KR19990046479A - a plastics film devise - Google Patents
a plastics film devise Download PDFInfo
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- KR19990046479A KR19990046479A KR1019990009358A KR19990009358A KR19990046479A KR 19990046479 A KR19990046479 A KR 19990046479A KR 1019990009358 A KR1019990009358 A KR 1019990009358A KR 19990009358 A KR19990009358 A KR 19990009358A KR 19990046479 A KR19990046479 A KR 19990046479A
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- Prior art keywords
- film
- deposited
- deposition
- metal
- zinc
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- 239000004033 plastic Substances 0.000 title description 2
- 229920003023 plastic Polymers 0.000 title description 2
- 238000000151 deposition Methods 0.000 claims abstract description 54
- 230000008021 deposition Effects 0.000 claims abstract description 43
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 29
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 29
- 239000003990 capacitor Substances 0.000 claims abstract description 28
- 229910052751 metal Inorganic materials 0.000 claims abstract description 26
- 239000002184 metal Substances 0.000 claims abstract description 26
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims abstract description 22
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 22
- 239000011701 zinc Substances 0.000 claims abstract description 22
- 239000002985 plastic film Substances 0.000 claims abstract description 21
- 229920006255 plastic film Polymers 0.000 claims abstract description 21
- 238000004519 manufacturing process Methods 0.000 claims abstract description 11
- 238000000034 method Methods 0.000 claims abstract description 4
- 239000007921 spray Substances 0.000 abstract description 5
- 230000005494 condensation Effects 0.000 abstract description 4
- 238000009833 condensation Methods 0.000 abstract description 4
- 239000010408 film Substances 0.000 description 52
- 238000001465 metallisation Methods 0.000 description 5
- 239000010409 thin film Substances 0.000 description 5
- 230000007423 decrease Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 2
- 229910001297 Zn alloy Inorganic materials 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 229920000379 polypropylene carbonate Polymers 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000007751 thermal spraying Methods 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
- C23C28/025—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only with at least one zinc-based layer
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/20—Metallic material, boron or silicon on organic substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
- C23C4/01—Selective coating, e.g. pattern coating, without pre-treatment of the material to be coated
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
- C23C4/04—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the coating material
- C23C4/06—Metallic material
- C23C4/08—Metallic material containing only metal elements
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
본 발명은 용사 금속과의 전기적 접촉을 좋게 함으로서 내전류 특성을 향상시키고 응축잠열이 낮은 금속을 증착함으로서 필름의 내전압 특성을 유지시킬수 있도록 함과 아울러, 교류용 콘덴서에 사용할때 교류전원의 교번작용에 의한 부분방전 때문에 발생되는 콘덴서의 용량감퇴 현상을 극소화시켜 줄수 있도록 한 콘덴서용 아연증착 플라스틱필름의 제조방법에 관한 것으로, 이는 테이프상 플라스틱필름의 표면에 전극형성용 알루미늄증착막을 증착시켜 콘덴서용 알루미늄증착 플라스틱 필름을 제조하는 방법에 있어서, 상기 플라스틱필름(100)의 표면 일측에만 소폭의 비증착부(110)가 갖추어지도록 알루미늄증착막(200)을 증착하고, 상기 알루미늄증착막의 표면 전체를 덮어주도록 하되 상기 비증착부의 타측 방향인 에지부분(310)을 일체로 하여 상대적으로 두껍게 갖추어질수 있도록 아연금속막(300)을 증착시켜 됨을 특징으로 한다.The present invention improves the current resistance characteristics by improving the electrical contact with the thermal spray metal, and to maintain the voltage resistance characteristics of the film by depositing a metal with low latent heat of condensation, and also in the alternating action of AC power when used in an AC capacitor The present invention relates to a method for manufacturing a zinc-deposited plastic film for capacitors that minimizes the capacity loss of a capacitor caused by partial discharge caused by partial discharge. In the method of manufacturing a plastic film, the aluminum deposition film 200 is deposited so that a small non-deposition portion 110 is provided only on one surface of the plastic film 100, and the entire surface of the aluminum deposition film is covered. The edge portion 310 in the other direction of the non-deposition portion is integrally formed. It cants to ever thicker equipped with depositing a zinc metal layer 300 that is a feature.
