KR20000030878A - Method of making chamber using for CVD - Google Patents

Abstract

PURPOSE: A manufacturing method of a chamber for processing a wafer is provided to reduce reject and thermal deformation of the chamber by welding, so that dimension and size of the chamber are constant and rework is not necessary. CONSTITUTION: A manufacturing method of a chamber for processing a wafer comprises 8processes. In the 1st process, an upper flange having a cooling-water path and an O-ring slot is manufactured. In the 2nd process, a lower flange having a cooling-water path is manufactured. In the 3rd process, a wafer pot is manufactured. In the 4th process, a vacuum pot is manufactured. In the 5th process, the vacuum pot is welded to a vacuum-pot installation hole in a cylindrical chamber body. In the 6th step, a wafer pot is welded into a wafer in/outlet. In the 7th step, the upper flange is welded into upper portion of the chamber body. In the 8th step, the lower flange is welded into lower portion of the chamber body. Here, each welding is a preform welding by preform melting without a welding rod. Also, a balancing process is further comprised between the 6th and 7th steps, so that parallelism between the upper and lower portions in the chamber body is regulated.

Description

Method of making chamber for wafer processing {Method of making chamber using for CVD}

The present invention relates to a method for manufacturing a wafer processing chamber, and more particularly, even when the chamber is combined with an external device by precisely adjusting the squareness and horizontality of each part during the fabrication of the chamber, even if the chamber is not deformed in a high vacuum environment at high temperature. The present invention relates to a wafer processing chamber manufacturing method capable of efficiently processing a wafer.

The wafer processing chamber is a chamber for performing a process commonly called CVD (Chemical Vapor Deposition). The CVD is a thin film growth process using chemical vapor growth, which is now industrially spread, and is now used for manufacturing various thin films.

In general, however, this method requires very high temperatures and maintains a very high vacuum in the chamber. Therefore, fabricating the wafer processing chamber is a very precise operation and does not allow any gaps or twists in the chamber.

In general, the process of making the chamber is made by separately manufacturing each element constituting the chamber and welding each part to complete one chamber. However, in the related art, since the welding rod is used to weld each component of the chamber to each other, the welding surface is dirty and the post-processing on the welding surface is necessarily inconvenient.

In addition, the welding using the electrode is to dissolve the electrode between the base material to bond the base material, the base material may be distorted during the welding or the relative position may be slightly deformed. These minor deformations will cause the chamber to fail and the chamber must be reworked.

The present invention has been made to solve the above problems, the welding of each part constituting the chamber by the base metal welding, the weld surface is clean and does not cause the minute deformation due to the welding of the chamber by welding There is no defect and the support for heat deformation prevention is used in consideration of the heat deformation of each member during welding. Therefore, there is no torsion of each part of the chamber, so the dimensions and specifications of the chamber are uniform. The purpose is to provide a method.

1 is a flow chart showing the procedure of the wafer manufacturing chamber manufacturing method according to an embodiment of the present invention.

Figure 2 is a perspective view showing the chamber separated to explain a method for manufacturing a wafer processing chamber according to an embodiment of the present invention.

3 and 4 are cross-sectional views for explaining the manufacturing method of the upper flange of the wafer processing chamber manufacturing method according to an embodiment of the present invention.

Figure 5 is a perspective view of the ring and the insertion block mounted to the upper flange.

Figure 6 is a cross-sectional view showing a state in which the complete flange welded to the upper flange.

7 is a cross-sectional view for explaining a method of manufacturing a lower flange of the wafer processing chamber according to an embodiment of the present invention.

8 is a cross-sectional view for explaining a method for manufacturing a wafer port in the wafer processing chamber manufacturing method according to an embodiment of the present invention.

9 is a view showing a separate vacuum port of the wafer processing chamber according to an embodiment of the present invention.

10 is a cross-sectional view for explaining a method of manufacturing the vacuum port.

FIG. 11 is a perspective view illustrating a state in which a vacuum port is coupled to a chamber body of a method for manufacturing a wafer processing chamber according to an embodiment of the present invention; FIG.

12 and 13 are views illustrating a state in which a chamber body and a wafer entry / exit port are combined in a method for manufacturing a wafer processing chamber according to an embodiment of the present invention.

14 is a partial cross-sectional view showing a state of coupling the chamber body and the upper flange of the wafer processing chamber manufacturing method according to an embodiment of the present invention.

<Explanation of symbols for the main parts of the drawings>

10: first step 12: second step

14: 3rd process 16: 4th process

18: 5th process 20: 6th process

22: 7th process 23: 8th process

24: Balancing process 25: Grooving step

26: Vertical path forming step 27: Insert block installation step

28,37: ring insertion step 29,47,50: first welding step

30: 1st finishing step 31: Complete welding step

32: 2nd finishing step 33: Tube welding step

34: O-ring groove machining step 35: Inner peripheral face machining step

36: Grooving step 38, 41: Complete welding step

39,42 finishing step 40: connecting plate manufacturing step

43: polishing step 44, 46, 49: preparation step

45: welding step 48, 51: second welding step

54: upper flange member 55: wafer port

56: O-ring groove 57: Vacuum port

58: Insertion block 59: Bolt hole

60, 67: Ring 61: Corner part

62: vertical through hole 63: insertion protrusion

64: chamber body 66: wafer entry port

68: connection plate 69: port

70: Bolt hole 71, 80, 83: Jam jaw

72: Wafer entrance and exit 73: Vacuum port installation port

74: vacuum port member 75: lower flange member

76: body mounting groove 77: connection ring

78: connection manifold 79: connection flange

81: Cooling water flow groove 82: Mounting groove

84: fever groove 85: vertical passage

86: gas passage 87: close contact surface

88: cooling water flow groove 89: mounting groove

91: Cooling water flow path 92: Top plate

93: side wall member 94: lower plate

95: Manifold mounting hole 96, 97, 98: Deformation prevention support

W: welding area

In order to achieve the above object, the present invention provides a first step of forming an upper flange by forming a cooling water channel and an O-ring groove in the upper flange member, and a second process of forming a lower flange by forming a cooling water channel in the lower flange member. A third step of fabricating a wafer port by welding the connecting plate to the wafer entry / exit port, a fourth step of producing a vacuum port by welding the connection manifold to the vacuum port member, and a chamber in which the wafer entry / exit and vacuum port mounting holes are formed. A fifth step of welding the vacuum port to the vacuum port mounting hole of the body, a sixth step of welding the wafer port to the wafer inlet / outlet, a seventh step of welding the upper flange to the upper end of the chamber body, and the chamber die In the wafer processing chamber manufacturing method comprising the eighth step of welding the lower flange to the bottom of the,

