KR20000066695A - A floor with an effect of thermal insulation and storage - Google Patents
A floor with an effect of thermal insulation and storage Download PDFInfo
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- KR20000066695A KR20000066695A KR1019990013987A KR19990013987A KR20000066695A KR 20000066695 A KR20000066695 A KR 20000066695A KR 1019990013987 A KR1019990013987 A KR 1019990013987A KR 19990013987 A KR19990013987 A KR 19990013987A KR 20000066695 A KR20000066695 A KR 20000066695A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/304—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising vinyl halide (co)polymers, e.g. PVC, PVDC, PVF, PVDF
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/10—Inorganic particles
- B32B2264/105—Metal
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/12—Mixture of at least two particles made of different materials
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/302—Conductive
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Abstract
Description
본 발명은 열전도성이 우수한 금속분말과 잠열축열재를 바닥재의 1층 이상에 적용하므로써 열전도성을 우수하게 하며 축열 보온기능으로 난방시 바닥재에 전달된 열에너지를 효과적으로 축열하였다가 난방이 종료된 후에도 일정시간 이상 보온 효과를 가질 수 있는 보온축열 바닥재에 관한 것이다.The present invention provides excellent thermal conductivity by applying a metal powder and latent heat storage material having excellent thermal conductivity to at least one layer of the flooring material. The heat storage thermal insulation function effectively accumulates thermal energy transferred to the flooring material during heating, and even after the heating is finished. It relates to a heat storage flooring material that can have a thermal insulation effect over time.
종래의 바닥재는 주된 소재인 PVC의 낮은 열전도 특성과 제품 구조상 발포형상으로 이루어져 열전도도가 낮은 단열효과를 보인다. 주거공간에 시공하여 사용하는 이러한 일반적인 바닥재는 하부층과 접촉하고 있는 바닥면을 난방할 경우 공급된 열이 PVC 바닥재의 낮은 열전도도의 단열특성으로 인하여 쉽게 상부로 전달되지 못하고 난방효율이 떨어지는 단점이 있다.Conventional flooring material is made of a low thermal conductivity of the main material PVC and the foam structure of the product structure shows a low thermal conductivity insulation effect. The common flooring used in residential spaces has a disadvantage in that when the floor is in contact with the lower floor, the supplied heat is not easily transferred to the upper part due to the low thermal conductivity of PVC flooring and the heating efficiency is lowered. .
발포층의 구성이 많은 가정용 경보행 바닥재는 더욱 열전도도가 낮아 바닥난방 형식의 우리나라 대부분의 가정에서는 열효율면에서 PVC 바닥재가 불리한 특징을 갖게 된다.Home alarm line flooring material with many foam layers has a lower thermal conductivity, and PVC flooring has disadvantageous characteristics in terms of thermal efficiency in most homes of the floor heating type.
열전도도란 물질고유의 성질로서 일반적으로 고체, 액체, 기체의 순으로 작아지며 온도에 따른 물질의 미시적 구조에 따라 열전도도가 달라지게 된다. 플라스틱 고분자 물질의 경우 열전도도는 0.1∼0.3㎉/m.h.℃정도이며, 순수한 금속의 경우는 50㎉/m.h.℃ 이상이고, 특히 구리나 은은 300㎉/m.h.℃ 이상의 열전도도를 갖는다. 또한 공기의 열전도도는 0.02∼0.03㎉/m.h.℃로서 이런 공기의 낮은 열전도도 특성으로 인하여 고체 재료 속에 많은 공극(PORE)을 갖는 PVC, 우레탄, 폴리에스터 포옴(PE FOAM), 유리솜은 열전도도가 낮아 단열재로 사용된다.Thermal conductivity is a material-specific property, which generally decreases in the order of solids, liquids, and gases, and thermal conductivity varies according to the microscopic structure of the material according to temperature. In the case of plastic polymer materials, the thermal conductivity is about 0.1 to 0.3 kPa / m.h. ° C. In the case of pure metals, the thermal conductivity is 50 kPa / m.h. In addition, the thermal conductivity of air is 0.02 ~ 0.03㎉ / mh ℃. Because of the low thermal conductivity of air, PVC, urethane, polyester foam (PE FOAM) and glass wool which have a lot of pores in solid materials have thermal conductivity. It is used as a heat insulating material.
이에 본 발명은 상기한 종래의 문제점을 해결하기 위하여 안출된 것으로서, 본 발명의 목적은 금속중에서도 열전도도가 높은 금속분말을 첨가하여 PVC 바닥재의 열전도율을 극대화시키고 물질의 상변화시 에너지를 축열할 수 있는 잠열축열재를 사용하여 난방시 공급받은 열을 일부 축열하여 난방이 종료된 후에도 일정 시간 이상 보온효과를 가질 수 있는 바닥재를 제공하는 것이다.Accordingly, the present invention has been made to solve the above-mentioned conventional problems, the object of the present invention is to add a metal powder with high thermal conductivity among the metal to maximize the thermal conductivity of the PVC flooring material and to accumulate energy upon phase change of the material. By using the latent heat storage material in which the heat supplied during heating is partially stored to provide a flooring material that can have a warming effect for a predetermined time even after the heating is completed.
