KR19990043547A - Mask analysis device for semiconductor device manufacturing - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a mask analyzing apparatus for manufacturing a semiconductor device that can easily analyze impurities present in a mask used in the lithography process of a semiconductor device manufacturing process.

According to the present invention, a seating portion is formed to maintain an airtight mask at a lower portion of the inner wall at an upper end of the inner wall. An upper body having a rectangular cylindrical shape in close contact with the upper body and having upper and lower surfaces open, an upper lid capable of keeping the upper opening of the upper body confidential, and a lower lid capable of maintaining the lower opening of the lower body;

It is characterized by comprising a.

Therefore, there is an effect that can easily analyze the upper and lower surfaces of the mask without contamination of the surrounding environment.

Description

Mask analysis device for semiconductor device manufacturing

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mask analyzer for manufacturing a semiconductor device, and more particularly, to easily analyze impurities present in a mask such as a reticle used in a lithography process of a semiconductor device manufacturing process. The mask analysis mechanism for semiconductor device manufacture which can be performed.

BACKGROUND ART In the semiconductor device manufacturing process, a lithography process is usually performed to form a predetermined pattern on a wafer.

The lithography process is performed by placing a mask on which a specific circuit is designed on a wafer on which a photoresist film is formed, and then scanning light through the mask. Accordingly, the photoresist film formed on the wafer is exposed and the specific circuit of the mask is transferred onto the wafer by developing the exposed photoresist film.

Generally, the mask is used to transfer 1: 1 a specific circuit formed on the mask onto a wafer. In particular, a mask called a reticle is used to transfer a specific circuit reduced by about five times by using a stepper onto a wafer. The upper part of the mask is formed of a glass material, and the lower part is chromium (Cr) treated.

However, since the mask may be contaminated by ionic impurities or metallic impurities during use, the degree of contamination of the mask is periodically analyzed by the ionic impurities or metallic impurities.

In the analysis process for the ionic impurities, a mask is placed on a box such as a carrier, and then a pretreatment step of eluting ionic impurities present on the mask is performed by dropping ultrapure water on the mask using a pipette. In addition, the ultrapure water in which the ionic impurities are eluted is analyzed by HPIC (High Performance Ion Chromatography) facility.

In the analysis process for the metallic impurities, a mask is placed on a box such as a carrier, and then a pretreatment process is performed in which a scanning solution is dropped on the mask by using a pipette to elute metallic impurities present on the mask. In addition, the scanning solution in which the metallic impurities are eluted is analyzed by spectral analysis in an Atomic Absorption Spectrometer (AAS) facility.

However, the pretreatment process of the HPIC and AAS facilities has a problem that the reliability of the results of the analysis process is inferior because the mask is exposed to the surrounding environment and is contaminated by placing the mask on a box such as a carrier.

In addition, the mask having different materials of the upper and lower surfaces has different characteristics of the upper and lower surfaces, so the analysis process for the lower surface should also proceed, but the lower surface of the mask is in contact with a box such as a carrier during the pretreatment process. There was a problem that the analysis process could not proceed due to contamination.

SUMMARY OF THE INVENTION An object of the present invention is to provide a mask analyzer for manufacturing a semiconductor device which can prevent the mask from being exposed to the surrounding environment and being contaminated when the mask is subjected to an analysis process.

Another object of the present invention is to provide a mask analyzer for manufacturing a semiconductor device capable of analyzing the upper and lower surfaces of a mask.

1 is an exploded perspective view for explaining an embodiment of a mask analyzer for manufacturing a semiconductor device according to the present invention.

* Explanation of symbols for main parts of the drawings

10: upper lid 10a: first bolt hole

10b: 1st protrusion 10c, 20c, 40b: handle

20: upper body 20a: second bolt hole

20b: first groove 20d: first induction furnace

30: lower body 30a: third bolt hole

30b: 2nd groove 30c: Seating part

30d: second induction furnace 40: lower lid

40a: second projection 50: bolt

52: Nut

In the mask analyzing apparatus for manufacturing a semiconductor device according to the present invention for achieving the above object, the analysis mask is mounted along the periphery of the inner wall upper end portion is provided with a seating portion is formed so as to maintain the airtight with the bottom, the upper and lower surfaces are open and square Cylindrical lower body; An upper body of a rectangular cylindrical shape in close contact with the upper portion of the lower body corresponding to the lower body, and having an upper surface and a lower surface opened; And an upper lid capable of keeping the upper opening of the upper body hermetically sealed and a lower lid capable of keeping the lower opening of the lower body hermetically sealed.