Each welding is a base metal welding which melts and welds a base metal to be bonded to each other without using a welding rod, and machined the upper and lower surfaces of the chamber body between the sixth and seventh processes. It further comprises a balancing process to match the parallelism, the welding of the upper flange and the lower flange to the chamber body, after welding the upper flange to the chamber body and the lower flange to the chamber body, and then the lower portion and the lower flange of the chamber body It is characterized in that the welding is completely welded to the inside of the chamber body, and then completely welded to the upper end of the chamber body and the upper flange.

In addition, the first process includes (a) a groove processing step of digging a mounting groove in the bottom surface of the upper flange member and processing a coolant flow groove in the mounting groove; (b) a vertical passage forming step of processing and forming one vertical passage passing through the upper flange member in the cooling water flow groove; (c) an insertion block installation step of fixing the insertion block in which the gas passage communicating with the vertical passage is formed in close contact with the mounting groove and the cooling water flow groove below the vertical passage; (d) a ring insertion step of inserting a ring into a mounting groove, each having a vertical through hole formed at both ends and fitted into the mounting groove but not in contact with the cooling water flow groove to form a flow passage between the cooling water flow groove; ; (e) a first welding step of welding the base block at both ends of the insertion block and the ring and welding the insertion block and the ring with the base material spot welding to the upper flange member; (f) a first finishing step of flattening the bottom surface of the upper flange member which has undergone the first welding step through machining; (g) a full welding step of welding the edge of the mounting groove and the insertion block and the ring to the base flange so that the insertion block and the ring welded in the groove are completely coupled to the upper flange member; (h) a second finishing step of flattening the bottom surface of the upper flange member which has undergone the complete welding step through machining; (i) a tube welding step of connecting the cooling water flow grooves to the outside by welding the tubes to each of two vertical through holes formed in the ring; (j) O-ring groove processing step of processing two rows of O-ring grooves parallel to the upper surface of the upper flange member so that the vertical passage is located between the O-ring groove and (k) of the chamber body on the inner peripheral surface of the upper flange member Forming a locking step that can span the upper end, characterized in that it comprises an inner peripheral surface processing step of further forming a heat dissipation groove spaced at a predetermined interval from the upper outer peripheral surface of the chamber body in the lower portion of the locking jaw.

In addition, the second process includes: (a) a groove processing step of digging a mounting groove in the bottom surface of the lower flange member and processing the coolant flow groove in the mounting groove; (b) a ring insertion step of inserting a ring having a plurality of vertical through holes into the mounting groove to form a flow path between the cooling water flow grooves; (c) a complete welding step of welding the lower flange member and the ring base material; (d) digging the body mounting groove into which the lower end of the chamber body is inserted into the upper surface of the lower flange member in the fully welded state, and finishing the flat surface of the lower flange member.

In addition, the third process includes the steps of: (a) forming a cooling water flow path in the connection plate and a connection plate manufacturing step of forming a locking jaw in which the end of the wafer entry / exit port is in close contact with the central port mounting hole; (b) a complete welding step of inserting an end portion of the wafer entry / exit port into a port mounting hole and welding the base material of the locking jaw portion and the end portion of the wafer entry / exit port; (c) a finishing step of plane-processing the outer surface of the connecting plate after the complete welding step; and (d) a polishing step of polishing the flatly finished surface through the finishing step.

In addition, the fourth step (a) forming a locking jaw on the outer peripheral surface of the upper end of the connecting manifold and the locking jaw is inserted so as to support the manifold mounting frame of the vacuum port member, the insertion protrusion is the upper end of the connecting manifold A step of protruding the inside of the vacuum port member and inserting a deformation preventing support into the connection manifold; (b) welding the edge of the insertion protrusion and the manifold fitting, but the melt ratio of the base material is 60 to 70% of the insertion protrusion 63 and 30 to 40% of the edge of the manifold fitting. It is done.

In the fifth step, (a) a deformation preventing support is installed in the chamber body to prevent thermal deformation of the chamber body, and a deformation preventing support is inserted between the upper and lower plates of the vacuum port member. A preparation step of bringing the edge of the vacuum port installation port and the edge of the vacuum port member into contact with each other; (b) a first welding step of welding the base material to the edge of the vacuum port member and the vacuum port mounting hole inside the chamber body; and (c) a second welding step of welding the vacuum port member and the vacuum port installation tool again on the outer side of the chamber body.

In addition, the sixth step (a) to install the deformation preventing support inside the wafer entry and exit port, to fix the deformation prevention support to the outer surface of the connecting plate and to position the end of the wafer entry and exit port on the edge of the wafer entry and exit Preparing to make; (b) a first welding step of spot welding the base material on the outside of the chamber body at a contact portion between the wafer entry and exit port and the wafer entrance and exit port; (c) a second welding step of completing the bonding by welding the base material at the inside of the chamber body with the wafer entry and exit ports and the entrance and exit ports.

In addition, in the seventh process of coupling the upper flange to the chamber body 64, the locking jaw 83 formed on the inner circumferential surface of the upper flange 54 is positioned to be caught by the upper end of the chamber body 64, and the locking jaw in this state. The upper end of the 83 and the chamber body 64 is characterized in that the process of welding the base material.

Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings.

Basically, the chamber fabrication method according to the present invention first fabricates the chamber body, the upper flange, the lower flange, the wafer port, and the vacuum port, which are the elements that make up the chamber, and then polishes and cleans the ultrasonic elements. Combine to form a chamber. In addition, the chamber is again polished and ultrasonically cleaned after the chamber is formed by the combination of the above elements.

1 is a block diagram showing the flow of a method for manufacturing a wafer processing chamber according to an embodiment of the present invention.

As shown in Fig. 1, the method for manufacturing a wafer processing chamber according to the present embodiment includes a first step 10 of manufacturing an upper flange, a second step 12 of manufacturing a lower flange, and a wafer port (Fig. 1). 2 of 55, a third process 14 for producing a vacuum port, a fourth process 16 for manufacturing a vacuum port (57 in Fig. 2), and a chamber for coupling the vacuum port 57 to the chamber body 64 5th process 18, the 6th process 20 which couples the said wafer port 55 to the said chamber body 64, and milling in the state which welded the said wafer port 55 and the vacuum port 57. Balancing process 24 for parallelizing the upper and lower surfaces of the chamber body 64 through the machining through, and the seventh process (22) for fixing the upper and lower flanges on the upper and lower ends of the chamber body (64) ) And the eighth process (23).

The first step (10) is a process of manufacturing the upper flange by welding the ring 60 and the insertion block 58 to the upper flange member 54, the groove processing step 25, and vertical as described below The passage forming step 26, the insertion block installation step 27, the ring insertion step 28, the first welding step 29, the primary finishing step 30, the complete welding step 31 and , Secondary finishing step 32, tube welding step 33, the O-ring groove processing step 34 and the inner peripheral surface processing step 35 is performed in this order.

In addition, the second process 12 for manufacturing the lower flange is made through the groove processing step 36, the ring insertion step 37, the complete welding step 38, and the finishing step 39.

In addition, the third process 14 of manufacturing the wafer port 55 includes a connection plate manufacturing step 40, a complete welding step 41, a finishing step 42, and a polishing step 43. In addition, the fourth process 16 includes a preparation step 44 and a welding step 45 as a process of manufacturing the vacuum port 57.

The fifth step 18 of fixing the vibration port 57 manufactured through the fourth step 16 to the chamber body 64 includes a preparation step 46, a first welding step 47, and a second welding step. And a step 48, wherein the sixth step 20 is a step of coupling the wafer port 55 to the chamber body 64, a preparation step 49, a first welding step 50 and a second welding step. It consists of 51.

In addition, the seventh process 22 is a process of welding the upper flange to the chamber body 64, including a preparation step 52 and a complete welding step 53, and the eighth process 23 is the lower flange chamber It is a process of bonding to the body 64.

Hereinafter, each process and step will be described in more detail with reference to the accompanying drawings.

2 is a view showing a separate configuration of the chamber before explaining a method for manufacturing a wafer processing chamber according to an embodiment of the present invention.

Referring to the drawings, the wafer processing chamber includes a chamber body 64 in which wafers are stored and a work is performed, and a wafer port 55 and a vacuum port 57 respectively coupled to side portions of the chamber body 64. do. In addition, the upper flange and the lower flange is welded to the upper end and the lower end of the chamber body (64).

Two rows of O-ring grooves 56 are formed on the upper surface of the upper flange member 54 constituting the upper flange, and the mounting groove 82 and the cooling water flow groove 81 are formed on the bottom. The ring 60 and the insertion block 58 is installed in the groove. The ring 60 is fitted into the mounting groove 82 so that the cooling water flow groove 81 becomes a cooling water flow passage.

In addition, one vertical passage 85 is formed between the O-ring grooves 56 of the upper flange member 54. The vertical passage 85 passes through the upper flange member 54 and the lower portion is connected to the cooling water flow groove (81 in FIG. 4). In addition, as is well known, the upper surface of the upper flange member 54 is covered with a hemispherical cover with an O-ring (not shown) interposed to completely seal the chamber.

Body mounting grooves 76 are formed on the upper surface of the lower flange member 75 coupled to the lower end of the chamber body 64. The body mounting groove 76 is a groove for receiving and coupling the lower end of the chamber body 64. In addition, grooves (88 and 89 of FIG. 7) are formed at the bottom of the lower flange member 75, and a ring 67 is inserted into the groove.

On the other hand, the chamber body 64 is formed with a wafer entry and exit 72 and the vacuum port installation port 73. One end of the wafer entry and exit port 66 is welded to the wafer entrance and exit port 72, and a vacuum port member 74 is inserted and welded to the vacuum port installation port 73. At this time, each said welding is a base metal welding. As is known, the base metal welding melts both sides to be joined without using a welding rod and is integrally bonded.

The other end of the wafer entry and exit port 66 is fitted to the center portion of the connecting plate 68 and welded together. To this end, a port mounting port 69 is provided at the center of the connection plate 68. The inner circumferential surface of the port mounting port 69 is formed to be in contact with the outer surface of the wafer entry / exit port 66, and a locking jaw 71 is formed on the inner circumferential surface of the port mounting port 69. Therefore, when the wafer entry / exit port 66 is inserted into the port mounting port 69, the end portions of the wafer entry / exit port 66 are in contact with each other in the state of being caught by the latching jaw 71, and in this state, the locking step 71 and the wafer entry / exit port are in contact with each other. The tip of (66) can be welded to the base material. A plurality of bolt holes 70 are formed at the edge of the connection plate 68 for coupling with an external device.

