KR20000008100A - Metal bonding method using nickel+phosphorus, nickel+boron, or nickel+silicon plated layer - Google Patents

Metal bonding method using nickel+phosphorus, nickel+boron, or nickel+silicon plated layer Download PDF

Info

Publication number
KR20000008100A
KR20000008100A KR1019980027776A KR19980027776A KR20000008100A KR 20000008100 A KR20000008100 A KR 20000008100A KR 1019980027776 A KR1019980027776 A KR 1019980027776A KR 19980027776 A KR19980027776 A KR 19980027776A KR 20000008100 A KR20000008100 A KR 20000008100A
Authority
KR
South Korea
Prior art keywords
nickel
plating
boron
phosphorus
bonding
Prior art date
Application number
KR1019980027776A
Other languages
Korean (ko)
Other versions
KR100276172B1 (en
Inventor
전용수
Original Assignee
전용수
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 전용수 filed Critical 전용수
Priority to KR1019980027776A priority Critical patent/KR100276172B1/en
Publication of KR20000008100A publication Critical patent/KR20000008100A/en
Application granted granted Critical
Publication of KR100276172B1 publication Critical patent/KR100276172B1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/008—Soldering within a furnace
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/24—Preliminary treatment

Abstract

PURPOSE: The metal bonding method is provided to simplify the bonding process, to ensure the uniformity of the plated layer, and to minimize the possibility of occurrence of the defective bonding. CONSTITUTION: The metal bonding method comprises the steps of:plating at a range of 5-50 micro meter by electrolytic or non-electrolytic plating of nickel and phosphorus, nickel and boron, or nickel and silicon onto the bonding face of metal in shape of a thin film and small compound object; and heating at 900-1250°C for 5030 minutes under the state of physical pressurization or without pressurization in a reductive continuous furnace.

Description

니켈+인, 니켈+붕소 또는 니켈+실리콘 도금층을 이용한 금속 접합 방법Metal bonding method using nickel + phosphorus, nickel + boron or nickel + silicon plating layer

본 발명은 니켈+인, 니켈+붕소 또는 니켈+실리콘 도금층을 이용한 금속 접합 방법으로서 예를들어 냉동 공조용 라디에이터 등을 제조하는 박판 및 소형 복잡 형상 제품의 접합에 적합하게 한 것이다.The present invention is a metal bonding method using nickel + phosphorus, nickel + boron, or nickel + silicon plating layer, for example, suitable for joining thin plates and small complex shaped products for producing a radiator for refrigeration and air conditioning.

종래에는 상기와 같은 대상 금속을 접합할 때는 브레이징 공법을 사용하였기 때문에 브레이징용 필러(flller)금속이 소모되고 접합 공정이 매우 복잡하며 필러금속 적용이 곤란한 박판이나 매우 복잡한 형상을 갖는 금속간의 접합시는 매우 불리하였다.In the past, the brazing method was used to join the target metals as described above. Therefore, the brazing filler metal is consumed, the bonding process is very complicated, and the bonding between the thin plates or the metals having a very complicated shape is difficult. It was very disadvantageous.

또한 브레이징 공법은 접합의 균일성이 보장되지 않고 브레이징 필러 금속의 과부족에 의한 접합 불량 발생 가능성이 상존하였다.In addition, the brazing method does not guarantee the uniformity of the bonding, and the possibility of bonding failure due to the excessive shortage of the brazing filler metal has always existed.

본 발명은 박판 및 소형 복합 제품 형상의 금속의 접합면에 대하여 전해 또는 무전해 도금으로 5-50㎛범위로 도금하는 단계와 이를 맞대어 환원성 분위기의 연속로에서 무가압 또는 물리적 가압한 상태에서 900-1250℃로 5-30분간 가열하는 단계로서 서로 용융 접합시키는 것이다.The present invention is a step of plating in the range of 5-50㎛ by electrolytic or electroless plating on the joining surface of the metal of the thin plate and the small composite product shape to meet the 900- in a pressureless or physically pressurized state in a continuous furnace in a reducing atmosphere 5-30 minutes heating to 1250 ° C to melt bonding to each other.

이하 발명의 요지를 그 실시예인 제조 공정에 의하여 항목별로 상세히 설명하면 다음과 같다.Hereinafter, the gist of the present invention will be described in detail by item by the manufacturing process as an example.

