KR20010002266A - Heater block for semiconductor manufacturing facilities - Google Patents
Heater block for semiconductor manufacturing facilities Download PDFInfo
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- KR20010002266A KR20010002266A KR1019990021992A KR19990021992A KR20010002266A KR 20010002266 A KR20010002266 A KR 20010002266A KR 1019990021992 A KR1019990021992 A KR 1019990021992A KR 19990021992 A KR19990021992 A KR 19990021992A KR 20010002266 A KR20010002266 A KR 20010002266A
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- heater block
- cover
- main body
- semiconductor manufacturing
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
- B65D85/50—Containers, packaging elements or packages, specially adapted for particular articles or materials for living organisms, articles or materials sensitive to changes of environment or atmospheric conditions, e.g. land animals, birds, fish, water plants, non-aquatic plants, flower bulbs, cut flowers or foliage
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D11/00—Containers having bodies formed by interconnecting or uniting two or more rigid, or substantially rigid, components made wholly or mainly of plastics material
- B65D11/18—Containers having bodies formed by interconnecting or uniting two or more rigid, or substantially rigid, components made wholly or mainly of plastics material collapsible, i.e. with walls hinged together or detachably connected
- B65D11/1833—Containers having bodies formed by interconnecting or uniting two or more rigid, or substantially rigid, components made wholly or mainly of plastics material collapsible, i.e. with walls hinged together or detachably connected whereby all side walls are hingedly connected to the base panel
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D21/00—Nestable, stackable or joinable containers; Containers of variable capacity
- B65D21/02—Containers specially shaped, or provided with fittings or attachments, to facilitate nesting, stacking, or joining together
- B65D21/0209—Containers specially shaped, or provided with fittings or attachments, to facilitate nesting, stacking, or joining together stackable or joined together one-upon-the-other in the upright or upside-down position
- B65D21/0213—Containers presenting a continuous stacking profile along the upper or lower edge of at least two opposite side walls
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D1/00—Containers having bodies formed in one piece, e.g. by casting metallic material, by moulding plastics, by blowing vitreous material, by throwing ceramic material, by moulding pulped fibrous material, by deep-drawing operations performed on sheet material
- B65D1/22—Boxes or like containers with side walls of substantial depth for enclosing contents
- B65D1/225—Collapsible boxes
Abstract
Description
본 발명은 반도체 제조설비용 히터블럭에 관한 것으로서, 보다 상세하게는 히터블럭 본체로부터 코일을 분리할 수 있는 구조를 이룸으로써 코일에 이상이 발생하였을 경우 상기 코일의 수리 및 교체가 가능하도록 하는 반도체 제조설비용 히터블럭에 관한 것이다.The present invention relates to a heater block for semiconductor manufacturing equipment, and more particularly, to a semiconductor manufacturing structure that allows the coil to be repaired and replaced when an abnormality occurs in the coil by forming a structure capable of separating the coil from the heater block body. It relates to a heater block for equipment.
산화막 형성공정은 실리콘 집적회로 제작에 있어서 매우 중요한 기본공정의 하나로써, 실리콘 공정에서는 열산화물이 주로 사용되며, 이러한 산화막 형성공정에는 산화막을 형성하는 온도조건에 따라 다양한 방법을 적용할 수 있다.The oxide film forming process is one of the most important basic processes in the fabrication of silicon integrated circuits, and thermal oxides are mainly used in the silicon process, and various methods may be applied to the oxide film forming process depending on temperature conditions for forming the oxide film.
즉, 200℃ 이하의 온도범위에서 실리콘 산화막을 형성하는 양극산화, 산화규소 진공증착, 스퍼터링 및 플라즈마 공정 등이 적용되고, 250~600℃의 온도범위에서는 보통 실란(SiH4)의 산화에 의한 증착방법이 적용되며, 600~900℃의 온도범위에서는 실리콘 화합물의 열분해를 통해 산화막을 증착시키는 방법이 적용된다. 그리고 900~1250℃의 온도범위에서는 실리콘의 열산화 공정이 적용되기도 한다.That is, 200 ℃ temperature anodic oxidation, the silicon oxide vacuum deposition to form a silicon oxide film in the following, sputtering and the like plasma process is applied, and deposition by oxidation of a usual silane (SiH 4) in the temperature range of 250 ~ 600 ℃ The method is applied, and a method of depositing an oxide film through thermal decomposition of a silicon compound is applied in the temperature range of 600 ~ 900 ℃. And in the temperature range of 900 ~ 1250 ℃ silicon thermal oxidation process may be applied.
