KR20000051507A - Filter apparatus applied semiconductor fabricating equipment - Google Patents

Filter apparatus applied semiconductor fabricating equipment Download PDF

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Publication number
KR20000051507A
KR20000051507A KR1019990002005A KR19990002005A KR20000051507A KR 20000051507 A KR20000051507 A KR 20000051507A KR 1019990002005 A KR1019990002005 A KR 1019990002005A KR 19990002005 A KR19990002005 A KR 19990002005A KR 20000051507 A KR20000051507 A KR 20000051507A
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South Korea
Prior art keywords
housing body
filter
housing
fluid
filter device
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KR1019990002005A
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Korean (ko)
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KR100589463B1 (en
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양수근
김창국
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윤종용
삼성전자 주식회사
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Priority to KR1019990002005A priority Critical patent/KR100589463B1/en
Publication of KR20000051507A publication Critical patent/KR20000051507A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Separation Using Semi-Permeable Membranes (AREA)

Abstract

PURPOSE: A filter device for a semiconductor equipment is provided by being able to replace easily a filter members from a filter housing without modifying piping design, and by preventing a leakage of the solution to be supplied from the filter housing. CONSTITUTION: A filter device for the semiconductor equipment consists of: a housing body having a fixed receiving space and having the projecting portion of a ring type at the top of a circumference surface; a filter members to be installed in the housing body; a bottom cover of the housing body connected with a fluid inlet valve for filtered fluid; and a top cover of the housing body connected with a fluid outlet valve for filtered fluid and installed with an external thread portion at the projecting portion of the ring type so as to detach/build-up.

Description

반도체 설비용 필터 장치{Filter apparatus applied semiconductor fabricating equipment}Filter apparatus for semiconductor equipment {Filter apparatus applied semiconductor fabricating equipment}

본 발명은 반도체 설비용 필터 장치에 관한 것으로, 더욱 상세하게는 공정 용액 유입관의 일측 단부에 상부가 개구되고 내부에 교환형 필터부재가 수납된 필터 하우징을 결합시키고, 공정 용액 토출관의 일측 단부에 하우징 커버를 연결시킨 상태에서 필터 하우징과 하우징 커버를 분리/조립 가능하게 결합시켜 공정 용액의 필터링은 물론 필터 부재를 교환할 수 있도록 한 반도체 설비용 필터 장치에 관한 것이다.The present invention relates to a filter device for semiconductor equipment, and more particularly, a filter housing having an upper portion opened at one end of a process solution inlet pipe and having a replaceable filter member housed therein, and having one end of the process solution discharge pipe. The present invention relates to a filter device for a semiconductor device in which a filter housing and a housing cover are detachably coupled in a state in which a housing cover is connected to the housing cover, so as to filter the process solution and replace the filter member.

일반적으로 웨이퍼 또는 글래스 기판과 같은 소재를 가공하는 반도체 제조 공정에는 증착공정, 리소그래피 공정 및 식각공정 등과 같은 여러 공정들이 포함되고, 이들 공정에는 다양한 공정 용액이 공급되어 이용된다.Generally, a semiconductor manufacturing process for processing a material such as a wafer or glass substrate includes various processes such as a deposition process, a lithography process, and an etching process, and various process solutions are supplied and used in these processes.

그 일예로, 습식각공정에는 식각액이나 세정액과 같은 공정 용액들이 탱크로부터 공급되며, 공정 용액에 의하여 웨이퍼 또는 글래스 기판이 소정 패턴으로 식각 또는 세정된다.For example, in the wet etching process, process solutions such as an etching solution or a cleaning solution are supplied from a tank, and the wafer or glass substrate is etched or cleaned in a predetermined pattern by the process solution.

이때, 공정 용액은 일반적으로 필터 장치를 통해 소정의 파티클이 필터링된 다음 식각설비에 투입된다.In this case, the process solution is generally filtered into a predetermined particle through a filter device and then added to the etching facility.

도 1 및 도 2에는 이와 같은 기능을 갖는 종래 필터 장치 2 개의 일례가 도시되어 있다.1 and 2 show two examples of conventional filter devices having such a function.

