KR20000015694U - Apparatus for inspecting PCB - Google Patents

Abstract

The present invention relates to a printed circuit board inspection mechanism and a printed circuit board inspection apparatus including the inspection mechanism; At least three mounting plates installed on the support frame and spaced apart from each other to form a layer; Inserted into each of the through-holes, the upper end is extended to a certain height to the upper portion of the uppermost mounting plate to contact the inspection site, the lower end is extended to the lower portion of the lowermost mounting plate is connected to the external tester through the socket and the conductor, the mounting plate It includes an inspection pin that is elastically supported in the upward direction by a spring supported on. In addition, at least two guide posts are provided perpendicular to the bottom plate, the lower frame is installed the printed circuit board inspection mechanism in the installation position of the bottom plate; Lifting movement in the upper portion of the lower frame in a state facing the lower frame, the printed circuit board inspection mechanism is installed at the installation position of the opposite surface, and provided with a sliding holder for guiding the guide posts in the lifting movement It characterized in that it comprises an upper frame. The printed circuit board inspection mechanism of the present invention and the printed circuit board inspection apparatus provided with the inspection mechanism, as described above, do not come into contact with neighboring inspection pins even if the spacing between the inspection pins is very tight. High, the test pin is installed vertically to prevent the bending of the test pin, the service life of the device is long, easy maintenance and can greatly reduce the cost of inspection.

Description

Printed circuit board inspection device and a printed circuit board inspection device provided with the inspection device {Apparatus for inspecting PCB}

The present invention relates to a printed circuit board inspection mechanism for inspecting whether an electric circuit including various components mounted on a printed circuit board as well as a printed circuit board is correctly formed and a printed circuit board inspection apparatus for carrying out the inspection by mounting the inspection mechanism. will be.

In printed circuit boards, the correct mounting of various components and the formation of appropriate circuits are directly related to the reliability of the product. Therefore, the test pins are brought into contact with the printed circuit board as well as with the component elements of the printed circuit board where the component mounting is completed. Several devices are being used to check.

In order to check the correct configuration of many types of printed circuit boards, various types of inspection equipment have been used in the past. This is in accordance with the principle of performing the inspection by sensing the flow of current by electrically connecting the test pin fixed to the support plate in accordance with the pattern of the circuit board, the test portion of the printed circuit board.

However, in the conventional method of detecting the movement of current by contacting a large number of test pins fixed to the support plate to the test site, a spring must be built in the test pin, so that a high integration circuit can be tested by the thickness of the pin. There was no. In addition, the test could be performed by using a needle-type probe and an elastic pin to test a highly integrated circuit, but this also requires an expensive elastic pin, and in particular, the probe must be inclined diagonally to contact the inspection site. As a result, the bending of the probe occurred, so that the accurate test could not be performed and thus the reliability of the test could not be achieved.

The present invention has been made to solve the above problems, the vertical installation of the test pin with a spring without using a separate elastic pin, but the contact between the neighboring test pin does not occur, it is a test of high integration circuit Even though the inspection reliability is very high, the bending of the test pins can be prevented, the service life is long, and the device can be easily removed and installed without fixing the test pins on the mounting plate. Printed circuit board inspection configured to provide a printed circuit board inspection mechanism that can greatly reduce the required cost, and to implement accurate operation of the inspection mechanism through an accurate lifting movement by mounting the inspection mechanism configured as described above. It is an object to provide a device.

1 is a view schematically showing the configuration of a printed circuit board inspection mechanism according to an embodiment of the present invention.

Figure 2 is a cross-sectional view showing the installation structure of the test pin in the printed circuit board inspection mechanism according to an embodiment of the present invention.

3A and 3B are perspective views illustrating an example of a test pin applied to a PCB test apparatus according to an embodiment of the present invention.

Figure 4 is a schematic perspective view illustrating the structure of a frame on which a printed circuit board inspection mechanism is mounted according to an embodiment of the present invention.

Figure 5 is a schematic view illustrating the operation of the printed circuit board inspection apparatus according to an embodiment of the present invention.