이러한 다양한 산화막 형성공정 중에서, 특히 플라즈마를 이용한 산화막 증착(PLASMA ENHANCED-OXIDE DEPOSITION) 공정으로는 노벨러스(NOVELLUS) 설비가 널리 통용되고 있는데, 이 노벨러스 설비를 사용함에 있어서 가장 중요하게 고려하여야 할 조건은 공정진행을 위한 적정온도의 유지이다.Of these various oxide film formation processes, in particular, NOVELLUS facilities are widely used as the plasma deposition process using plasma. Maintenance of the proper temperature for progression.
이와같이 산화막 형성공정 중에 적정온도를 유지하기 위해서 주로 사용되는 방식으로는 일정저항을 가진 히터코일에 전류를 공급하여 코일에 의해 발열되도록 하는 것이 일반적이며, 이때 적정온도(대략 400℃)를 유지시켜주는 장치를 히터블럭이라고 한다.As such, a method commonly used to maintain a proper temperature during the oxide film forming process is to supply a current to a heater coil having a constant resistance to generate heat by a coil, and at this time, to maintain a proper temperature (about 400 ° C.) The device is called a heater block.
일례로 종래기술의 반도체 제조설비용 히터블럭에 대해 첨부된 도면에 의거하여 설명하면 다음과 같다.As an example, a heater block for a semiconductor manufacturing apparatus of the prior art will be described with reference to the accompanying drawings.
도 1에서 나타낸 것과 같이 종래의 반도체 제조설비용 히터블럭은 코일홈(10a)이 형성된 본체(10)와, 이 본체(10)의 코일홈(10a)에 내장되는 코일(12)과, 상기 본체(10)의 코일홈(10a)을 덮어씌우는 코일커버(14)가 구비된 구성으로 되어 있다.As shown in FIG. 1, a conventional heater block for semiconductor manufacturing equipment includes a main body 10 having a coil groove 10a formed therein, a coil 12 embedded in the coil groove 10a of the main body 10, and the main body 10. The coil cover 14 which covers the coil groove 10a of 10 is provided.
상기 본체(10)는 열을 발생시키는 원판형상으로 그 배면에는 코일(12)을 내장시킬 수 있게 다수개의 동심원 형상의 코일홈(10a)이 형성되어 있다.The main body 10 has a disc shape that generates heat, and a plurality of concentric coil grooves 10a are formed on the rear surface thereof so as to embed the coil 12.
상기 코일(12)은 본체(10)의 코일홈(10a)을 따라 내장되어 있고 이 코일(12)들 각각이 전원을 인가받을 수 있도록 외부전원에 연결되어 있으며 본체(10)가 대략 400℃정도 발열될 수 있도록 한다.The coil 12 is embedded along the coil groove 10a of the main body 10, and each of the coils 12 is connected to an external power source to receive power, and the main body 10 is about 400 ° C. Allow fever.
상기 코일커버(14)는 본체(10)의 코일홈(10a)을 덮어씌워서 코일(12)이 외부로 이탈되지 않도록 하는 링형상으로 그 저면중앙이 코일홈(10a)에 내장된 코일(12)의 상부까지 삽입될 수 있게 돌출되어 있으며 이 돌출부위 길이방향 양측이 용접 등에 의해 본체(10)의 배면에 고착되어 있다.The coil cover 14 covers a coil groove 10a of the main body 10 so as to prevent the coil 12 from escaping to the outside. The coil cover 14 has a coil 12 having a bottom center thereof embedded in the coil groove 10a. It protrudes so that it can be inserted to the upper part of the both sides of this protrusion part is fixed to the back surface of the main body 10 by welding etc.
이러한 구성의 종래기술은 본체(10)의 배면에 형성된 코일홈(10a)을 따라 코일(12)을 내장시키고 그 상부로 코일커버(14)를 덮어씌운 후 용접시켜 코일커버(14)가 본체(10)의 배면에 고착되도록 함으로써 히터블럭의 조립이 완료된다.The prior art of such a configuration is to embed the coil 12 along the coil groove (10a) formed on the back of the main body 10 and to cover the coil cover 14 to the upper portion and welded to the coil cover 14 to the main body ( The assembly of the heater block is completed by being fixed to the back of 10).