In addition, the connection manifold 78 is welded to the lower portion of the vacuum port member 74. To this end, the lower plate (94 in FIG. 9) of the vacuum port member 74 is provided with a manifold mounting hole 95, and a locking jaw 80 is formed at an upper end of the connection manifold 78. At this time, when the connecting manifold 78 is inserted into the manifold mounting hole 95, the edge portion of the manifold mounting hole 95 is caught by the locking jaw 80.

Reference numeral 77 is a connecting ring. It is installed on the outer circumference of the connection manifold 78 before the vacuum port member 74 and the connection manifold 78 is coupled, and is connected to an external device (not shown) by bolts to connect the connection flange to the external device. Provide a pressing force on (79). A plurality of bolt holes are formed in the connection ring 77 to be coupled to the external device by a bolt.

3 to 6 are diagrams for explaining the manufacturing method of the upper flange which is the first step 10 in the method for manufacturing a wafer processing chamber according to an embodiment of the present invention.

3 is a cross-sectional view taken along the line III-III of FIG. 2 and FIG. 4 is a cross-sectional view taken along the line IV-IV.

3 and 4, two rows of O-ring grooves 56 are formed on the upper surface of the upper flange member 54 so as to be spaced apart from each other. As described above, the O-ring groove 56 is fitted with an O-ring (not shown), and the upper surface of the upper flange member 54 is covered with a cover (not shown) so that the chamber body 64 is sealed.

Cooling water flow grooves 81 and mounting grooves 82 are formed on the bottom of the upper flange member 54 by lathe machining. The coolant flow groove 81 is a groove formed second in the mounting groove 82 after the mounting groove 82 is processed, and a lower portion thereof is blocked by the ring 60 to provide a flow path of the coolant. That is, when the ring 60 is inserted into the mounting groove 82 and the ring 60 is welded to the upper flange member 54, the cooling water flow groove 81 is sealed to become one passage. As shown in FIG. 5, the ring 60 has a shape in which one side is cut and opened, and a vertical through hole 62 is formed at both ends, and an insertion block 58 is inserted between both open ends.

Therefore, the coolant flows into the vertical through-hole 62 on one side and flows into the coolant flow groove 81 to flow out into the vertical through-channel 62 on the other side.

On the other hand, Figure 4 is a view showing a state in which the insertion block 58 is installed in the groove (81,82). The insertion block 58 is a block mounted to the grooves 81 and 82 in a state sandwiched between both ends of the ring 60 as shown in FIG. The upper surface of the insertion block 58 protrudes corresponding to the shape of the coolant flow groove 81 so as to be in close contact with the coolant flow groove 81 to block the flow path of the coolant flow groove 81. Therefore, the contact surface 87, which is the upper surface of the insertion block 58 takes the form of a step approximately. A vertical gas passage 86 is formed at the center of the insertion block 58.

A locking jaw 83 protrudes inward from an inner circumferential surface of the upper flange member 54. The locking jaw 83 is a protrusion formed to protrude so that the upper end of the chamber body 64 is fused together with the upper end of the chamber body 64 through the base metal welding, as described below, and thus the chamber body 64 and the upper flange. In combination with the member 54.

In addition, a heat dissipation groove 84 is formed in the lower portion of the locking step 83. The heat dissipation groove 84 prevents heat deformation of the upper flange 54 by welding heat generated during the fusion welding between the upper end of the chamber body 64 and the upper flange member 54 to the upper flange member 54. To do so, it is to discharge heat between the upper flange member 54 and the chamber body (64).

That is, the heat dissipation groove 84 is a groove which cuts a portion corresponding to the lower portion of the locking jaw 83 of the inner circumferential surface of the upper flange member 54 to a predetermined depth between the chamber body 64 and the upper flange member 54. To ensure that the temperature of the upper end of the chamber body 64, which is heated during the base metal welding, is not transmitted to the upper flange member 54. Therefore, thermal deformation of the upper flange member 54 by welding heat does not occur.

The thickness h3 of the locking step 83 depends on the thickness of the upper flange member 54, but is generally processed to about 1/10 to 2/10 of the thickness of the upper flange member 54, and the heat radiation groove 84 The height h5 is preferably about 1/3 to 1/5 of the thickness of the upper flange member 54.

Meanwhile, referring to FIG. 4, it can be seen that the vertical passage 85 is formed in the upper flange member 54. The vertical passage 85 is a hole provided between the O-ring grooves 56 of the upper flange member 54 as shown in FIG. Therefore, when the insertion block 58 is inserted into the lower portion of the vertical passage 85 in the grooves 81 and 82 as described above, the gas passage 86 and the vertical passage 85 communicate with each other to form one vertical flow passage. .

Meanwhile, in FIG. 3, the thickness h1 of the ring 60 is smaller than the depth h2 of the mounting groove 82. Therefore, when the ring 60 is completely inserted into the mounting groove 82, the bottom of the ring 60 is inserted by (h2-h1) with respect to the bottom of the upper flange member 54. In the same manner as in the insertion block 58, the thickness h1 of the insertion block 58 in FIG. 4 is smaller than the depth h2 of the mounting groove 82. The insertion depth h2-h1 depends on the thickness of the upper flange member 54 and is preferably about 1/20 to 2/10 of the thickness of the upper flange member 54.

5 is a view illustrating a ring 60 and an insertion block 58 inserted into the bottom of the upper flange member 54.

As shown, the ring 60 and the insertion block 58 are connected to each other to form a circle and are installed in the grooves 81 and 82 at the bottom of the upper flange member 54 in this state. The protrusion formed on the upper surface of the insertion block 58 blocks the cooling water flow groove 81 to form a flow path for the cooling water flow as described above.

6 is a view showing a cross-section of the upper flange completed through the manufacturing method of the upper flange to be described later.

Referring to the drawings, it can be seen that the ring 60 and the upper flange member 54 are integrally welded with the ring 60 inserted into the mounting groove 82. This is a state after the base material welding by melting both the edge portion (61 of FIG. 4) and the edge portion of the ring 60 of the mounting groove 82.

