KR20000020612A - Scrubber for manufacturing semiconductor - Google Patents

Scrubber for manufacturing semiconductor Download PDF

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Publication number
KR20000020612A
KR20000020612A KR1019980039282A KR19980039282A KR20000020612A KR 20000020612 A KR20000020612 A KR 20000020612A KR 1019980039282 A KR1019980039282 A KR 1019980039282A KR 19980039282 A KR19980039282 A KR 19980039282A KR 20000020612 A KR20000020612 A KR 20000020612A
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KR
South Korea
Prior art keywords
chamber
oxidation
scrubber
oxidation catalyst
exhaust gas
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KR1019980039282A
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Korean (ko)
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KR100539454B1 (en
Inventor
고혁준
이기성
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윤종용
삼성전자 주식회사
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Priority to KR1019980039282A priority Critical patent/KR100539454B1/en
Publication of KR20000020612A publication Critical patent/KR20000020612A/en
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Publication of KR100539454B1 publication Critical patent/KR100539454B1/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D53/00Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
    • B01D53/34Chemical or biological purification of waste gases
    • B01D53/74General processes for purification of waste gases; Apparatus or devices specially adapted therefor
    • B01D53/86Catalytic processes
    • B01D53/8621Removing nitrogen compounds
    • B01D53/8634Ammonia
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D53/00Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
    • B01D53/34Chemical or biological purification of waste gases
    • B01D53/74General processes for purification of waste gases; Apparatus or devices specially adapted therefor
    • B01D53/86Catalytic processes
    • B01D53/8671Removing components of defined structure not provided for in B01D53/8603 - B01D53/8668
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4412Details relating to the exhausts, e.g. pumps, filters, scrubbers, particle traps
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02CCAPTURE, STORAGE, SEQUESTRATION OR DISPOSAL OF GREENHOUSE GASES [GHG]
    • Y02C20/00Capture or disposal of greenhouse gases
    • Y02C20/30Capture or disposal of greenhouse gases of perfluorocarbons [PFC], hydrofluorocarbons [HFC] or sulfur hexafluoride [SF6]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Biomedical Technology (AREA)
  • Analytical Chemistry (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Health & Medical Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Exhaust Gas Treatment By Means Of Catalyst (AREA)

Abstract

PURPOSE: A method for a scrubber to manufacturing semiconductor is provided to dispose of waste gas regardless of an oxidized chamber's working. CONSTITUTION: An oxidized chamber(1) is connected to a scrubber and an oxidized catalytic room are linked to the scrubber in a raw so that the oxidized chamber may put the waste gas heading toward the oxidized chamber to the oxidized catalytic room(6) via the first branched line separated from an incoming line for waste gas(11) in the case dregs accumulate inside a heater or the heater cannot work on. Whereby, the toxicity within the waste gas is converted to harmless oxides in the shape of fume, and the oxides and the waste gas are emitted into air through cooling process, separating process, and pressurizing process. The third incoming line(8) for air and an air-blower are linked with the oxidized catalytic room so that additional air may is supplied to the oxidized catalytic room(6).

Description

반도체장치 제조설비용 스크러버Scrubber for semiconductor device manufacturing equipment

본 발명은 반도체장치 제조설비로부터 방출되는 배기가스 중에 포함된 화학물질들을 제거하기 위한 스크러버에 관한 것이다. 보다 상세하게는 본 발명은 반도체장치 제조설비로부터 방출되는 배기가스 중에 포함된 화학물질들을 산화시켜 산화물의 분진상태로 고화시킨 후, 고화된 분진형태의 화학물질을 배기가스로부터 분리하여 제거하는 스크러버에 관한 것이다.The present invention relates to a scrubber for removing chemicals contained in exhaust gas emitted from a semiconductor device manufacturing facility. More specifically, the present invention is a scrubber for oxidizing the chemicals contained in the exhaust gas discharged from the semiconductor device manufacturing equipment to solidify in the form of oxide dust, and then separate and remove the chemical substance in the form of solidified dust from the exhaust gas It is about.

반도체장치의 제조를 위하여는 각종의 공정가스들이 사용되며, 사용된 공정가스들 중에는 미반응의 독성가스들이 배기가스에 포함되어 방출되는 경우가 많으며, 이러한 미반응의 독성가스들은 주로 산화 등에 의하여 산화시켜 산화물의 분진형태로 고화시킨 후, 사이클론 등으로 포집한 후, 배출하고 있다.Various types of process gases are used for the manufacture of semiconductor devices, and among the used process gases, unreacted toxic gases are often included in the exhaust gas, and these unreacted toxic gases are mainly oxidized by oxidation. After the solidification is carried out in the form of an oxide dust, it is collected by a cyclone or the like and then discharged.

