KR20000038873A - Integrated core winding transformer - Google Patents

Abstract

PURPOSE: An integrated core winding transformer is provided to manufacture an AC/DC converting rectifier comprising an integrated transformer in a chip. CONSTITUTION: An AC voltage is applied to a primary winding(221), and a current is flowed through the primary winding(221). A magnetic field induction core(214) generates magnetic field by the current. A secondary winding(222) is disposed in parallel to the primary winding(221). A magnetic field induction current is generated by the magnetic field. The secondary winding(22) outputs a DC voltage according to the winding ratio.

Description

Integrated iron core winding transformer structure and manufacturing method thereof, structure of integrated AC / DC conversion rectifier including this integrated transformer and manufacturing method thereof

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a DC voltage source of a high speed transmission integrated circuit using heterojunction dipole transistor electronic devices, and more particularly, to a structure and a manufacturing method of an integrated transformer simultaneously manufactured in the same chip as a circuit and an AC-DC conversion rectifier including the transformer. It relates to a structure and a method of manufacturing the same.

In general, a plurality of control DC power sources are required in addition to supplying the main DC power of the circuit for the smooth operation of the integrated circuit. That is, a DC voltage source for driving the entire circuit is essential and an additional DC power source for controlling the performance of the circuit is required for the element elements of the circuit. However, in the existing circuit, a voltage having a required magnitude is used internally by using a separate voltage source or by using a bias circuit from a main power source. However, since the bias circuit is usually composed of a resistor, it causes unnecessary power consumption due to heat in the resistor. In the case of the GHz-class high-speed circuit, a feedback circuit through the bias circuit is also configured to cause interference.

In addition, while the use of a separate voltage source from the outside has the advantage that the control of the circuit is convenient, while the economic problems for the separate voltage source and the problem that the entire system is complicated.

An operation principle of a separate DC voltage source required for operation and control of a GHz-class high speed integrated circuit using a conventional heterojunction dipole transistor device will be described with reference to FIG. 1.

1 is a conceptual diagram illustrating a general DC voltage source, and shows a circuit diagram of an AC / DC conversion rectifier as an example.

The AC voltage applied to the primary input terminal 101 of the transformer is converted to a desired DC voltage level through the transformer 102 and rectified to a DC voltage through the rectifying diode 103 to be supplied to the load 104. Of course, a bridge type rectifier may be used to obtain a precise and cleaner DC waveform, and after rectification, a cleaner DC waveform may be obtained by using a filter, but the fundamental operation principle thereof is as described herein.

That is, the transformer 102 that converts to the voltage of the required size in FIG. 1 determines the transformer ratio according to the primary and secondary winding ratios using the iron core winding transformer in the conventional case. have.

Therefore, in order to solve the above problems, the present invention provides a structure of an integrated iron core winding transformer that is horizontally arranged instead of using a bias circuit using a conventional resistor or separately using an external DC voltage source, and fabricating the transformer. It is an object of the present invention to provide a method and a structure of an integrated AC / DC current converter including the integrated transformer and a method of manufacturing the same.

The structure of the integrated iron core winding type transformer of the present invention for achieving the above object includes a primary side winding through which an AC voltage is applied to which a current flows, a magnetic field induction iron core generating a magnetic field by the current, and the primary winding; It is arranged horizontally, characterized in that consisting of the secondary winding which passes through the windings in the form of a closed loop to generate a magnetic field induction current by the generated magnetic field to output a DC voltage according to the turns ratio.

In the above, each of the primary side winding and the secondary side winding is provided with primary and secondary via holes for connecting the lower part and the upper part of the winding, and are connected to the hole by metal. In addition, upper and lower surfaces of the primary winding and the secondary winding are respectively provided with wiring metals for connecting with other elements.

