KR20000018481A - Stone cutting method - Google Patents

Stone cutting method Download PDF

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Publication number
KR20000018481A
KR20000018481A KR1019980036084A KR19980036084A KR20000018481A KR 20000018481 A KR20000018481 A KR 20000018481A KR 1019980036084 A KR1019980036084 A KR 1019980036084A KR 19980036084 A KR19980036084 A KR 19980036084A KR 20000018481 A KR20000018481 A KR 20000018481A
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South Korea
Prior art keywords
stone
cutting
cut
adhesive
plywood
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KR1019980036084A
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Korean (ko)
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KR100307378B1 (en
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서인석
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서인석
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Priority to KR1019980036084A priority Critical patent/KR100307378B1/en
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Publication of KR100307378B1 publication Critical patent/KR100307378B1/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/02—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/02—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing
    • B28D1/06—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing with reciprocating saw-blades
    • B28D1/068—Components, e.g. guiding means, vibrations damping means, frames, driving means, suspension
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • B28D7/04—Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work

Abstract

PURPOSE: A stone cutting method is provided to cut a stone without breaking the stone while cutting the brittle stone into thin pieces for being used for constructing interior material. CONSTITUTION: A stone cutting method comprises: a first stepped cutting step(ST-1) for cutting a stone(10) for not being easily broken by brittleness; an adhering step(ST-2) for adhering a wooden or a synthetic resin plywood(20) on the both surfaces of the cut stone by using an adhesive; a second stepped cutting step(ST-3) for cutting the central unit of the both side adhered surfaces; a step(ST-4) for adhering the plywood to the second stepped cut surface in case of the second stepped cut stone thicker than a desired thickness; and a step(WT-5) for cutting the central unit of the both side adhered surfaces.

Description

석재 절단방법Stone cutting method

본 발명은 석재의 절단방법에 관한 것으로서, 더욱 상세하게는 취성을 갖는 석재를 건축내장재 등으로 사용하기 위해 얇은 두께로 절단할 때, 상기 석재가 쉽게 깨지지 않도록 절단하는 석재 절단방법에 관한 것이다.The present invention relates to a method for cutting a stone, and more particularly, to a stone cutting method for cutting so that the stone is not easily broken when cutting to a thin thickness for use as a building interior material and the like brittle.

일반적으로 석재는 부식이 되지 않고, 강도 및 경도가 높으며, 외관이 깨끗하고 청소가 용이하여 건축 내장재로 많이 사용된다.In general, the stone is not corroded, high strength and hardness, clean appearance and easy to clean it is used as a building interior materials.

도 1은 종래 석재가 절단되는 모습을 도시한 사시도이다.1 is a perspective view showing a state that a conventional stone is cut.

이를 참조하면, 상기 석재(10)에 의한 건축 내장재는 일반적으로 강도와 경도가 큰 화강석 등을 얇게 절단하여 주로 건물의 바닥재나 벽체로 사용하게 된다.Referring to this, the building interior material by the stone 10 is generally used to cut the granite and the like having a large strength and hardness thinly and mainly used as a floor or wall of the building.

이와 같이 석재(10)를 절단하기 위해서는 석재(10)보다 강도와 경도가 큰 다이어몬드 팁을 갖는 톱날(35)이 이용되며, 이러한 톱날(35)이 석재의 절단면(15)에 일정한 힘으로 가압된 상태에서 석재의 절단면(15)을 절삭하게 되는 데, 이러한 과정에서 석재(10)에는 소정의 가압력과 진동 등에 의한 충격력이 발생된다.In order to cut the stone 10 as described above, a saw blade 35 having a diamond tip having a greater strength and hardness than the stone 10 is used, and the saw blade 35 is pressed against the cut surface 15 of the stone with a constant force. In this state, the cutting surface 15 of the stone is cut. In this process, the stone 10 generates a predetermined force and impact force due to vibration.

한편, 상기 석재(10)는 강도와 경도가 매우 강한 반면, 충격에 약하기 때문에 취성에 의해 쉽게 깨진다는 단점이 있다.On the other hand, while the stone 10 is very strong in strength and hardness, the weakness of the impact has a disadvantage of being easily broken by brittleness.

따라서, 상기 석재(10)의 절단 두께가 얇아지게 되면, 석재(10) 절단과정에서 발생되는 진동 등의 충격력에 의해 절단면(15)이 쉽게 깨지게 되므로 그 가공이 매우 어려운 단점이 있다.Therefore, when the cutting thickness of the stone 10 becomes thin, since the cutting surface 15 is easily broken by the impact force such as vibration generated in the cutting process of the stone 10, the processing thereof is very difficult.

또한, 이와 같은 가공상의 어려움 때문에 작업자의 숙련이 고도로 요구되며, 석재(10)의 재료가 되는 화강석 등의 암석 소모량이 증가된다.In addition, due to such processing difficulties, the skill of the operator is highly required, and rock consumption such as granite which becomes the material of the stone 10 is increased.

본 발명의 주된 목적은 상기 석재의 외표면에 목재나 합성수지를 부착시켜 석재에 발생되는 충격력이 상기 목재나 합성수지에 의해 흡수 완충되도록 하므로써, 고가의 석재가 절단과정에서 쉽게 깨지지 않도록 하는 석재 절단방법을 제공하는 것이다.The main object of the present invention is to attach a wood or synthetic resin to the outer surface of the stone so that the impact force generated in the stone is absorbed and buffered by the wood or synthetic resin, so that the expensive stone is not easily broken during the cutting process To provide.

본 발명의 다른 목적은 상기 석재를 얇은 두께로 절단하므로써, 고가인 석재를 절약할 수 있는 석재 절단방법을 제공하는 것이다.Another object of the present invention is to provide a stone cutting method that can save expensive stone by cutting the stone to a thin thickness.

도 1은 종래 석재가 절단되는 모습을 도시한 사시도,1 is a perspective view showing a state that a conventional stone is cut,

도 2는 본 발명에 따른 석재가 절단되는 모습을 도시한 단면도,2 is a cross-sectional view showing a state in which the stone is cut according to the present invention;

도 3은 본 발명의 변형예에 따른 석재가 절단되는 모습을 도시한 단면도,3 is a cross-sectional view showing a state that the stone is cut according to a modification of the present invention,

도 4는 본 발명에 따른 석재 절단방법을 도시한 플로어챠트,Figure 4 is a floor chart showing a stone cutting method according to the present invention,

도 5는 본 발명의 변형예에 따른 석재 절단방법을 도시한 플로어챠트이다.5 is a floor chart showing a stone cutting method according to a modification of the present invention.

*** 도면의 주요 부분에 대한 부호의 설명 ****** Explanation of symbols for the main parts of the drawing ***

10 : 석재 15 : 절단면10: stone 15: cutting surface

20 : 합판20: plywood

본 발명은 석재를 소정의 두께로 절단하는 석재 절단방법에 있어서, 상기 석재의 일면에 목재나 합성수지로 된 합판을 접착제로 고착시키는 접착단계와, 상기 석재를 접착면으로부터 소정의 두께로 절단하는 절단단계가 반복적으로 이루어지는 특징을 갖는다.The present invention is a stone cutting method for cutting a stone to a predetermined thickness, the adhesive step of fixing a plywood made of wood or synthetic resin to one surface of the stone with an adhesive, and cutting to cut the stone to a predetermined thickness from the adhesive surface The step is repeated.

본 발명의 변형예는 석재를 소정의 두께로 절단하는 석재 절단방법에 있어서, 상기 석재를 취성에 의해 쉽게 개지지 않을 두께로 절단하는 1차 절단단계와, 상기 1차 절단단계에 의해 절단된 석재의 양면에 목재나 합성수지로 된 합판을 접착제로 고착시키는 접착단계와, 상기 석재의 양측 접착면의 중앙부를 절단하는 2차 절단단계로 이루어진 특징을 갖는다.According to a modification of the present invention, in the stone cutting method of cutting the stone to a predetermined thickness, the first cutting step of cutting the stone to a thickness that will not be easily opened by brittleness, and the stone cut by the first cutting step Bonding step of fixing the plywood made of wood or synthetic resin with an adhesive on both sides of the, and the secondary cutting step of cutting the central portion of both sides of the adhesive surface of the stone.

본 발명의 변형예에서 상기 2차 절단된 석재가 원하는 두께보다 두꺼울 경우 상기 2차 절단면에 합판을 부착시키고, 다시 양측 접착면 중앙부를 절단하는 과정을 반복적으로 수행하는 특징을 갖는다.In the modified example of the present invention, when the secondary cut stone is thicker than the desired thickness, the second cut surface is attached to the plywood, and again, the process of repeatedly cutting both sides of the adhesive surface has a feature.

이하, 본 발명의 바람직한 실시예에 대해 첨부된 도면에 의거하여 상세히 설명하면 다음과 같다.Hereinafter, with reference to the accompanying drawings for a preferred embodiment of the present invention will be described in detail.

도 2는 본 발명에 따른 석재의 절단 모습을 도시한 단면도이고, 도 4는 본 발명에 따른 석재의 절단방법을 도시한 플로어챠트이다.2 is a cross-sectional view showing a cutting state of the stone according to the present invention, Figure 4 is a floor chart showing a cutting method of the stone according to the present invention.

이를 참조하면, 상기 석재의 절단방법은 석재(10)의 일면에 목재나 합성수지로 된 합판(20)을 접착제로 고착시키고(ST-1), 이러한 석재(10)를 접착면으로부터 원하는 두께로 절단하게 된다(ST-2).Referring to this, the stone cutting method is to adhere the plywood 20 made of wood or synthetic resin to one surface of the stone 10 with an adhesive (ST-1), and cut the stone 10 to the desired thickness from the adhesive surface (ST-2).

이때, 상기 석재(10)에 부착된 목재나 합성수지로 된 합판(20)은 석재(10)를 절단하는 과정에서 발생되는 진동 등의 충격력을 흡수하여 석재(10)가 취성에 의해 깨지는 것을 방지하게 된다.At this time, the plywood 20 made of wood or synthetic resin attached to the stone 10 absorbs impact force such as vibration generated in the process of cutting the stone 10 to prevent the stone 10 from being broken by brittleness. do.

상기 석재(10)에 합판(10)을 고착시키기 위한 접착제로는 `AC-307`이라는 접착제가 사용되는 데, 상기 접착제의 주제로는 비스패놀 A 에폭시수지가 38%, 희석재가 10%, 충진재가 52% 혼합되어 이루어지며, 상기 접착제의 경화제로는 아민경화제가 40%, 희석재가 14%, 충진재가 46% 혼합되어 이루어진다.As the adhesive for fixing the plywood 10 to the stone 10, an adhesive called 'AC-307' is used. The main subject of the adhesive is bispanol A epoxy resin 38%, diluent 10%, filler 52% is mixed, the curing agent of the adhesive is an amine curing agent 40%, diluent 14%, 46% of the filler is made of a mixture.

도 3은 본 발명의 변형예에 따른 석재의 절단 모습을 도시한 단면도이고, 도 5는 본 발명의 변형예에 따른 석재의 절단방법을 도시한 플로어챠트이다.3 is a cross-sectional view showing a cutting state of a stone according to a modification of the present invention, Figure 5 is a floor chart showing a cutting method of a stone according to a modification of the present invention.

이를 참조하면, 상기 석재의 절단방법은 먼저, 석재(10)를 취성에 의해 깨지지 않을 정도의 두께로 절단한 후(ST-1) 상기와 같이 절단된 석재(10)의 양면에 목재나 합성수지로 된 합판(20)을 접착제로 고착시키고(ST-2), 석재(10)의 중앙부를 절단하여 얇은 석재(10) 2장으로 만든다(ST-3).Referring to this, the cutting method of the stone, first, the stone 10 is cut to a thickness that is not broken by brittleness (ST-1) and then the wood or synthetic resin on both sides of the cut stone 10 as described above The laminated plywood 20 is fixed with an adhesive (ST-2), and the center portion of the stone 10 is cut to make two thin stones 10 (ST-3).

이렇게 제조된 석재(10)가 원하는 두께보다 두꺼울 경우 상기 석재의 절단면(15)에 다시 합판(20)을 부착시키고(ST-4), 양측 접착면 중앙부를 절단하여 2장의 더 얇은 석재(10)로 제조한다(ST-5).If the thus prepared stone 10 is thicker than the desired thickness, the plywood 20 is again attached to the cut surface 15 of the stone (ST-4), and the two thinner stones 10 by cutting the central adhesive side on both sides To prepare (ST-5).

이와 같은 공정을 반복하면서 상기 석재(10)를 원하는 두께로 절단하게 된다.The stone 10 is cut to a desired thickness while repeating such a process.

이때, 상기 석재(10)에 부착된 합판(20)은 석재(10)를 절단하는 과정에서 발생되는 진동 등의 충격력을 흡수하여 석재(10)가 취성에 의해 깨지는 것을 방지하게 된다.At this time, the plywood 20 attached to the stone 10 absorbs the impact force such as vibration generated in the process of cutting the stone 10 to prevent the stone 10 from being broken by brittleness.

상기 석재(10)에 합판(20)을 고착시키기 위한 접착제로는 상술한 `AC-307`이라는 접착제가 사용된다.As the adhesive for fixing the plywood 20 to the stone 10, the above-mentioned adhesive "AC-307" is used.

이상의 본 발명의 작용예에 대해 살펴보면 다음과 같다.Looking at the working example of the present invention as follows.

도 2는 본 발명에 따른 석재의 절단 모습을 도시한 단면도이고, 도 3은 본 발명의 변형예에 따른 석재의 절단 모습을 도시한 단면도이다.2 is a cross-sectional view showing a cut state of a stone according to the present invention, Figure 3 is a cross-sectional view showing a cut state of a stone according to a modification of the present invention.

이를 참조하면, 상기 석재의 절단방법은 석재(10)의 일면이나 양면에 충격 흡수효과가 있는 목재나 합성수지로 된 합판(20)을 접착제로 고착시킨 상태에서 이러한 석재(10)를 소정의 두께로 절단하게 되면, 상기 합판(20)이 석재(10)의 절단과정에서 발생되는 진동 등의 충격력을 흡수하여 석재(10)가 취성에 의해 깨지는 것을 방지하게 된다.Referring to this, the cutting method of the stone is such that the stone 10 to a predetermined thickness in the state in which the plywood 20 made of wood or synthetic resin having an impact absorbing effect on one or both sides of the stone 10 is fixed with an adhesive agent. When cutting, the plywood 20 absorbs the impact force such as vibration generated in the cutting process of the stone 10 to prevent the stone 10 from being broken by brittleness.

따라서, 상술한 석재(10)를 원하는 정도의 두께로 얇게 절단할 수 있어 고가인 석재(10)를 절약할 수 있게 된다.Therefore, the above-described stone 10 can be cut to a thin thickness as desired, thereby saving the expensive stone 10.