적용 도금 기술Applied plating technology

대상 : 박판 및 소형 복합 제품 형성의 금속Target: Metal of sheet and small composite product formation

종류 : 니켈+인, 니켈+붕소 또는 니켈+실리콘Type: Nickel + Phosphorus, Nickel + Boron or Nickel + Silicon

도금 방법 : 전해 및 무전해도금Plating method: electrolytic and electroless plating

* 전해 도금 : 도금층의 균일도는 다소 떨어지나 경제성 양호* Electrolytic plating: Uniformity of plating layer is somewhat reduced but good economic efficiency

* 무전해도금 : 도금층의 균일성이 매우 우수함* Electroless plating: Excellent uniformity of plating layer

도금 공정 기술 : 기존에 실시하고 있는 방법으로 접합면에 실시하며 그 상세한 설명은 관용기술이므로 생략함Plating process technology: It is applied to the joint surface by the existing method and the detailed description is omitted because it is a conventional technology.

도금 두께 : 5-50㎛범위Plating thickness: 5-50㎛ range

* 경제성과 접합 특성을 고려하여 10㎛ 정도* About 10㎛ considering economical and bonding characteristics

접합 기술Bonding technology

적용 가열로의 분위기 : 진공 또는 환원성 분위기로Atmosphere in Applied Furnace: Into Vacuum or Reducing Atmosphere

* 스테인레스 판재 브레이징의 경우 진공로의 사용하여야 하는 본 발명의 기술을 환원성 분위기의 연속로에서 작업이 가능하므로 양산성이 우수함* In the case of stainless steel plate brazing, the technology of the present invention, which should be used in a vacuum furnace, can be operated in a continuous furnace in a reducing atmosphere, and thus excellent in mass productivity.

가열 온도 :Heating temperature:

* 니켈+인 도금 : 900-1050℃Nickel + phosphorus plating: 900-1050 ℃

* 니켈+붕소 도금 : 1050-1150℃Nickel + Boron Plating: 1050-1150 ℃

* 니켈+실리콘 도금 : 1150-1250℃* Nickel + Silicon Plating: 1150-1250 ℃

가열 시간 : 도금 종류 및 제품에 따라 5-30분유지Heating time: 5-30 minutes depending on plating type and product

기타 : 접합시 무가압 상태에서도 충분한 접합력을 얻을 수 있으나 접합력을 더욱 향상시키기 위해서는 물리적인 가압을 추가적으로 실시할Other: Although sufficient bonding strength can be obtained even under no pressure during bonding, additional physical pressure may be applied to further improve the bonding strength.

수 있음.May be.

이와 같은 공정으로서 도금층이 박판에 도금된 상태에서 용융 되어 용융 도금층이 서로 접합됨으로 이후 서냉하면 박판이 자연적으로 도금층에 의해 접합되는 것이다.As such a process, the plating layer is melted in the state where it is plated on the thin plate, and the hot dip galvanizing layers are bonded to each other.

상기한 바와 같은 본 발명은 기존 브레이징용 필러(flller)금속을 사용하지 않기 때문에 접합공정이 매우 간단하여 필러금속의 적용이 곤란한 박판이나 매우 복잡한 형상을 갖는 금속간의 접합시 특히 유리 하고 또한 도금층의 균일성이 보장됨으로써 기존 브레이징시 필러금속의 과부족에 의한 접합 불량 발생 가능성을 극소화 할 수 있음으로서 해당 산업 분야에 실용화 보급할 수 있는 것이다.As described above, the present invention does not use a conventional filler metal for brazing, so the bonding process is very simple, and it is particularly advantageous when bonding between thin plates or metals having a very complicated shape, which is difficult to apply the filler metal, and uniform plating layer. As it is guaranteed, it is possible to minimize the possibility of joining defects caused by excessive shortage of filler metal during existing brazing, and thus it can be practically distributed in the relevant industrial fields.

