KR20000042242A - Disc for conditioning polishing pad - Google Patents

Abstract

PURPOSE: A disc for conditioning a polishing pad is to remove a slurry remained in a groove of the polishing pad during a chemical-mechanical polishing process, thereby increasing a durability of the polishing pad. CONSTITUTION: A disc for conditioning a polishing pad(100) comprises a circular disc body, a diamond particle which is attached on the circular disc body(102) and a brush(106) which is attached on the circular disc body along with the diamond particle. In the disc, the brush is made of a resin and removably mounted on the disc body to be facilely replaced with a new one. The brush and the diamond particle are alternatively attached on the disc body. The disc is rotated in one direction during a polishing process. Slurry remained in a groove of the polishing pad is removed by the brush, which is rotated in the same direction with the polishing pad.

Description

Polishing Pad Conditioning Disc

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing apparatus, and more particularly, to contaminants and residual slurry stuck in grooves of a wafer polishing pad during a chemical mechanical polishing (CMP) process. Discs that can effectively remove the (disc).

As the degree of integration of semiconductor devices increases and the multi-layer wiring process becomes practical, a global planarization technique for the material layer on the chip is required in order to secure a margin of the photolithography process and minimize the wiring length. . Currently, methods for planarizing the underlying structure include boro-phospho-silicate glass (BPSG) reflow, aluminum (Al) flow, spin-on glass (SOG). ) Etch-back, chemical physical polishing (CMP) process, etc. are used.

Among these, the CMP process is a method of chemically and physically polishing the surface of the chip by the chemical component in the slurry solution, which is an abrasive for polishing the wafer, and a pad for polishing the wafer and the physical component of the abrasive, thereby performing planarization. The global planarization and low temperature planarization of a large space area that cannot be achieved by the reflow process or the etchback process are emerging as a prominent planarization technology in next-generation semiconductor devices.

According to the conventional CMP apparatus, the pad rotates at a constant speed while feeding slurry onto the pad through the slurry supply nozzle, and the carrier rotates at a constant speed while applying a constant pressure to the wafer attached thereto. Through this process, the film deposited on the wafer is polished. At this time, the rotational speed of the pad, the rotational speed of the carrier, and the pressure applied to the wafer have a physical action, and the slurry has a chemical interaction with the film deposited on the wafer.

As the polishing process proceeds, the surface roughness of the pad is smoothed by the wafer during polishing. If the surface roughness of the pad is not restored to its original state, it will adversely affect the removal rate and uniformity in the subsequent polishing of the wafer. Therefore, the pads are conditioned while pressing the pads at a constant pressure using a rotating circular disk to restore the surface roughness of the pads between each run of the wafer and to supply fresh slurry to the pads.

FIG. 1 is a plan view of a conventional pad conditioning disk, and FIG. 2 is a sectional view of the disk shown in FIG. 3 and 4 are cross-sectional views illustrating pads before and after pad conditioning by the disk of FIG. 1.

1 to 4, the conventional pad conditioning disk 12 is composed of diamond particles 14 and a circular disk body 16. Pad conditioning is performed by rotating the pad 10 and the disk 12 attached on the plate in the same direction.

The pad 10 includes a lower pad layer 20 formed through an adhesive layer and a groove pad layer 18 formed by resuming an adhesive layer on an upper portion of the lower pad layer 20. Therefore, when the CMP process is performed, contaminants and residual slurry remain in the grooves of the groove pad layer 18 as well as the surface of the pad 10, as shown in FIG. 3. Here, reference numeral 19a denotes a contaminant and residual slurry present on the surface of the pad 10, and reference numeral 19b denotes a contaminant and residual slurry that is sandwiched in the groove of the groove pad layer 18.

Since the groove of the groove pad layer 18 has a very narrow width w of about 0.01 "and a depth d of about 0.015", the grooves of the diamond pads 14 are attached to the circular disk body 16. In the case of conditioning the pad 10 using the disk 12 of FIG. 4, contaminants and residual slurry 19a present on the surface of the pad 10 can be removed, but the groove pad layer ( Contaminants and residual slurry 19b stuck in the grooves of 18) cannot be removed. Accordingly, the contaminants and the residual slurry 19b which are stuck in the grooves of the groove pad layer 18 are hardened so that the groove depth of the groove pad layer 18 is reduced from the initial 'd' to 'a' and thus the pad 10. The problem of shortening the lifespan occurs.

Accordingly, an object of the present invention is to provide a disk capable of removing contaminants and residual slurry stuck in the groove of the polishing pad during the CMP process.

1 is a plan view of a conventional pad conditioning disk.

2 is a cross-sectional view of the disk shown in FIG.

3 and 4 are cross-sectional views showing pads before and after pad conditioning by the disk of FIG.

5 is a plan view of a disk for pad conditioning according to the present invention;

FIG. 6 is a sectional view of the disk shown in FIG. 5; FIG.

7 and 8 are cross-sectional views illustrating pads before and after pad conditioning by the disk of FIG.

<Explanation of symbols for the main parts of the drawings>

100: pad 102: disk

106: Brush 108: Diamond Particles

110: disc body 112: lower pad layer

114: groove pad layer 116a, 116b: contaminant

In order to achieve the above object, the present invention provides a disk for conditioning a wafer polishing pad in a CMP process, the disk comprising: a circular disk body; And a diamond particle and a brush attached together to the circular disk body.

Preferably, the brush is of resin type.

Preferably, the brush is detachably attached to facilitate exchange from the circular disk body.

Preferably, the diamond particles and brushes are alternately attached circularly to the circular disk body.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 5 is a plan view of a disk for pad conditioning according to the present invention, and FIG. 6 is a sectional view of the disk shown in FIG. 7 and 8 are cross-sectional views illustrating pads before and after pad conditioning by the disk of FIG. 5.

5 to 8, the pad conditioning disk 102 according to the present invention is formed by attaching a diamond particle 108 and a brush 106 to a circular disk body 110. Preferably, the brush 106 is formed of a resin series. The diamond particles 108 and the resin-based brush 106 are alternately attached to the circular disk body 110 in a circle. Preferably, the brush 106 is detachably attached (d) to the circular disk body 110 in order to facilitate replacement of the brush 106 from the circular disk body 110.

The pad 100 includes a lower pad layer 112 formed through an adhesive layer and a groove pad layer 114 formed by resuming an adhesive layer on an upper portion of the lower pad layer 112. The groove pad layer 114 is formed with a plurality of grooves having a width w of about 0.01 "and a depth d of about 0.015". Therefore, during the CMP process, as shown in FIG. 7, contaminants and residual slurry remain in the grooves of the groove pad layer 114 as well as the surface of the pad 100. Here, reference numeral 116a denotes a contaminant and residual slurry present on the surface of the pad 100, and reference numeral 116b denotes a contaminant and residual slurry sandwiched in the groove of the groove pad layer 114.

As described above, when pad conditioning is performed while rotating the pad 100 having the contaminant and the residual slurry and the disk 102 having the brush 106 according to the present invention in the same direction, the pad as shown in FIG. 8. The contaminants and residual slurry 116a present on the surface of 100 are removed by the diamond particles 108 of the disk 102 and stuck in the grooves of the groove pad layer 114 and the residual slurry 116b. Is removed by the resin-based brush 106 of the disk 102. Therefore, since the groove depth of the groove pad layer 114 maintains the original 'd', the life of the pad 100 may be improved.

As described above, according to the disk for disk conditioning according to the present invention, by attaching diamond particles and a brush together to the circular disk body, contaminants and residual slurry on the surface of the pad as well as contaminants stuck in the grooves of the groove pad layer and Residual slurry can also be removed. Therefore, since the groove depth of the groove pad layer affecting the life of the pad can be maintained at an initial value, the life of the pad can be improved.

As described above, although described with reference to a preferred embodiment of the present invention, those skilled in the art will be variously modified without departing from the spirit and scope of the invention described in the claims below. And can be changed.

Claims (4)

A disk for conditioning a wafer polishing pad in a chemical physical polishing process, the disk comprising: Circular disk body; And And a diamond particle and a brush attached together to said circular disk body. The disk of claim 1, wherein the brush is made of resin. The disk of claim 1, wherein the brush is detachably attached from the circular disk body to facilitate exchange. The disk of claim 1, wherein the diamond particles and the brush are alternately attached to the circular disk body in a circular manner.