도 1은 본 발명의 일예에 따른 바닥재의 단면도,1 is a cross-sectional view of the flooring according to an embodiment of the present invention,
도 2는 본 발명의 다른 예에 따른 바닥재의 단면도,2 is a cross-sectional view of the flooring according to another embodiment of the present invention,
도 3은 본 발명의 또 다른 예에 따른 바닥재의 단면도.3 is a cross-sectional view of the flooring according to another embodiment of the present invention.
**** 도면의 주요부분에 대한 부호의 설명 ******** Explanation of symbols for the main parts of the drawing ****
1. UV 층 2. 스킨층1. UV layer 2. Skin layer
3. 발포 또는 비발포 인쇄층 4. 기재층3. Foamed or non-foamed printed layer 4. Base layer
5. 발포 또는 비발포 하부층 6. 칩층5. Foamed or non-foamed bottom layer 6. Chip layer
7. 이면층7. Back layer
본 발명은 다층으로 이루어진 바닥재에 있어서, 열전도성이 우수한 금속분말 및 잠열축열재를 바닥재의 1층 이상에 첨가하는 것을 특징으로 한다.The present invention is characterized in that a multi-layered flooring material is added with at least one layer of a metal powder and a latent heat storage material having excellent thermal conductivity.
본 발명의 바닥재에 적용되는 금속분말과 잠열축열재는 다음과 같다.Metal powder and latent heat storage material applied to the flooring of the present invention are as follows.
열전도성 금속분말Thermally Conductive Metal Powder
본 발명에 사용되는 열전도성이 우수한 금속분말 충진제로는 Cu, Ni, Fe, Ag, Fe2O3또는 활성탄 중에서 단독 또는 1종 이상을 혼합사용하며, 그 입경은 1∼50㎛이다. 입경이 1㎛ 이하이면 제조공정의 복잡함에 따른 가격상승이 초래되며 50㎛ 이상이 되면 제품가공시 외관 불량이 발생한다. 또한 그 사용량은 각층의 PVC 수지 100중량부에 대하여 0.1∼50중량부이며 0.1중량부 미만이면 열전도도 효과가 미미하고 50중량부를 초과하면 유연성, 작업성 등 바닥재의 기본물성이 발휘되지 않는다.The metal powder filler having excellent thermal conductivity used in the present invention may be used alone or in combination of one or more of Cu, Ni, Fe, Ag, Fe 2 O 3 or activated carbon, and has a particle diameter of 1 to 50 µm. If the particle size is less than 1㎛ induces a price increase due to the complexity of the manufacturing process, if more than 50㎛ occurs appearance defects during processing the product. In addition, the amount is 0.1 to 50 parts by weight based on 100 parts by weight of the PVC resin of each layer, if less than 0.1 parts by weight of the thermal conductivity effect is insignificant, if it exceeds 50 parts by weight, the basic properties of the flooring material such as flexibility, workability is not exhibited.
그리고 기존의 바닥재에 상기 열전도성 금속분말을 단순하게 혼합사용하는 경우에는 보온효과의 증대를 기대할 수 없다. 이것은 축열소재 자체가 난방시 흡열을 하여 바닥재에 전달되는 열을 흡수하기 때문에 난방의 초기에는 기존 일반 바닥재에 비하여 오히려 온도상승이 늦어져서 난방 효과가 늦게 나타나기 때문이다.In addition, when the thermally conductive metal powder is simply mixed and used in the existing flooring material, an increase in the thermal insulation effect cannot be expected. This is because the heat storage material itself absorbs heat transferred to the flooring by absorbing heat during heating, and thus the heating effect is delayed due to a slow temperature rise in the early stage of heating.
본 발명에서는 이러한 문제를 방지하고자 열전도도가 높은 금속분말과 함께 잠열축열재를 첨가하여, 사용할 때 발생되는 초기의 낮은 열전달의 문제점을 개선하였으며 바닥재의 보온기능을 극대화시켰다.In the present invention, to prevent such a problem by adding a latent heat storage material with a metal powder with high thermal conductivity, it improved the problem of the initial low heat transfer occurred when using and maximized the thermal insulation function of the flooring.