첨부된 도 1의 필터 장치(10)는 필터 하우징(12)과 필터 하우징(12) 내부에 수납되어 필터 기능을 수행하는 필터 부재(미도시)가 일체로 형성된 일체형 필터장치로 필터 하우징(12)의 상단 및 하단에는 공정 용액이 필터 부재를 통과하도록 공정 용액 유입구(14) 및 공정 용액 배출구(16)가 형성되며, 공정 용액 유입구(14) 및 공정 용액 배출구(16)에는 수직으로 배치된 배관(14a,16a)이 설치된다. 이와 같은 구성을 갖는 일체형 필터장치(10)는 필터 하우징(12)으로부터 유독성을 갖는 공정 용액이 누설되는 것을 방지할 수 있다.The filter device 10 of FIG. 1 is an integrated filter device in which the filter housing 12 and the filter member (not shown) that are housed inside the filter housing 12 and perform a filter function are integrally formed. The process solution inlet 14 and the process solution outlet 16 are formed at the top and the bottom of the process solution so that the process solution passes through the filter member, and the process solution inlet 14 and the process solution outlet 16 are vertically arranged with a pipe ( 14a and 16a are provided. The integrated filter device 10 having such a configuration can prevent the toxic process solution from leaking from the filter housing 12.

그러나, 이와 같은 일체형 필터장치(10)는 필터 부재를 교체할 수 없어 필터 하우징(12)을 포함한 전체 필터장치(10)를 모두 교체해야 하는 문제점이 있다.However, such an integrated filter device 10 has a problem that the entire filter device 10 including the filter housing 12 must be replaced, since the filter member cannot be replaced.

이와 같은 문제점을 극복하기 위해서 최근 도 2에 도시된 바와 같이 필터 부재(20)의 교환이 가능한 필터 부재 교환형 필터장치가 개발된 바 있는데, 이 필터 부재 교환형 필터장치(20)는 공정 용액의 흐름이 수평방향으로 이루어짐으로 공정 용액 공급구(22) 및 공정 용액 배출관(24) 또한 수평으로 이루어져야 하며 이에 따라서 배관(22a,24a) 또한 수평 방향을 갖는다.In order to overcome such a problem, as shown in FIG. 2, a filter member exchangeable filter device capable of replacing the filter member 20 has been recently developed. Since the flow is made in the horizontal direction, the process solution supply port 22 and the process solution discharge pipe 24 should also be horizontal, so that the pipes 22a and 24a also have a horizontal direction.

그러나, 종래 일체형 필터장치(10)로부터 필터 부재 교환형 필터장치(20)로 필터 장치를 교체할 때, 일체형 필터장치(10)와 필터 부재 교환형 필터장치(20)의 배관 형태가 상이하기 때문에 배관을 추가적으로 다시 설치하여야 하는 문제점이 있다.However, when replacing the filter device from the conventional integrated filter device 10 to the filter member exchangeable filter device 20, since the piping form of the integrated filter device 10 and the filter member exchangeable filter device 20 are different. There is a problem in that the piping must be additionally reinstalled.

따라서, 본 발명은 이와 같은 종래 문제점을 감안한 것으로써, 본 발명의 목적은 종래 일체형 필터장치에 적용되던 배관을 추가적으로 다시 설치하지 않으면서도 일체형 필터장치의 필터부재를 교환할 수 있도록 함에 있다.Accordingly, the present invention has been made in view of such a conventional problem, and an object of the present invention is to be able to replace the filter member of the integrated filter device without additionally re-installing the pipe used in the conventional integrated filter device.

본 발명의 다른 목적은 후술될 본 발명의 상세한 설명에서 보다 명확해질 것이다.Other objects of the present invention will become more apparent from the following detailed description of the invention.

도 1은 종래 반도체 설비에 사용된 일체형 필터 장치를 도시한 측면도.1 is a side view showing an integrated filter device used in a conventional semiconductor equipment.

