polishing pad containing microporous polymer bundles of cellular structure and method for manufacturing the polymerized pad containing hollow polymeric microelements bundle of cellular tissue and manufacturing method there of}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polishing pad having a micro hollow polymer bundle having a cellular structure and a method of manufacturing the same. More particularly, in polishing a surface of a target article such as a silicon wafer, sufficient elasticity and flexibility to face the surface of the target article The present invention relates to a polishing pad having a fine hollow polymer bundle having a cellular structure, which has a polishing structure and is subjected to polishing by flowing in a state of collecting a slurry used for polishing.

Generally, the polishing pad is used alone or as a member thereof for polishing an article surface for which a high level of flatness is required.

The shape of the polishing pad used in this way may be manufactured in various shapes and shapes corresponding to the target object such as a cone, a cylinder, a flat plate.

The article to be polished is applied to an article in which polishing sites such as semiconductor devices, silicon devices, glass, ceramics, polymer plastics, metals, stones, etc. are separated into powders, and the semiconductor wafer is described as an example of the article. Shall be.

The above polishing operation is performed in the process of positioning the surface of the wafer in contact with or near to the polishing pad, supplying the polishing slurry therebetween, and flowing the poly pad or wafer.

Meanwhile, the components of the slurry used in this way may include liquids such as water and oil, abrasives such as aluminum oxide, silicon carbide, salt, abrasives, emulsifiers, and other materials corresponding to the properties of the article.

Hereinafter, the application relationship between the above-described polishing pad and the target wafer and slurry will be described with reference to the chemical-mechanical polishing (CMP) configuration shown in FIG. 1.

As shown in FIG. 1, the general configuration of the CMP 10 includes a pad chuck 12 which rotates at a high speed in a horizontal state by driving a lower drive motor (not shown for simplicity of the drawing). On the upper surface of the chuck 12, a plate-shaped polishing pad 14a having a predetermined thickness is attached and fixed in a conventional manner.

In addition, a slurry supply nozzle 16 is installed at an upper center position spaced apart from the center of the polishing pad 14a, and the slurry supplied through the slurry supply nozzle 16 is polished by centrifugal force by the rotation of the polishing pad 14a. It is apply | coated uniformly to the upper surface of the pad 14a.

Meanwhile, as shown in FIG. 1, the polishing part 18 fixes the wafer to one side of the upper surface of the polymeric pad 14a so that one surface of the wafer is selectively positioned to face the upper surface of the polishing pad 14a. Is installed.

The polishing unit 18 is configured to rotate and simultaneously move the fixed wafer in a state opposite to the polishing pad 14a, and optionally to separate the wafer to another position.

And the dressing part 20 which grinds and removes the surface layer of the polishing pad 14a used by predetermined thickness is provided in the other site | part of the upper surface of the polishing pad 14a.

According to the configuration of the CMP, the slurry supplied through the slurry supply nozzle 16 is uniformly applied to the upper surface by the high speed rotation of the polishing pad 14a, and in this state, the above-described polishing portion 18 is formed of the wafer. The desired surface is placed to face or contact the upper surface of the polishing pad 14a so as to flow in the direction of the left and right arrows shown in FIG.

The wafer to be positioned at this time flows in contact with or in contact with the polishing pad 14a to which the slurry is uniformly applied, thereby polishing the opposite surface.

When the opposite surface of the wafer is sufficiently polished in this process, the polishing unit 18 positions the polished wafer to the outside and positions the next wafer to perform polishing again.

On the other hand, as the surface layer of the polishing pad 14a is worn by the continuous polishing operation in the above-described polishing operation, the predetermined thickness of the surface layer is ground and reused.

In this case, the slurry supply is stopped, and the dressing portion 20 is positioned from the other side of the polishing pad 14a to prepare the next wafer polishing step by grinding a predetermined thickness of the surface layer of the rotating polishing pad 14a.

Here, according to the above, the structure of the polishing pad 14a which is generally used is mainly one of a multilayer structure having non-uniform physical properties throughout the thickness of the polishing pad 14a.