잠열축열재Latent heat storage material
본 발명의 바닥재에 적용되는 잠열축열재(PCM:Phase changed material)는 난방온도 이하의 상온에서는 고체 상태를 유지하고 있다가 난방이 시작되어 축열제의 녹는점 이상이 되면 액체 상태로 상이 변화한다. 이때 열원으로부터 형상의 변화에 필요한 일정량의 열을 축열하고 있다가 난방이 종료한 후 열원의 공급이 끝나면 잠열축열재의 온도가 내려가면서 형상이 다시 고체 상태로 변화하고 축열된 열을 방출하는 기능을 한다.The latent heat storage material (PCM: Phase changed material) applied to the flooring material of the present invention maintains a solid state at room temperature below the heating temperature, and when the heating is started, the phase changes to a liquid state when the melting point of the heat storage agent is higher than the melting point. At this time, it accumulates a certain amount of heat necessary for the change of shape from the heat source, and after the heating is completed, when the supply of the heat source is completed, the temperature of the latent heat storage material decreases, and the shape changes to a solid state and releases the accumulated heat. .
잠열축열재는 열원에서 열을 흡수한 후 적절한 때에 방출하는 원료로서 축열방식의 종류는 현열축열, 잠열축열, 화학축열, 농도차축열, 흡착열이용 축열, 광화학 축열 방식이 있는데, 이들 중에서 널리 사용되는 방식은 현열축열, 잠열축열, 화학축열 방식이다.The latent heat storage material is a raw material that absorbs heat from a heat source and releases it at an appropriate time. The types of heat storage methods include sensible heat storage, latent heat storage, chemical heat storage, concentration heat storage, heat storage using adsorption heat, and photochemical heat storage system. Are sensible heat storage, latent heat storage, and chemical heat storage.
본 발명에서는 잠열축열식 소재를 사용하였으며 이중에서 특히 무기 수화물을 사용하였다. 무기 수화물의 성분중에 잠열구실을 하는 주역은 결정수 즉, H2O이다. 상온에서 고체 상태인 PCM 물질은 난방시 열을 받아 축열을 하면서 상이 액상으로 변하게 되는데, 이러한 소재가 용융과 응고를 반복하면서 마이그레이션(MIGRATION) 또는 휘발되어 잠열축열재 자체가 소멸되거나 기능저하가 발생한다. 또한 액상 상태에서의 마이그레이션 현상은 제품의 변색을 유발할 수도 있다.In the present invention, a latent heat storage material was used, and in particular, an inorganic hydrate was used. The main role of latent heat preservation among the components of the inorganic hydrate is crystal water, that is, H 2 O. PCM material that is solid at room temperature undergoes heat upon heating and undergoes heat storage to change its phase to a liquid phase.These materials are migrated or volatilized while melting and solidifying, causing the latent heat storage material to disappear or deteriorate. . In addition, the migration phenomenon in the liquid phase may cause discoloration of the product.
본 발명에서는 이러한 현상을 방지하기 위하여 잠열축열재를 우레탄이나 아크릴 또는 알키드 수지를 사용하여 표면을 구형으로 코팅(coating)하였다. 이것을 마이크로캡슐레이션(MICROCAPSULATION)이라 하며 잠열축열재가 용융과 응고를 반복하여도 잠열축열재를 보호하는 기능을 한다.In the present invention, in order to prevent this phenomenon, the surface of the latent heat storage material was coated with a spherical surface using urethane, acrylic or alkyd resin. This is called MICROCAPSULATION and the latent heat storage material protects the latent heat storage material even after repeated melting and solidification.
마이크로캡슐레이션(MICROCAPSULATION)의 원리를 살펴보면 마이크로캡슐은 내부물질과 이를 둘러싸는 외부물질로 구성되어 있으며, 이 내부물질과 외부물질과의 계면장력의 차이를 이용하여 제작한다. 마이크로캡슐의 내부물질은 핵이라는 각종 기능을 갖는 활성물질로서 본 발명의 경우 잠열축열재이고, 이를 보호하는 외부물질은 벽 또는 막이라고 하며 천연수지 또는 합성수지로 되어 있다. 친수성 물질을 캡슐레이션 하는 방법은 에멀젼 방법을 사용하여 소수성 용매에 수적을 형성시킨 후 외벽을 합성수지로 코팅하게 된다.Looking at the principle of microcapsulation (MICROCAPSULATION), microcapsules are composed of an internal material and an external material surrounding it, and are manufactured using the difference in the interfacial tension between the internal material and the external material. The inner material of the microcapsules is an active material having various functions such as a nucleus, and in the case of the present invention, it is a latent heat storage material, and the outer material protecting it is called a wall or a membrane and is made of natural resin or synthetic resin. The method of encapsulating hydrophilic material is to form water droplets in a hydrophobic solvent using an emulsion method and then the outer wall is coated with a synthetic resin.