종래의 경우, 이를 위하여 도 1에 도시한 바와 같은 스크러버를 사용하여 왔다. 이는 크게 산화챔버(1)와 제1사이클론(2), 제2사이클론(3) 및 송풍기(4)로 이루어지며, 상기 산화챔버(1)의 상단에는 배기가스인입관(11)과 질소가스인입관(12) 및 제1공기인입관(13)이 연결되고, 상기 산화챔버(1)의 하단에는 냉각챔버(14)가 취부되며, 이 냉각챔버(14)에는 제2공기인입관(16)과 냉각수순환관(17)이 연결되며, 상기 냉각챔버(14)의 하단에는 제1포집통(15)이 취부되어 이루어지며, 상기 배기가스인입관(11)을 경유하여 유입된 배기가스는 제1공기인입관(13)을 경유하여 유입된 공기와 혼합되어 산화챔버(1)내에서 600 내지 700℃의 온도로 가열, 산화되어 배기가스들 중에 포함된 독성가스들(예를 들면, 실란(SiH4) 등)이 산화되고, 산화 후에는 산화된 배기가스가 냉각챔버(14)로 유입되어 여기에서 냉각수순환관(17)을 경유하여 유입된 냉각수에 의하여 냉각되어 산화물의 분진형태로 고화된 화학물질들이 1차로 제1포집통(15)으로 분리되며, 1차분리 후의 배기가스는 상기 냉각챔버(14)와 제1사이클론(2)을 서로 연결하는 제1이송관(18)을 경유하여 제1사이클론(2)으로 유입된 후, 여기에서 고속으로 회전되면서 미분리된 분진들이 2차분리하여 분리된 분진을 제2포집통(21)으로 분리되고, 2차분리 후 상기 제1사이클론(2)과 제2사이클론(3)을 서로 연결하는 제2이송관(22)을 경유하여 제2사이클론(3)으로 유입된 후, 재차 고속으로 회전되면서 미분리된 분진들이 추가로 3차분리하여 분리된 분진을 제3포집통(31)으로 분리되고, 최종적으로 배기가스들은 전동모터(41)에 연결되어 회전되는 송풍기(4)에 의하여 추진되어 배출관(5)을 통하여 대기중으로 배출되었다.In the conventional case, a scrubber as shown in FIG. 1 has been used for this purpose. It is composed of the oxidation chamber 1, the first cyclone (2), the second cyclone (3) and the blower (4), the exhaust gas inlet pipe (11) and nitrogen gas at the upper end of the oxidation chamber (1) The inlet pipe 12 and the first air inlet pipe 13 are connected, and a cooling chamber 14 is attached to the lower end of the oxidation chamber 1, and the second air inlet pipe 16 is attached to the cooling chamber 14. And a cooling water circulation pipe 17 are connected to each other, and a first collecting container 15 is mounted at a lower end of the cooling chamber 14, and the exhaust gas introduced through the exhaust gas inlet pipe 11 is formed. 1) Toxic gases (eg, silanes) contained in the exhaust gases are mixed with the air introduced through the air inlet pipe 13 and heated and oxidized in the oxidation chamber 1 to a temperature of 600 to 700 ° C. SiH 4), etc.) is oxide, after cooling by the exhaust gas is oxidized is introduced into the cooling chamber 14 via the cooling water circulation pipe 17 where the cooling water inlet The chemical solidified in the form of oxide dust is first separated into the first collecting container 15, and the exhaust gas after the first separation is connected to the cooling chamber 14 and the first cyclone 2. After flowing into the first cyclone (2) via the transfer pipe (18), while being rotated at a high speed here, the separated dust is secondarily separated to separate the separated dust into a second collecting container (21), 2 After the separation, the first cyclone (2) and the second cyclone (3) are introduced into the second cyclone (3) via the second transport pipe (22) connected to each other, and then rotated at a high speed again and not separated The dust is further separated by tertiary separation, and the separated dust is separated into the third collecting container 31. Finally, the exhaust gases are driven by the blower 4 which is connected to the electric motor 41 and rotated to discharge the discharge pipe 5. Through the atmosphere.

그러나, 이러한 종래의 스크러버의 경우, 히터가열방식으로 동작되기 때문에 히터내부에 분진이 퇴적되거나, 고장에 의한 운전정지, 기타 유지, 보수 등의 경우에는 동작이 불가능하기 때문에 스크러버를 운전정지시켜야만 하였으며, 그에 따라 배기가스를 적절히 처리하지 못하게 되어 전반적인 스크러버는 물론 이에 연결된 반도체장치 제조설비의 가동을 중단시켜야만 하였으므로 전반적인 설비가동율이 저하되는 문제점이 있었다.However, in the case of such a conventional scrubber, the scrubber had to be stopped because dust is accumulated inside the heater and the operation is not possible in the case of operation stop due to a failure or other maintenance or repair because the heater is operated by a heater heating method. As a result, the exhaust gas cannot be properly disposed, and therefore, the overall scrubber and the semiconductor device manufacturing facilities connected thereto have to be shut down.