Such a multilayer structure is usually divided into a support layer, a polishing layer and a working surface on which the polishing layer is surfaced.

In the above configuration, the support layer has a porous structure as a structure bonded to the pad chuck 12 and the like described above, and has a resilience property in response to the force applied by the wafer, so that the polishing layer provided on the upper side corresponds to the wafer. It serves to support a uniform elastic force.

In addition, the polishing layer provided on the upper side of the support layer is made of a porous urethane or the like whose component is microelastic, and the working surface forming the surface layer of the polishing layer is more elastic and flexible than the polishing layer, so that the polishing layer is in contact with or close to the wafer. Will be opposed.

In the polishing pad 14a having such a configuration, the work surface is differentiated locally or globally during the polishing operation, thereby unevenly polishing the surface of the target wafer.

Therefore, in performing the polishing operation, the working surface of the polishing pad 14a described above is ground to a predetermined thickness at a predetermined cycle corresponding to the degree of wear.

On the other hand, the configuration of the working surface of the polishing pad 14a requires that the silicon slurry be flowed in a state in which the slurry is continuously collected in a contact or close correspondence with the wafer so as to keep the slurry continuously distributed on the opposite surface. .

As a configuration for realizing such a requirement, the contents described in US Patent Publication No. 96-5578362 describe that the structure divided into the above-described support layer, polishing layer, and work surface corresponds to the wear and grinding properties of each layer. It is formed in a single configuration to be made continuously.

The construction of the polishing pad 14b described in U.S. Patent Publication No. 96-5578362 is composed of a polymeric matrix 22 and the polymeric base, which are not permeable to the liquid slurry, as shown in FIG. It is formed by impregnating (22) with a large amount of hollow polymer (polymeric microelement) (24) to be uniformly distributed.

The above-mentioned components of the polymeric base 22 are a mixture of a urethanes, polyesters, polysulfones, polyvinylacetate, fluorinated hydrocarbons, and resins such as these mixtures and copolymers, and the composition is composed of liquid urethane as its representative component. .

In addition, the above-mentioned components of the hollow polymer 24 are PVC-based components, and polyvinyl alcohol pectin, polyvinyl pyrolidine, hydroxyethylcellous, methylcellous, hydropropylmethylcellous, carboxymethylcellous, hydropropylcellous, polyacryl acids, polyacrylamide, polyethylene glycol, polygydroxyethylacrylites, starches, maleic acid copolymers, polyethylene oxide, polyurethane and combinations thereof.

On the other hand, these hollow polymers 24 are partitioned inside, and the low boiling point hydrocarbon-based gas is introduced therein and expanded to a size of about 10 to 150 μm, and generally about 90 μm is mainly used.

The reason why the hollow polymer 24 is expanded to have a size of about 90 μm is to facilitate the opening of the hollow polymer 24 from the surface layer of the polymeric base 22, thereby securing the elasticity and flexibility of the surface layer and the surface layer. To achieve the lower elasticity.

Meanwhile, as described above, the polishing pad manufacturing apparatus 26 and the manufacturing process using the polymeric base 22 and the hollow polymer 24 may be uniformly distributed in the predetermined amount of the polymeric base 22. The degree of hollow polymer 24 is impregnated.

Thereafter, the above-described polymeric base 22 and the hollow polymer 24 are sufficiently stirred to form a final mixture, which is injected into the mold 28 having a predetermined shape in which the inside is hermetically sealed using an injector 29. .

The injected final mixture is subjected to gelation, curing, and cooling in the mold 28, and the resulting solid mixture is removed from the mold 28 and cut into a predetermined thickness and shape. It is formed of (14b).

As described above, in the manufactured polishing pad 14b, the hollow polymer 24 is exposed to the surface of the polishing pad 14b by wear or grinding continuously on the working surface to receive a predetermined amount of slurry. The fine pores are formed.

On the other hand, the surface layer portion of the polishing pad 14b has a more elastic and flexible characteristic compared to the surface layer portion that is not exposed by the hollow polymer 24 being exposed open, and also inserts the surface layer portion that is not exposed open. The hollow polymer 24 has a predetermined elasticity and flexibility due to the distribution relationship.