Figure 6 is a view showing for explaining the operation of the worker using the printed circuit board inspection apparatus according to an embodiment of the present invention.

<Description of the code | symbol about the principal part of drawing>

11: Printed circuit board inspection mechanism 13: Support frame

15: printed circuit board 17: inspection site

19: through hole 21: mounting plate

23: socket 25: external tester

27: Spring 29, 31: Inspection pin

33: support jaw 35: locking jaw

37: cover plate 39; hole

41: protrusion 43: guide post

45: bottom plate 47: mounting holes

49: lower frame 51: sliding holder

53: upper frame 55: lead wire

57: Bolt hole 59: Fixing bolt

61: operator 63: mounting position

The present invention to achieve the above object, the support frame; At least three or more mounting plates installed on the support frame and having a plurality of through-holes formed in the same shape at positions corresponding to inspection portions of the printed circuit board, and spaced apart from each other to form layers; Inserted into each of the through-holes, the upper end is extended to a certain height to the upper portion of the uppermost mounting plate to contact the inspection site, the lower end is extended to the lower portion of the lowermost mounting plate is connected to the external tester through the socket and the conductor, the mounting plate It characterized in that it comprises a test pin elastically supported in the upward direction by a spring supported on. In addition, each of the springs installed on the plurality of test pins is evenly distributed on the mounting plate constituting a plurality of layers, the springs provided on the test pins adjacent to each other is located on the mounting plate of the other layer is configured so that mutual contact is not made It is done.

In addition, the test pin is formed on the outer periphery so that the support pin is elastically supported in the upper direction is pressed to the upper by a spring, the locking jaw is formed on the upper portion of the test pin so that the test pin does not fall to the top, It is characterized in that it further comprises a cover plate which is provided on the upper surface and includes an upper portion of the test pin therein and a hole for pressing the locking step to the bottom.

In addition, the body of the test pin is provided with a projection formed larger than the diameter of the through mounting hole, the test pin does not escape to the upper portion of the mounting plate through the through mounting hole, the spring is installed between the lower portion of the protrusion and the upper surface of the mounting plate It characterized in that the pin is elastically supported to the top.

In addition, the present invention is provided with at least two guide posts vertically with respect to the bottom plate, the lower frame is provided with the printed circuit board inspection mechanism in the installation position of the bottom plate; Lifting movement in the upper portion of the lower frame in a state facing the lower frame, the printed circuit board inspection mechanism is installed at the installation position of the opposite surface, and provided with a sliding holder for guiding the guide posts in the lifting movement And an inspection frame provided in the upper frame and an inspection pin provided in the lower frame are positioned on the same vertical line, and when the proximity pins are adjacent to each other, an electrical connection is made between the inspection portions of the printed circuit board. Characterized in forming.

Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings.

1 is a view schematically showing the configuration of a printed circuit board inspection mechanism according to an embodiment of the present invention.

As shown, the printed circuit board inspection mechanism 11 according to the present embodiment includes a bolt hole 57 in the bottom plate and three mounting plates 21 at the lower portion of the printed circuit board 15 to be inspected. A support frame 13 to be positioned, three mounting plates 21 installed and supported on the support frame 13, and are supported through the mounting plate 21 and connected to an external tester (25 in FIG. 5). It is configured to include a test pin (29,31).

First, the mounting plate 21 is a plate made of an insulator, and a through mounting hole 19 is formed so that various kinds of inspection pins 29 and 31 can be installed therethrough. The through hole 19 guides the lifting motion of the test pin and has a different diameter according to the type of the test pin. In this embodiment, three mounting plates 21 are provided, but the number of mounting plates 21 may be configured in three or more in proportion to the length of the test pin. The through-holes 19 formed in each of the mounting plates 21 are formed vertically and have the same pattern on each of the mounting plates 21, so that the test pins 29 and 31 simultaneously form three mounting plates 21. It can be positioned vertically through.

