KR19990031691A - Semiconductor package test board - Google Patents

Abstract

The present invention provides a semiconductor package test board for testing a driving capability by supplying a test voltage to a semiconductor package, comprising: a ground part disposed inside the test board and having a pattern formed of a ball grid array; A first voltage supply having voltage ports for supplying first and second voltages for a voltage, a connection pattern formed in a ball lattice arrangement to connect pins on an inner side of the first voltage supply and on the outer side; A semiconductor package connecting portion having a connection pattern formed in a ball lattice arrangement for supplying a second voltage, and a first, second, third, and fourth voltage for supplying a test voltage surrounded by a narrow distance from the semiconductor package connecting portion; And a second voltage supply having voltage ports.

Description

Semiconductor package test board

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor package test board, and more particularly, to a semiconductor package test board having a structure capable of effectively executing electrical tests of a ball grid array (BGA) type semiconductor package.

The semiconductor integrated circuit mainly uses a universal test board connecting each pin of the package, that is, the socket pin and each channel for inspection at the package level.

In the case of traditional dual inline package (quad flat) or quad flat package (QFP), the number of pins does not exceed 256, so the voltage and grounding arrangements are not serious when designing the board, but only considering the product design in terms of product characteristics. It became. However, the BGA type package, which has emerged as a new assembly technique due to the increase in the density of semiconductor devices and the number of pins of the package, uses solder balls on the external terminals, thereby reducing the mounting area compared to the QFP while providing a higher lead pitch. Shorter.

1 is a diagram illustrating a BGA type semiconductor package test board according to the related art, and includes a channel part 10 disposed inside the test board and having a pattern formed in a ball grid array to connect pins of a semiconductor package. A first voltage supply unit 20 surrounding the channel unit 10 and having first and second voltage ports V1 and V2 and ground ports GND for supplying first and second voltages for a test voltage; And a semiconductor package connecting portion 30 having a connection pattern formed in a ball grid array surrounding the first voltage supplying portion 20 and connecting the pins of the semiconductor package, and a predetermined distance d1 from the semiconductor package connecting portion 30. And a second voltage supply unit 40 having voltage ports V1, V2, and GND for supplying the first and second voltages.

The BGA packaged test board configured as described above has a short lead pitch due to an increase in the number of pins, and thus, when a test board designed according to a conventional concept is used, shorts are generated by adjacent pins when the board is manufactured. In addition, when two or more test voltages are used, there is a problem in that the length of the wiring becomes longer and the characteristics of the test board are unexpectedly lowered depending on the product.

An object of the present invention is to prevent the short-circuit of the pins adjacent to each other even when using a universal type BGA test board to solve the above problems of the prior art and the characteristics of the test board and when using a dedicated test board It is to provide a semiconductor package test board that can expect almost the same effect.

1 is a view showing a BGA type semiconductor package test board according to the prior art.

2 is a view showing a BGA type semiconductor package test board according to the present invention.

* Description of the symbols for the main parts of the drawings *

100: ground portion 110: first voltage supply portion

120: semiconductor package connection 130: second voltage supply

In order to achieve the above object, the device of the present invention is a semiconductor package test board for testing a driving capability by supplying a test voltage to a semiconductor package, the ground portion having a pattern formed of a ball grid array located inside the test board ; A first voltage supply surrounding the ground and having voltage ports for supplying first and second voltages for a test voltage; A semiconductor package connection part surrounding the first voltage supply part and having a connection pattern formed in a ball lattice arrangement on the inside to connect pins and having a connection pattern formed in a ball lattice arrangement on the outside in order to supply the second voltage; And a second voltage supply unit surrounding the semiconductor package connection at a narrow distance and having voltage ports for supplying first, second, third and fourth voltages for a test voltage.

Hereinafter, with reference to the accompanying drawings will be described in detail the present invention.

FIG. 2 is a diagram illustrating a semiconductor package test board according to an embodiment of the present invention, wherein a ground part 100 is disposed inside the test board and has a ground pattern formed in a ball grid array, and surrounds the ground part 100 and a test voltage. A first voltage supply unit 110 having first and second voltage ports V1 and V2 and ground ports GND for supplying the first and second voltages; and the first voltage supply unit 110. The semiconductor package connector 120 includes a connection pattern C formed in a ball grid array to connect the pins to an inner side thereof, and a connection pattern V2 'formed in a ball grid array to supply the second voltage to the outside thereof. And first, second, third, and fourth voltages for supplying first, second, third, and fourth voltages for a test voltage while surrounding the semiconductor package connecting portion 120 at a narrow distance d2. Second voltage with ports V1, V2, V3, V4 It consists of payment (130).

According to the present invention configured as described above, since the distance between the semiconductor package connection unit 120 and the second voltage supply unit 130 is shorter, the wiring length can be shorter than that of the conventional test board. In addition, the present invention can use up to four test voltages by arranging the voltage ports of the test voltages V3 and V4 to coincide with the outermost ends of the sockets when assembling the chips, compared to the prior art.

The present invention can prevent the short phenomenon of the pins adjacent to each other when manufacturing the test board, and the test board characteristics can be expected to have almost the same effect as when using a dedicated test board. And various kinds of voltage supply can be applied to the desired product.

Claims (1)

A semiconductor package test board for testing a driving capability by supplying a test voltage to a semiconductor package, A ground part disposed inside the test board and having a pattern formed of a ball grid array; A first voltage supply surrounding the ground and having voltage ports for supplying first and second voltages for a test voltage; A semiconductor package connection part surrounding the first voltage supply part and having a connection pattern formed in a ball lattice arrangement on the inside to connect pins and having a connection pattern formed in a ball lattice arrangement on the outside in order to supply the second voltage; And And a second voltage supply having a narrow distance from the semiconductor package connection and having voltage ports for supplying first, second, third and fourth voltages for a test voltage.