상기 코일(12)에는 외부로부터 전원이 인가되어 가열되고, 가열된 코일(12)에 의해 본체(10)의 발열온도가 400℃에 이를때까지 상승된 후 계속해서 400℃를 유지시키게 되는 것이다.Power is applied to the coil 12 from the outside and heated, and the heating coil 12 is heated until the heat generation temperature of the main body 10 reaches 400 ° C, and then continues to maintain 400 ° C.
그러나, 이러한 종래기술의 반도체 제조설비용 히터블럭은 코일커버(14)가 본체(10) 배면에 용착되어 있기 때문에 코일(12)에 문제가 발생하여 단선되거나 또는 마이크로 브리지(MICRO BRIDGE) 발생시 코일(12)에 대한 보수작업이 불가능하게 되고, 그 결과 상기 히터블럭 전체를 폐기시켜야 하였으며 이로인한 비용손실의 문제점을 갖고 있었다.However, since the coil cover 14 is welded to the back of the main body 10, the heater block of the prior art semiconductor manufacturing equipment has a problem due to the coil 12 being disconnected or a micro bridge (MICRO BRIDGE) occurs when the coil ( The maintenance work for 12) was not possible, and as a result, the entire heater block had to be discarded, which caused a problem of cost loss.
본 발명은 상기와 같은 문제점을 해결하기 위해서 안출된 것으로써, 코일에 이상이 발생하였을 때 히터블럭을 폐기시키지 않고 코일에 대한 보수작업을 행할 수 있도록 함으로써 비용을 절감시킬 수 있는 반도체 제조설비용 히터블럭을 제공하는데 그 목적이 있다.The present invention has been made to solve the above problems, the heater for semiconductor manufacturing equipment that can reduce the cost by allowing the maintenance work on the coil without discarding the heater block when the abnormality occurs in the coil The purpose is to provide a block.
도 1은 종래기술에 대한 반도체 제조설비용 히터블럭의 결합상태를 나타낸 부분절취 사시도이다.1 is a partial cutaway perspective view showing a coupling state of a heater block for a semiconductor manufacturing apparatus according to the prior art.
도 2는 본 발명에 의한 반도체 제조설비용 히터블럭의 결합상태를 나타낸 부분절취 사시도이다.2 is a partially cutaway perspective view illustrating a coupling state of a heater block for a semiconductor manufacturing apparatus according to the present invention.
도 3은 본 발명에 의한 반도체 제조설비용 히터블럭의 분해사시도이다.3 is an exploded perspective view of a heater block for semiconductor manufacturing equipment according to the present invention.
**도면의 주요부분에 대한 부호의 설명**** Description of the symbols for the main parts of the drawings **
10 : 본체 10a : 코일홈10: main body 10a: coil groove
10b : 체결공 12 : 코일10b: fastener 12: coil
14, 16 : 코일커버 16a : 관통공14, 16: coil cover 16a: through hole
18 : 체결부재18: fastening member
이와 같은 상기의 목적을 달성하기 위한 본 발명에 따른 반도체 제조설비용 히터블럭은 배면전체에 걸쳐 복수의 코일홈이 형성된 본체와, 상기 코일홈에 내장되어 본체를 가열시키는 코일과, 이 코일이 내장된 코일홈 상부를 덮어씌워서 코일이 외부로 이탈되는 것을 방지하는 코일커버 및 이 코일커버를 본체의 코일홈에서 결합시키는 체결부재를 포함하여 이루어지는 것을 그 특징으로 한다.The heater block for a semiconductor manufacturing apparatus according to the present invention for achieving the above object is a main body having a plurality of coil grooves formed over the entire back surface, a coil embedded in the coil grooves to heat the body, and the coil is embedded It is characterized in that it comprises a coil cover for covering the upper portion of the coil groove to prevent the coil is separated from the outside and a fastening member for coupling the coil cover in the coil groove of the main body.
또한, 본 발명에 따른 반도체 제조설비용 히터블럭은 상기 체결부재로 스크류를 사용한 것을 특징으로 한다.In addition, the heater block for semiconductor manufacturing equipment according to the present invention is characterized in that a screw is used as the fastening member.
이하, 본 발명의 구체적인 일 실시예를 첨부된 도면을 참조하여 상세히 설명한다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.