The first process for manufacturing the upper flange configured as described above begins with the groove processing step 25 of first forming the mounting groove 82 and the cooling water flow groove 81 on the bottom of the upper flange member 54. As shown in FIG. 2, the grooved step 25 may be formed by a lathe because the upper flange member 54 takes the form of a ring.

Subsequently, a vertical passage forming step 26 of forming one vertical passage 85 in the cooling water flow groove 81 of the upper flange member 54 is performed. At this time, a plurality of bolt holes 59 are formed in the edge portion of the upper flange member 54. The bolt hole 59 is provided for the coupling between the cover (not shown) and the upper flange to be covered on the upper flange of course.

Insertion block for inserting the insertion block 58 and the ring 60 in the grooves 81 and 82 after the mounting groove 82 and the coolant flow groove 81 is formed on the bottom of the upper flange member 54 The installation step 27 and the ring insertion step 28 are performed. At this time, the installation position of the insertion block 58 is accurately set so that the gas passage 86 of the insertion block 58 communicates with the vertical passage 85 of the upper flange member 54. In particular, the insertion block 58 is inserted into the groove is completely in contact with the inner surface of the groove so that water does not penetrate into the contact surface between the insertion block 58 and the groove. For this purpose, it is preferable to insert the insertion block 58 first before inserting the ring 60 and to weld the insertion block 58 in the grooves 81 and 82 in advance in this state.

After the installation of the ring 60 and the insertion block 58 is completed, the first welding step 29 for temporarily fixing the ring 60 and the insertion block 58 to the mounting groove 82 through spot welding is performed. do. The temporary fixation is made through the partial point welding of the ring 60 and the insertion block 58 to the mounting groove 82 as well as the connection with the ring 60 to the insertion block 58. The partial welding is a rare spot welding of the base 60 and the corner 61 of the ring 60 and the insertion block 58 and the mounting groove 82 without using a welding rod.

Subsequently, a first finishing step 30 of finishing the bottom of the upper flange member 54 on which the spot welding is performed using a lathe is performed. This is a step of machining the bottom surface of the upper flange member 54 flat by the heat applied to the upper flange member 54 during the first welding step (29). The first finishing step 30 may be performed by milling.

After the bottom of the upper flange member 54 is finished through the first finishing step 30, the complete welding to perform the welding of the ring 60 and the insertion block 58 to the mounting groove 82 secondary Step 31 is performed. At this time, before welding, it is a matter of course to remove foreign substances on the welding target area. Since the welding of the ring 60 and the insertion block 58 to the upper flange member 54 is the base metal welding, it is natural that the welding target surface needs to be cleaned before the welding is performed.

The complete welding step 31 is a welding of the entire contact portion of the ring 60 and the insertion block 58 as continuous welding, not welding. That is, the edge 61 of the mounting groove 82 and the contact portion of the ring 60 and the insertion block 58 in the groove 82 are melted and integrated.

When the coupling of the ring 60 and the insertion block 58 to the upper flange member 54 is completed, the secondary finishing step 32 is performed. The second finishing step 32 is a step of machining the bottom surface of the upper flange member 54 flatly in consideration of the heat deformation generated by performing the complete welding step 31, as in the first finishing step 30. It is made by milling.

When the surface processing of the bottom surface of the upper flange member 54 is completed through the secondary finishing step 32, a tube (not shown) is welded to the vertical through hole 62 of the ring 60. Of course, the tube is connected to the external device is a pipe that allows the coolant flows through the coolant flow groove 81.

O-ring groove processing step 34 is followed. The O-ring groove processing step 34 is a step of forming two rows of O-ring grooves (56 in Fig. 2) on the upper surface of the upper flange member 54 according to a known method by machining by milling or lathe.

When the processing of the O-ring groove 56 is completed, the inner peripheral surface processing step 35 of the upper flange member 54 is performed to process the locking jaw 83 and the heat dissipation groove 84 on the inner peripheral surface of the upper flange member 54. The locking step 83 is a protrusion formed so that the upper flange member 54 is supported by the upper end of the chamber body 64 as shown in FIG. It is a fusion site.

At this time, as described above, the thickness h3 of the locking step 83 is processed to be about 1/10 to 2/10 of the thickness of the upper flange member 54, and the height h5 of the heat dissipation groove 84 is upper part. It is processed to about 1/3 to 1/5 of the thickness of the flange member 54.

Subsequently, the upper flange manufactured through the above steps is polished and subjected to ultrasonic cleaning and then waiting.

The second process 12 for manufacturing the lower flange includes digging a groove on the bottom surface of the lower flange member 75 and welding the ring 67 to the groove.

FIG. 7 is a diagram illustrating a configuration of a lower flange in order to explain the second step 12.

Referring to the drawings, the body mounting groove 76 is formed on the upper surface of the lower flange member 75. The body mounting groove 76 is a mounting groove provided to insert and fix the lower end of the chamber body (64). In addition, the bottom surface of the lower flange member 75 is provided with a cooling water flow groove 88 and the mounting groove (89). A ring 67 is inserted into the mounting groove 89 such that the cooling water flow groove 88 becomes a cooling water flow path.

In order to manufacture the lower flange configured as described above, first, by mounting the lower flange member 75 on a milling or lathe to dig the mounting groove 89 on the bottom and to process the coolant flow groove 88 in the interior of the mounting groove 89 Grooving step 36 is performed. This groove 88, 89 processing step is made in the same manner as in the first step (10).

When the processing of the mounting groove 89 and the coolant flow groove 88 is completed, the ring insertion step 37 for mounting the ring 67 to the mounting groove 89 is then performed, and the ring 67 in the mounting groove 89 is performed. Performing a complete welding step 38 to fully weld and the lower flange member 75. The welding at this time also melts and joins the contact portion between the edge portion 61 of the mounting groove 89 and the ring 67 as the base metal welding. Before performing the complete welding step 38, the welding target part is washed in advance so that the base metal welding can be performed more efficiently. In all the base metal weldings described below, the foreign substances on the surface to be welded are wiped off before welding, so that the welding is performed efficiently.