In the use relationship according to the configuration of the polishing pad 14b, the contact or close correspondence with the wafer will be described in more detail with reference to FIG. 3A.

FIG. 3A is a cross-sectional view schematically showing the relationship between the use of the polishing pad 14b and the contact of the wafer shown in FIG. 2, with the wafer facing the top surface in the state where the slurry-coated polishing pad 14b is rotated. It is for explaining the relationship between the process of the polishing operation and the slurry flow relationship and the force acting on the surface layer of the polishing pad 14b.

As shown in Fig. 3A, the supplied slurry is received and collected in the hollow polymer 24 by the high speed rotation of the polishing pad 14b, and the working surface of the polishing pad 14b in which the hollow polymer 24 is not exposed is Elastic force is provided.

First, the slurry of the portion exposed to the working surface of the slurry in the state collected by the hollow polymer 24 participates in the polishing operation directly or indirectly, but it is difficult to expect the degree of polishing.

In addition, the slurry of the upper portion contained in the hollow polymer 24 flows to the working surface of the polishing pad 14b in which the hollow polymer 24 is not exposed in contact with the surface of the wafer.

On the other hand, the work surface portion between the hollow polymers 24 is elastic and flexible in the up, down and both directions by the opening of the neighboring hollow polymers 24 and the hollow polymers 24 which are not open under the work surface. Thereby providing a resilient force against the surface of the wafer with the slurry distributed on that surface.

Here, the surface layer portion of the polishing pad 14b is abraded by continuous polishing, and the worn surface layer distributes the slurry supplied unevenly, so that the surface of the corresponding wafer has a globally uneven polishing atmosphere. It will be placed on.

In addition, the peripheral portion of the hollow polymer 24 having a weak bearing force corresponding to the frictional pressure caused by the polishing operation is grown in a pushed shape as shown in FIG. 3A by the frictional pressure acting as the degree of wear increases. It is then grown in a shape to cover the open portion of the hollow polymer (24).

The growth protruding portion acts as a factor that inhibits the subsequent flow of the slurry to distribute the slurry unevenly during polishing, thereby changing the polishing characteristics for the wafer.

In this case, as shown in FIG. 3B, the dressing part 20 is placed on the upper surface of one side of the polishing pad 14b which rotates while the supply of slurry is stopped, thereby grinding the predetermined working surface thickness.

However, also in this case, the periphery of the open hollow polymer 24 on the exposed working surface is pushed away from the periphery of the surface layer as it does not provide sufficient support in response to the grinding pressure of the dressing section 20. This results in the formation of an extension in the polishing process, which causes the above-mentioned problems, resulting in a nonuniform distribution of the slurry and a decrease in polishing efficiency of the wafer.

In addition, as the grinding operation is required in a short cycle as a repetition of the above problems, the life of the polishing pad is shortened, there is a problem of delay in work time and productivity decrease due to the polishing operation.

When the peripheral side portion of the hollow polymer 24 is present in the pushed shape, the area is continuously grown in the pushed shape by being worn during the polishing operation, thereby reducing the reproducibility due to the polishing work, to form a fine pattern. There was a problem of lowering workability.

In addition, as described above, as the grinding cycle for the surface layer of the polishing pad 14b is shortened due to the decrease in the polishing efficiency, the life of the polishing pad 14b is shortened, thereby making it difficult to work with replacement of the polishing pad 14b. There was an uneconomical problem that increased production costs.

On the other hand, as described above, as the size of the hollow polymer 24 is formed on the average of about 90㎛ size, compared with the amount of slurry to be collected, the transfer efficiency capacity required for polishing is reduced, the hollow polymer 24 When a large amount is exposed to the surface layer of the polishing pad 14b, the degree of participation in the polishing operation is lowered, and thus the polishing operation time is delayed.

As described above, when the surface of the wafer is not polished uniformly, there is a problem of lowering the production yield of the semiconductor device produced by the wafer.