도 2 내지 도 3에 도시한 바와 같이, 본 발명에 따른 반도체 제조설비용 히터블럭은 코일홈(10a)이 형성된 본체(10)와, 상기 코일홈(10a)에 내장되는 코일(12)과, 이 코일홈(10a)을 덮어씌우는 코일커버(16)가 구비된 구성으로 되어 있다.As shown in Figures 2 to 3, the heater block for semiconductor manufacturing equipment according to the present invention comprises a main body 10 having a coil groove (10a), a coil 12 embedded in the coil groove (10a), The coil cover 16 which covers this coil groove 10a is provided.
이하 본 발명에 의한 부호의 설명중 종래기술에서 설명된 부호의 반복되는 설명은 생략한다.In the following description of the signs according to the present invention, repeated description of the signs described in the prior art will be omitted.
상기 본체(10)의 코일홈(10a) 양측에는 코일커버(16)를 부착시킬 수 있게 체결공(10b)이 상기 코일홈(10a)을 따라 다수 형성되어 있다.A plurality of fastening holes 10b are formed along the coil groove 10a to attach the coil cover 16 to both sides of the coil groove 10a of the main body 10.
상기 코일커버(16)는 본체(10)의 코일홈(10a)을 덮어씌울 수 있게 링형상으로 형성되어 있고, 그 저면이 코일(12)의 상단부를 눌러 이 코일(12)이 코일홈(10a)내에서 유동되지 않도록 지지하기 위해 돌출되어 있으며, 이 코일커버(16)의 링형상 전체에 걸친 내, 외경부에는 본체(10)의 체결공(10b)에 이 코일커버(16)를 체결부재(18)에 의해 결합시킬 수 있게 관통공(16a)이 다수개 형성되어 있다.The coil cover 16 is formed in a ring shape so as to cover the coil groove 10a of the main body 10, and a bottom surface thereof presses an upper end of the coil 12 so that the coil 12 is coil groove 10a. The coil cover 16 is protruded so as not to flow in the inside, and the inner and outer diameter portions of the coil cover 16 are fastened to the fastening holes 10b of the main body 10. A plurality of through holes 16a are formed so as to be joined by the 18.
여기서 상기 코일커버(16)를 본체(10)에 결합시키는 방법은 체결부재로서 스크류가 가장 바람직할 것이며, 그 외에도 볼트 등과 같은 체결수단에 의해 결합시킬 수 있다.Here, the method of coupling the coil cover 16 to the main body 10 may be the screw most preferable as the fastening member, in addition, it may be coupled by a fastening means such as a bolt.
그리고 상기 코일커버(16)는 링형상 이외에도 링이 여러개로 나누어진 분리형 코일커버도 가능하며 상기 코일홈을 덮어씌울 수만 있으면 그 형상에 구애받지 않는다.In addition to the ring shape, the coil cover 16 may include a separate coil cover in which a ring is divided into several parts, and the coil cover 16 may be covered with the coil groove as long as it can cover the coil groove.
한편, 상기 코일홈(10a) 및 코일(12)수는 한개 이상 다수개로 그 수를 마음대로 조절할 수 있다.On the other hand, the number of the coil groove (10a) and the number of coils 12 can be adjusted to any number of one or more.
이러한 구성에 따른 본 발명의 히터블럭은 본체(10)의 코일홈(10a)에 코일(12)을 내장시키고 나서 코일커버(16)를 코일홈(10a) 상부로 덮어씌운 후 이 코일커버(16)의 관통공(16a)과 본체(10)의 체결공(10b)을 일치시켜 체결부재(18)로 체결시킨다.In the heater block according to the present invention, the coil cover 16 is covered with an upper portion of the coil groove 10a after the coil 12 is embedded in the coil groove 10a of the main body 10. The through hole 16a and the fastening hole 10b of the main body 10 coincide with each other to be fastened with the fastening member 18.
이때 상기 코일커버(16)의 저면에 형성된 돌출부가 코일(12)의 상단부를 눌러 코일(12)이 코일홈(10a) 내에서 유동되지 않고 본체(10)로 원활한 열전도가 행해질 수 있게 한다.At this time, the protrusion formed on the bottom surface of the coil cover 16 presses the upper end of the coil 12 so that the coil 12 does not flow in the coil groove 10a and smooth heat conduction is performed to the main body 10.
이렇게 조립이 완성된 히터블럭은 외부전원을 인가하여 코일(12)이 가열됨으로써 상기 플라즈마를 이용한 산화막 증착공정에 알맞는 온도를 지속적으로 유지할 수 있게 된다.The assembly of the heater block is completed so that the coil 12 is heated by applying an external power source to continuously maintain a temperature suitable for an oxide film deposition process using the plasma.
