KR20000013413U - Tube for B, G, A package storing - Google Patents

Abstract

The present invention improves the structure of the B, G, and A package storage containers into a tube type to prevent solder ball dropout and ball damage caused by loading a B, G, and A package onto a conventional tray, and to meet the tube type packing requirements. I would have to.

To this end, the present invention is provided with an open front and a closed rear and the tube 4 is formed in the body 3, the space (5) for storing the B, G, A package, and the tube (4) B, G, A package housing tube is provided, characterized in that the closure member 9 for sealing the open front of the.

Description

Tube for B, G, A package storing

The present invention relates to a structural improvement of a ball grid array package (BGA) storage container. More specifically, the structure of the B / A package storage container is improved to a tube type. The storage of this package is to be made more secure.

Typically, a BG package is a plastic ball grid array package (PBGA) 100 and an SBGA package (SBGA) as shown in FIGS. 1A and 2A. : Super Ball Grid Array package (200), and the general ball grid array package manufacturing process is as follows.

Die attach process for mounting the chip 6 on the printed circuit board 1, wire bonding process for connecting the internal terminal of the chip 6 and the pattern on the printed circuit board 1 with the gold wire 7, mounting In order to protect the chip 6 from the external environment, the resin encapsulation process of encapsulating the mold body 8 and the ball mount process of joining the solder balls 2 to the external connection terminal pattern of the lower end of the printed circuit board 1 are performed. Is done.

Thereafter, the finished product is loaded into the tray 100a to undergo an external appearance inspection.

However, in the related art, as can be seen from FIGS. 2 and 4, the B, G, and A packages are loaded and packed in the tray 100a, and thus have the following problems.

That is, in the related art, since a B, G, and A package, which is a product, is stored in a flat tray and stacked, the device is completely removed from the receiving groove of the tray or is out of position when an impact is applied to the tray. there was.

In addition, since the conventional tray cannot be transported or handled in a separate tray state, when the tray stack is packed, the product is placed in a receiving groove in the individual tray 100a, and then the individual trays 100a are stacked again. Then, the stacked individual trays 100a should be transported or handled after binding with a belt.

In addition, the unpacking of the tray stack has a disadvantage that it is cumbersome and time consuming, such as lifting the bound belt and then lifting the stacked trays 100a one by one.

Further, in the related art, due to the structural feature of the tray for non-G package, it is not possible to prevent collision between the outer solder ball 2 and the tray wall during the flow of the non-G package in the tray. There was a problem that the solder ball (2) dropping and ball damage occurs.

Therefore, since the defects are treated during appearance inspection, there are many problems such as lowering the yield of the semiconductor manufacturing process or poor mounting during mounting due to ball damage.

The present invention is to solve the above problems, to improve the structure of the B, G, A package storage container to the tube type to prevent solder ball drop and ball damage caused when loading the B, G, A package into the conventional tray. On the other hand, it is an object of the present invention to provide a tube for B, G, A package storage that can meet the tube-type packing requirements.

1 is a longitudinal cross-sectional view showing a conventional B, G, A package

FIG. 2 is a longitudinal cross-sectional view showing a state where a conventional S-B-G package is loaded in a tray;

3 is a longitudinal sectional view showing a conventional S-B-A package.

4 is a longitudinal sectional view showing a state in which a conventional S-B-A package is loaded in a tray;

Figure 5a is an exploded perspective view showing a tube for b, b, g, a package storage and the closure member according to the present invention

FIG. 5B is a longitudinal cross-sectional view showing a state in which a P, B, G, and A package is loaded into the package receiving tube of FIG. 5A; FIG.

Figure 6a is an exploded perspective view showing a tube for B, G, A package storage and the closure member according to the present invention

FIG. 6B is a longitudinal cross-sectional view showing a state in which an S-B, G-A package is loaded into the package receiving tube of FIG. 6A; FIG.

FIG. 7 is a longitudinal sectional view showing a state in which a B, G, A package is accommodated in a package receiving tube of the same type as in FIG. 6A; FIG.

Explanation of symbols on the main parts of the drawings

100: P B G package 200: S B G package

1: circuit board 2: solder ball

3: body 4, 4a: tube

5: space part 6: chip

7: Gold wire 8: Mold body

9: plug member 10: seating surface

In order to achieve the above object, the present invention is provided with an open front and a closed rear and a tube in which the B, G, A package is accommodated in the space inside the body, and a closure member for sealing the open front of the tube There is provided a B, G, A package receiving tube, characterized in that the provided.

Hereinafter, an embodiment of the present invention will be described in detail with reference to FIGS. 3A to 6B.

FIG. 5A is an exploded perspective view showing a B, B, A package receiving tube and a closure member according to the present invention, and FIG. 5B is a state in which the B, B, A package is loaded in the package receiving tube of FIG. 5A. 6A is an exploded perspective view showing the S-B-A package accommodating tube and the closure member according to the present invention, and FIG. 6B is a S-B-G. As a longitudinal cross-sectional view showing a state in which the A package is loaded, the present invention has an open front and a closed rear surface, and a tube in which a B, G and A package is accommodated in a cavity 5 inside the body 3. (4) and a closure member 9 for sealing the open front surface of the tube 4.

At this time, the B, G, A package receiving tube (4) is formed to have a shape similar to the cross-sectional contour of the B, G, A package, so as to minimize the flow of the B, G, A package. The gap with this package should also be designed to the minimum.

On the other hand, the lower surface of the non-G-A package receiving tube 4 is provided with a seating surface 10 on which the edge of the circuit board 1 is placed.

The operation of the B, G, and A package storage tube 4 of the present invention configured as described above will be described through the action of the B, G, and A package loading as follows.

First, the B.G.A.packages 100 are sequentially pushed and filled one by one into the space 5 in the B, A.A package accommodation tube 4 as shown in FIG. 5A.

In this state, even if an impact is applied from the outside, the plug member on the front surface of the tube 4 so that the blood, paper, and a package 100 inside the tube 4 does not flow in the front and rear directions of the storage tube 4. (9) will be installed.

At this time, since the shape of the tip portion of the closure member 9 is the same as the cross-sectional shape of the tube 4, the flow of the P, B, G, A package 100 in the space 5 is minimized. The substrate 1 of the BG-A package 100 is spread over the bent seating surface 10 below the tube 4.

In contrast, the S-B-A package 200 is packed in a tube 4a having a shape as shown in 6a, and in this case, it is packed through the same process as described above.

On the other hand, in the above, the B.B.A.A package 100 can be accommodated in the S.B.G.A.A package 200 receiving tube 4a of FIG. 6A if only the dimension of the tube height side is increased. This can be seen through.

As described above, the present invention improves the non-G-A package tray into a tube-type structure, thereby minimizing the flow of the non-G-A package during storage, thereby preventing solder ball dropping or ball damage. In addition, defects in appearance and mounting of B, G, and A packages can be prevented in advance.

In addition, it is possible to reduce the cost compared to the conventional tray, it is possible to easily perform the inspection of appearance defects of B, G, A package.

Claims (2)

An open front and a closed rear are provided, and the tube for storing the B, G and A packages in the space inside the body, B, G, A package receiving tube, characterized in that the closure member for sealing the open front of the tube is provided. The method of claim 1, The B, G, A package receiving tube is formed to have a shape similar to the cross-sectional outline contour of the B, G, A package, And a seating surface on which an edge of a circuit board is seated at a lower portion of the B, G, and A package storage tube.