Subsequently, the body mounting groove 90 is machined on the upper surface of the lower flange member 75. In addition, considering the thermal deformation caused by the lower flange member 75 due to the base metal welding to perform the finishing step 39 to finish the upper surface of the lower flange member 75 to finish the manufacture of the lower flange once. After the lower flange is manufactured, the lower flange is polished and ultrasonically cleaned, and then waited for the eighth process described later.

The third process 14 of manufacturing the wafer port 55 is a process of joining the wafer entry / exit port 66 and the connection plate 68 as shown in FIG.

For the third process 14, a connection plate manufacturing step 40 of processing the locking jaw 71 on the inner surface of the port mounting hole 69 of the connection plate 68 on which the cooling water flow path 91 is formed is performed. . Subsequently, the wafer entry and exit port 66 is inserted into the port mounting port 69, but the end of the wafer entry and exit port 66 is caught by the locking step 71 and the locking step 71 and the wafer entry and exit port 66. Perform a complete welding step 41 of completely welding. The welding here is also a base metal welding, and wipes off foreign substances on the welded part before welding. As shown in FIG. 8, the welding portion W is a locking jaw 71 and a wafer entry / exit port 66 in contact with the locking jaw 71.

Subsequently, the finishing step 42 is performed. The finishing step 42 is a machining process in consideration of the thermal deformation of the connection plate 68 generated while passing through the complete welding step 41 as a planar processing of the outer surface of the connection plate 68. The connecting plate 68 is connected to an external device to allow the wafer to enter and exit the chamber through the wafer entry / exit port 66. If the outer surface is not smooth, the chamber secures verticality when the chamber is coupled with the external device. As a result, the entire chamber may be out of balance.

Therefore, the finishing step 42 is a very important process, and not only the finishing step 42 but also the polishing step 43 is performed to machine the outer surface of the connecting plate 68 more precisely. After the wafer port 55 is manufactured through the above steps, the wafer port 55 is polished as a whole and ultrasonic cleaning is performed.

The fourth process 16 is a step of manufacturing the vacuum port 57. As shown in FIG. 9, the vacuum port 57 includes a vacuum port member 74, a connection ring 77, and a connection manifold 78. The vacuum port member 74 is formed by welding the upper plate 92, the side wall member 93, and the lower plate 94. In addition, as described above, the lower plate 94 has a manifold mounting hole 95 formed therein, and the diameter of the manifold mounting hole 95 passes through the insertion protrusion 63, which is the upper end of the connecting manifold 78, and has a locking step. 80 is formed to be caught.

In the fourth process 16, as shown in FIG. 10, the upper insertion protrusion 63 of the connecting manifold 78 is inserted into the manifold mounting hole 95 so that the insertion protrusion 63 is lower than the lower plate 94. FIG. It begins with a preparatory step 44 to protrude upwards and on the other hand to install a strain relief support 96 inside the connection manifold 78. The deformation preventing support 96 is a known auxiliary device to be inserted to prevent the cylindrical connection manifold 78 from being thermally deformed and crushed or deformed by welding heat.

The insertion depth h6 of the insertion block 63 to the lower plate 95 depends on the thickness of the connecting manifold 78 and the lower plate 95 and is approximately 3/40 to 1 of the thickness of the connecting manifold 78. It is preferable to set it as / 10.

The substrate is welded by applying heat to the insertion protrusion 63 in the ready state. At this time, the melting of the insertion protrusion 63 and the rim of the manifold fitting 95 is 30 to 40% of the edge of the manifold fitting 95 when the insertion protrusion 63 is melted 60 to 70%. It is preferred to melt. After the welding operation is completed, the vacuum port is polished and ultrasonically cleaned.

On the other hand, the first to fourth processes are processes for producing the respective parts constituting the chamber and are independent of each other, and therefore, the order from the first to the fourth process need not be kept.

The fifth to eighth processes to be described later are a full-scale process of manufacturing the chamber according to the present embodiment by combining the respective parts produced through the first to fourth processes as one.

The fifth process 18 is a process of coupling the vacuum port 57 to the chamber body 64, and includes a preparation step 46, a first welding step 47, and a second welding step 48.

In the preparation step 46, a deformation preventing support (not shown) is installed inside the chamber body 64, and as shown in FIG. 11, the deformation preventing support 96 is also provided in the vacuum port member 74. Step of inserting the front end of the vacuum port member 74 in the vacuum port installation port 73 in the state of installing the contact portion to be welded to each other.

The first welding step 47 following the preparation step 46 is a step of welding the chamber body 64 and the vacuum port member 74 but inside the chamber body 64. The welding made at this time also melts and joins the contact portion between the chamber body 64 and the vacuum port member 74 as a base material welding without using a welding rod.

Subsequently, a second welding step 48 of welding the chamber body 64 and the vacuum port member 74 to the base material on the outside of the chamber body 64 is performed. The fifth process 18 is terminated by performing the second welding step 48. Even after the fifth process 18 is completed, the deformation preventing support remains in the chamber body 64.

After coupling the vacuum port 57 to the chamber body 64, a sixth process 20 of coupling the wafer port 55 is performed. The sixth process 20 for joining the wafer ports 55 also includes a preparation step 49, a first welding step 50, and a second welding step 51.

In the preparation step 49, the deformation preventing support (not shown) is first installed in the wafer entry / exit port 66, and in particular, the deformation preventing support (97 in FIG. 12) is also installed on the outer surface of the connecting plate 68. The step of contacting the parts to be welded with each other. As described above, since the connecting plate 68 is connected to an external device, the smoothness of the connecting plate 68 is a very important element, and thus, as shown in FIGS. 12 and 13, the outer surface of the connecting plate 68 By installing two deformation preventing support 97 to prevent the deformation caused by the heat of welding.