한편, 장기간 사용중 자체의 결함 즉, 상기 코일(12)에 단선이나 마이크로 브리지 등과 같은 문제점이 발생하였을 때에는 전원을 차단하고 상기 코일커버(16)를 본체(10)에서 분리시킨 후 코일(12)의 문제점을 확인하여 보수작업을 행하거나 또는 보수작업이 불가능할 경우에는 코일을 분리한 후 교체하는 등의 작업을 수행할 수 있게 되는 것이다.On the other hand, when a defect such as a short circuit or a micro bridge occurs in the coil 12 during long-term use, the power is cut off and the coil cover 16 is separated from the main body 10 and then the coil 12 is removed. Checking the problem to perform the maintenance work or, if the maintenance work is impossible it is possible to perform such tasks as removing and replacing the coil.
이상에서 기술한 바와 같은 본 발명에 따른 반도체 제조설비용 히터블럭에 의하면, 종래의 반도체 제조설비용 히터블럭에서 코일홈을 용접등으로 밀폐시켰기 때문에 코일에 문제가 발생하였을 때 히터블럭을 폐기시켜야 하는 문제점을 갖고 있었던 것과는 달리 코일커버를 코일홈 상부에 착탈시킬 수 있도록 함으로써 코일에 이상이 발생시 상기 코일커버를 코일홈에서 분리시켜 코일의 보수 또는 교체작업을 행할 수 있으며 이에 따라 비용이 절감되는 효과를 얻는다.According to the heater block for semiconductor manufacturing equipment according to the present invention as described above, in the conventional heater block for semiconductor manufacturing equipment, because the coil groove is sealed by welding or the like, the heater block should be discarded when a problem occurs in the coil. Unlike the problem, the coil cover can be detached from the upper part of the coil groove so that the coil cover can be separated from the coil groove in case of abnormality in the coil to perform repair or replacement of the coil, thereby reducing the cost. Get
이상의 설명에서와 같이 본 발명은 하나의 바람직한 구체예에 대해서만 기술하였으나, 상기의 구체예를 바탕으로 한 본 발명의 기술사상 범위 내에서의 다양한 변형 및 수정이 가능함은 당업자에게 있어서 명백한 것이며, 또한, 이러한 변형 및 수정이 첨부된 특허청구범위에 속함은 당연한 것이다.As described above, the present invention has been described for only one preferred embodiment, but it is apparent to those skilled in the art that various changes and modifications can be made within the technical spirit of the present invention based on the above embodiments. It is natural that such variations and modifications fall within the scope of the appended claims.
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019990021992A KR20010002266A (en) | 1999-06-14 | 1999-06-14 | Heater block for semiconductor manufacturing facilities |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019990021992A KR20010002266A (en) | 1999-06-14 | 1999-06-14 | Heater block for semiconductor manufacturing facilities |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20010002266A true KR20010002266A (en) | 2001-01-15 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019990021992A KR20010002266A (en) | 1999-06-14 | 1999-06-14 | Heater block for semiconductor manufacturing facilities |
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| Country | Link |
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| KR (1) | KR20010002266A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20030026387A (en) * | 2001-09-12 | 2003-04-03 | 주식회사 아이앤에스 | The pedestal heater to be used at a chemical vapor deposition justice of a semiconductor wafer and the method |
| KR100885379B1 (en) * | 2002-10-02 | 2009-02-23 | 엘지디스플레이 주식회사 | Plasma enhanced chemical vapor deposition apparatus |
| KR20110021588A (en) * | 2009-08-26 | 2011-03-04 | 삼성전자주식회사 | Photoalignment agent and liquid crystal display device using the same |
-
1999
- 1999-06-14 KR KR1019990021992A patent/KR20010002266A/en not_active Application Discontinuation
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20030026387A (en) * | 2001-09-12 | 2003-04-03 | 주식회사 아이앤에스 | The pedestal heater to be used at a chemical vapor deposition justice of a semiconductor wafer and the method |
| KR100885379B1 (en) * | 2002-10-02 | 2009-02-23 | 엘지디스플레이 주식회사 | Plasma enhanced chemical vapor deposition apparatus |
| KR20110021588A (en) * | 2009-08-26 | 2011-03-04 | 삼성전자주식회사 | Photoalignment agent and liquid crystal display device using the same |
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