On the other hand, as described above, the hollow polymer 24 has elasticity and flexibility, but may be broken when opened during the polishing or grinding process, the transport efficiency of the slurry is lowered, and the ground area of the collected slurry may be artificially formed. There is a problem that the polishing efficiency is lowered.

In addition, when the inner bottom portion of the hollow polymer 24 is exposed and is in direct contact with the wafer, the wafer surface is changed as compared with the peripheral polymeric base 22 by changing the environment of the working surface such as impact on the wafer. There was a problem that the degree of polishing for the non-uniform.

DISCLOSURE OF THE INVENTION An object of the present invention is to solve a conventional problem, wherein a work surface in contact with or in close proximity to an object has sufficient elastic force and flexibility during polishing, and at the same time, polishing and grinding by the object and dressing part. The micro hollow structure of the cell structure that has sufficient elasticity, flexibility, and bearing capacity to cope with the frictional force during the operation to suppress the wear of the surface layer and increase the grinding efficiency to maintain the surface layer flatness and extend its lifespan. The present invention provides a polishing pad having a polymer bundle and a method of manufacturing the same.

In addition, the fine structure of the cell structure to ensure that the slurry is uniformly applied, improve the degree of participation in the polishing work in a fixed state that these slurry is collected and to improve the efficiency of the polishing work and to shorten the working time according to the polishing work The present invention provides a polishing pad having a hollow polymer bundle and a method of manufacturing the same.

In addition, the polishing pad having a fine hollow polymer bundle having a cellular structure to reduce the consumption of the slurry, and to increase the production yield according to the use of the target article by improving the degree of polishing and reproducibility of the target article and a method of manufacturing the same. In providing.

In addition, it is possible to reduce the degree of breakdown of the open hollow polymer, to improve slurry transfer efficiency, to artificially support the collected slurry, thereby performing fine pattern polishing, and to According to the present invention, a polishing pad having a fine hollow polymer bundle having a cell structure and a method of manufacturing the same may be used to maintain a constant working environment so as to reduce the impact during polishing on an object and to improve the degree of polishing. In providing.

1 is a configuration diagram schematically showing a relationship between a general polishing apparatus in which a polishing pad is used and a polishing pad accordingly.

2 is a cross-sectional view showing a conventional polishing pad structure having hollow polymer particles.

FIG. 3A is a cross-sectional view for explaining the use of the polishing pad shown in FIG. 2 and an operational relationship with respect to an object.

3B is a cross-sectional view showing a dressing relationship for grinding the surface of the polishing pad shown in FIG. 2 to a predetermined thickness.

4 is a partial cross-sectional view showing the structure of a polishing pad having a fine hollow polymer bundle according to an embodiment of the present invention.

FIG. 5A is a cross-sectional view for explaining the use of the polishing pad shown in FIG. 4 and an operational relationship with respect to an object.

5B is a cross-sectional view showing a dressing relationship for grinding the surface of the polishing pad shown in FIG. 4 to a predetermined thickness.

FIG. 6A is an enlarged perspective photograph showing a magnified shape of the fine hollow polymer bundle constituting the polishing pad; FIG.

FIG. 6B is a drawing substitute photograph showing an enlarged view of FIG. 6A;

FIG. 7A is an enlarged plan view photograph showing the surface of the polishing pad in a state where the fine hollow polymer bundles of FIG. 6A or 6B are provided and distributed;

FIG. 7B is a plan view photograph substituted for the drawing in which FIG. 7A is enlarged.