In addition, a method of manufacturing an integrated transformer, which is another feature of the present invention, includes forming a pattern corresponding to the primary wiring metal of the primary and secondary windings by a photolithography process and then depositing the primary wiring metal, which is a lower wiring portion. The first step is to apply the primary insulating surface protection film, etch the primary via hole, and deposit the secondary wiring metal to fill the primary via hole with metal to connect with the primary wiring metal to form the magnetic field induction iron core simultaneously. Step 2, Apply a second insulating surface protection film on the resultant, etch the secondary via hole, and then deposit the tertiary wiring metal by filling the secondary via hole with metal to connect with the primary via hole. A third step of forming the tertiary wiring metal, which is the upper wiring portion of the winding, is performed to fabricate an integrated iron core winding transformer having a horizontal arrangement.

In addition, an AC / DC conversion rectifier incorporating the integrated transformer, which is another feature of the present invention, receives an AC voltage applied to a primary winding and generates a magnetic field by a magnetic field induction iron core, which is arranged horizontally on the primary winding. An integrated iron core winding transformer in which a magnetic field induction current is generated in the secondary winding to output a DC current, and the primary and secondary windings are passed through, and the iron core and a portion other than the winding are covered with an insulating surface protective film; A rectifier diode connected to a resistive base metal electrode and a collector metal electrode is connected to one end of the secondary winding of the transformer to rectify the DC current, and a resistor for rectifier output connected between the other end of the secondary winding and the emitter electrode. A heterojunction dipole transistor (HBT) element having a structure is integrated.

In addition, a method of manufacturing an AC / DC conversion rectifier, which is another feature of the present invention, includes a buffer layer thin film, a secondary collector layer thin film, a collector layer thin film, a base layer thin film and an emitter layer thin film sequentially grown on a semi-insulating compound semiconductor substrate. A first process of forming an epitaxial structure composed of a cap layer thin film, a second process of forming a resistive emitter metal electrode on a selected portion of the upper part of the emitter layer thin film of the epitaxial structure resultant, and exposing the surface of the base layer thin film by etching A third process of forming a resistive base metal electrode on the selected portion of the base layer thin film after exposure, and exposing the surface of the sub collector layer thin film by etching, and then connecting the resistive base metal electrode to the selected portion of the upper portion of the sub collector layer thin film A fourth process of forming a resistive collector metal electrode, and the rectification is performed by device isolation etching in the resultant structure. A fifth process of defining an odd device and depositing a necessary primary wiring metal and a resistance metal on a selected portion of the surface of the buffer layer thin film exposed by device isolation etching, and a primary insulating surface protective film on the entire surface of the resultant After the coating, the primary via hole is etched in the necessary part including the HBT element, the magnetic induction iron core is deposited as the secondary wiring metal, and then the secondary insulating surface protective film is applied, and then the secondary via hole is etched in the required part. The sixth process of depositing the tertiary wiring metal of the primary and secondary windings while filling the holes with metal is connected.

As described above, the present invention can manufacture an integrated small transformer using the manufacturing process of the existing heterojunction bipolar transistor (HBT) at the same time. Therefore, it is economical to manufacture the control DC voltage source required for the 10GHz high-speed electronic circuit in the circuit at the same time as the circuit fabrication. It is also expected to maintain the high speed characteristics of the circuit. In addition, since it has the form of iron core winding type transformer, it is possible to freely convert the primary and secondary winding ratios to obtain a desired level of voltage, and high quality metal such as Ti / Au by vacuum deposition method for primary and secondary windings. Because of this, the loss is small and the conversion efficiency can be maximized. In addition, since the required shape is etched by photolithography and the first and second wiring metals are deposited by vacuum deposition, the size is minimized and only a small space necessary for capacitance of 1pF is required when using the current stable process. Do.

1 is a circuit diagram of a conventional AC / DC conversion rectifier,

2 is a block diagram of an integrated transformer according to the present invention;

3 is a cross-sectional view of an integrated AC / DC current converter structure of an integrated transformer and a heterojunction bipolar transistor according to the present invention;

4 is a plan view of an integrated AC / DC conversion rectifier structure according to the present invention.