On the other hand, the cover plate 37 is provided on the upper surface of the uppermost mounting plate 21 of the mounting plate 21. The cover plate 37 is a support plate for providing a pressing force to the test pin 29 so that the test pin 29 to be described later does not escape upward, and a plurality of holes 39 are formed. The holes 39 are formed in the same arrangement as the through mounting holes 19 formed in the mounting plate 21 so that the upper end portions of the test pins 29 and 31 protrude from the upper surface of the cover plate 37. do.

The inspection pins 29 and 31 installed in the through-holes 19 of the mounting plate 21 may apply various types of inspection pins corresponding to the inspection sites. In the present embodiment, two types of test pins are applied as shown in FIG. 2, but various types of test pins may be used according to the characteristics of the test part 17 of the printed circuit board 15. That is, if the inspection target region is formed relatively wide, use a thick inspection pin, on the contrary, if the inspection target region is very thin or narrow, use a thin inspection pin.

The inspection pins 29 and 31 protrude from the through-hole 19 and the hole 39 so that the upper end thereof can sufficiently contact the inspection part 17 of the printed circuit board 15 to be inspected. Is connected to the external tester (25 in FIG. 5) through the socket 23 and the lead 55. In addition, the test pins 29 and 31 are elastically supported upward by the springs 27, and the test pins 29 and 31 are in contact with the test portion 17 of the printed circuit board 15. It is done sexually.

2 is a partial cross-sectional view illustrating the installation structure of the test pin in the printed circuit board inspection mechanism according to an embodiment of the present invention.

The same reference numerals as the above reference numerals denote the same members having the same function.

As shown, the test pins applied to the printed circuit board test mechanism according to the present embodiment consists of two types of test pins. That is, the inspection pin 29 provided on the left side in the drawing is thicker than the inspection pin 31 provided on the right side. The thickness of the test pin as described above is determined in correspondence with the state of the inspection target region (17 in Fig. 1) of the printed circuit board as described above. Therefore, test pins of other structures not shown in the drawings may be applied.

The inspection pin 29 on the left side of the drawing installed vertically on the three mounting plates 21 is elastically supported upward by the spring 27. First, the inspection pin 29 has an upper end protruding to an upper portion of the cover plate 37, and the locking jaw 35 is formed on the outer circumferential surface of the test pin 29 so as to be caught by the edge of the hole 39 of the cover plate 37 so as not to escape to the outside. Formed. A part where the locking jaw 35 is formed is included in the penetrating fitting 19, and the up and down lifting movement is guided by the inner circumferential surface of the penetrating fitting 19.

The support jaw 33 is formed at the lower side of the locking jaw 35. The support jaw 33 is a jaw formed to receive the elastic force of the spring 27 and is in contact with the upper end of the spring 27 to receive the elastic force in the upward direction. The support jaw 33 and the locking jaw 35 are integrally formed with the test pin 29 and have a cylindrical shape as a whole.

The lower end of the spring 27 wrapped around the test pin 29 and installed on the lower side of the support jaw 33 is mounted on the mounting plate 21 and supported upward. Therefore, each spring 27 is installed in a compressed state between the mounting plate 21 and the support jaw 33 while wrapping the test pin 29, the support jaw 33 is pressed in the direction of the arrow a do. The outer diameter of the spring 27 is larger than the diameter of the through-hole 19, the inner diameter is formed smaller than the support jaw 33 to press the test pin 29 in the upward direction.

On the other hand, as the circuit integration technology is gradually advanced, the circuit inspection mechanism must be precise, and the gap between the inspection pins is gradually getting smaller due to such a requirement. However, due to the diameter of the spring provided in each test pin and the test pin can not be installed densely any more test pin. This case occurs because the space between the test pins is very dense so that adjacent test pins can contact each other during the lifting motion. In particular, since the spring 27 surrounds the test pin, the outer diameter may be larger, so that the above case may occur. In order to solve the above problem, the spring 27 is evenly applied to each layer of the mounting plate 21. Dispensed. That is, the springs 27 provided on the test pins adjacent to each other are provided on different layers of the mounting plate 21 so that the neighboring springs 27 do not collide with each other to interfere with each other or electrical connection occurs.