잠열축열재의 구체적인 종류로는 CH3COONaㆍ3H2O, CaCl2ㆍ6H2O, Na2SO4ㆍ10H2O 등이 있으며, 이들을 단독 또는 1종 이상을 혼합사용할 수 있다. 잠열축열재의 함량은 각층의 PVC 수지 100중량부에 대하여 0.1∼50중량부를 사용할 수 있으며, 그 입경은 5∼100㎛이다. 입경이 5㎛ 이하이면 마이크로캡슐레이션이 어려워 마이크로캡슐레이션의 불량률이 높아지며 100㎛ 이상이면 제품 가공시 외관의 불량이 발생한다. 그 사용량이 0.1중량부 미만이면 보온의 기능이 미미하고 50중량부를 초과할 경우에는 유연성, 작업성 등 바닥재의 기본물성이 발휘되지 않는다.Specific types of latent heat storage materials include CH 3 COONa · 3H 2 O, CaCl 2 · 6H 2 O, Na 2 SO 4 · 10H 2 O, and the like, and these may be used alone or in combination of one or more thereof. The content of latent heat storage material can be used 0.1 to 50 parts by weight with respect to 100 parts by weight of the PVC resin of each layer, the particle diameter is 5 to 100㎛. If the particle size is 5㎛ or less, microcapsulation is difficult, and the defect rate of microcapsulation is high. If the particle size is 100㎛ or more, the appearance defect occurs during product processing. If the amount is less than 0.1 parts by weight, the function of thermal insulation is insignificant, and if it exceeds 50 parts by weight, the basic physical properties of flooring materials such as flexibility and workability are not exhibited.
본 발명에 따른 금속분말과 잠열축열재를 적용한 보온축열 바닥재는 일반적인 바닥재의 제조공정과 동일한 공정으로 생산할 수 있는데, 이를 일반적인 가정용 바닥재를 일예로 들어 본 발명에 첨부된 도면을 참조하여 상세하게 설명하면 다음과 같다.Insulating heat storage flooring material applying the metal powder and the latent heat storage material according to the present invention can be produced by the same process as the manufacturing process of the general flooring material, which will be described in detail with reference to the drawings attached to the present invention as an example of a general household flooring material. As follows.
본 발명에 따른 바닥재에 있어서, 도 1에 도시된 바와 같이 그라스파이버를 기재층(4)으로 사용하여 이에 PVC 졸을 함침시키고, 이의 상부에 인쇄층(3)을 적층시켜 그라비아 또는 전사지를 이용하여 인쇄무늬를 부여하고, 다시 이의 상부에 스킨층(2)을 선택적으로 적층하며 기재층 하부에는 발포 또는 비발포 하부층(5)을 적층시켜 완제품을 제조한다.In the flooring according to the present invention, as shown in Figure 1, using a glass fiber as the base layer 4, impregnated PVC sol therein, by laminating a printing layer (3) on top of it using gravure or transfer paper The printed pattern is given, and the skin layer 2 is selectively laminated on the upper part thereof, and the foamed or non-foamed lower layer 5 is laminated on the lower part of the substrate layer to manufacture the finished product.
상기 기재층(4)는 치수안정성이 우수한 그라스파이버에 PVC페이스트 수지 100중량부, 가소제 40∼70중량부, 안정제 1∼3중량부, 충진제 50∼200중량부, 잠열축열재 0.1∼50중량부, 열전도성 금속분말 0.1∼50중량부를 넣어 배합한 페이스트졸을 함침시켜 140∼200℃의 겔링드럼이나 오븐을 이용, 가열건조하여 제조한다.The base layer 4 is 100 parts by weight of PVC paste resin, 40 to 70 parts by weight of plasticizer, 1 to 3 parts by weight of stabilizer, 50 to 200 parts by weight of filler, and 0.1 to 50 parts by weight of latent heat storage material in glass fiber having excellent dimensional stability. 0.1-50 parts by weight of thermally conductive metal powder is impregnated to mix the paste sol, followed by heat drying using a gelling drum at 140-200 ° C. or an oven.
기재층(4) 위에 인쇄층(3)을 형성한 후 다양한 무늬와 색상의 인쇄를 하게 되는데 인쇄는 공지의 그라비아 인쇄, 옵셋인쇄, 로타리 스크린 인쇄공법을 이용하며, 이때 이용되는 잉크는 PVC계 코폴리머 10∼40중량부, 유기용제 30∼70중량부, 미분산된 유기 또는 무기계 안료 1∼20중량부를 투입하여 고속믹서로 혼합하여 적용할 수 있다.After the printing layer 3 is formed on the base layer 4, various patterns and colors are printed. The printing is performed using a well-known gravure printing, offset printing, or rotary screen printing method. 10 to 40 parts by weight of a polymer, 30 to 70 parts by weight of an organic solvent, and 1 to 20 parts by weight of an undispersed organic or inorganic pigment may be added and mixed in a high speed mixer.
상기 과정에 의해 인쇄가 완료되면 그 인쇄된 상부에 스킨층(2)을 적층할 수도 있는데, 스킨층(2)은 PVC 페이스트 수지 100중량부, 가소제 40∼70중량부, 안정제 1∼3중량부, 자외선 흡수제 0.1∼1중량부, 잠열축열재 0.1∼50중량부, 열전도성 금속분말 0.1∼50중량부를 고속임펠러가 있는 믹서기에서 10∼40분간 믹싱하여 내부 온도를 40℃ 이하가 되게 유지하는 졸가공 방법이나, PVC 스트레이트 수지 100중량부, 가소제 40∼70중량부, 안정제 1∼3중량부, 자외선 흡수제 0.1∼1중량부, 잠열축열재 0.1∼50중량부, 열전도성 금속분말 0.1∼50중량부를 정량투입하여 슈퍼믹서기에서 5∼20분간 믹싱한 다음 카렌다에서 압연가공을 하거나 T-다이에서 압출가공함으로써 얻을 수 있고 이를 가열 합판하는 방법으로 적층이 가능하다.When the printing is completed by the above process, the skin layer 2 may be laminated on the printed upper part. The skin layer 2 may include 100 parts by weight of PVC paste resin, 40 to 70 parts by weight of plasticizer, and 1 to 3 parts by weight of stabilizer. A sol which mixes 0.1 to 1 parts by weight of the ultraviolet absorber, 0.1 to 50 parts by weight of the latent heat storage material, and 0.1 to 50 parts by weight of the thermally conductive metal powder in a mixer with a high speed impeller for 10 to 40 minutes to maintain the internal temperature at 40 ° C. or lower. Processing method, 100 parts by weight of PVC straight resin, 40 to 70 parts by weight of plasticizer, 1 to 3 parts by weight of stabilizer, 0.1 to 1 part by weight of ultraviolet absorber, 0.1 to 50 parts by weight of latent heat storage material, and 0.1 to 50 parts by weight of thermally conductive metal powder The part is quantitatively mixed and mixed in a super mixer for 5 to 20 minutes and then rolled in a calendar or extruded in a T-die, which can be laminated by heating plywood.
이렇게 얻어진 반제품에 쿳션성을 부여하기 위한 하부층(5)을 적층시키는데, 하부층(5)은 PVC 페이스트 수지 100중량부, 가소제 40∼70중량부, 잠열축열재 0.1∼50중량부, 열전도성 금속분말 0.1∼50중량부, 안정제 1∼3중량부, 발포제 0∼5중량부, 충진제 10∼50중량부, Zn계 촉진제 1∼10중량부를 정량투입하여 고속 임펠러가 있는 믹서기에서 10∼40분간 믹싱하는 졸가공 방법이나 또는 PVC 스트레이트 수지를 이용하여 카렌다에서 압연가공하거나 T-다이에서 압출가공한 시트를 가열 합판하여 180∼250℃의 발포 오븐을 거침으로써 발포체를 얻는 일반적인 방법에 의해 형성될 수 있다.The semi-finished product thus obtained is laminated with a lower layer 5 for imparting cushioning properties. The lower layer 5 includes 100 parts by weight of PVC paste resin, 40 to 70 parts by weight of plasticizer, 0.1 to 50 parts by weight of latent heat storage material, and thermally conductive metal powder. 0.1 to 50 parts by weight, stabilizer 1 to 3 parts by weight, 0 to 5 parts by weight of blowing agent, 10 to 50 parts by weight of filler, and 1 to 10 parts by weight of Zn-based accelerator are metered in and mixed for 10 to 40 minutes in a mixer with a high speed impeller. It can be formed by a sol-processing method or a general method of obtaining a foam by heating a sheet of rolled in a calendar or extruded in a T-die using a PVC straight resin and passing a foam oven at 180 to 250 ° C.
이와 같이 제조된 바닥재의 표면을 자외선 경화타입 도료로 표면처리하여 UV층(1)을 형성함으로써 바닥재를 완성할 수 있다.The flooring may be completed by forming a UV layer 1 by surface-treating the surface of the flooring manufactured as described above with an ultraviolet curable paint.
상기 각층에 사용된 잠열축열재 및 열전도성 금속 파우더는 전층에 사용하거나 어느 한 층에 선택적으로 사용할 수도 있다.The latent heat storage material and the thermally conductive metal powder used in each layer may be used for the entire layer or selectively used in any one layer.
또한 본 발명의 바닥재는 도 2에 도시된 바와 같이 그라스파이버에 함침졸을 함침시킨 기재층(4) 위에 접착층을 도포하고 그 위에 정형 또는 무정형 칩을 산포하여 가열한 상태에서 프레스롤을 이용한 압착을 하여 칩에 일정한 무늬를 형성한 다음 다시 그 상부에 스킨층(2)을 선택적으로 적층시킨 후 발포 또는 비발포 시트로 구성된 하부층(5)을 접착하여 경보행 바닥재를 얻을 수 있다.In addition, the flooring of the present invention is coated with an adhesive layer on the substrate layer 4 impregnated with glass fiber impregnated sol, as shown in Figure 2 and sprayed using a press roll in a state in which the amorphous or amorphous chip is dispersed thereon and heated. By forming a predetermined pattern on the chip and then selectively stacked again the skin layer (2) on the top and then adhere to the lower layer (5) consisting of foamed or non-foamed sheet can be obtained warning line flooring.
또한 본 발명의 바닥재는 도 3에 도시된 바와 같이 그라스스크림 또는 부직포 함침층을 하부에 부착시켜 이면층(7)을 형성한 중보행 바닥재를 얻을 수 있다. 이러한 칩을 이용한 중보행 바닥재의 이면층에도 열전도성 금속분말과 잠열축열재를 적용하여 동일효과를 볼 수 있고, 또한 칩층에 투입되는 칩의 제조시에 열전도성 금속분말과 잠열축열재를 적용하여 경보행 바닥재와 동일한 효과의 중보행 바닥재를 얻을 수도 있다.In addition, the flooring of the present invention can be obtained by attaching a glass scrim or non-woven fabric impregnated layer to the bottom as shown in Figure 3 to obtain a heavy walking flooring material having a back layer (7). The same effect can be obtained by applying thermal conductive metal powder and latent heat storage material to the back layer of the heavy-pedestrian flooring using such a chip.In addition, thermal conductive metal powder and latent heat storage material can be applied in the manufacture of the chip into the chip layer. Heavy-duty flooring can be obtained with the same effect as a warning floor.
이러한 방법은 비닐 시트상의 바닥재 뿐만 아니라 비닐 타일계 상재에도 적용할 수 있다.This method can be applied to vinyl tile-based floorings as well as floorings on vinyl sheets.
이하 실시예를 통하여 본 발명을 상세하게 설명하며, 다음의 실시예는 본 발명을 한정하는 것은 아니다.Hereinafter, the present invention will be described in detail with reference to the following examples, which are not intended to limit the present invention.
실시예 1Example 1
도 1과 같은 구조의 바닥재에 있어서, 하부층(5)의 성분에 30㎛ 입경의 마이크로 캡슐화된 잠열축열재 Na2SO4ㆍ10H2O 20중량부, 25㎛ 입경의 열전도성 금속분말로 구리 분말 30중량부를 배합하여 통상의 방법으로 바닥재를 제조하였다.In the flooring material having the structure as shown in FIG. 1, the copper powder is a thermally conductive metal powder having a particle diameter of 30 μm and a microencapsulated latent heat storage material Na 2 SO 4 .10H 2 O in a component of the lower layer 5. 30 parts by weight of the flooring was prepared by a conventional method.
실시예 2Example 2
도 2와 같은 바닥재의 구조에 있어서, 하부층(5)의 성분에 25㎛ 입경의 마이크로 캡슐화된 잠열축열재 CaCl2ㆍ6H2O 25중량부, 25㎛ 입경의 열전도성 금속분말로 구리 분말 25중량부를 배합하여 통상의 방법으로 경보행 바닥재를 제조하였다.In the structure of the flooring material as shown in FIG. 2, 25 parts by weight of microencapsulated latent heat storage material CaCl 2 · 6H 2 O having a particle size of 25 μm in the components of the lower layer 5, and 25 parts by weight of copper powder with a thermally conductive metal powder having a particle size of 25 μm By combining the parts to prepare a warning line flooring in a conventional manner.
실시예 3Example 3
도 3과 같은 바닥재의 구조에 있어서, 부직포에 PVC졸을 함침시킨 이면층(7)의 성분에 30㎛ 입경의 마이크로 캡슐화된 잠열축열재 Na2SO4ㆍ10H2O 20중량부 및 20㎛ 입경의 열전도성 금속분말로 구리 분말 30중량부를 배합하고, 칩층(6)에 투입되는 칩의 제조성분중에 40㎛ 입경의 잠열축열재 Na2SO4ㆍ10H2O 20중량부 및 30㎛ 입경의 구리 분말 30중량부를 배합하여 통상의 방법으로 중보행 바닥재를 제조하였다.In the structure of the flooring material as shown in Fig. 3, 20 parts by weight of a microencapsulated latent heat storage material Na 2 SO 4 10H 2 O and a 20 μm particle diameter of a 30 μm particle diameter in a component of the back layer 7 impregnated with a PVC sol in a nonwoven fabric 30 parts by weight of copper powder is mixed with a thermally conductive metal powder of 20 parts by weight of latent heat storage material Na 2 SO 4 ㆍ 10H 2 O and a particle size of 30 μm in a 40 μm particle diameter in the manufacturing component of the chip introduced into the chip layer 6. 30 parts by weight of powder was blended to prepare a heavy walking flooring in a conventional manner.
실시예 4Example 4
도 1과 같은 바닥재의 구조에 있어서, 기재층(4)의 성분에 20㎛ 입경의 마이크로캡슐화된 잠열축열재 Na2SO4ㆍ10H2O 25중량부, 10㎛ 입경의 열전도성 금속분말로 구리 분말 30중량부를 배합하여 통상의 방법으로 바닥재를 제조하였다.In the structure of the flooring material as shown in FIG. 1, a copper encapsulated latent heat storage material Na 2 SO 4 10H 2 O 25 parts by weight and a thermally conductive metal powder having a particle size of 10 μm in the component of the base layer 4 30 parts by weight of powder was blended to prepare a flooring material in a conventional manner.