Description
본 발명은 콘덴서용 금속증착 플라스틱필름의 제조방법에 관한 것으로, 특히 용사 금속과의 전기적 접촉을 좋게 함으로서 내전류 특성을 향상시키고 응축잠열이 낮은 금속을 증착함으로서 필름의 내전압 특성을 유지시킬수 있도록 함과 아울러, 교류용 콘덴서에 있어서 교류전원의 교번작용에 의한 부분방전 때문에 발생되는 콘덴서의 용량감퇴 현상을 극소화시켜 줄수 있도록 한 콘덴서용 금속증착 플라스틱필름의 제조방법에 관한 것이다.The present invention relates to a method of manufacturing a metal-deposited plastic film for capacitors, in particular to improve electrical current characteristics by improving the electrical contact with the thermal spray metal and to maintain the withstand voltage characteristics of the film by depositing a metal with low latent heat of condensation; In addition, the present invention relates to a method of manufacturing a metal-deposited plastic film for capacitors, which minimizes the capacity decay of the capacitors caused by partial discharge due to alternating action of AC power in AC capacitors.
일반적으로 증착필름 콘덴서에 흔히 사용되고 있는 종래의 알루미늄증착 플라스틱 필림은 유전체로 작용하는 2-18㎛두께의 플라스틱 필름의 일면 또는 양면상에 전극으로 작용하는 도체성 금속을 면저항 10-2Ω/㎠의 200-1,000Å의 두께로 진공 증착하여 제조되며, 이때 베이스 필름으로 주로 사용되는 플라스틱필름으로는 폴리에틸렌 테레프탈레이트, 폴리프로필렌 및 폴리카보네이트등을 들수 있다.Conventional aluminum-deposited plastic films, which are commonly used in deposition film capacitors, contain a conductive metal that serves as an electrode on one or both sides of a plastic film having a thickness of 2-18 μm acting as a dielectric. Manufactured by vacuum deposition to a thickness of -1,000Å, the plastic film mainly used as the base film may include polyethylene terephthalate, polypropylene and polycarbonate.
상기와 같이 알루미늄증착 플라스틱필름을 이용한 알루미늄 증착필름 콘덴서의 일반적인 구성은 도 1 에 도시되어 있는 바와 같이 테이프상 플라스틱필름(10) 표면에 알루미늄 박막을 증착시킴에 있어 일측의 에지 부분에는 증착이 이루어지지 않도록 하여 비증착부(11)를 남겨놓은 상태에서 알루미늄증착막(12)을 형성시켜 된 알루미늄증착 플라스틱필름(10)을 원통형으로 연속적으로 적층 권회하여 원통형의 몸체(20)를 제작한 다음 이의 양단에 아연 또는 아연합금을 용사하여 전극(30)을 형성함과 아울러, 상기 전극상에 리드선(40)(40a)을 납땜 또는 용접하여 된 것이다.As described above, a general configuration of an aluminum deposition film capacitor using an aluminum deposition plastic film, as shown in FIG. 1, is not performed at the edge of one side in depositing an aluminum thin film on the tape-like plastic film 10. The aluminum-deposited plastic film 10 formed by forming the aluminum deposition film 12 in the state of leaving the non-deposited portion 11 so as to be continuously laminated and wound into a cylindrical shape to manufacture a cylindrical body 20, and then at both ends thereof. The electrode 30 is formed by spraying zinc or zinc alloy, and the lead wires 40 and 40a are soldered or welded on the electrode.
이와 같은 방법을 통하여 제조된 종래의 증착필름 콘덴서는 알루미늄의 낮은 전기저항특성(2.65 x 10-4)에 기인하여 증착박막의 두께를 얇게 형성할수 있기 때문에 자기 회복 특성이 우수하여 신뢰성이 높고 또한 우수한 내식특성 때문에 보관이 용이하면서도 플라스틱필름에 대한 알루미늄증착 박막의 접착 강도가 높아서 건식 증착필름 콘덴서 제조용으로 적합한 것으로 알려져 있는 것이다.The conventional deposition film capacitor manufactured by the above method is able to form a thin film thickness due to the low electrical resistance characteristic (2.65 x 10 -4 ) of aluminum, so that the self-healing property is excellent and the reliability is excellent. Due to its corrosion resistance, it is easy to store and has high adhesive strength of aluminum-deposited thin film to plastic film.
그러나, 상기와 같은 종래의 알루미늄증착 박막은 그 두께가 얇기 때문에 전극 형성을 위한 아연 또는 아연합금의 용사공정시 용사금속과의 접속에 어려움이 있어 부착강도가 낮고 전기적 접촉 저항이 커서 사용기간의 경과에 따라 tanδ값이 증가하게 되고 증착박막의 부분방전으로 인한 시간의 경과에 따라 캐패시턴스가 감소하는 등의 단점이 있었던 것이다.However, since the conventional aluminum deposition thin film is thin, it is difficult to connect with the thermal spray metal during the thermal spraying process of zinc or zinc alloy to form the electrode. As a result, tan δ increases and capacitance decreases with time due to partial discharge of the deposited thin film.