Therefore, as shown in FIG. 2, the springs of the test pins shown on the left side and the test pins 29 shown on the right side of the test pins 29 are installed on different layers of the mounting plate 21 so that contact is not made. Do not. Therefore, interference by the overlapping distance of the springs 27 as much as z can be prevented. If the springs 27 are installed on the same layer, the springs 27 will be electrically connected by overlapping the interval z and the inspection will not be possible. If the number of the mounting plate 21 is more, the spring 27 can also be installed evenly for each floor, the installation position of the spring 27 also becomes more diverse.

The socket 23 is bitten at the lower end of the test pins 29 and 31. The socket 23 is connected to the external tester (25 in FIG. 5) through the conductive wire 55, and connects the test pins (29, 31) and the external tester.

The test pin 31 shown on the right side of the test pin 29 has a relatively thin shape as compared with the test pin 29. The test pin 31 is thinner than the test pin 29 described above and cannot process the supporting jaw 33 or the locking jaw 35, and instead includes the protrusion 41 having the same function. The protrusion 41 serves as the support jaw 33 and the locking jaw 35 to prevent the test pin 31 from escaping from the mounting plate 21 to the outside, and also by the spring 27. The 31 is elastically supported upwards. That is, the protrusion 41 formed on the inspection pin 31 serves as a stopper that is caught on the bottom of the mounting plate 21 and prevents it from moving upward, and at the same time, a spring between the protrusion 41 and the mounting plate 21. The 27 is installed in a compressed state, and receives an upward elastic force from the spring 27. Therefore, the spring 27 is supported by the mounting plate 21, and elastically supports the projection 41 of the test pin 31 in the direction of the arrow a. As described above, the springs 27 installed surrounding the test pins 31 are evenly distributed on each layer of the mounting plate 21. Therefore, contact between the adjacent springs 27 does not occur, thereby ensuring the reliability of the inspection.

3A and 3B are perspective views illustrating the shape of a test pin applied to a printed circuit board test mechanism according to an embodiment of the present invention.

The inspection pin 31 shown in Fig. 3a is shaped like a needle and is very thin, and the upper end is thickened so that the inspection pin 31 can be easily brought into contact with the minute inspection part, and the body 41 is provided with a protrusion 41. . The protrusion 41 is formed by pressing the test pin 31 in the lateral direction and plastically deforming. The position of the protrusion 41 is determined according to the number or thickness of the mounting plate 21 previously designed.

On the other hand, on the inspection pin 29 shown in FIG. 3B, the locking jaw 35 and the support jaw 33 are formed by machining. Reference numeral 35 is a locking jaw to catch the hole 39 of the cover plate 37 so as not to escape to the outside, the support jaw 33 is formed in the lower portion of the locking jaw 35 so that the test pin 29 is a spring To receive the elastic force from (27 in Fig. 2).

When the diameter of the material forming the test pins 29 and 31 is smaller than approximately 0.7 mm, the test pin 31 is formed by pressing the material to form the protrusions 41 as shown in FIG. 3A. When the diameter is larger than 0.7mm, it is preferable to manufacture the test pin 29 having the engaging jaw 35 and the supporting jaw 33 by machining the material.

4 is a partial cutaway perspective view schematically illustrating a top and bottom frames of a printed circuit board inspection apparatus for performing inspection by mounting and lifting a printed circuit board inspection mechanism according to an embodiment of the present invention.

As shown, the printed circuit board inspection apparatus includes an upper frame 53 and a lower frame 49.

Four guide posts 43 are fixed to the lower frame 49 in a substantially vertical manner with respect to the bottom plate 45. The guide post 43 is inserted into the sliding holder 51 of the upper frame 53 to be described later as a member for guiding the lifting movement of the upper frame has a certain thickness and has rigidity. Four mounting holes 47 are provided at the center of the bottom plate 45. The mounting hole 47 is located on the same axis as the bolt hole 57 formed in the support frame 13 and is a hole into which the fixing bolt 59 is fitted. The fixing bolt 59 is a printed circuit board inspection mechanism. 11 is to be installed in the installation position 63 of the lower frame (49).