<Explanation of symbols for the main parts of the drawings>

10: CMP apparatus 12: pad chuck

14a, 14b, 30: polishing pad 16: slurry feed nozzle

18: polishing part 20: dressing part

22, 32: polymeric matrix 24: hollow polymer

34: fine hollow polymer bundle 36: fine hollow polymer

A feature of the present invention for achieving the above object is that a polymeric matrix mixed with a urethane and a curing agent is impregnated with a large amount of hollow polymer, and the surface layer is subjected to the open article as the hollow polymer is exposed from the surface layer by abrasion or grinding. In the polishing pad formed to collect the slurry in contact with or close to the surface of the elastic and flexible properties, the hollow polymer is formed of a bundle of fine hollow polymer of the unit by a large amount of fine hollow polymer agglomerated into a mutual foam shape, It is formed by impregnating a large amount of fine hollow polymer bundles in the polymeric matrix to form a predetermined volume ratio, and the portion of the fine hollow polymer bundles exposed to the surface layer of the polymeric matrix by grinding forms a tissue structure and forms a slurry at an upper portion thereof. Easy to collect and transfer It is characterized in that the rock formed.

In addition, the fine hollow polymer bundles are to be uniformly distributed corresponding to the overall polymeric matrix, and the size of these fine hollow polymer bundles is preferably 10 to 300 μm and an average diameter of 30 to 100 μm is used.

The micro hollow polymer constituting the micro hollow polymer bundle has a size of 0.1 to 10 μm, and an average diameter of 0.4 to 2 μm so that at least one slurry particle is collected and has a fixing force.

Further, the fine hollow polymer bundle and the fine hollow polymer constituting the fine hollow polymer bundle are spherical.

On the other hand, the bonding structure between each of the micro hollow polymers of the micro hollow polymer bundle exposed to the surface layer of the polymeric matrix to form a cellular structure has support force between the micro hollow polymers, and the exposed micro hollow polymer bundles are exposed. The polymeric matrix adjacent to is subjected to the bearing force by the bonding structure between the fine hollow polymers.

In addition, the fine hollow polymer is an organic polymer, the components of which are acryl, styrene, PVC, cellulose, polyvinylpyrrolidine, pectin, polyacryl acids, polyacrylamide, polyethylene glycol, starches, polyhydroxyethylacrylites, maleic Acid copolymers, polyethylene oxides, polyurethanes and components of any one of these polymers are selected and are typically acrylic.

In addition, it is preferable to use polyurethane as the component of the polymeric matrix.

On the other hand, the polishing pad manufacturing method having a fine hollow polymer bundle of the cell structure according to the present invention for achieving the above object is a fine hollow polymer added to an aqueous solution, usually referred to as a sieving pigment substitute for white pigment used in the paint industry Extracting the same and forming and extracting the micro hollow polymer bundles in a process of drying through a spray drying apparatus such that the micro hollow polymers are bonded to each other; Forming a mixture by impregnating and stirring a predetermined amount of the fine hollow polymer bundles uniformly in the polymeric matrix; Injecting the mixture into a mold mold having a predetermined shape to solidify the gel mixture through curing, cooling, and cooling; And removing the solidified mixture from the mold and cutting the mixture into a predetermined thickness and shape.

Hereinafter, a polishing pad having a fine hollow polymer bundle having a cell structure according to the above configuration and a method of manufacturing the same will be described with reference to the accompanying drawings.

Figure 4 is a cross-sectional view schematically showing the configuration of a polishing pad having a fine hollow polymer bundle of tissue structure according to an embodiment of the present invention, Figures 5a and 5b is a polishing and grinding for the polishing pad shown in Figure 4 6A to 7B are enlarged view corresponding photographs showing enlarged fine hollow polymer bundles constituting a polishing pad, and the same reference numerals are given to the same parts in the related art, and thus detailed The description will be omitted.

The structure of the polishing pad 30 having the micro hollow polymer bundle of the cellular structure according to the present invention, as shown in Figure 4, a large amount of fine hollow in the liquid polymeric matrix 32 mixed with a urethane and a curing agent It is formed by impregnating the polymer bundle 34 to be uniformly distributed.

Here, the above-described fine hollow polymer bundle 34 is a mass of the fine hollow polymer 36 is agglomerated in a mutual foam shape to form a unit, the size of which forms a spherical shape of about 10 ~ 300㎛, the average diameter is The thing within the range of 30-100 micrometers is used.