이상의 본 발명을 적용하면, 상기 석재 절단방법은 석재의 일면이나 양면에 목재나 합성수지로 된 합판을 부착시킨 상태에서 상기 석재를 절단하게 되므로, 석재 절단과정에서 발생되는 충격력이 상기 합판에 의해 완충되어 석재가 취성에 의해 깨지는 것을 방지할 수 있으며, 상기 합판에 의해 석재의 강도가 보강된다.Applying the present invention, the stone cutting method is to cut the stone in a state in which the plywood made of wood or synthetic resin attached to one or both sides of the stone, the impact force generated in the stone cutting process is buffered by the plywood The stone can be prevented from being broken by brittleness, and the strength of the stone is reinforced by the plywood.

또한, 상기 석재는 합판에 의해 내충격성과 강도가 보강되므로, 약 2㎜~3㎜의 두께로 얇게 절단할 수 있다.In addition, since the impact resistance and strength are reinforced by the plywood, the stone can be thinly cut to a thickness of about 2 mm to 3 mm.

또한, 상기 석재의 외표면에 석재에 의해 표현될 수 없는 나무 무늬나 기타 원하는 모양을 상기 목재나 합성수지에 의해 표현할 수 있게 되며, 목재나 합성수지의 질감에 의해 석재의 딱딱한 느낌을 보상해 줄 수 있게 된다.In addition, the wood surface or other desired shape can not be expressed by the stone on the outer surface of the stone can be represented by the wood or synthetic resin, and the texture of the wood or synthetic resin to compensate for the hard feeling of the stone do.

Claims (3)

석재(10)를 소정의 두께로 절단하는 석재 절단방법에 있어서,In the stone cutting method for cutting the stone 10 to a predetermined thickness, 상기 석재(10)의 일면에 목재나 합성수지로 된 합판(20)을 접착제로 고착시키는 접착단계(ST-1)와;An adhesive step of fixing the plywood 20 made of wood or synthetic resin to one surface of the stone 10 with an adhesive (ST-1); 상기 석재(10)를 접착면으로부터 소정의 두께로 절단하는 절단단계(ST-2)가 반복적으로 이루어지는 것을 특징으로 하는 석재 절단방법.Stone cutting method characterized in that the cutting step (ST-2) to cut the stone 10 from the adhesive surface to a predetermined thickness repeatedly. 석재(10)를 소정의 두께로 절단하는 석재 절단방법에 있어서,In the stone cutting method for cutting the stone 10 to a predetermined thickness, 상기 석재(10)를 취성에 의해 쉽게 부러지지 않을 두께로 절단하는 1차 절단단계(ST-1)와;A first cutting step (ST-1) of cutting the stone 10 to a thickness not easily broken by brittleness; 상기 1차 절단단계에 의해 절단된 석재(10)의 양면에 목재나 합성수지로 된 합판(20)을 접착제로 고착시키는 접착단계(ST-2)와;An adhesive step (ST-2) for fixing the plywood 20 made of wood or synthetic resin to an adhesive on both sides of the stone 10 cut by the first cutting step; 상기 석재(10)의 양측 접착면의 중앙부를 절단하는 2차 절단단계(ST-3)로 이루어진 것을 특징으로 하는 석재 절단방법.Stone cutting method, characterized in that made of a secondary cutting step (ST-3) for cutting the central portion of both sides of the adhesive surface of the stone (10). 제 2항에 있어서,The method of claim 2, 상기 2차 절단된 석재(10)가 원하는 두께보다 두꺼울 경우 상기 2차 절단면(15)에 합판(20)을 부착시키고(ST-4), 다시 양측 접착면 중앙부를 절단하는(ST-5) 과정을 반복적으로 수행하는 것을 특징으로 하는 석재 절단방법.When the secondary cut stone 10 is thicker than the desired thickness, attaching the plywood 20 to the secondary cut surface 15 (ST-4), and again cut both sides of the adhesive surface center (ST-5) Stone cutting method characterized in that to carry out repeatedly.
KR1019980036084A 1998-09-02 1998-09-02 Stone cutting method KR100307378B1 (en)

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