<Explanation of symbols for main parts of drawing>

101: primary input terminal of the transformer 102: transformer

103: rectifier diode 104: resistor for rectifier output load

201: semi-insulating substrate 202: buffer layer thin film

203: secondary collector layer thin film 204: collector layer thin film

205: base layer thin film 206: emitter layer thin film

207: emitter cap layer thin film 208: resistive emitter metal electrode

209: resistive base metal electrode 210: resistive collector metal electrode

211: primary wiring metal 212: primary insulating surface protective film

213: primary via hole 214: secondary wiring metal and magnetic field induction iron core

215: secondary insulating surface protective film 216: secondary via hole

217: tertiary wiring metal 218: connecting wiring metal for diode fabrication

219: resistor for rectifier output load 221: primary winding of integrated transformer

222: secondary winding of the integrated transformer

240: rectifier diode made of HBT

Hereinafter, with reference to the accompanying drawings will be described in detail the present invention.

2 is a block diagram of an embodiment of an integrated iron core winding transformer according to the present invention.

In the integrated iron core winding transformer according to the present invention, the magnetic field induction iron core of a closed loop type which passes through the primary winding 221, the secondary winding 222, the primary winding and the secondary winding, respectively, and induces a magnetic field ( Or secondary wiring metal) 214. The transformer is a horizontal arrangement of primary and secondary windings.

In the above, the primary and secondary windings 221 and 222 are formed through the via holes 213 and 216 connecting the primary wiring metal 211 and the tertiary wiring metal 217 and the two wiring metals 211 and 217. Is formed.

Look at the operation of Figure 2 configured as described above. First, when an AC voltage is applied to the primary winding 221, a current flows according thereto, and a magnetic field inducing high magnetic permeability iron core 214 generates a magnetic field. Since the generated magnetic field is generated along the iron core, the secondary magnetic field 222 also has the same magnetic field. This magnetic field acts to generate a magnetic field induced current in the secondary winding 222 to generate a voltage according to the turns ratio to the secondary winding. Here, the number of primary and secondary windings is determined by considering the quotable voltage and the desired voltage in the circuit.

A method of fabricating an integrated iron core winding transformer as shown in FIG. 2 will now be described with reference to a part of FIG. 3.

First, a pattern corresponding to the primary wiring metal of the primary and secondary windings 221 and 222 is completed using a photolithography process, and the primary wiring metal 211 is deposited using a vacuum deposition process or the like. Subsequently, the primary insulating surface protection film ('212' in FIG. 3) is applied, the primary via hole 213 is etched, and the secondary wiring metal is deposited to fill the primary via hole 213 with metal to form the primary wiring. The magnetic field induction iron core 214 is formed at the same time while being connected to the metal 211. In this case, the magnetic field inducing iron core 214 may be deposited as a metal film having a high permeability using a separate deposition apparatus such as a sputter. Subsequently, a secondary insulating surface protection film (“215” in FIG. 3) is applied, the secondary via hole 216 is etched, and the third via metal is deposited to fill the secondary via hole 216 with metal to fill the primary via hole. The third wiring metal 217, which is the upper wiring portion of the primary and secondary windings, is formed while connecting to the 213, thereby completing an integrated iron core winding transformer having a horizontal arrangement as shown in FIG.

An AC / DC current converter structure in which the integrated iron core winding transformer and the heterojunction bipolar transistor (HBT) device manufactured as described above are integrated in the same chip and a fabrication process thereof will be described with reference to FIG. 3 and FIG. 4. do.

First, a process of fabricating an HBT device will be described. A buffer layer thin film 202, a secondary collector layer thin film 203, a collector layer thin film 204, and a base layer thin film 205 are sequentially formed on a semi-insulating compound semiconductor substrate 201. , The emitter layer thin film 206 and the cap layer thin film 207 having a large forbidden bandwidth are grown. Here, a double heterojunction dipole transistor element using the same semiconductor having a large forbidden bandwidth for the emitter 206 and the collector 204 can be fabricated. The resistive emitter metal electrode 208 is formed on the emitter layer thin film 206, and the surface of the base layer thin film 205 is etched to form the emitter-base junction region through etching, and then the resulting structure is exposed. The resistive base metal electrode 209 is formed. Subsequently, the surface of the collector layer thin film 204 is exposed while forming a base-collector junction region through etching, and then, a resistive collector metal electrode 210 is formed on the resulting structure, and a heterojunction bipolar transistor device is defined through device isolation etching. do. In the case of manufacturing the rectifying diode 103 as shown in FIG. 1, the resistive base metal electrode 209 and the collector metal electrode 210 are connected together.