상기와 같은 종래의 문제점을 해소하기 위해 소개된 것이 일본공개특허공보 소59-103323호 즉, 도 2 에 도시된 바와 같이 플라스틱필름(10A)의 상면에 일측 에지부분에는 증착이 이루어지지 않도록 비증착부(11A)를 남겨놓은 상태에서 알루미늄증착막(12A)을 형성하되 상기 알루미늄증착막이 증착된 타측의 에지부분(12A')을 두껍게 증착시켜 준 것이 있으나, 이는 응축잠열이 큰 알루미늄을 에지부분에 두껍게 증착시켜 주게되면 유전체 필름에 손상을 주어 내전압 특성이 낮아지는 현상이 일어나고, 또한 교류용으로 사용할 경우 교류전원의 교번작용에 의하여 부분방전이 발생함으로서 사용기간이 경과함에 따라 비증착부(11A)의 끝단 부분부터 알루미늄증착막이 소멸되므로서 용량감소 현상이 나타나는 단점이 있고, 국내특허공보 공고번호 제94-8653호는 도 3 에 도시된 바와 같이 플라스틱필름(10B)의 표면에 소폭의 비증착부(11B)를 제외한 전범위에 알루미늄증착막(12B)이 증착되고, 그 위에 에지부분을 따라 아연이나 카드뮴과 같은 합금으로 이루어지는 금속층(13)을 별도로 형성한 것이 소개되었으나, 이것 역시 교류용에서는 교류전원의 교번작용에 의해서 부분방전이 발생함으로서 시용기간이 경과함에 따라 비증착부(11B)의 끝단부분 부터 알루미늄증착막(12B)이 소멸되어 용량이 감소하게 되는 현상이 일어나게 되었으며, 금속막이 증착되지 않은 알루미늄증착막 부위는 내산화및 내전류 특성이 떨어지게 되는 등의 제반결함이 있었던 것이다.In order to solve the conventional problems as described above, Japanese Unexamined Patent Publication No. 59-103323, that is, as shown in Fig. 2 as shown in Fig. Although the aluminum deposition film 12A is formed while the part 11A is left, the edge portion 12A 'of the other side on which the aluminum deposition film is deposited is thickly deposited. If deposited, the dielectric film is damaged and the breakdown voltage characteristic is lowered. Also, when used for alternating current, partial discharge occurs due to the alternating action of the alternating current power source. There is a disadvantage in that the capacity decrease phenomenon occurs as the aluminum deposition film is extinguished from the end portion, Korean Patent Publication No. 94-8653 is shown in FIG. As shown in FIG. 2, the aluminum deposition film 12B is deposited on the surface of the plastic film 10B except for the small non-deposited portion 11B, and a metal layer made of an alloy such as zinc or cadmium is formed along the edge portion thereof. Although (13) was separately formed, this was also introduced, but in the case of alternating current, partial discharge occurs due to the alternating action of the AC power supply, and as the application period elapses, the aluminum deposition film 12B is formed from the end of the non-deposition portion 11B. The dissipation caused a decrease in capacity, and the aluminum deposition film portion in which the metal film was not deposited had defects such as deterioration in oxidation resistance and current resistance.
따라서, 본 발명의 목적은 증착필름 콘덴서의 내산화및 내전류, 내전압 특성이 향상될수 있도록 함과 아울러, 교류용 콘덴서로 사용시 알루미늄증착막이 부분방전으로 소멸되어 용량이 감퇴되는 현상이 일어나지 않도록 하는데 그 목적이 있는 것이다.Accordingly, an object of the present invention is to improve the oxidation resistance, withstand current, and withstand voltage characteristics of the deposited film capacitor, and also to prevent the aluminum deposition film from disappearing due to partial discharge when used as an AC capacitor so that the capacity does not decrease. There is a purpose.
도 1 - 종래의 증착필름 콘덴서의 구성을 보인 사시도.1-a perspective view showing the configuration of a conventional deposition film capacitor.
도 2 - 종래의 콘덴서용 금속증착 필름제조방법을 도시한 단면도.2-a cross-sectional view showing a conventional method for producing a metal deposition film for a capacitor.
도 3 - 종래의 다른 콘덴서용 금속증착 필름제조방법을 도시한 단면도.Figure 3 is a cross-sectional view showing a conventional metal deposition film manufacturing method for another capacitor.