본 발명의 목적은 산화챔버의 가동여부에 무관하게 배기가스를 연속적으로 처리할 수 있는 반도체장치 제조설비용 스크러버를 제공하는 데 있다.SUMMARY OF THE INVENTION An object of the present invention is to provide a scrubber for manufacturing a semiconductor device which can continuously process exhaust gas regardless of whether the oxidation chamber is operated.

도 1은 종래의 반도체장치 제조설비용 스크러버를 개략적으로 도시한 구성도이다.1 is a block diagram schematically illustrating a conventional scrubber for manufacturing a semiconductor device.

도 2는 본 발명의 일 실시예에 따른 반도체 제조설비용 스크러버를 개략적으로 도시한 구성도이다.Figure 2 is a schematic diagram showing a scrubber for semiconductor manufacturing equipment according to an embodiment of the present invention.

도 3은 본 발명의 다른 실시예에 따른 반도체 제조설비용 스크러버를 개략적으로 도시한 구성도이다.Figure 3 is a schematic diagram showing a scrubber for semiconductor manufacturing equipment according to another embodiment of the present invention.

※ 도면의 주요부분에 대한 부호의 설명※ Explanation of code for main part of drawing

1 : 산화챔버 2 : 제1사이클론1: oxidation chamber 2: first cyclone

3 : 제2사이클론 4 : 송풍기3: second cyclone 4: blower

5 : 배출관 6 : 산화촉매실5: discharge pipe 6: oxidation catalyst chamber

7 : 필터 8 : 제3공기인입관7: Filter 8: 3rd air inlet pipe

11 : 배기가스인입관 12 : 질소가스인입관11: exhaust gas inlet pipe 12: nitrogen gas inlet pipe

13 : 제1공기인입관 14 : 냉각챔버13: 1st air inlet pipe 14: cooling chamber

15 : 제1포집통 16 : 제2공기인입관15: 1st collection container 16: 2nd air inlet pipe

17 : 냉각수순환관 18 : 제1이송관17: cooling water circulation pipe 18: the first transfer pipe

21 : 제2포집통 22 : 제2이송관21: 2nd collection container 22: 2nd transfer pipe

31 : 제3포집통 41 : 전동모터31: third collecting container 41: electric motor

61 : 제3이송관 62 : 제4유로변경밸브61: 3rd transfer pipe 62: 4th flow path change valve

81 : 공기블로워 111 : 제1유로변경밸브81: air blower 111: first flow path change valve

112 : 제1분지관 113 : 배기가스단속밸브112: first branch pipe 113: exhaust gas control valve

114 : 제1분지단속밸브 131 : 제5유로변경밸브114: first branch control valve 131: fifth flow path change valve

132 : 제2분지관 133 : 에어밸브132: second branch pipe 133: air valve

181 : 제2유로변경밸브 221 : 제3유로변경밸브181: second flow path change valve 221: third flow path change valve

본 발명에 따른 반도체장치 제조설비용 스크러버는, 산화챔버와 분진분리용 사이클론을 포함하여 구성되는 스크러버에 있어서, 상기 산화챔버에 대하여 산화촉매실을 병렬로 연결시키고, 이들 산화챔버와 산화촉매실을 상기 사이클론에 연결시켜 이루어진다.In the scrubber for semiconductor device manufacturing equipment according to the present invention, in a scrubber comprising an oxidation chamber and a dust separation cyclone, an oxidation catalyst chamber is connected to the oxidation chamber in parallel, and the oxidation chamber and the oxidation catalyst chamber are connected. By connecting to the cyclone.

이하, 본 발명의 구체적인 실시예를 첨부한 도면을 참조하여 상세히 설명한다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

도 2에 개략적으로 도시한 바와 같이, 본 발명에 따른 반도체장치 제조설비용 스크러버는, 산화챔버(1)와 분진분리용 사이클론을 포함하여 구성되는 스크러버에 있어서, 배기가스 중에 포함될 수 있는 유독가스를 산화시켜 고상의 산화물로 전환시키는 산화챔버(1)에 더하여 상기 산화챔버(1)와 병렬로 산화촉매실(6)을 더 연결시키고, 고상의 산화물을 배기가스로부터 분리하여 정화된 배기가스가 배출관(5)을 통하여 대기중으로 배출되도록 이루어짐을 특징으로 한다.As schematically shown in FIG. 2, a scrubber for manufacturing a semiconductor device according to the present invention, in a scrubber including an oxidation chamber 1 and a dust separation cyclone, may contain toxic gases that may be included in exhaust gas. In addition to the oxidation chamber 1 for oxidizing and converting into a solid oxide, an oxidation catalyst chamber 6 is further connected in parallel with the oxidation chamber 1, and the exhaust gas purified by separating the solid oxide from the exhaust gas is discharged. (5) characterized in that made to be discharged into the atmosphere.