After fabricating the HBT device as described above, the integrated iron core winding transformer is integrated.

First, a first wiring metal 211 is deposited on the buffer layer thin film 202.

Further, a resistive metal 219 is subsequently deposited on the buffer layer thin film 202 on which the primary wiring metal is deposited, and an insulating surface protective film 212 is applied to the surface of the entire structure in which the completed HBT element and the integrated transformer are to be formed. After that, the primary via hole 213 is formed in the required portion including the HBT by using a dry etching method. The metal is then filled in the primary via hole 213.

The secondary wiring metal 214 of the integrated transformer is deposited to form the magnetic field induction iron core of the transformer and the wiring metal 214 of the HBT element. Here, in order to increase the magnetic permeability of the magnetic induction iron core, a magnetic material having a high permeability may be deposited using a deposition apparatus such as a sputter.

Subsequently, the secondary insulating surface protection film 215 is formed on the surface of the resultant product, and the secondary via hole 216 is formed in the required portion including the HBT element by dry etching, and then the secondary is formed by the vacuum deposition process. Filling the via hole 216 with metal to connect the metal of the primary via hole 213 to deposit the tertiary wiring metal 217 forming the upper metal part of the primary and secondary windings to complete the integrated transformer. At this time, the tertiary wiring metal 217 of the secondary winding 222 is connected to the HBT rectifying diode 240 shown in FIG. 4, and the primary wiring metal or the tertiary wiring metal ( 211 and 217 are connected to one end of the rectifier output load resistor 219, and the other end of the resistor 219 is connected to the emitter metal electrode 214 of the HBT element.

A plan view of an integrated AC / DC conversion rectifier including an integrated transformer completed through the above process is shown in FIG. 4. In FIG. 4, the integrated iron core winding type transformer between 221 and 222 indicating primary and secondary input and output ends of the transformer functions as the transformer 102 of FIG. 1, and is the base of the heterojunction bipolar transistor. The rectifying diode 240 of FIG. 4 functions as the rectifying diode 103 shown in FIG. 1 by the metal film 218 connecting the metal electrode 209 and the collector metal electrode 210. Also, the resistor 219 for the rectifier output load in FIG. 4 performs the same function as the resistor 104 for the rectifier output load in FIG. 1.

When designing a high integrated circuit such as a heterojunction bipolar transistor high speed circuit using an integrated AC / DC conversion rectifier including an integrated transformer according to an embodiment of the present invention, in addition to the advantage that the DC control of the circuit can be freely performed inside the circuit. There is an advantage that the shielding in the circuit can be facilitated if necessary.

In the above description of the device structure of one embodiment, it can be easily understood by those skilled in the art that the present invention may be implemented differently without departing from the spirit of the present invention.

As described above, according to the present invention, an AC / DC conversion rectifier including an integrated transformer in the same chip may be manufactured in the form of an integrated circuit at the same time using a conventional process for manufacturing a heterojunction bipolar transistor. . The high-speed circuit including the integrated transformer can solve the DC voltage source for the partial control of the circuit inside the chip, and its structure is simple and has many advantages compared to the conventional one in the process. The shielding can be ensured to improve the high speed performance of the high speed circuit.

Therefore, the AC / DC conversion rectifier including the integrated transformer manufactured according to the present invention improves the high-speed operation characteristics of the circuit compared to the conventional DC voltage source. In addition to being wider, it enables the fabrication of extremely high performance circuits.