도 4 - 본 발명이 적용되어 제조된 금속증착필름의 제조방법을 도시한 단면도.Figure 4 is a cross-sectional view showing a method of manufacturing a metal deposition film is applied to the present invention.
도 5 - 본 발명이 적용된 금속증착필름 제조장치의 개략적인 단면도.5-schematic cross-sectional view of a metal deposition film manufacturing apparatus to which the present invention is applied.
도 6 - 본 발명이 적용된 증착필름으로 제조한 콘덴서 내전압 특성을 비교한 측정결과 그래프.Figure 6-Measurement result graph comparing the capacitor withstand voltage characteristics prepared by the deposited film to which the present invention is applied.
도 7 - 본 발명이 적용된 증착필름으로 제조한 콘덴서에 정전용량 특성을 비교한 측정결과 그래프.Figure 7-Measurement result graph comparing the capacitance characteristics of the capacitor prepared by the deposited film to which the present invention is applied.
도 8 - 본 발명의 다른 실시예를 보인 단면도.8 is a cross-sectional view showing another embodiment of the present invention.
도면의 주요 부분에 대한 부호설명Explanation of Signs of Major Parts of Drawings
100:플라스틱필름 110:비증착부100: plastic film 110: non-deposition
200:알루미늄증착막 300:아연금속막200: aluminum deposition film 300: zinc metal film
310:에지부분310: edge part
이하, 첨부되는 도면을 토대로 하여 본 발명의 실시예를 구체적으로 설명하면 다음과 같다.Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
도 4 는 본 발명이 적용되어 제조된 금속증착필름 제조방법의 실시예를 보인 단면도로서, 플라스틱필름(100)의 표면 일측에 소폭을 갖는 비증착부(110)를 제외한 전면에 알루미늄증착막(200)을 증착하고, 상기 알루미늄증착막의 표면에 아연금속막(300)을 증착시켜 주되 상기 아연금속막중 비증착막(110)의 타측 방향인 에지부분(310)을 아연금속막을 일체로 하여 두껍게 증착시켜 준 것이다.4 is a cross-sectional view showing an embodiment of a metal deposition film manufacturing method applied to the present invention, the aluminum deposition film 200 on the entire surface except the non-deposition portion 110 having a small width on one surface of the plastic film 100 And depositing a zinc metal film 300 on the surface of the aluminum deposition film, but thickly depositing the edge portion 310 of the non-deposition film 110 of the zinc metal film integrally with the zinc metal film. .
상기와 같은 본 발명의 증착필름 콘덴서는 알루미늄증착막(200)의 표면 전체에 응축잠열이 낮은 아연금속막을 증착시켜 주므로서 필름의 내전압 특성을 유지시켜 주게 되는 효과가 있고, 또한 에지부분(310)이 아연금속막에 의해 두껍게 증착되어 있어 용사금속과의 전기적 접촉을 좋게 함은 물론, 내전류특성을 향상시켜 주게되는 등의 효과가 있는 것이다.The deposition film capacitor of the present invention as described above has the effect of maintaining the withstand voltage characteristics of the film by depositing a zinc metal film having a low latent heat of condensation on the entire surface of the aluminum deposition film 200, and also the edge portion 310 It is deposited by a thick zinc metal film to improve electrical contact with the thermal spray metal, as well as to improve the current resistance characteristics.
상기와 같은 증착막의 형성공정은 도 5 에 도시된 바와 같이 기계압의 진공도를 10-3- 10-4torr로 한 상태에서 베이스필름 롤(1)에 권취되어 있는 플라스틱필름(2)이 냉각드럼(3)(온도 -25 내지 -10℃)을 통해 알루미늄증착부(4)와 아연증착부(5)에 갖추어져 있는 알루미늄과 아연이 순차적으로 도포됨과 아울러, 급속냉각시켜 준뒤 귄취롤(6)에 의해 권취가 이루어지도록 하게되는 것이다.Deposition layer of the step of forming the pressure to degree of vacuum of the machine 10 -3 as shown in Figure 5 as described above - that is wound on the plastic base film roll (1) in a state of 10 -4 torr to a film (2) and the cooling drum (3) The aluminum and zinc provided in the aluminum deposition part 4 and the zinc deposition part 5 are sequentially applied through (temperature -25 to -10 ° C.), and then rapidly cooled, followed by a quench roll (6). It is to be wound by.