A plurality of second bolt holes are formed at an upper end of the upper body, and a plurality of third bolt holes are formed at an upper end of the lower body to correspond to the second bolt holes and have female threads formed at a predetermined end portion thereof. It can be fastened to the female screw portion of the predetermined region of the end portion of the third bolt hole through the hole and the third bolt hole.

In addition, a plurality of first bolt holes may be formed in an upper portion of the upper lid and larger than a diameter of the head of the bolt inserted into the second bolt hole and corresponding to the second bolt hole.

In addition, a first protrusion may be formed below the upper lid, and a first groove into which the first protrusion may be inserted may be formed on the upper body.

And, a handle may be formed on the upper lid.

In addition, a first induction path having an inverted fan shape may be formed in a predetermined region of the upper body inner wall, and a handle may be formed on the outer wall of the upper body.

In addition, a second induction path having a fan shape may be formed in a predetermined region of the lower body inner wall, and a handle may be formed on the outer wall of the lower body.

In addition, a second groove may be formed below the lower body, and a second protrusion inserted into the second groove may be formed above the lower lid.

In addition, a handle may be formed below the lower lid.

In addition, the mask analyzer may be formed of a Teflon material.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

In the mask analyzer for manufacturing a semiconductor device according to the present invention, as shown in FIG. 1, a rectangular plate-shaped upper lid 10 having a plurality of first bolt holes 10a formed at an edge thereof is provided. The upper lid 10 is formed of a Teflon material having high resistance to chemicals, and a handle 10c is formed on the upper lid 10. The diameter of the first bolt hole 10a is made larger than the diameter of the head of the bolt 50 so that the bolt 50 can be inserted into the first bolt hole 10a, and the upper lid 10 The first protrusion 10b is formed at the lower portion.

In addition, a plurality of second bolt holes 20a corresponding to the first bolt holes 10a are formed at an upper end of the upper lid 10, and an upper body of a rectangular cylindrical shape having upper and lower surfaces opened ( 20) is installed. The upper body 20 is formed of a Teflon material, the handle 20c is installed on the outer wall of the upper body 20. In addition, a first groove 20b into which the first protrusion 10b of the upper lid 10 is inserted is formed in a predetermined region of the upper portion of the upper body 20, and a reverse region is formed in a predetermined region of the inner wall of the upper body 20. A fan-shaped first guide path 20d is formed.

In addition, the lower portion of the upper body 20 has a seating portion 30c is formed so that the analysis mask is seated along the periphery of the upper end of the inner wall to maintain the airtightness with the lower portion, the upper and lower sides of the rectangular cylinder shape open Body 30 is installed. The upper end of the lower body 30 is formed with a plurality of third bolt holes 30a corresponding to the second bolt holes 20a and having female threads (not shown) formed at predetermined end portions thereof. The lower body 30 is formed of a Teflon material, and a second induction path 30d having a fan shape is formed in a predetermined region of the inner wall of the lower body 30. In addition, a second groove 30b is formed in a predetermined region under the lower body 30.

According to the manufacturer, a handle (not shown) may be further formed on the outer wall of the lower body 30.

In addition, a lower lid 40 having a square plate shape having a second protrusion 40a that can be inserted into the second groove 30b is installed below the lower body 30. A handle 40b is formed below the lower lid 40.

Therefore, the operator cleans the upper lid 10, the upper body 20, the lower body 30 and the lower lid 40 by using the cleaning liquid and the hot nitrogen gas, and then lowers the lower lid 40 on the cleaned lower lid 40. The body 30 is positioned using a handle (not shown). At this time, the second protrusion 40a of the lower lid 40 is inserted into the second groove 30b of the lower body 30.

In addition, an analysis mask, on which an analysis process is to be performed, is placed on the seating portion 30c of the lower body 30.

Subsequently, the upper body 20 is positioned on the lower body 30 by using the handle 20c to coincide with the second bolt hole 20a and the third bolt hole 30a. Then, after the bolt 50 is inserted into the second bolt hole 20a and the third bolt hole 30a, the female screw part (not shown) formed in the predetermined region of the end of the third bolt hole 30a is inserted. After insertion, tighten the nut 52. Accordingly, the upper body 20 and the lower body 30 is tightly coupled.

Then, after dropping a predetermined amount of ultrapure water or a scanning solution on the upper surface of the analysis mask inside the upper body 20, the upper lid 10 on the upper body 20 to prevent contamination by the surrounding environment. Cover. At this time, the first protrusion 10b of the upper lid 10 is inserted into the first groove 20b of the upper body 20, and the head of the bolt 50 is completely inserted into the first bolt hole 10a. do.