Claims (13)

In the integrated transformer, A primary winding to which an AC voltage is applied and current flows; A magnetic field induction iron core generating a magnetic field by the current; And An integrated type comprising: a secondary side winding arranged horizontally with the primary winding and passing the windings in a closed loop to generate a magnetic field induction current by the generated magnetic field to output a DC voltage according to a turns ratio Iron core wound transformer structure. The method of claim 1, And each of the primary side winding and the secondary side winding has primary and secondary via holes for connecting the lower part and the upper part of the winding, and are connected to the holes by metal. The method of claim 1, The upper and lower surfaces of the primary winding and the secondary winding have wiring metals for connecting with other elements, respectively. A first step of forming a pattern corresponding to the primary wiring metal of the primary and secondary windings by a photolithography process and then depositing the primary wiring metal as the lower wiring portion; A second step of applying a primary insulating surface protection film, etching the first via hole, and depositing a second wiring metal to fill the first via hole with metal to connect with the first wiring metal to form a magnetic field induction iron core simultaneously; And Apply the secondary insulating surface protection film on the resultant, etch the secondary via hole, and then deposit the tertiary wiring metal to fill the secondary via hole with metal to connect with the primary via hole, and connect the upper wiring of the primary and secondary windings. A method of manufacturing an integrated iron core winding transformer, comprising: forming an integrated iron core winding transformer in a horizontal arrangement by performing a third step of forming a tertiary wiring metal as a part. The method of claim 4, wherein The primary and secondary wiring metal is a method of manufacturing an integrated iron core winding transformer, characterized in that the deposition by using a vacuum deposition process. The method of claim 4, wherein The magnetic field induction iron core is a method of manufacturing an integrated iron core winding type transformer, characterized in that to deposit a metal film using a sputter. The method of claim 4, wherein The primary and secondary windings are manufactured using an integrated iron core winding transformer, characterized in that the production using Ti / Au. In the structure of the AC / DC conversion rectifier, Receives an AC voltage applied to the primary winding, generates a magnetic field by the magnetic field induction core, generates a magnetic field induction current in the secondary winding arranged horizontally on the primary winding, and outputs a DC current. The primary and secondary windings An integrated iron core winding transformer which is covered with an insulating surface protection film on a portion through which the iron core and the winding core are passed; A rectifier diode connected to a resistive base metal electrode and a collector metal electrode is connected to one end of the secondary winding of the transformer to rectify the DC current, and is used for rectifier output connected between the other end of the secondary winding and the emitter metal electrode. A structure of an AC / DC conversion rectifier characterized by the integration of a heterojunction dipole transistor (HBT) device with a resistor. The method of claim 8, The primary and secondary windings are provided with a primary wiring metal and a tertiary wiring metal, respectively, in the lower portion and the upper portion of the magnetic induction core which are secondary wiring metals. A structure of an AC / DC conversion rectifier, characterized in that each is connected to a metal filled in a secondary via hole. The method according to claim 8 or 9, The tertiary wiring metal of the secondary winding is connected to one side of the rectifying diode, the primary wiring metal structure of the AC / DC conversion rectifier, characterized in that connected. Forming an epi structure comprising a buffer layer thin film, a sub collector layer thin film, a collector layer thin film, a base layer thin film, an emitter layer thin film, and a cap layer thin film sequentially grown on a semi-insulating compound semiconductor substrate; Forming a resistive emitter metal electrode on a selected portion of the upper part of the emitter layer thin film of the epitaxial structure resultant; Exposing the surface of the base layer thin film by etching to form a resistive base metal electrode on a selected portion of the base layer thin film; Exposing the surface of the secondary collector layer thin film by etching and forming a resistive collector metal electrode connected to the resistive base metal electrode on a selected portion of the secondary collector layer thin film; Defining a rectifying diode device by device isolation etching in the resultant structure, and depositing a first wiring metal and a resistance metal required for a selected portion of the surface of the buffer layer thin film exposed by device isolation etching; And After applying the primary insulating surface protective film on the entire surface of the resultant, the primary via hole is etched in the necessary part including the HBT element, the magnetic induction iron core, which is the secondary wiring metal, is deposited, and then the secondary insulating surface protective film is applied. An integrated iron core winding transformer is manufactured by etching a secondary via hole in a required part, and depositing the third wiring metal of the primary and secondary windings while filling the holes with metal and connecting the holes. Method of integrated AC / DC conversion rectifier. The method of claim 11, And manufacturing a rectifying diode by connecting the base metal electrode and the collector metal electrode by a metal film. The method of claim 11, The first and second via holes are filled with metal by a vacuum deposition process, characterized in that the AC / DC conversion rectifier manufacturing method.