도 2는 종래 반도체 설비에 사용된 카트리지형 필터 장치를 도시한 측면도.2 is a side view showing a cartridge type filter device used in a conventional semiconductor facility.

도 3은 본 발명에 의한 필터부재 교환형 필터 장치의 구조를 도시한 단면도.Figure 3 is a cross-sectional view showing the structure of the filter member replaceable filter device according to the present invention.

이와 같은 본 발명의 목적을 달성하기 위한 반도체 설비용 필터 장치는 소정 수납 공간이 확보되고 외주면 상단에 링형 돌출부가 형성된 하우징 몸체, 하우징 몸체에 수납된 필터 부재와, 하우징 몸체의 하단부에 형성되어 필터링될 유체가 유입되도록 유체 유입관과 연통된 하우징 몸체 하부 커버와, 하우징 몸체의 상단부에 설치되어 필터링된 유체가 토출되도록 유체 토출관과 연통되며 하우징 몸체에 대하여 분해/조립되도록 링형 돌출부의 상단에 안착되고 외주면에 수나사부가 형성 하우징 몸체 상부 커버와, 링형 돌출부를 가압함과 동시에 수나사부와 나사 체결되어 하우징 몸체 상부 커버와 하우징 몸체를 견고하게 결합시키는 결합부재를 포함하는 것을 특징으로 한다.In order to achieve the object of the present invention, a filter device for a semiconductor device may include a housing body having a predetermined storage space and a ring-shaped protrusion formed on an upper circumferential surface thereof, a filter member accommodated in the housing body, and formed at a lower end of the housing body to be filtered. A lower cover of the housing body in communication with the fluid inlet pipe for inflow of the fluid, and an upper portion of the housing body in communication with the fluid discharge pipe for discharging the filtered fluid and seated on the top of the ring-shaped protrusion to disassemble / assemble the housing body. A male screw portion is formed on the outer circumferential surface, and a coupling member for firmly coupling the housing body upper cover and the housing body by being screwed with the male screw portion while simultaneously pressing the ring-shaped protrusion.

이하, 본 발명에 의한 반도체 설비용 필터 장치를 첨부된 도 3을 참조하여 보다 구체적으로 설명하면 다음과 같다.Hereinafter, the filter device for a semiconductor device according to the present invention will be described in more detail with reference to FIG. 3.

첨부된 도 3은 본 발명에 의한 반도체 설비용 필터장치(200)의 구조를 설명하기 위한 단면도로, 본 발명에 의한 반도체 설비용 필터장치(200)는 전체적으로 보아 속이 빈 파이프 형상을 갖는 하우징 몸체(210), 하우징 몸체(210)의 하단부에 설치 또는 형성되며 공급 용액이 유입되는 공급용액 유입 배관(220)과 연통되는 하우징 몸체 하부 커버(230), 하우징 몸체(210)의 내부에 수납되는 필터 부재(240) 및 하우징 몸체(210)의 상단부에 분리 가능토록 설치되며 공급 용액이 토출되는 공급용액 토출 배관(250)과 연통되는 하우징 몸체 상부 커버(260) 및 하우징 몸체(210)와 하우징 몸체 상부 커버(260)를 결합시키는 결합 부재(270) 및 공급 용액이 외부로 누설되는 것을 방지하는 밀봉링(280)으로 구성된다.3 is a cross-sectional view illustrating the structure of the semiconductor device filter device 200 according to the present invention. The filter device for semiconductor device 200 according to the present invention has a hollow body having a hollow pipe shape. 210, a filter member installed or formed at the lower end of the housing body 210 and housed in the housing body lower cover 230 and the housing body 210 communicating with the supply solution inflow pipe 220 through which the feed solution is introduced. The housing body upper cover 260 and the housing body 210 and the housing body upper cover which are detachably installed at the upper end of the 240 and the housing body 210 and communicate with the supply solution discharge pipe 250 through which the supply solution is discharged. A coupling member 270 for engaging the 260 and a sealing ring 280 for preventing leakage of the feed solution to the outside.