The micro hollow polymer 36 constituting the micro hollow polymer bundle 34 has a size of 0.1 to 10 μm and an average diameter of 0.4 to 2 μm so that at least one slurry particle is collected when opened during polishing. By providing a fixing force to form a tissue structure to increase the polishing efficiency during transport.

Further, the fine hollow polymer bundle 34 and the fine hollow polymer 36 constituting the same are formed in a spherical shape, and the spherical shape is uniformly distributed in the polymeric matrix 32 and uniformly influences the polishing operation. To form.

In addition, the bonding structure of each of the micro hollow polymers 36 of the micro hollow polymer bundles 34 exposed to the surface layer of the polymeric matrix 32 to form a cellular structure provides support force between the micro hollow polymers 36. .

In addition, the area of the polymeric matrix 32 adjacent to the exposed micro hollow polymer bundle 34 periphery may be affected by the bearing force of the above-described bonding structure of the micro hollow polymers 36 in response to the frictional pressure caused by polishing and grinding. Will receive.

In addition, the fine hollow polymer 36 is an organic polymer, the component of which is acrylic, styrene, PVC, cellulose, polyvinylpyrrolidine, pectin, polyacryl acids, polyacrylamide, polyethylene glycol, starches, polyhydroxyethylacrylites , maleic acid copolymers, polyethylene oxide, polyurethane and any one of these polymers are selected and used. Typically, an acrylic component is used, and the above-described component of the polymeric matrix 32 is polyurethane. .

On the other hand, looking at the polishing pad manufacturing method having a fine hollow polymer bundle of the cell structure according to the present invention, the state in which the fine hollow polymer 36 is added to an aqueous solution, which is usually referred to as a sieving pigment substitute for the white pigment used in the paint industry. When the aqueous solution is dried in the process of spraying at a predetermined pressure through a spray drying apparatus (omitted for the sake of simplification of the drawing) or the like, the adjacent micro hollow polymers are bonded to each other in a foam form so that the micro hollow polymer bundles ( 34).

The fine hollow polymer bundle 34 thus formed is extracted and impregnated to be uniformly distributed in the liquid polymeric matrix 32 in which a curing agent is added to the polyurethane, and the mixture is stirred to form a mixture.

Then, the above-mentioned mixture is put into a mold having a predetermined shape and solidified through a gelation process, a curing process, and a cooling process, and the polishing is required by removing the solidified mixture from the mold and cutting the mixture to have a predetermined thickness, shape, and shape. It is formed by the pad 30.

Referring to the cross-sectional shape of the polishing pad 30 manufactured as described above, as shown in FIG. 4, the surface layer portion opened as a large amount of the fine hollow polymer bundle 34 is impregnated in the polymeric matrix 32. Is more elastic and flexible than the bottom of the surface.

In addition, the upper portion of the fine hollow polymer bundle 34 opened from the surface layer of the polysilicon pad 30 collects the supplied slurry to form a shape having a predetermined fixing force, thereby effectively transferring the slurry particles during polishing.

Therefore, according to the present invention, as a large amount of fine hollow polymers are formed in a mutual foam-like bundle and impregnated into the polymeric matrix, elasticity and flexibility are secured throughout the polishing pad thickness, and the polishing pad surface layer in which the fine hollow polymer bundles are opened. The elasticity and flexibility of the microporous polymer bundle will be more elastic and flexible than the bottom of the unopened surface layer.

In addition, the fine hollow polymer bundle portion exposed to the surface layer of the polishing pad effectively collects and fixes the slurry particles through the open portions of the respective fine hollow polymers, thereby increasing the polishing efficiency during transport in response to the target article, The work time required is shortened.

And, the slurry to be supplied is collected at least one small amount in each of the fine hollow polymer, the wide area of the lower portion where the conventional slurry was accommodated is filled with the fine hollow polymer, the supply amount of the slurry by performing a simple ground area This is reduced, and through the improvement of the polishing degree and the reproducibility of the target article, there is an effect that the manufacturing yield according to the use of the target article is improved.