Meanwhile, four sliding holders 51 are provided on the upper frame 53 that moves up and down on the lower frame 49. The sliding holder 51 has the same axial center as the guide post 43, and has a shape of a pipe, and accommodates the guide post 43 therein when the upper frame 53 descends, thereby Guide your lifting exercises. In addition, an installation tool 47 is formed on an opposite surface of the upper frame 53 facing the lower frame 49, and the printed circuit board inspection mechanism 11 is fixed to the installation tool 47 by a fixing bolt 59. Is installed.

5 is a view for explaining the operation of the printed circuit board inspection apparatus provided with the printed circuit board inspection mechanism 11 in the upper frame and the lower frame.

The same reference numerals as the above reference numerals denote the same members having the same function.

As shown, the printed circuit board inspection apparatus according to the present embodiment includes a lower frame 49 and an upper frame 53 which face each other with the printed circuit board 15 to be inspected therebetween. The inspection pins 29 and 31 of the printed circuit board inspection mechanism 11, which are installed as fixing bolts 59 at the installation position (63 in FIG. 4) of the lower frame 49, are inspected portions of the printed circuit board 15. Corresponding to (17) and installed vertically, the lower end is connected to the external tester 25 by a conductive wire (55). In addition, the inspection mechanism 11 provided in the upper frame 53 is fixedly installed backwards and faces the inspection mechanism 11 provided in the lower frame 49.

Therefore, the test pins 29 and 31 provided in the inspection mechanism 11 installed on the lower frame 49 and the test pins 29 and 31 provided in the upper frame 53 correspond to each other and are located on the same vertical line. When the upper frame 53 descends, the electrical connection is made to be close to each other with the inspection part 17 of the printed circuit board 15 interposed therebetween. Each of the test pins 29 and 31 positioned in the upper frame 53 is also connected to the external tester 25 by the conductor 55.

In order to operate the printed circuit board inspection apparatus made as described above, the upper frame 53 is lowered in the direction of the arrow d while the printed circuit board 15, which is an inspection object, is positioned between the upper and lower inspection mechanisms 11. Then, the guide post 43 is first inserted into the sliding holder 51, and guides the downward movement of the upper frame 53 with respect to the lower frame 49. When the lowering of the upper frame 53 continues, the test pins of the upper frame 53 and the test pins of the lower frame 49 come into contact with the test portion 17 of the printed circuit board 15, and the upper and lower test pins 29, 31, the closed circuit including the printed circuit board 15, the conducting wire 55 and the external tester 25 is constituted so that the inspection is performed. Therefore, if the inspection part 17 of the printed circuit board 15 is badly produced and short-circuited, the closed circuit is opened so that a normal signal is not transmitted to the external tester 25 so that the defect of the printed circuit board can be confirmed. .

When the inspection of the printed circuit board 15 positioned between the inspection mechanism installed on the upper frame 53 and the inspection mechanism installed on the lower frame 49 is completed, the upper frame 53 is spaced apart from the lower frame 49 to rise. . At this time, the guide post 53 is guided by the upward movement of the upper frame 53 while being pulled out from the sliding holder 51. When the rising of the upper frame 53 relative to the lower frame 49 is completed, the inspection is completed by removing the printed circuit board 15 after the inspection and placing the printed circuit board to be inspected next.

If the circuit configuration is changed due to different models of the printed circuit board to be inspected next time, the used printed circuit board inspection mechanism 11 is separated from the upper and lower frames 53 and 49 to respond to the newly changed circuit configuration. By coupling the printed circuit board inspection mechanism 11 configured to be in the installation position (63 in FIG. 4) of the upper and lower frames, inspection of the printed circuit board having a different circuit configuration is performed.

6 is a plan view illustrating an inspection apparatus schematically showing a working line of a worker using the apparatus for inspecting a printed circuit board according to an embodiment of the present invention.

As shown, the operator 61 is working in front of the inspection apparatus to inspect the printed circuit board as a printed circuit board inspection apparatus of the present invention, the operator to place the printed circuit board 15 to work in a predetermined position in the inspection apparatus The hand must be moved in the direction of arrow u for example. In addition, in order to send the completed printed circuit board 15 to the next process, the hand must move in the direction of the arrow v.

