KR20000016860U - pusher in fabrication of semiconductor memory module - Google Patents
pusher in fabrication of semiconductor memory module Download PDFInfo
- Publication number
- KR20000016860U KR20000016860U KR2019990001994U KR19990001994U KR20000016860U KR 20000016860 U KR20000016860 U KR 20000016860U KR 2019990001994 U KR2019990001994 U KR 2019990001994U KR 19990001994 U KR19990001994 U KR 19990001994U KR 20000016860 U KR20000016860 U KR 20000016860U
- Authority
- KR
- South Korea
- Prior art keywords
- pusher
- memory module
- assembly
- present
- semiconductor memory
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 11
- 239000004065 semiconductor Substances 0.000 title claims abstract description 6
- 229920001971 elastomer Polymers 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 230000035939 shock Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
본 고안은 푸셔어셈블리의 구조를 개선하여 기존 메모리 모듈의 핀의 변화 및 디바이스 타입의 변화시마다 푸셔쪽의 파트를 교체해 주어야 하는 문제 및 푸셔가 모듈을 쳐서 콘택시킬 때 생기는 낙진을 저감시킬 수 있도록 한 것이다.The present invention improves the structure of the pusher assembly to reduce the problem that the parts on the pusher should be replaced every time the pin of the existing memory module changes and the device type, and the fallout caused when the pusher hits the module and makes contact. .
이를 위해, 본 고안은 푸셔블록(1)과, 푸셔(2)와, 놉(3)으로 이루어진 메모리 모듈 제조용 푸셔어셈블리에 있어서; 상기 푸셔(2) 하부에 탄성부재(6)를 부착하고, 상기 푸셔블록(1) 하부에는 높이 조절용 너트(4)를 체결한 것을 특징으로 하는 반도체 메모리 모듈 제조용 푸셔어셈블리가 제공된다.To this end, the present invention provides a pusher assembly for manufacturing a memory module including a pusher block (1), a pusher (2), and a knob (3); An elastic member 6 is attached to the lower side of the pusher 2, and a pusher assembly for manufacturing a semiconductor memory module is provided at the lower side of the pusher block 1, in which a height adjusting nut 4 is fastened.
Description
본 고안은 반도체 메모리 모듈 제조용 푸셔 어셈블리에 관한 것으로서, 더욱 상세하게는 메모리 모듈 제조용 푸셔어셈블리의 구조개선에 관한 것이다.The present invention relates to a pusher assembly for manufacturing a semiconductor memory module, and more particularly, to a structural improvement of a pusher assembly for manufacturing a memory module.
기존의 기술장치는 도 1 및 도 2에 나타낸 바와 같이, 푸셔어셈블리의 푸셔(2)를 모듈 타입이 바뀔 때마다 바꾸어 주어야 하며, 또한 푸셔(2)가 메모리 모듈을 슬라이드 어셈블리위에 콘택시킬 때 눌러주도록 되어 있다.1 and 2, the existing technical apparatus must change the pusher 2 of the pusher assembly every time the module type is changed, and also push the pusher 2 when the memory module contacts the slide assembly. It is.
이 때, 상기 푸셔어셈블리는 푸셔블록(1)과, 푸셔(2)와, 놉(3)으로 구성된다.In this case, the pusher assembly includes a pusher block 1, a pusher 2, and a knob 3.
이와 같이 된 종래의 기술장치는 모듈을 장비 중앙의 안착부위에 놓으면 양측 실린더(5)가 위로 올라갔다 내려오면서 푸셔(2)가 모듈의 윗부분을 눌러 안착시키도록 동작하게 된다.The prior art device is operated so that the pusher (2) by pressing the upper part of the module to be seated as the two cylinders (5) up and down when the module is placed on the seating portion of the center of the equipment.
그러나, 이와 같은 종래의 메모리 모듈용 푸싱장치는 메모리 모듈이 다른 타입으로 바뀔 때 마다 푸셔(2)를 바꾸어 주어야 하며, 푸셔(2)가 모듈을 눌러줄 때 모둘에서 낙진이 발생하여 콘택성 불량이 발생하게 되는 문제점이 있었다.However, such a pushing device for a conventional memory module has to change the pusher 2 every time the memory module is changed to another type, and when the pusher 2 pushes the module, both fallouts occur, resulting in poor contact. There was a problem that occurred.
본 고안은 상기한 제반 문제점을 해결하기 위한 것으로서, 푸셔어셈블리의 구조를 개선하여 기존 메모리 모듈의 핀의 변화 및 디바이스 타입의 변화시마다 푸셔쪽의 파트를 교체해주어야 하는 문제 및 푸셔가 모듈을 쳐서 콘택시킬 때 생기는 낙진을 저감시킬 수 있는 반도체 메모리 모듈 제조용 푸셔어셈블리를 제공하는데 그 목적이 있다.The present invention is to solve the above-mentioned problems, and to improve the structure of the pusher assembly, the problem that the parts of the pusher should be replaced every time the pin change and the device type of the existing memory module changes and the pusher hits the module An object of the present invention is to provide a pusher assembly for manufacturing a semiconductor memory module that can reduce fallout.
도 1은 종래의 기술장치를 나타낸 정면도1 is a front view showing a conventional technical device
도 2는 도 1의 푸셔어셈블리를 나타낸 사시도2 is a perspective view of the pusher assembly of FIG.
도 3은 본 고안의 푸셔어셈블리를 나타낸 정면도3 is a front view showing a pusher assembly of the present invention
도 4는 도 3의 A부를 나타낸 사시도4 is a perspective view showing part A of FIG.