따라서, 산화챔버(1)로 배기가스를 공급하기 위한 배기가스인입관(11)은 상기 산화챔버(1)와 상기 산화촉매실(6)로 연결되어야 하며, 이는 상기 배기가스인입관(11)으로부터 분지되는 제1분지관(112)에 상기 산화촉매실(6)을 연결하고, 원래의 배기가스인입관(11)은 산화챔버(1)에 연결하는 것에 의하여 달성될 수 있다.Therefore, the exhaust gas inlet pipe 11 for supplying the exhaust gas to the oxidation chamber 1 should be connected to the oxidation chamber 1 and the oxidation catalyst chamber 6, which is the exhaust gas inlet pipe 11. By connecting the oxidation catalyst chamber 6 to the first branch pipe 112 branched from, the original exhaust gas inlet pipe 11 can be achieved by connecting to the oxidation chamber 1.

상기 산화챔버(1)에는 종래의 스크러버에서와 같이 질소가스인입관(12)과, 산화를 위한 제1공기인입관(13), 상기 산화챔버(1)의 하단에 취부되는 냉각챔버(14) 및 냉각챔버(14)에 연결된 제2공기인입관(16)과 냉각수순환관(17) 및 상기 냉각챔버(14)의 하단에 취부되는 제1포집통(15)들이 포함될 수 있다. 따라서, 상기 배기가스인입관(11)을 경유하여 상기 산화챔버(1)로 유입되는 배기가스는 상기 제1공기인입관(13)을 경유하여 유입되는 공기와 혼합된 후, 상기 산화챔버(1)내에서 적절한 온도, 예를 들어 600 내지 700℃ 정도의 온도범위로 가열되어 상기 배기가스 중 독성가스들을 산화시킨 후, 산화된 배기가스를 상기 산화챔버(1)의 하단에 취부된 냉각챔버(14)로 유입시키면, 상기 냉각챔버(14)를 경유하여 흐르는 냉각수의 순환에 의하여 냉각되어 산화물 분진이 분리되어 제1포집통(15)에 수집되고, 보다 미세한 분진을 포함한 배기가스는 상기 냉각챔버(14)와 제1사이클론(2) 사이를 서로 연결하는 제1이송관(18)을 경유하여 제1사이클론(2)으로 도입되어 그 내부에서 고속으로 회전하는 와류를 형성시켜 상기 냉각챔버(14)에서 미분리된 보다 미세한 분진을 다시 제2포집통(21)으로 수집하고, 보다 미세한 분진들은 유사하게 제2사이클론(3)으로 유입되어 동일한 분진분리과정을 거친 후, 상기 제2사이클론(3)의 상단에 취부된 송풍기(4)에 의하여 배출관(5)을 경유하여 대기중으로 배출되게 된다.As in the conventional scrubber, the oxidation chamber 1 has a nitrogen gas inlet tube 12, a first air inlet tube 13 for oxidation, and a cooling chamber 14 mounted at a lower end of the oxidation chamber 1. And a second air inlet pipe 16 connected to the cooling chamber 14, a cooling water circulation pipe 17, and a first collecting container 15 mounted at a lower end of the cooling chamber 14. Therefore, the exhaust gas introduced into the oxidation chamber 1 via the exhaust gas inlet pipe 11 is mixed with the air introduced through the first air inlet pipe 13 and then the oxidation chamber 1 ) To oxidize the toxic gases in the exhaust gas by heating to an appropriate temperature, for example, a temperature range of about 600 to 700 ℃, and the oxidized exhaust gas is mounted in the cooling chamber (the lower end of the oxidation chamber 1) 14), it is cooled by the circulation of the cooling water flowing through the cooling chamber 14, the oxide dust is separated and collected in the first trap 15, the exhaust gas containing finer dust is the cooling chamber It is introduced into the first cyclone (2) via the first transfer pipe (18) connecting the (14) and the first cyclone (2) to each other to form a vortex that rotates at a high speed therein The finer particles which have not been separated in the cooling chamber 14 are collected again into the second collecting container 21, and the finer particles are similarly introduced into the second cyclone 3 to undergo the same dust separation process. The blower 4 mounted on the upper end of the second cyclone 3 is discharged into the atmosphere via the discharge pipe 5.

따라서, 본 발명에서는 상기한 바와 같이 산화챔버(1)와 병렬로 산화촉매실(6)을 더 연결시키므로써 상기 산화챔버(1)가 히터내부에의 분진의 퇴적이나, 고장에 의한 운전정지, 기타 유지, 보수 등의 경우에는 동작이 불가능한 경우에는 상기 산화챔버(1)로 공급되던 배기가스를 상기 배기가스인입관(11)으로부터 분지된 제1분지관(112)을 경유하여 상기 산화촉매실(6)로 공급하여, 상기 산화촉매실(6)내에서 배기가스 중의 독성가스들이 산화되도록 한 점에 특징이 있다고 할 수 있다. 상기 산화촉매실(6)내에는 실란 등과 같이 반도체장치 제조공정에서 주로 사용되는 유기화학물질들의 산화를 촉매하는 산화촉매가 투입되어 있으며, 상기 산화촉매들은 본 발명에 따른 스크러버가 설치되는 반도체장치 제조설비에서 사용되는 공정가스에 따라 달라질 수 있으며, 당해 기술분야에서 통상의 지식을 가진 자에게는 공정가스의 적절한 산화를 촉매할 수 있는 산화촉매를 선택하여 사용할 수 있음은 당연히 이해될 수 있는 것이며, 본 발명이 산화촉매의 종류에 의하여 제한되는 것이 아님은 당연히 이해될 수 있는 것이다. 특히, 상기 산화촉매로는 실란(SiH4), 포스핀(PH3) 및 암모늄(NH3) 등의 산화를 촉매하는 산화촉매가 사용될 수 있다.Therefore, in the present invention, by further connecting the oxidation catalyst chamber 6 in parallel with the oxidation chamber 1 as described above, the oxidation chamber 1 stops operation due to accumulation of dust in the heater or failure. In the case of other maintenance, repair, etc., if the operation is impossible, the oxidation catalyst chamber is supplied via the first branch pipe 112 branched from the exhaust gas inlet pipe 11 to the exhaust gas supplied to the oxidation chamber 1. Supplying to (6), it can be said that the toxic gas in the exhaust gas is oxidized in the oxidation catalyst chamber (6). In the oxidation catalyst chamber 6, an oxidation catalyst catalyzing the oxidation of organic chemicals mainly used in a semiconductor device manufacturing process, such as silane, is introduced, and the oxidation catalysts are manufactured by manufacturing a semiconductor device in which a scrubber according to the present invention is installed. It can be understood that it can vary depending on the process gas used in the equipment, and those skilled in the art can select and use an oxidation catalyst capable of catalyzing the proper oxidation of the process gas. It is to be understood that the invention is not limited by the type of oxidation catalyst. In particular, the oxidation catalyst may be an oxidation catalyst for catalyzing the oxidation of silane (SiH 4 ), phosphine (PH 3 ) and ammonium (NH 3 ).

상기 산화촉매실(6)의 전, 후에는 필터(7)가 더 취부될 수 있으며, 이 필터(7)는 상용적으로 구입하여 사용할 수 있을 정도로 공지된 것을 구입하여 사용할 수 있는 것이다.The filter 7 may be further mounted before and after the oxidation catalyst chamber 6, and the filter 7 may be purchased and used so as to be commercially available.

상기 산화촉매실(6)은 상기 산화챔버(1)에 연결된 배기가스인입관(11)으로부터 유로변경밸브를 경유하여 분지되어 연결될 수 있으며, 상기 산화촉매실(6)에는 별도의 공기인입관이 더 연결될 수 있다. 이 공기인입관은 상기한 제1공기인입관(13)으로부터 분지되어 상기 산화촉매실(6)에 연결될 수 있으며, 또한 별도의 공기인입관에 공기블로워(81)를 취부시켜 연결될 수도 있다.The oxidation catalyst chamber 6 may be branched from the exhaust gas inlet pipe 11 connected to the oxidation chamber 1 via a flow path change valve, and a separate air inlet pipe may be provided in the oxidation catalyst room 6. Can be further connected. The air inlet pipe may be branched from the first air inlet pipe 13 to be connected to the oxidation catalyst chamber 6, or may be connected to an air blower 81 by attaching it to a separate air inlet pipe.