That is, the deformation preventing support 97 is to hold the connection plate 68 by bending the transfer heat generated during welding of the wafer port 55 to the chamber body 64 so that the smoothness is not lost. In addition, the deformation preventing support 97 is installed in connection with the deformation preventing support 97 by passing a support mounting bolt through a bolt hole already formed in the connecting plate 68.

In addition, as shown in FIG. 13, the deformation preventing support 98 was further installed between each deformation preventing support 97 and the connection plate 68. The bending plate 68 is bent by the heat of welding as shown by a dotted line in FIG. 13, wherein the deformation preventing support 98 is sandwiched between the connection plate 68 and the deformation preventing support 97 to connect the connection plate ( 68) to provide a force in the direction of the arrow b to more actively prepare for thermal deformation.

When the preparation step 49 is completed, the first welding step 50 for temporarily welding the edge of the wafer entry and exit 72 and the wafer entry and exit port 66 outside the chamber body 64 is continued. This welding is a base metal welding as spot welding.

Subsequently, the second welding step 51 is continued. The second welding step 51 is a step of welding the wafer port 55 and the chamber body 64 by the base metal in the chamber body 64 to complete the bonding. After the second welding step 51 is completed and the heat of welding is cooled, the deformation preventing support 97 and the deformation preventing support provided in the wafer entry / exit port 66 are removed.

Subsequently, a balancing step 24 is performed. The balancing process 24 is a process of adjusting the horizontal and parallelism of the surface to be mounted before mounting the upper flange and the lower flange to the chamber body 64, so that the upper flange and the lower flange to be assembled are parallel to each other. . The balancing process 24 is carried out by machining by milling, and in fact, for the balancing process, the chamber body 64 is initially manufactured to have a margin sufficient for processing.

The upper and lower surfaces of the chamber body 64 completed by the balancing process are parallel to each other and the connecting plate 68 and the connecting manifold 78 fixed to the chamber body 64 are perpendicular to the upper and lower end surfaces. To achieve.

This is followed by a seventh process 22 and an eighth process 23. The seventh process 22 is a process of fixing the upper flange to the upper end of the chamber body 64, the eighth process 23 is a process of fixing the lower flange to the lower end of the chamber body (64).

The seventh process 22 and the eighth process 23 are performed simultaneously. In this process, the upper flange is first mounted on the chamber body 64 by welding the base material, and then the chamber body 64 is inverted in this state, and the bottom groove 76 of the lower flange member 75 is attached to the chamber body 64. Spot weld with)) and attach the lower flange. Since the upper and lower flanges are mounted, the deformation of the chamber body 64 by the complete welding described later does not occur.

After the upper and lower flanges are mounted, the chamber body 64 is turned upside down and the lower flange and the chamber body 64 are completely welded. The complete welding at this time is also the base metal welding and is performed inside the chamber body 64. Then the upper flange is completely welded.

FIG. 14 is a view showing a state where the engaging jaw 83 formed on the inner circumferential surface of the upper flange member 54 is placed on and contacted with the upper end of the chamber body 64. In the above state, the locking jaw 83 and the upper end of the chamber body 64 are melted, and the chamber body 64 and the upper flange member 54 are integrally welded together. On the other hand, since the heat dissipation groove 84 is formed in the lower portion of the locking step 83, the welding heat to be transferred to the upper flange member 54 is released in the direction of the arrow c does not cause deformation of the upper flange member 54.

After the assembly of the chamber is completed as described above, the inner and outer surfaces of the chamber are polished as a finishing process, and ultrasonic drying and alcohol washing are performed, followed by drying to completely finish the work.

As mentioned above, although this invention was demonstrated in detail through the specific Example, this invention is not limited to the said Example, A various deformation | transformation is possible for a person with ordinary knowledge within the scope of the technical idea of this invention.

According to the present invention made as described above, the welding of each part constituting the chamber is used as the base material welding, and the welding surface is clean, and the micro deformation does not occur due to the welding, and there is no defect of the chamber by welding. In the fabrication of the chamber, in order to use the thermal deformation prevention support in consideration of the thermal deformation of each member due to welding, there is no torsion of each part of the chamber, so the size and dimensions of the chamber are uniform, and there is no need to reprocess the chamber.

Claims (8)