* 도면의 주요부분에 대한 부호의 설명 *Explanation of symbols on the main parts of the drawings
1:푸셔블록 2:푸셔1: pusher block 2: pusher
3:놉 4:너트3: knob 4: nut
5:실린더 6:탄성부재5: cylinder 6: elastic member
상기한 목적을 달성하기 위해, 본 고안은 푸셔블록과, 푸셔와, 놉으로 이루어진 메모리 모듈 제조용 푸셔어셈블리에 있어서; 상기 푸셔 하부에 탄성부재를 부착하고, 상기 푸셔블록 하부에는 높이 조절용 너트를 체결한 것을 특징으로 하는 반도체 메모리 모듈 제조용 푸셔어셈블리가 제공된다.In order to achieve the above object, the present invention is a pusher assembly for manufacturing a memory module consisting of a pusher block, a pusher, and a knob; An elastic member is attached to the lower part of the pusher, and a pusher assembly for manufacturing a semiconductor memory module is provided at a lower part of the pusher block, wherein a height adjusting nut is fastened.
이하, 본 고안의 일실시예를 첨부도면 도 3 및 도 4를 참조하여 상세히 설명하면 다음과 같다.Hereinafter, an embodiment of the present invention will be described in detail with reference to FIGS. 3 and 4.
도 3은 본 고안의 푸셔어셈블리를 나타낸 정면도이고, 도 4는 도 3의 A부를 나타낸 사시도로서, 본 고안은 푸셔블록(1)과, 푸셔(2)와, 놉(3)으로 이루어진 메모리 모듈 제조용 푸셔어셈블리에 있어서; 상기 푸셔(2) 하부에 탄성부재(6)를 부착하고, 상기 푸셔블록(1) 하부에는 높이 조절용 너트(4)를 체결하여 구성된다.3 is a front view showing a pusher assembly of the present invention, Figure 4 is a perspective view showing part A of Figure 3, the present invention is for manufacturing a memory module consisting of a pusher block (1), a pusher (2), the knob (3) In a pusher assembly; The elastic member 6 is attached to the lower part of the pusher 2, and the height adjusting nut 4 is fastened to the lower part of the pusher block 1.
이 때, 상기 높이 조절용 너트(4)는 육각너트이다.At this time, the height adjusting nut (4) is a hexagon nut.
이와 같이 구성된 본 고안의 작용은 다음과 같다.The operation of the present invention configured as described above is as follows.
본 고안은 높이 조절용 너트(4)를 푸셔블록(1) 하부에 부착하므로써 타입별로 푸셔(2)를 따로 교체할 필요가 없으며, 또한 충격을 줄이기 위한 탄성부재(6)인 러버 또는 폴리우레탄을 부착하므로써 메모리 모듈 윗면을 눌러줄 때 발생되는 충격을 완화시켜 낙진 발생을 줄일수 있게 된다.The present invention does not need to replace the pusher (2) by type by attaching the height adjusting nut (4) to the bottom of the pusher block (1), and also attaches a rubber or polyurethane, which is an elastic member (6) to reduce the impact As a result, the impact generated when the upper surface of the memory module is pressed can be alleviated to reduce the occurrence of fallout.
즉, 본 고안은 높이 조절용 너트(4)가 푸셔블록(1) 하부에 부착되므로써 메모리 타입이 바뀌더라도 푸셔(2)를 바꾸어주지 않아도 된다.That is, the present invention does not need to change the pusher 2 even if the memory type is changed because the height adjusting nut 4 is attached to the bottom of the pusher block 1.
또한, 푸셔(2) 하부에 러버 또는 폴리우레탄 재질의 탄성부재(6)가 부착되어 있으므로 푸셔(2)가 메모리 모듈 윗면을 누를 때의 충격을 줄일 수 있게 되어, 푸셔(2)가 누르는 충격으로 인해 발생하는 낙진에 의해 야기되는 콘택 불량 또한 줄일 수 있게 된다.In addition, since the elastic member 6 made of rubber or polyurethane is attached to the lower side of the pusher 2, the shock when the pusher 2 presses the upper surface of the memory module can be reduced. Contact failures caused by falling out can also be reduced.
이상에서와 같이, 본 고안은 푸셔어셈블리의 구조를 개선하여 기존 메모리 모듈의 핀의 변화 및 디바이스 타입의 변화시마다 푸셔쪽의 파트를 교체해 주어야 하는 문제를 해결할 수 있을 뿐만 아니라 푸셔가 모듈을 쳐서 콘택시킬 때 생기는 낙진을 저감시키므로써 메모리 모듈의 생산성을 향상시킬 수 있게 된다.As described above, the present invention improves the structure of the pusher assembly to solve the problem that the parts of the pusher should be replaced every time the pin of the existing memory module is changed and the device type is changed, and the pusher hits the module to make a contact. It is possible to improve the productivity of the memory module by reducing fallout that occurs.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019990001994U KR20000016860U (en) | 1999-02-09 | 1999-02-09 | pusher in fabrication of semiconductor memory module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019990001994U KR20000016860U (en) | 1999-02-09 | 1999-02-09 | pusher in fabrication of semiconductor memory module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20000016860U true KR20000016860U (en) | 2000-09-25 |
Family
ID=54759197
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019990001994U KR20000016860U (en) | 1999-02-09 | 1999-02-09 | pusher in fabrication of semiconductor memory module |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR20000016860U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100925119B1 (en) * | 2007-06-07 | 2009-11-05 | 미래산업 주식회사 | Pushing Unit, Test Handler having the same, and method of manufacturing semiconductor device using the same |
-
1999
- 1999-02-09 KR KR2019990001994U patent/KR20000016860U/en not_active Application Discontinuation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100925119B1 (en) * | 2007-06-07 | 2009-11-05 | 미래산업 주식회사 | Pushing Unit, Test Handler having the same, and method of manufacturing semiconductor device using the same |
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|---|---|---|---|
| WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid |