KR20000003008U - Ball Grid Array Sockets and Contacts for Integrated Circuit Chips - Google Patents

Abstract

The present invention relates to a ball grid array socket and a contact for an IC chip, and includes an upper cover, a slider, a plastic housing, a handlebar, a plurality of metallic contacts, a spring, and four legs. This newly designed structure allows the metallic contacts in the socket to contact metallic balls under the BGA chip at a uniform lateral pressure instead of downward pressure to prevent damage or deformation to the PCB. The arc-shaped and V-shaped designs of the metallic contacts respectively on the upper and lower pin portions ensure the contact between the metallic contacts and the metallic balls. The pretilted pin portion may help to accommodate more liquid brazing material in the space formed by the inclined pin portion, thereby obtaining a better soldering effect. Inspection holes provided on the plastic housing allow the operator to make a visual preliminary check on the quality of the solder without using sophisticated measuring devices.

Description

Ball Grid Array Sockets and Contacts for Integrated Circuit Chips

The present invention relates to ball grid array sockets and structures for contacts for integrated circuit chips, more specifically metallic balls and ICs mounted beneath the chip with uniformly distributed side pressure. The contacts inside the sockets of the chip may be in full contact using the movement of the slider, whereby the signals are directed to ball grid array sockets and contacts that can be transmitted accurately.

IC chips (Integrated Circuit chips) have been widely used as computer components for a long time. Conventional methods for attaching an IC chip on a printed circuit board (PCB) usually use a dip soldering process, but this process is difficult to control. IC chip terminal pins are easily deformed or bent. An advanced technology called Surface Mounting Technology (SMT) has been used in which the terminal pins of the IC chip are made in a spherical shape and the IC chip and the board are connected by soldering. However, SMT also results in a poor soldering process, where high-density IC chip terminal pins must be soldered, so that the heat required to solder the terminal pins is difficult to transfer into a group of terminal pins, making it difficult to check and correct. .

In the case where it is necessary to replace a defective IC chip or even modify the whole computer installation, the above-described conventional DIP and SMT techniques cannot perform satisfactorily. This type of socket is also required when using a desired MPU upgrade exchange device such as a PC motherboard.

In order to solve the above problems, two inventions published by the inventors of the present invention, "ball chip array socket for IC chip" (Taiwan Patent No. 119885) and "improved structure for ball grid array socket for IC chip" ( Taiwan Patent No. 86219485). In the case of these two inventions, however, the contacts and metallic balls mounted under the bottom of the BGA chip are pressed under downward pressure which may damage the PCB or cause deformation of the PCB. In this regard, the inventors of the present invention are not satisfied with the two inventions and seek to find a solution to these problems.

Through long efforts, the inventors have finally found a solution to the above-mentioned problems with the present invention described below, "BGA socket and contact for IC chip."

In order to prevent damage or deformation of the PCB, the first object of the present invention utilizes the movement of the slide of the metallic balls mounted under the IC chip and the contacts inside the socket of the IC chip with uniformly distributed side pressure instead of downward pressure. This provides a BGA socket and contact structure for an IC chip that may be in full contact.

The second object of the present invention is that the contact with the metallic ball mounted under the BGA chip with the V-type lower pin is improved by the upper part of the newly designed metallic contact in arc shape, and consequently the quality of the contact therebetween is improved. To provide a structure of the BGA socket and contacts for the integrated IC chip.

It is a third object of the present invention to provide a structure of a BGA socket and a contact for an IC chip which improves the soldering quality of a PCB by forming metallic contact pins at an inclined angle.

It is a fourth object of the present invention to provide a structure of a BGA socket and a contact for an IC chip, which enables the operator to visually perform preliminary inspections according to the quality of soldering by means of inspection holes that are uniquely designed without using sophisticated measuring devices.

In order to achieve these and other objects, the subject matter of the present invention provides a structure of a BGA socket and contact for an IC chip, and the structure described herein to perform the above-described advantageous functions, the top cover, the slider, the plastic housing and And a handle bar, a plurality of metallic contacts, a spring and four legs.