The first step of manufacturing the upper flange by forming the cooling water flow path and the O-ring groove in the upper flange member, the second process of forming the lower flange by forming the cooling water flow path in the lower flange member, and welding the connecting plate to the wafer entry port The third step of manufacturing the wafer port, the fourth step of manufacturing the vacuum port by welding the connecting manifold to the vacuum port member, and the vacuum port in the vacuum port mounting hole of the chamber body where the wafer entry and exit ports and the vacuum port mounting hole are formed. A fifth process of welding, a sixth process of welding a wafer port to the wafer inlet and outlet, a seventh process of welding an upper flange to an upper end of the chamber body, and an eighth process of welding a lower flange to a lower end of the chamber die In the wafer manufacturing chamber manufacturing method comprising a step, Each welding is a base metal welding which melts and welds a base metal to be bonded to each other without using a welding rod, and machining the upper and lower surfaces of the chamber body 64 between the sixth and seventh processes. It further comprises a balancing process 24 to match the mutual parallelism, the welding of the upper flange and the lower flange to the chamber body 64, the upper flange is welded to the top of the chamber body 64 and the lower flange chamber After welding the lower end of the body 64, the lower end and the lower flange of the chamber body 64 is completely welded to the inside of the chamber body, the wafer characterized in that the welding is completely welded to the upper end and the upper flange of the chamber body Process chamber manufacturing method. The method of claim 1, wherein the first step (10) (a) a groove processing step (25) of digging the mounting groove (82) on the bottom of the upper flange member (54) and processing the cooling water flow groove (81) in the mounting groove (82); (b) a vertical passage forming step (26) for processing and forming one vertical passage (85) passing through the upper flange member (54) in the cooling water flow groove (81); (c) Insertion of the insertion block 58 having the gas passage 86 communicating with the vertical passage 85 is completely attached to the mounting groove 82 and the cooling water flow groove 81 in the lower portion of the vertical passage 85. Block installation step 27; (d) Vertical through holes 62 are formed at both ends, respectively, and are fitted in the mounting grooves 82, but not in contact with the coolant flow grooves 81, thereby forming a flow passage between the coolant flow grooves 81. A ring insertion step 28 of fitting the ring 60 to the mounting groove 82; (e) A first welding step of welding the base block at both ends of the insertion block 58 and the ring 60 and welding the insertion block 58 and the ring 60 to the base flange with respect to the upper flange member 54. (29); (f) a first finishing step 30 for flatly finishing the bottom of the upper flange member 54 which has passed through the first welding step 29 through machining; (g) The edge 61 and the insertion block of the mounting groove 82 to completely couple the insertion block 58 and the ring 60 welded in the grooves 81 and 82 to the upper flange member 54. 58) and a complete welding step 31 for welding the base material to the ring 60; (h) a second finishing step 32 for flattening the bottom surface of the upper flange member 54 in which the complete welding step 31 is performed through machining; (i) a tube welding step (33) for connecting the cooling water flow grooves (81) to the outside by welding the tubes to the two vertical through holes (62) formed in the ring (60), respectively; (j) O-ring groove processing step 34 to process two rows of O-ring grooves 56 parallel to the upper surface of the upper flange member 54, the vertical passage (85) is located between the O-ring grooves (56). ) And (k) a locking jaw 83 is formed on the inner circumferential surface of the upper flange member 54 to span the upper end of the chamber body 64, and an upper end of the chamber body 64 is located below the locking jaw 83; Wafer processing chamber manufacturing method characterized in that it comprises an inner peripheral surface processing step (35) for further forming a heat dissipation groove (84) spaced apart from the outer peripheral surface. The method of claim 1, wherein the second step 12 (a) a groove processing step 36 of digging the mounting groove 89 on the bottom of the lower flange member 75 and processing the coolant flow groove 88 in the mounting groove 89; (b) a ring insertion step 37 for inserting a ring 67 having a plurality of vertical through holes 62 into the mounting groove 89 to form a flow path between the cooling water flow grooves 88; ; (c) a complete welding step (38) for welding the lower flange member (75) and the ring (67) to the base material; (d) digging the body mounting groove 76 into which the lower end of the chamber body 64 is inserted into the upper surface of the lower flange member 75 in the fully welded state, and flatly finishing the upper surface of the lower flange member 75. Wafer processing chamber manufacturing method comprising a finishing step (39). The method of claim 1, wherein the third step (14) (a) A connection plate manufacturing step of forming a cooling water flow path 91 in the connection plate 68 and a locking jaw 71 in which the end of the wafer entry and exit port 66 is in close contact with the port fitting hole 69 in the center thereof. 40; (b) a complete welding step (41) for inserting an end of the wafer entry / exit port (66) into the port mounting opening (69) and welding the base material of the engaging jaw (71) portion and the end of the wafer entry / exit port (66); (c) a finishing step 42 for planarizing the outer surface of the connecting plate 68 having completed the complete welding step 41; and (d) a polishing step (43) for polishing the flatly finished surface through the finishing step (42). The method of claim 1, wherein the fourth process (16) (a) A locking jaw 80 is formed on the upper outer circumferential surface of the connecting manifold 78, and the locking jaw 80 is inserted to support the rim of the manifold mounting hole 95 of the vacuum port member 74. An insertion protrusion 63, which is an upper end of the fold 78, protrudes into the vacuum port member 74, and a preparation step 44 for inserting a deformation preventing support into the connection manifold 78; (b) the edges of the insertion protrusion 63 and the manifold fitting 95 are welded together, but the melt ratio of the base material is 60 to 70% of the insertion protrusion 63 and the edge of the manifold fitting 95 is 30 to 70%. Wafer processing chamber manufacturing method comprising a welding step (45) to be 40%. The method of claim 1, wherein the fifth step (18) (a) A deformation preventing support is provided in the chamber body 64 to prevent thermal deformation of the chamber body 64, and is also deformed between the upper plate 92 and the lower plate 94 of the vacuum port member 74. A preparation step 46 for contacting the edges of the vacuum port mounting tool 73 and the edge portion of the vacuum port member 74 with the prevention support member inserted therein; (b) a first welding step 47 for welding the base material of the vacuum port member 74 and the edge of the vacuum port installation port 73 inside the chamber body 64; (c) a method for fabricating a wafer processing chamber, comprising a second welding step 48 for welding the base member 74 and the vacuum port installation port 73 on the outside of the chamber body 64 again. The method of claim 1, wherein the sixth step (20) (a) Installing a deformation prevention support inside the wafer entry and exit port 66, fixing the deformation prevention support 97 to the outer surface of the connecting plate 68, and forming the wafer entry and exit port 66 at the edge of the wafer entry and exit 72. A preparation step 49 for positioning the ends to be in contact with each other; (b) a first welding step (50) for spot welding the base material on the outside of the chamber body (64) between the wafer entry and exit port (66) and the wafer entrance and exit port (72); (c) a wafer processing chamber fabrication comprising a second welding step 51 for completing the bonding by welding the wafer entry port 66 and the wafer entrance and exit 72 to the inside of the chamber body 64. Way. The method of claim 1, In the seventh process of coupling the upper flange to the chamber body 64, the locking jaw 83 formed on the inner circumferential surface of the upper flange member 54 is positioned to be caught by an upper end of the chamber body 64, and the locking jaw ( 83) and a process for welding the base material of the upper end of the chamber body (64).