As described above, in the printed circuit board inspection apparatus of the present invention, the guide post and the sliding holder are moved in the direction of the arrow c so that the operator does not collide with the guide post 43 or the sliding holder 51 while moving the hand during operation. I was. Therefore, the inspection work can be efficiently performed without the copper wire of the worker's hand following the arrow u and the arrow v hitting the inspection apparatus.

The present invention has been described in detail through specific embodiments, but the present invention is not limited to the above-described embodiments, and various modifications may be made by those skilled in the art within the scope of the technical idea of the present invention.

The printed circuit board inspection mechanism of the present invention and the printed circuit board inspection apparatus provided with the inspection mechanism, as described above, do not come into contact with neighboring inspection pins even if the spacing between the inspection pins is very tight. High, the test pin is installed vertically to prevent bending of the test pin, so the service life of the device is long. In addition, it is possible to remove and install without fixing the test pin to the support plate, so the maintenance of the device is easy and the cost can be greatly reduced. In addition, since the inspection mechanism can be installed and separated from the inspection apparatus, even if the circuit pattern of the printed circuit board is changed, the inspection mechanism can be easily replaced to quickly respond to the change of the inspection target circuit pattern.

Claims (6)

A support frame 13; Installed in the support frame 13, a plurality of through-holes 19 are formed in the same shape at the position corresponding to the inspection portion 17 of the printed circuit board 15, each of which is spaced at least three One or more mounting plates 21; Inserted into each of the through-holes 19, the upper end is extended to a certain height to the upper portion of the uppermost mounting plate to contact the inspection site 17, the lower end is extended to the lower portion of the lowermost mounting plate to the socket 23 and the conducting wire ( 55. A printed circuit board inspection mechanism, comprising: test pins (29, 31) connected to an external tester through a spring (55) and elastically supported upward by a spring (27) supported by an installation plate (21). The method according to claim 1, wherein the springs 27 installed on the plurality of test pins 29 and 31 are evenly distributed on the mounting plates 27 constituting a plurality of layers, and adjacent to the test pins 29 and 31 adjacent to each other. Printed circuit board inspection mechanism, characterized in that the spring is provided 27 is located on the installation plate of the other layer so that mutual contact is not made. The method according to claim 2, wherein the test pin 29 is formed in the outer circumferential support jaw 33 to be elastically supported in the upward direction is pressed upward by the spring 27, so that the test pin 29 does not fall out A locking jaw 35 is formed on an upper portion of the inspection pin 29, and is provided on an upper surface of the uppermost mounting plate to include the upper portion of the inspection pin 29 therein, and to press the locking jaw 35 downward. Printed circuit board inspection mechanism, characterized in that it further comprises a cover plate (39) is formed. The body of the test pin 31 is provided with a projection 41 formed larger than the diameter of the through-hole 19, the test pin 31 is installed through the through-hole 19 21 is not escaped to the upper portion, the printed circuit board inspection mechanism, characterized in that the spring (27) is installed between the lower portion of the protrusion 41 and the upper surface of the mounting plate to support the test pin (31) to the top. At least two guide posts 43 are provided perpendicular to the bottom plate 45, the lower frame 49, the printed circuit board inspection mechanism 11 is installed in the installation position of the bottom plate 45; Lifting motion in the upper portion of the lower frame 49 in a state facing the lower frame 49, the printed circuit board inspection mechanism 11 is installed at the installation position of the opposite surface, the guide post 43 during the lifting movement Printed circuit board inspection apparatus comprising an upper frame (53) having a sliding holder (51) for guiding the inside. The method of claim 5, wherein the test pins 29 and 31 provided in the upper frame 53 and the test pins 29 and 31 provided in the lower frame 49 are positioned on the same vertical line, so that the printed circuits are in close proximity to each other. Printed circuit board inspection apparatus, characterized in that the electrical connection is made with the inspection portion (17) of the substrate (15) in between.