The drawings schematically illustrate embodiments which serve to illustrate various advantages and objectives of the present invention.

1 is an assembly view of the BGA socket and contacts for the IC chip of the present invention.

Figure 2 is a three-dimensional exploded view of the BGA socket and contact for the IC chip of the present invention.

3 is a front view, a plan view and a side view of a contact of the present invention.

Figure 4 is a cross-sectional view of the BGA socket and contact for the IC chip of the present invention.

5 is a view schematically showing how the BGA chip is mounted in the socket of the present invention.

6 is a schematic cross-sectional view of a BGA socket and contact for an IC chip in an embodiment of the present invention (before the operation of the slider).

FIG. 7 is a view similar to FIG. 6 except that the state after the operation of the slider is shown;

8 is a view schematically showing the movement of each component in the BGA socket and contact for the IC chip of the present invention.

Explanation of symbols on the main parts of the drawings

10: top cover 20: slider

30 plastic housing 40 handlebar

50: metallic contact 60: spring

70: legs

1 and 2, the BGA socket and the contact for the IC chip of the present invention include a top cover 10, a slider 20, a plastic housing 30, a handlebar 40, and a plurality of metallic contacts. 50, a spring 60 and four legs 70. The top cover 10 is formed of a hollow plate with two clasps 12 that engage each slot 31 provided in the plastic housing 30 when the top cover 10 is covered. The slider 20 is a square plastic body having a concave surface provided with a plurality of square holes 28 opposite the plastic housing 30. A protruding block is formed on the front edge of the slider, and four sliding slots 25 having two sliding slots 25 on the right and left sides are formed on the side edges. In addition, the plastic housing 30 is formed with a square concave surface provided with a plurality of square holes 33, and two positioning blocks 37 on the right and left sides inside the two edges facing the concave surface. Four positioning blocks 37 are formed. The front part of the plastic housing 30 is drilled to form a circular hole 35, and a hook 39 is provided at one edge to hook the handlebar 40. Handlebar 40 formed similarly to L has a rotating shaft 43 at its end, which includes an eccentric 46 and also a plurality of metallic contacts 50 at this end. The plastic housing 30 is provided with four legs and a spring 60.

The metallic contacts are mounted to the plastic housing 30 and the handlebar 40 is secured to the housing 30 with the legs 70. The rotating shaft 43 is inserted into the circular hole 35 formed in the front part of the plastic housing 30. Top cover 10 is secured on plastic housing 30 with four legs 70.

Referring to FIG. 3, which shows a front view, a plan view, and a side view of a metallic contact according to the present invention, when the downward pressure is applied to the metallic contact 50, the upper portion of the metallic contact 50 is positioned below the metallic ball 85. It can be seen from the figure that it is formed almost in an arc shape in order to gently press). Since the contact end 53 of the contact 50 is formed in a V shape, better contact can be obtained by increasing the contact contact area. The pin portion 56 of the contact 50 is inclined in advance at an angle to accommodate more liquid solder in the space formed by the inclined pin portion 56, thereby making the metallic contact 50 to the PCB 95. Improves solder reliability (see FIG. 8D).

4 is a cross-sectional view of a BGA socket and a contact for an IC chip of the present invention, which shows a plurality of metallic contacts 50 inserted in a square hole 33 provided in the plastic housing 33 before applying a force. ).

FIG. 5 is a view schematically showing how a BGA chip is inserted into a socket of the present invention, and FIG. 6 is a schematic cross-sectional view of a BGA socket and a contact for an IC chip as an embodiment of the present invention before operation of a slider. Wherein, when the BGA chip 80 is inserted into the socket 90, the plurality of metallic balls 85 provided below the BGA chip 80 enter the square hole 33, and the metallic hole already received in the square hole 33. Light contact with the contact 50 can be seen from these two figures. However, if the quality of the pin portion 56 of the metallic contact 50 is unreliable, a complete contact between all metallic contacts 50 and metallic balls 85 cannot be expected, even contact 50 and metallic balls. Some of the 85 are not in contact with each other at all. When such a situation occurs, it is certainly a bad communication signal, and even if the device is made of such incomplete parts, the signal is completely lost.