Claims (1)

박판 및 소형 복합 제품 형상의 금속의 접합면에 대하여 니켈(니켈계)+인, 니켈+붕소 또는 니켈+실리콘의 전해 또는 무전해 도금으로 5-50㎛범위로 도금하는 단계와 이를 맞대어 환원성 분위기의 연속로에서 무가압 또는 물리적 가압한 상태에서 900-1250℃로 5-30분간 가열하는 단계로서 도금층이 서로 용융되어 접합시키는 것을 특징으로 하는 니켈+인, 니켈+붕소 또는 니켈+실리콘 도금층을 이용한 금속접합방법.Electroplating or electroless plating of nickel (nickel) + phosphorus, nickel + boron or nickel + silicon on the joining surface of the metal in the form of a thin plate and a small composite product to the plating in the range of 5-50㎛ range of the reducing atmosphere A metal using nickel + phosphorus or nickel + boron or nickel + silicon plating layer, wherein the plating layers are melted and bonded to each other by heating at 900-1250 ° C. for 5-30 minutes in a pressureless or physically pressurized state in a continuous furnace. Joining method.
KR1019980027776A 1998-07-10 1998-07-10 Metal joining method with surface layers deposited by ni+p, ni+b or ni+si plating KR100276172B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019980027776A KR100276172B1 (en) 1998-07-10 1998-07-10 Metal joining method with surface layers deposited by ni+p, ni+b or ni+si plating

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019980027776A KR100276172B1 (en) 1998-07-10 1998-07-10 Metal joining method with surface layers deposited by ni+p, ni+b or ni+si plating

Publications (2)

Publication Number Publication Date
KR20000008100A true KR20000008100A (en) 2000-02-07
KR100276172B1 KR100276172B1 (en) 2000-12-15

Family

ID=19543681

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019980027776A KR100276172B1 (en) 1998-07-10 1998-07-10 Metal joining method with surface layers deposited by ni+p, ni+b or ni+si plating

Country Status (1)

Country Link
KR (1) KR100276172B1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100505534B1 (en) * 2002-05-27 2005-08-03 주식회사 스펙 A Machining And Brazing Methood Of Thin Metal Plate With Micro Flow Path And Pattern

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5874291A (en) * 1981-10-30 1983-05-04 Hitachi Ltd Diffusion bonding method
JPH01278977A (en) * 1988-04-28 1989-11-09 Japan Steel Works Ltd:The Manufacture of copper-nickel clad material

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100505534B1 (en) * 2002-05-27 2005-08-03 주식회사 스펙 A Machining And Brazing Methood Of Thin Metal Plate With Micro Flow Path And Pattern

Also Published As

Publication number Publication date
KR100276172B1 (en) 2000-12-15

Similar Documents

Publication Publication Date Title
US4059217A (en) Superalloy liquid interface diffusion bonding
KR101528373B1 (en) Sputter target assemblies having a controlled solder thickness
CN100360269C (en) Method of connecting module layers suitable for the production of microstructure components and a microstructure component
CN101314192B (en) Connecting method for metallic material and non-metallic composite
JPS595389B2 (en) Diffusion bonding assembly
KR20100008345A (en) Sputter target assembly having a low-temperature high-strength bond
JPS6336941B2 (en)
KR100348437B1 (en) How to Make Sputtering Target Assemblies and New Target Assemblies
EP0623415B1 (en) Method of making cathode targets comprising silicon
KR20000008100A (en) Metal bonding method using nickel+phosphorus, nickel+boron, or nickel+silicon plated layer
CN111656462B (en) Method for producing a magnetocaloric composite material and corresponding heat exchanger
US5100739A (en) Separating sheet provided with a plurality of plating layers, excellent in strippability and having a high hardness
US2855296A (en) Method of sintering nickel powder onto stainless steel
JPH01249294A (en) Precoated brazing filler metal-coated metal sheet, production thereof and using method therefor
US4754913A (en) Method of joining zinc coated aluminum members and uncoated aluminum members
KR100394776B1 (en) Anticorrosive coating method for gas sealing part of fuel cell separator
KR100524048B1 (en) A Brazing Method Of A Thin Metal Plate For Cooling An Electronic Device
CN212171525U (en) Bimetal composite steel plate with adhesive interface
CA1236256A (en) Process for bonding refractory to surfaces
JPS58199855A (en) Surface treatment of tuyere
CN115401306B (en) Bonding method of CVD diamond window and heat conduction copper component
JPH1087385A (en) Metal-ceramic composite substrate and its production
CN217726780U (en) Hot-pressing composite tool
JPH09237677A (en) Elecromagmetic induction heating composite material, and manufacture thereof
KR930006111B1 (en) Method of clading

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20080910

Year of fee payment: 9

LAPS Lapse due to unpaid annual fee