상기 산화챔버(1)에는 분진분리용 사이클론이 2개 이상 연결될 수 있으며, 특히 이들은 연결관들을 경유하여 순차적으로 연결될 수 있다. 특히, 상기 산화챔버(1)와 산화촉매실(6)이 유로변경밸브들에 의하여 상기 사이클론들 중 어느 하나에 선택적으로 연결될 수 있다.Two or more cyclones for dust separation may be connected to the oxidation chamber 1, and in particular, they may be sequentially connected via connecting tubes. In particular, the oxidation chamber 1 and the oxidation catalyst chamber 6 may be selectively connected to any one of the cyclones by flow channel change valves.

본 발명의 일 실시예에 따르면, 도 2에 도시한 바와 같이, 배기가스인입관(11)과 그에 취부된 배기가스단속밸브(113)를 경유하여 배기가스가 산화챔버(1)로 유입되면, 상기 산화챔버(1)에 연결된 제1공기인입관(13)을 경유하여 유입된 공기와 함께 산화챔버(1)내에서 600 내지 700℃의 온도로 가열되면서 산화되어 독성가스를 무해한 분진형태의 산화물로 전환시키고, 이를 냉각챔버(14)로 유입시켜 냉각챔버(14)에 연결된 제2공기인입관(16)을 경유하여 유입되는 공기에 의한 희석과 냉각수순환관(17)에 의한 냉각에 의하여 분진이 분리되어 제1포집통(15)으로 수집되고, 잔여의 미분리된 미세한 분진들과 배기가스는 상기 냉각챔버(14)에 연결된 제1이송관(18)을 경유하여 제1사이클론(2)으로 유입되어 미세한 분진들이 상기 제1사이클론(2)내에서 분리되도록 하여 분리된 분진들은 제2포집통(21)으로 수집하고, 잔여의 보다 미세한 분진들과 배기가스는 계속해서 제2이송관(22)을 경유하여 제2사이클론(3)으로 유입시켜 여기에서 보다 미세한 분진들이 상기 제2사이클론(3)내에서 분리되도록 하여 분리된 분진들은 제3포집통(31)으로 수집하고, 잔여의 배기가스는 상기 제2사이클론(3)의 상단에 취부된 송풍기(4)와 이를 구동시키는 전동모터(41)에 의하여 가압하여 배출관(5)을 통하여 대기중으로 배출시킨다.According to an embodiment of the present invention, as shown in FIG. 2, when the exhaust gas flows into the oxidation chamber 1 via the exhaust gas inlet pipe 11 and the exhaust gas control valve 113 attached thereto, Oxides in dusty form that are oxidized and harmless to toxic gases by heating to a temperature of 600 to 700 ° C in the oxidation chamber 1 together with the air introduced through the first air inlet pipe 13 connected to the oxidation chamber 1 To the cooling chamber 14 and dust by dilution by air introduced through the second air inlet pipe 16 connected to the cooling chamber 14 and cooling by the cooling water circulation pipe 17. This is separated and collected in the first collecting container (15), the remaining fine particles and the exhaust gas is first cyclone (2) via the first transfer pipe (18) connected to the cooling chamber (14) Fine dust entering the The separated dusts are separated in the first cyclone 2 and collected in the second collecting container 21, and the remaining finer dusts and exhaust gas are continuously passed through the second conveying pipe 22. The finer dusts are introduced into the second cyclone 3 so that finer dusts are separated in the second cyclone 3, and the separated dusts are collected in the third collecting container 31, and the remaining exhaust gas is collected in the second cyclone 3. Pressurized by the blower 4 mounted on the upper end of the cyclone (3) and the electric motor 41 for driving it to be discharged to the atmosphere through the discharge pipe (5).