Thereafter, after the pretreatment process of about 1 hour, the upper lid 10 is removed using the handle 10c.

Then, the operator lifts the upper body 20 and the lower body 30 to the top by using a handle (not shown) formed on the lower body 30 or the handle 20c formed on the upper body 20, and tilts it upwards. As time passes, the ultrapure water or the scanning solution in which the impurities contained in the upper surface of the analysis mask are eluted is placed in a clean container such as a mass cylinder through the first induction path 20d of the upper body 20.

Then, the impurities contained in the ultrapure water or the scanning solution contained in the container such as the mass cylinder are analyzed qualitatively and quantitatively using the HPIS facility and the AAS facility.

The upper body 20 is positioned on the upper lid 10, the lower body 30 is positioned on the upper body 20, and the lower portion is placed on the lower body 30 by flipping a mask analyzer. Allow the lid 40 to be positioned.

After removing the lower lid 40, a predetermined amount of ultrapure water or a scanning solution is dropped on the lower surface of the analysis mask in the lower body 30, and then the lower lid 40 is covered.

Thereafter, in order to elute impurities adsorbed on the lower surface of the mask, the lower lid 40 is removed after about 1 hour of pretreatment.

In addition, the worker lifts the upper body 20 and the lower body 30 to the upper side using the handle 20c of the upper body 20 and tilts them inclined so that impurities adsorbed on the lower surface of the mask are eluted with time. Ultrapure water or scanning solution is contained in a clean container such as a mass cylinder through the second induction path 30d of the lower body 30.

Thereafter, the ultrapure water contained in the clean container such as the mass cylinder is analyzed using the HPIS facility and the AAS facility.

According to the manufacturer, if the packing is installed between the lower body 30 and the upper body 20, it is possible to further prevent the ultrapure water or the scanning solution outflow, it can proceed to the above-described analysis process for the reticle.

Therefore, according to the present invention, by performing the pretreatment process of the HPIC and AAS facilities without contamination by the surrounding environment, there is an effect that can obtain a reliable analysis process results.

In addition, by performing an analysis process on the lower surface of the mask, it is possible to analyze the impurity contamination of the mask more accurately.

Although the present invention has been described in detail only with respect to the described embodiments, it will be apparent to those skilled in the art that various modifications and variations are possible within the technical scope of the present invention, and such modifications and modifications are within the scope of the appended claims.

Claims (14)

An analysis mask is mounted along the periphery of the inner wall upper end to form a seating portion to maintain airtightness with the lower part, and a lower body having a rectangular tube shape having upper and lower surfaces open; An upper body of a rectangular cylindrical shape in close contact with the upper portion of the lower body corresponding to the lower body, and having an upper surface and a lower surface opened; An upper lid capable of keeping the upper opening of the upper body confidential; And A lower lid capable of keeping the lower opening of the lower body confidential; Mask analysis apparatus for semiconductor device manufacturing, characterized in that it comprises a. The method of claim 1, The semiconductor device, wherein a plurality of second bolt holes are formed at an upper end of the upper body, and a plurality of third bolt holes are formed at an upper end of the lower body to correspond to the second bolt holes and have female threads formed at predetermined regions of the ends. Mask analyzer for manufacturing. The method of claim 2, The upper body and the lower body are coupled to each other by bolts penetrating through the second bolt hole and the third bolt hole and fastened to the female screw portions of the predetermined region of the end portion of the third bolt hole. . The method of claim 3, wherein A mask for manufacturing the semiconductor device, characterized in that a plurality of first bolt holes are formed above the upper lid and larger than a diameter of the head of the bolt inserted into the second bolt holes, and corresponding to the second bolt holes. Analytical Organization. The method of claim 4, wherein And a first protrusion is formed below the upper lid, and a first groove into which the first protrusion is inserted is formed in an upper portion of the upper body. The method of claim 5, A mask analyzer for manufacturing a semiconductor device, characterized in that a handle is formed on the upper lid. The method of claim 1, And an inverse fan-shaped first induction path is formed in a predetermined region of the upper body inner wall. The method of claim 7, wherein And a handle is formed on an outer wall of the upper body. The method of claim 1, And a second induction path having a fan shape is formed in a predetermined region of the inner wall of the lower body. The method of claim 9, And a handle is formed on an outer wall of the lower body. The method of claim 1, And a second groove formed below the lower body, and a second protrusion inserted into the second groove is formed above the lower lid. The method of claim 11, And a handle is formed under the lower lid. The method of claim 1, The mask analyzer for manufacturing a semiconductor device according to claim 1, wherein the mask analyzer is formed of a Teflon material. The method of claim 1, And an analysis reticle is used as the analysis mask.