보다 구체적으로, 소정 길이를 갖는 하우징 몸체(210)의 상단 외주면에는 링 형상으로 소정 높이 돌출된 돌출부(212)가 형성되는데, 돌출부(212)는 결합 부재(270)가 걸리는 걸림 돌기 역할을 한다.More specifically, a protrusion 212 protruding a predetermined height in a ring shape is formed on the upper outer circumferential surface of the housing body 210 having a predetermined length, and the protrusion 212 serves as a locking protrusion to which the coupling member 270 is caught.

또한, 하우징 몸체(210)의 상단은 이중 단턱(214,216)이 형성되고, 이중 단턱(214,216)중 어느 하나의 단턱(214)은 링 형상의 밀봉링(280)이 안착되기 위한 단턱으로 밀봉링용 단턱(214)에는 밀봉링(280)이 안착된다.In addition, the upper end of the housing body 210 is formed with a double step (214, 216), the step of any one of the double step (214, 216) is a step for sealing ring stepping step for seating the ring-shaped sealing ring 280 The seal ring 280 is seated at 214.

하우징 몸체 상부 커버(260)는 일측 단부가 개구된 원통 형상으로 직경은 앞서 설명한 하우징 몸체(210)의 돌출부(212)에 안착되는 직경을 갖으며, 하우징 몸체 상부 커버(260)의 외주면에는 소정 피치(pitch)를 갖는 수나사부가 형성된다.The housing body upper cover 260 has a cylindrical shape in which one end is opened and has a diameter that is seated on the protrusion 212 of the housing body 210 described above, and has a predetermined pitch on the outer circumferential surface of the housing body upper cover 260. A male screw portion having a pitch is formed.

또한, 하우징 몸체 상부 커버(260)의 단부에는 하우징 몸체(210)의 단턱(216)과 맞춤 결합되도록 단턱이 형성되는 바, 단턱면에는 하우징 몸체(210)에 설치된 밀봉링(280)이 접촉된다.In addition, the end of the housing body upper cover 260 is formed with a stepped to be coupled with the step 216 of the housing body 210, the stepped surface is in contact with the sealing ring 280 installed in the housing body 210 .

이와 같이 하우징 몸체(210)에 하우징 몸체 상부 커버(260)를 단순히 접촉시킨 상태로는 필터 기능을 완벽하게 수행할 수 없을뿐만 아니라 유독성 공정 용액이 외부로 누설될 위험이 매우 높음으로, 하우징 몸체(210)와 하우징 몸체 상부 커버(260)는 결합부재(270)에 의하여 견고하게 결합된다.In such a state that the housing body upper cover 260 is simply in contact with the housing body 210 as described above, the filter function cannot be completely performed and the risk of toxic process solution leaking to the outside is very high. 210 and the housing body top cover 260 is firmly coupled by a coupling member 270.

결합부재(270)는 양단이 개구된 원통 형상으로 어느 일측 단부는 원통의 내측으로 소정 길이 절곡되는데, 절곡된 상태에서 원통의 내경은 하우징 몸체(210)의 외주면에 삽입 가능하면서 하우징 몸체(210)의 외주면에 형성된 돌출부(212)에 걸리도록 형성된다.Coupling member 270 is a cylindrical shape with both ends open at one end is bent a predetermined length into the inside of the cylinder, the inner diameter of the cylinder in the bent state can be inserted into the outer peripheral surface of the housing body 210 while the housing body 210 It is formed to be caught by the protrusion 212 formed on the outer peripheral surface of the.

또한, 결합부재(270)의 내주면에는 하우징 몸체 상부 커버(260)의 외주면에 형성된 수나사부와 나사 체결되기 위한 암나사부가 형성되어 결합부재(270)를 하우징 몸체(210)의 하단부를 통하여 삽입한 후, 결합부재(270)의 절곡된 부분에 의하여 하우징 몸체(210)의 돌출부(212)가 강하게 클램핑될 때까지 결합부재(270)를 회전시키면서 결합부재(270)의 암나사부와 하우징 몸체 상부 커버(260)의 수나사부를 나사 체결한다.In addition, the inner circumferential surface of the coupling member 270 is formed with a female screw portion for screwing with a male screw portion formed on the outer circumferential surface of the housing body upper cover 260, and then inserts the coupling member 270 through the lower end of the housing body 210. By rotating the coupling member 270 until the protrusion 212 of the housing body 210 is strongly clamped by the bent portion of the coupling member 270, the female screw portion of the coupling member 270 and the housing body upper cover ( Screw the male threads of 260).