본 발명에 따른 증착필름(PP 7㎛)을 사용하여 제조된 콘덴서(규격: 10 MFD)를 85℃에서 500V 교류전압의 시험조건으로 내전압 특성과 용량특성을 시험한 결과 내전압 특성은 도 6 에 도시된 바와 같이 절연파과 전압(BDV: Break Down Voltage)의 측정결과를 비교하여 나타낸 그래프로서 본 발명이 적용된 콘덴서의 내전압 특성이 우수함을 알수 있고, 또한 용량특성은 도 7 에 도시된 바와 같이 본 발명이 적용된 콘덴서의 용량 변화율이 상대적으로 작음을 알수 있는 것이다.The withstand voltage characteristics and capacitance characteristics of the capacitor (standard: 10 MFD) manufactured using the deposited film (PP 7 μm) according to the present invention were tested under a test condition of 500 V AC voltage at 85 ° C., and the withstand voltage characteristics are shown in FIG. 6. As a graph showing the measurement results of the breakdown voltage (BDV) as described above, it can be seen that the withstand voltage characteristics of the capacitor to which the present invention is applied are excellent, and the capacitance characteristic of the present invention is shown in FIG. It can be seen that the capacity change rate of the applied capacitor is relatively small.
그리고, 상기의 증착필름 콘덴서를 교류용 콘덴서로 사용할때 알루미늄증착막(200) 표면의 전면에 아연금속막(300)이 증착되어 있으므로서 교류전원의 교번작용에 의한 부분방전으로 인해 알루미늄증착막의 끝단인 에지부분이 소멸되지 않아 콘덴서의 용량의 감소를 극소화시켜 줄수 있게되는 등의 효과가 있는 것이다.When the deposition film capacitor is used as an AC capacitor, the zinc metal film 300 is deposited on the entire surface of the aluminum deposition film 200, and thus, due to the partial discharge due to the alternating action of the AC power source, There is an effect that the edge portion does not disappear, thereby minimizing the reduction of the capacitor capacity.
본 발명의 다른 실시예로서는 도 8 에 도시된 바와 같이 알루미늄증착막(200)의 표면 양측 끝단인 각 에지부분에만 아연금속막(300a)(300b)을 두껍게 증착시켜 줄수도 있는 것이다.As another embodiment of the present invention, as shown in FIG. 8, the zinc metal films 300a and 300b may be thickly deposited only at each edge portion of both surfaces of the aluminum deposition film 200.
이상에서와 같이 본 발명은 플라스틱필름에 증착되어 있는 알루미늄증착막의 표면 전체에 아연금속막을 증착시켜 줌과 아울러, 비증착부의 반대편인 에지부분에 아연이 두껍게 증착되도록 하므로서 용사금속과의 전기적 접촉을 높여 내전류 특성을 향상시켜 주게되는 효과가 있고, 응축잠열이 낮은 아연금속막이 플라스틱필름의 전면에 증착되어 있어 필름의 내전압 특성을 유지시켜 주게되는 효과가 있는 것이다.As described above, the present invention increases the electrical contact with the thermal spray metal by depositing a zinc metal film on the entire surface of the aluminum deposition film deposited on the plastic film and by depositing a thick zinc on the opposite side of the non-deposition portion. The effect is to improve the withstand current characteristics, and the zinc metal film having a low latent heat of condensation is deposited on the front surface of the plastic film to maintain the withstand voltage characteristics of the film.
또한, 아연금속막이 비증착부측에 위치하는 알루미늄증착막의 에지부분에 까지 아연금속막이 증착되어 있어 교류용 콘덴서로 사용할 경우 교류전원의 교번작용에 의한 부분방전이 발생되지 않아 콘덴서 전체 용량의 감퇴 현상을 극소화시켜 주므로서 교류용으로도 활용할수 있음은 물론, 콘덴서의 사용수명을 연장시켜 주게되는 등의 효과가 있는 것이다.In addition, since the zinc metal film is deposited on the edge portion of the aluminum deposition film where the zinc metal film is located on the non-deposition portion side, partial discharge due to the alternating action of the AC power supply does not occur when the AC metal capacitor is used. By minimizing it, it can be used for alternating current as well as extending the service life of the capacitor.
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019990009358A KR19990046479A (en) | 1999-03-19 | 1999-03-19 | a plastics film devise |
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| KR1019990009358A KR19990046479A (en) | 1999-03-19 | 1999-03-19 | a plastics film devise |
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| KR19990046479A true KR19990046479A (en) | 1999-07-05 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20190071969A (en) * | 2017-12-15 | 2019-06-25 | 성문전자주식회사 | A deposition apparatus for a film capacitor having two masks |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| KR20190071969A (en) * | 2017-12-15 | 2019-06-25 | 성문전자주식회사 | A deposition apparatus for a film capacitor having two masks |
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