On the other hand, the above-described fine hollow polymer bundles have sufficient elasticity, flexibility, and supporting force in response to the frictional force acting during the grinding operation or the grinding operation of the dressing part, thereby suppressing the wear of the surface layer and at the same time preventing the deformation of the polymeric matrix. As it is supported so that the grinding efficiency is increased, the flatness of the surface layer is improved and maintained at the same time, thereby extending the life of the polishing pad.

Although the present invention has been described in detail only with respect to the described embodiments, it will be apparent to those skilled in the art that various modifications and variations are possible within the technical scope of the present invention, and such modifications and modifications are within the scope of the appended claims.

Claims (12)

Flexible and flexible properties such that the surface layer contacts or approaches the surface of the object as the hollow matrix is impregnated with a large amount of hollow polymer and the hollow polymer is openly exposed from the surface layer by abrasion or grinding. In the polishing pad formed to collect the slurry, The hollow polymer is formed by forming a plurality of fine hollow polymer bundles of micro hollow polymers in a mutual foam shape, and impregnating the fine hollow polymer bundles in a predetermined volume ratio in the polymeric matrix. Polishing pad having a micro hollow polymer bundle having a cellular structure, wherein the polymer bundle is exposed to the surface layer of the polymeric matrix by grinding to form a cellular structure so as to easily collect and transport the slurry to an upper portion thereof. . The method of claim 1, And the fine hollow polymer bundles are uniformly distributed corresponding to the entirety of the polymeric matrix. The method of claim 1, Polishing pad having a fine hollow polymer bundle of the tissue structure, characterized in that the size of the fine hollow polymer bundle is 10 ~ 300㎛. The method of claim 3, wherein The polishing pad having the fine hollow polymer bundle of the tissue structure, characterized in that the average diameter of the fine hollow polymer bundle is 30 to 100㎛. The method of claim 1, The polishing pad having the micro hollow polymer bundle of the cell structure, characterized in that the size of the micro hollow polymer constituting the micro hollow polymer bundle. The method of claim 5, The average diameter of the fine hollow polymer is a polishing pad having a bundle of fine hollow polymer of the tissue structure, characterized in that at least one or more slurry particles are accommodated and fixed 0.4 ~ 2㎛. The method of claim 6, And the fine hollow polymer constituting the fine hollow polymer bundle and the fine hollow polymer bundle is a spherical shape. The method of claim 1, The microstructure of the tissue structure is characterized in that the bonding structure between each of the micro hollow polymer of the micro hollow polymer bundle exposed to the surface layer of the polymeric matrix to form a cell structure has support force between the micro hollow polymers. Polishing pads with hollow polymer bundles. The method of claim 1, The bonding structure between each of the micro hollow polymers of the micro hollow polymer bundle exposed to the surface layer of the polymeric matrix to form a cellular structure is formed to provide support to the polymeric matrix adjacent to the microporous polymer bundle periphery. Polishing pads having fine hollow polymer bundles of the tissue structure. The method of claim 1, And the micro hollow polymer is an organic polymer. The method of claim 10, Components of the fine hollow polymer may be acryl, styrene, The micro hollow polymer of the above-mentioned tissue structure, characterized in that the composition of any one of PVC, cellulose, polyvinylpyrrolidine, pectin, polyacryl acids, polyacrylamide, polyethylene glycol, starches, polygydroxyethylacrylites, maleic acid copolymers, polyethylene oxide, polyirethane and these polymers Polishing pads having bundles. In the process of spraying the fine hollow polymer in the state of being added to an aqueous solution called a sieving pigment substitute for the white pigment used in the paint industry, it is allowed to dry so that adjacent fine hollow polymers are bonded to each other in a foam form to form a bundle of fine hollow polymers. Extracting what is being; Forming a mixture by impregnating and stirring the predetermined amount of the fine hollow polymer bundles uniformly in the polymeric matrix; Injecting the mixture into a mold mold having a predetermined shape to solidify the gel mixture through curing, cooling, and cooling; And Removing the solidified mixture from a mold and cutting it into a predetermined thickness and shape; Polishing pad manufacturing method having a fine hollow polymer bundle of tissue structure, characterized in that comprises a.