이와 같이 구성된 본 발명에 의한 반도체 설비용 필터장치(200)의 하우징 몸체 하부 커버(230)에는 공정 용액 유입관(220)이 연통되고, 하우징 몸체 상부 커버(260)에는 공정 용액 토출관(250)이 연통되어 필터 부재(240)의 수명이 다 되었을 경우 결합부재(270)를 역회전시킴으로써 하우징 몸체(210)와 하우징 몸체 상부 커버(260)가 매우 쉽게 분리됨으로 필터 부재(240)를 매우 쉽게 교체할 수 있다.The process solution inlet tube 220 communicates with the housing body lower cover 230 of the filter device for semiconductor device 200 according to the present invention configured as described above, and the process solution discharge tube 250 is connected to the housing body upper cover 260. In this communication, when the life of the filter member 240 is reached, the housing member 210 and the housing body upper cover 260 are very easily separated by rotating the coupling member 270 to replace the filter member 240 very easily. can do.

이상에서 상세하게 설명한 바와 같이, 별도의 배관 설계 변경 없이 필터 하우징으로부터 필터 부재를 용이하게 교체할 수 있음과 동시에 필터 하우징으로부터 공급 용액의 누설을 방지하는 효과가 있다.As described in detail above, it is possible to easily replace the filter member from the filter housing without changing the piping design, and at the same time, there is an effect of preventing the leakage of the feed solution from the filter housing.

Claims (2)

소정 수납 공간이 확보되고 외주면 상단에 링형 돌출부가 형성된 하우징 몸체;A housing body having a predetermined storage space and having a ring-shaped protrusion formed at an upper end of the outer circumferential surface thereof; 상기 하우징 몸체에 수납된 필터 부재와;A filter member housed in the housing body; 상기 하우징 몸체의 하단부에 형성되어 필터링될 유체가 유입되도록 유체 유입관과 연통된 하우징 몸체 하부 커버와;A housing body lower cover formed at a lower end of the housing body and in communication with a fluid inflow pipe so that fluid to be filtered is introduced; 상기 하우징 몸체의 상단부에 설치되어 필터링된 유체가 토출되도록 유체 토출관과 연통되며 상기 하우징 몸체에 대하여 분해/조립되도록 상기 링형 돌출부의 상단에 안착되고 외주면에 수나사부가 형성 하우징 몸체 상부 커버와;A housing body upper cover installed at an upper end of the housing body and in communication with a fluid discharge tube to discharge the filtered fluid and seated at an upper end of the ring-shaped protrusion to be disassembled / assembled with respect to the housing body and having a male thread on an outer circumferential surface thereof; 상기 링형 돌출부를 가압함과 동시에 상기 수나사부와 나사 체결되어 하우징 몸체 상부 커버와 상기 하우징 몸체를 견고하게 결합시키는 결합부재를 포함하는 것을 특징으로 하는 반도체 설비용 필터 장치.And a coupling member which presses the ring-shaped protrusion and is screwed with the male screw to securely couple the housing body upper cover to the housing body. 제 1 항에 있어서, 상기 하우징 몸체 상부 커버와 상기 하우징 몸체의 사이에는 상기 유체가 누설되는 것을 방지하는 밀봉링이 개재 설치되는 것을 특징으로 하는 반도체 설비용 필터 장치.The semiconductor device filter device of claim 1, wherein a sealing ring is disposed between the housing body upper cover and the housing body to prevent the fluid from leaking.
KR1019990002005A 1999-01-22 1999-01-22 Filter apparatus applied semiconductor fabricating equipment KR100589463B1 (en)

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