한편, 상기 산화챔버(1)의 가동을 정지시키고자 하는 경우, 상기 배기가스인입관(11)으로부터 분지된 제1분지관(112)을 경유하여 상기 산화촉매실(6)로 배기가스가 인입되도록 상기 배기가스인입관(11)과 제1분지관(112) 사이에 취부된 제1유로변경밸브(111)를 동작시키고, 계속해서 상기 제1공기인입관(13)으로부터 분지되는 제2분지관(132)을 경유하여 공기가 흐를 수 있도록 제5유로변경밸브(131)를 동작시키면 상기 제1분지관(112)을 통하여 산화촉매실(6)로 유입되는 배기가스를 상기 산화촉매실(6)내의 산화촉매에 의하여 산화시키고, 계속해서 종래와 동일 또는 유사하게 제1사이클론(2) 및/또는 제2사이클론(3)에 의하여 분진형태의 산화물을 분리하여 제2포집통(21) 및/또는 제3포집통(31)내로 수집할 수 있다. 이때, 상기 배기가스인입관(11)에 취부된 배기가스단속밸브(113)는 폐쇄하고, 반대로 상기 제1분지관(112)에 취부된 제1분지단속밸브(114)는 개방시켜 배기가스가 산화촉매실(6)로만 흐르도록 조절할 수 있다. 또한, 상기 제2분지관(132)에는 에어밸브(133)가 취부되어 역시 공기의 흐름을 단속할 수 있다.On the other hand, when it is desired to stop the operation of the oxidation chamber 1, the exhaust gas is introduced into the oxidation catalyst chamber 6 via the first branch pipe 112 branched from the exhaust gas inlet pipe 11. The first flow path change valve 111 mounted between the exhaust gas inlet pipe 11 and the first branch pipe 112 is operated so that the second minute branched from the first air inlet pipe 13 is continued. When the fifth flow path change valve 131 is operated to allow air to flow through the branch pipe 132, the exhaust gas flowing into the oxidation catalyst chamber 6 through the first branch pipe 112 is transferred to the oxidation catalyst chamber ( 6) oxidize by oxidation catalyst, and then separate the oxide of dust form by the first cyclone (2) and / or the second cyclone (3) in the same or similar manner as in the prior art to the second trap 21 and And / or may be collected into a third collecting container 31. At this time, the exhaust gas regulating valve 113 mounted on the exhaust gas inlet pipe 11 is closed, and on the contrary, the first branch regulating valve 114 mounted on the first branch pipe 112 is opened to exhaust the gas. It can be adjusted to flow only into the oxidation catalyst chamber (6). In addition, an air valve 133 is mounted to the second branch pipe 132 to control the flow of air.

한편, 상기 산화촉매실(6)은 제3이송관(61)을 경유하여 제1사이클론(2) 및/또는 제2사이클론(3)과 선택적으로 연결될 수 있으며, 상기 제1사이클론(2)으로 연결시키고자 할 때에는 상기 제3이송관(61)에 취부된 제4유로변경밸브(62)를 상기 제1이송관(18)에 취부된 제2유로변경밸브(181) 쪽으로 연결시키고, 상기 제2사이클론(3)으로 연결시키고자 할 때에는 상기 제4유로변경밸브(62)를 상기 제2이송관(22)에 취부된 제3유로변경밸브(221) 쪽으로 연결시킬 수 있다. 그에 따라, 상기 산화촉매실(6)과 제1사이클론(2)을 연결시키고자 하는 경우, 상기 제2유로변경밸브(181)는 상기 냉각챔버(14)와 제1사이클론(2)의 연결상태를 해제하고, 산화촉매실(6)에 연결된 제3이송관(61)으로부터 유입되는 배기가스를 상기 제1사이클론(2) 쪽으로 흐르도록 전환될 수 있다. 또한, 유사한 방법으로 상기 산화촉매실(6)과 제2사이클론(3)을 연결시키고자 하는 경우에도, 상기 제4유로변경밸브(62)와 상기 제3유로변경밸브(221)를 순차적으로 전환시켜 상기 산화촉매실(6)과 상기 제2사이클론(3)을 직접 연결시킬 수 있다.Meanwhile, the oxidation catalyst chamber 6 may be selectively connected to the first cyclone 2 and / or the second cyclone 3 via the third transfer pipe 61, and may be connected to the first cyclone 2. In order to be connected, the fourth flow path change valve 62 mounted on the third transfer pipe 61 is connected to the second flow path change valve 181 mounted on the first transfer pipe 18. When the second cyclone 3 is to be connected, the fourth flow path change valve 62 may be connected to the third flow path change valve 221 mounted to the second transfer pipe 22. Accordingly, when the oxidation catalyst chamber 6 and the first cyclone 2 are to be connected, the second flow path change valve 181 is connected to the cooling chamber 14 and the first cyclone 2. And release the exhaust gas flowing from the third transfer pipe 61 connected to the oxidation catalyst chamber 6 toward the first cyclone 2. In addition, when the oxidation catalyst chamber 6 and the second cyclone 3 are to be connected in a similar manner, the fourth flow path change valve 62 and the third flow path change valve 221 are sequentially switched. The oxidation catalyst chamber 6 and the second cyclone 3 may be directly connected to each other.

또한, 본 발명의 다른 실시예에 따르면, 도 3에 나타난 바와 같이, 상기 산화촉매실(6)에 별도의 제3공기인입관(8)을 연결시키고, 상기 제3공기인입관(8)에는 별도의 공기블로워(81)를 취부시키므로써 상기 산화촉매실(6)에 별도로 충분한 공기가 공급될 수 있도록 할 수도 있다.In addition, according to another embodiment of the present invention, as shown in FIG. 3, a third air inlet pipe 8 is connected to the oxidation catalyst chamber 6, and the third air inlet pipe 8 is connected to the third air inlet pipe 8. By attaching a separate air blower 81, sufficient air can be separately supplied to the oxidation catalyst chamber 6.