실시예 5Example 5
도 1과 같은 바닥재의 구조에 있어서, 스킨층(2)의 성분에 35㎛ 입경의 마이크로캡슐화된 잠열축열재 CaCl2ㆍ6H2O 25중량부, 하부층(5)에 30㎛ 입경의 열전도성 금속분말로 구리분말 30중량부를 배합하여 통상의 방법으로 바닥재를 제조하였다.In the structure of the flooring material as shown in FIG. 1, 25 parts by weight of microencapsulated latent heat storage material CaCl 2 · 6H 2 O having a particle size of 35 µm in the components of the skin layer 2, and a thermally conductive metal having a particle diameter of 30 µm in the lower layer 5 30 weight part of copper powder was mix | blended with powder, and the flooring material was manufactured by the conventional method.
실시예 6Example 6
도 2와 같은 바닥재의 구조에 있어서, 기재층(4)의 성분에 30㎛ 입경의 마이크로캡슐화된 잠열축열재 CaCl2ㆍ6H2O 25중량부, 20㎛ 입경의 열전도성 금속분말로 구리분말 25중량부를 배합하여 통상의 방법으로 바닥재를 제조하였다.In the structure of the flooring material as shown in FIG. 2, 25 parts by weight of microencapsulated latent heat storage material CaCl 2 .6H 2 O having a particle size of 30 µm in the components of the base material layer 4, and a copper powder 25 with a thermally conductive metal powder having a particle diameter of 20 µm. The bottom part was prepared by the conventional method by mix | blending a weight part.
실시예 7Example 7
도 2와 같은 바닥재의 구조에 있어서, 기재층(4)의 성분에 30㎛ 입경의 마이크로캡슐화된 잠열축열재 CaCl2ㆍ6H2O 25중량부, 15㎛ 입경의 열전도성 금속분말로 구리분말 25중량부와 스킨층(2)에 25㎛의 마이크로캡슐화된 잠열축열재 첨가제인 Na2SO4ㆍ10H2O 20중량부와 20㎛ 입경의 열전도성 첨가제인 은 분말 30중량부를 배합하여 통상의 방법으로 바닥재를 제조하였다.In the structure of the flooring material as shown in FIG. 2, 25 parts by weight of microencapsulated latent heat storage material CaCl 2 .6H 2 O having a particle size of 30 µm in the components of the base material layer 4, and a copper powder 25 with a thermally conductive metal powder having a particle diameter of 15 µm. 20 parts by weight of Na 2 SO 4 ㆍ 10H 2 O, which is a 25 μm microencapsulated latent heat storage additive, and 30 parts by weight of silver powder, which is a thermally conductive additive having a particle size of 20 μm, are mixed with the weight part and the skin layer 2. Flooring was prepared.
비교예Comparative example
잠열축열재와 열전도성 금속분말을 배합하지 않은 것을 제외하고는 실시예 1과 동일한 바닥재를 제조하였다.The same flooring material as in Example 1 was prepared except that the latent heat storage material and the thermally conductive metal powder were not blended.
상기 실시예 1 내지 7과 비교예의 바닥재에 대하여 열전도율 및 보온성을 측정하였으며, 결과는 표 1과 같다.Thermal conductivity and insulation were measured for the flooring materials of Examples 1 to 7 and Comparative Examples, and the results are shown in Table 1.
- 열전도율 측정방법-Thermal conductivity measurement method
측정기 : unitherm 2031(미국 ANTER사)Measuring instrument: unitherm 2031 (USA ANTER company)
시험방법 : KS L-9016 평판 열류계법 이용하여 측정하였으며 그 결과를 표 1에 나타내었다.Test Method: Measured by KS L-9016 plate heat flow meter method and the results are shown in Table 1.
- 잠열축열성 측정방법-Latent heat storage
가열 및 냉각과정에 따른 잠열축열온도의 축열성능을 알아보기 위해, 각 실시예 및 비교예의 바닥재(표면온도 : 15℃)를 일반적인 온돌방에 설치한후 가열과정에서는 60℃의 온수를 2시간 30분으로 공급하고 냉각과정에서는 온수공급을 중단하였다.In order to examine the heat storage performance of the latent heat storage temperature according to the heating and cooling process, the flooring material (surface temperature: 15 ℃) of each example and the comparative example was installed in a general ondol room, and the heating process was followed by hot water at 60 ℃ for 2 hours 30 minutes. The hot water supply was stopped during the cooling process.
상기와 같은 실험결과, 가열과정과 냉각과정에서 바닥재가 25℃ 이상 유지하는 시간을 측정하여 표 1에 나타내었다.As a result of the above experiment, it is shown in Table 1 by measuring the time the flooring material is maintained at 25 ℃ or more during the heating and cooling process.