Referring to FIG. 7, it is similar to FIG. 6 except that the state after the operation of the slider after the BGA chip 80 is mounted in the socket 90 is shown. The protruding block 22 provided at the front end of the slider 20 is pushed by the operation of the eccentric portion 46 of the handlebar 40 after the handlebar 40 is pressed down, thereby pushing the slider 20 to plastic. It moves into the housing 30 and as a result causes the metallic balls 85 under the BGA chip 80 to come into contact with the metallic contacts 50 at lateral pressure. By such operation, each metallic contact 50 ensures reliable contact with the corresponding metallic ball 85. With this ideally designed structure of the present invention, the signal can be transmitted accurately and reliably, which is the most important and characteristic point of the present invention (see FIGS. 8A-8C).

In addition to this, referring to E of FIG. 8, another advantage is that the pin portion 56 of the metallic contact 50 may be prevented by the possibility of future failures caused by incomplete soldering operations during the manufacturing process. ) Is obtained by an inspection hole (not shown) that allows the operator to make a preliminary visual inspection from the top of the socket 90 as to whether or not it is reliably soldered to the PCB 95.

In conclusion, the BGA socket and contact for the IC chip of the present invention have several advantages over the advantages of the invention cited herein or other equivalent inventions. In other words,

1. Addresses the possibility of damage or deformation to the PCB caused by the downward pressure used in the prior art by side pressure contact between the metallic contacts and the metallic balls under the BGA chip.

2. With the inspection holes provided according to the present invention, the operator can facilitate visual preliminary inspection regarding the quality of soldering of metallic contacts and metallic balls on the PCB.

3. By designing the upper part of the metallic contact according to the present invention in an arc shape, it is possible to reduce the force applied to the upper part by transmitting a force to press the metallic ball beneath it, and as a result, the chip pops out of the socket by the slider movement. Prevents climbing The V-shaped contact ends of the contacts increase the contact area, which can produce better contact efficiency.

4. The inclined pin portion of the metallic contact according to the present invention provides space for accommodating more liquid state solder material for better soldering effect of the metallic contact in contact with the PCB.

Of course, in the above-described embodiment of the present invention, various changes and modifications can be made without departing from its scope. Thus, in order to facilitate the advancement of science and useful technologies, the present invention is disclosed and limited only by the scope of the appended claims.

Claims (1)

A hollow top cover; A square slider having a concave surface provided with a plurality of square holes facing the plastic housing, four sliding slots each formed two at the side edges, and a protruding block formed at the front edge; A concave surface provided with a plurality of square holes for accommodating metallic contacts, four positioning blocks provided two each inside two edges facing the concave surface, and hooks provided at one edge to hook the handlebars. Having a square plastic housing; A substantially L-shaped handlebar having a rotating shaft 43 at an end for receiving the eccentric; A plurality of metallic contacts having an upper portion formed similarly to an arc shape, a contact end formed in a V shape, and a fin portion pretilted at an angle; With four legs; Springs, The metallic contact is received in the plastic housing, the rotating shaft of the handlebar is inserted into a circular hole drilled in the front portion of the plastic housing, the handlebar is fixed to the plastic housing having the four legs, A slider is fitted to the plastic housing by the sliding slot and secured by the positioning block provided on the plastic housing, and the top cover is secured to the plastic housing thereon by the legs. In sockets and contacts, The structure described above, after the BGA chip is attached to the socket, the slider is moved by the operation of the eccentric shaft portion of the handlebar, which causes the metallic balls to be side pressure under the BGA chip. A ball grid array socket and contact for an integrated circuit chip, characterized by being able to contact contacts.