상기 산화촉매실(6)의 크기 즉, 처리용량은 제한이 없으나, 산화챔버(1)의 동작 중에만 배기가스의 보조처리용으로 사용하는 것으로도 충분하며, 이 경우 약 24시간 정도의 연속가동이 가능한 정도의 용량이면 충분하다고 할 수 있다.The size of the oxidation catalyst chamber 6, i.e., the processing capacity is not limited, but it is sufficient to be used for auxiliary treatment of the exhaust gas only during the operation of the oxidation chamber 1, in which case the continuous operation for about 24 hours. It can be said that this possible capacity is enough.

따라서, 본 발명에 의하면 산화챔버(1)가 정지되는 경우에도 산화촉매에 의하여 배기가스를 처리토록 하므로써 계속적으로 스크러버를 동작시킬 수 있도록 하므로써 반도체장치 제조설비를 계속적으로 동작시킬 수 있도록 하여 설비의 가동율을 높이고, 생산성을 향상시킬 수 있는 효과가 있다.Therefore, according to the present invention, even when the oxidation chamber 1 is stopped, the scrubber can be continuously operated by treating the exhaust gas by the oxidation catalyst so that the semiconductor device manufacturing equipment can be continuously operated so that the operation rate of the equipment can be continued. There is an effect that can increase the productivity.

이상에서 본 발명은 기재된 구체예에 대해서만 상세히 설명되었지만 본 발명의 기술사상 범위 내에서 다양한 변형 및 수정이 가능함은 당업자에게 있어서 명백한 것이며, 이러한 변형 및 수정이 첨부된 특허청구범위에 속함은 당연한 것이다.Although the present invention has been described in detail only with respect to the described embodiments, it will be apparent to those skilled in the art that various modifications and variations are possible within the technical scope of the present invention, and such modifications and modifications are within the scope of the appended claims.

Claims (6)

산화챔버와 분진분리용 사이클론을 포함하여 구성되는 스크러버에 있어서, 상기 산화챔버에 대하여 산화촉매실을 병렬로 연결시키고, 이들 산화챔버와 산화촉매실을 상기 사이클론에 연결시켜 이루어짐을 특징으로 하는 반도체장치 제조설비용 스크러버.A scrubber comprising an oxidation chamber and a dust separation cyclone, wherein the oxidation catalyst chamber is connected in parallel to the oxidation chamber, and the oxidation chamber and the oxidation catalyst chamber are connected to the cyclone. Scrubber for manufacturing equipment. 제 1 항에 있어서,The method of claim 1, 상기 산화촉매실내에 산화촉매가 투입됨을 특징으로 하는 상기 반도체장치 제조설비용 스크러버.And an oxidation catalyst is introduced into the oxidation catalyst chamber. 제 2 항에 있어서,The method of claim 2, 상기 산화촉매로는 실란(SiH4), 포스핀(PH3) 및 암모늄(NH3) 등의 산화를 촉매하는 산화촉매임을 특징으로 하는 상기 반도체장치 제조설비용 스크러버.The oxidation catalyst is a scrubber for the semiconductor device manufacturing equipment, characterized in that the oxidation catalyst catalyzing the oxidation of silane (SiH 4 ), phosphine (PH 3 ) and ammonium (NH 3 ). 제 1 항에 있어서,The method of claim 1, 상기 산화촉매실의 전, 후에 필터가 더 취부됨을 특징으로 하는 상기 반도체장치 제조설비용 스크러버.And a filter is further attached before and after the oxidation catalyst chamber. 제 1 항에 있어서,The method of claim 1, 상기 산화촉매실이 상기 산화챔버에 연결된 배기가스인입관으로부터 유로변경밸브를 경유하여 분지되어 연결됨을 특징으로 하는 상기 반도체장치 제조설비용 스크러버.And the oxidation catalyst chamber is branched from the exhaust gas inlet pipe connected to the oxidation chamber via a flow path change valve. 제 1 항에 있어서,The method of claim 1, 상기 산화챔버에 상기 분진분리용 사이클론이 2개 이상 연결되며, 상기 산화챔버와 산화촉매실이 유로변경밸브들에 의하여 상기 사이클론들 중 어느 하나에 선택적으로 연결됨을 특징으로 하는 상기 반도체장치 제조설비용 스크러버.At least two dust separation cyclones are connected to the oxidation chamber, and the oxidation chamber and the oxidation catalyst chamber are selectively connected to any one of the cyclones by flow channel change valves. Scrubber.
KR1019980039282A 1998-09-22 1998-09-22 Scrubber for semiconductor device manufacturing equipment KR100539454B1 (en)

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