상기 표 1의 결과에서 알 수 있는 바와 같이, 열전도성 금속분말과 잠열축열재가 포함된 본 발명의 바닥재는 이들 성분이 포함되지 않은 바닥재에 비하여 열전도성이 우수하여 난방공급에 따른 효과가 신속히 나타남을 알 수 있으며, 또한 보온효과가 우수하여(비교예의 일반 바닥재의 온도는 냉각과정에서는 거의 직선적으로 떨어지는 현상을 볼 수 있었다) 난방종료 후에도 상당 시간 보온효과를 나타낼 수 있다.As can be seen from the results of Table 1, the flooring material of the present invention including the thermally conductive metal powder and the latent heat storage material is excellent in thermal conductivity compared to the flooring material that does not contain these components, the effect of the heating supply is shown quickly. It can be seen that the thermal insulation effect is excellent (the temperature of the general floor material of the comparative example is almost linearly dropped during the cooling process), and the thermal insulation effect can be maintained for a considerable time after the heating is finished.
이상에서 설명된 바와 같이, 본 발명에 따른 바닥재는 열전도성이 우수한 금속분말과 잠열축열재를 바닥재를 구성하는 1층 이상의 원료에 배합하므로써 열전도성이 우수하고 바닥재 자체가 보온효과를 갖는다.As described above, the flooring according to the present invention is excellent in thermal conductivity by blending the metal powder and latent heat storage material having excellent thermal conductivity to one or more layers of the material constituting the flooring material and the flooring material itself has a thermal insulation effect.
Claims (3)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019990013987A KR20000066695A (en) | 1999-04-20 | 1999-04-20 | A floor with an effect of thermal insulation and storage |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019990013987A KR20000066695A (en) | 1999-04-20 | 1999-04-20 | A floor with an effect of thermal insulation and storage |
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| KR20000066695A true KR20000066695A (en) | 2000-11-15 |
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| Application Number | Title | Priority Date | Filing Date |
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| KR1019990013987A KR20000066695A (en) | 1999-04-20 | 1999-04-20 | A floor with an effect of thermal insulation and storage |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| KR100364766B1 (en) * | 2000-03-02 | 2002-12-18 | 한국에너지기술연구원 | Heating and heat storage apparatus using plastic for heat conduction and storage |
| KR100746155B1 (en) * | 2005-05-19 | 2007-08-09 | 은광판지포장 주식회사 | A corrugated cardboard as a flooring |
| KR101069501B1 (en) * | 2008-10-14 | 2011-09-30 | (주)엘지하우시스 | Energy saving decoration sheet and manufacturing method thereof |
| KR101295424B1 (en) * | 2009-08-05 | 2013-08-09 | (주)엘지하우시스 | Energy saving decoration sheet and manufacturing method thereof |
| KR102050856B1 (en) * | 2018-08-02 | 2019-12-04 | 주식회사 이즈원산업 | Experimental hot water circulation experiment equipment for measuring the heat transfer performance of indoor flooring |
| KR102586790B1 (en) * | 2023-06-13 | 2023-10-11 | 고등기술연구원연구조합 | Air Battery System Utilizing a Cold Thermal Energy Recycle Module and Method of Operating the Air Battery System |
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| JPH01292187A (en) * | 1988-01-28 | 1989-11-24 | Hiraoka & Co Ltd | Floor covering material having electromagnetic wave shielding property |
| KR970008262A (en) * | 1995-07-04 | 1997-02-24 | 이우복 | Spacer of field emission display device and vacuum package method using same |
| JPH09116293A (en) * | 1995-10-23 | 1997-05-02 | Nippon Plast Kogyo Kk | Electromagnetic wave shielding material, its manufacture, and its application method |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| KR100364766B1 (en) * | 2000-03-02 | 2002-12-18 | 한국에너지기술연구원 | Heating and heat storage apparatus using plastic for heat conduction and storage |
| KR100746155B1 (en) * | 2005-05-19 | 2007-08-09 | 은광판지포장 주식회사 | A corrugated cardboard as a flooring |
| KR101069501B1 (en) * | 2008-10-14 | 2011-09-30 | (주)엘지하우시스 | Energy saving decoration sheet and manufacturing method thereof |
| KR101295424B1 (en) * | 2009-08-05 | 2013-08-09 | (주)엘지하우시스 | Energy saving decoration sheet and manufacturing method thereof |
| KR102050856B1 (en) * | 2018-08-02 | 2019-12-04 | 주식회사 이즈원산업 | Experimental hot water circulation experiment equipment for measuring the heat transfer performance of indoor flooring |
| KR102586790B1 (en) * | 2023-06-13 | 2023-10-11 | 고등기술연구원연구조합 | Air Battery System Utilizing a Cold Thermal Energy Recycle Module and Method of Operating the Air Battery System |
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