KR19990013459A - Fine wire made of gold alloy, method for producing this wire and use thereof - Google Patents

Fine wire made of gold alloy, method for producing this wire and use thereof Download PDF

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Publication number
KR19990013459A
KR19990013459A KR1019980024269A KR19980024269A KR19990013459A KR 19990013459 A KR19990013459 A KR 19990013459A KR 1019980024269 A KR1019980024269 A KR 1019980024269A KR 19980024269 A KR19980024269 A KR 19980024269A KR 19990013459 A KR19990013459 A KR 19990013459A
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South Korea
Prior art keywords
gold
alloy
weight
cerium
wire
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KR1019980024269A
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Korean (ko)
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KR100284929B1 (en
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군터 헤르클로츠
율겐 레울
루츠 샤라플러
크리스토프 시몬스
Original Assignee
안드레스 바우만;게르하르트 리체르트
베.체.헤레우스게엠베하
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Publication of KR19990013459A publication Critical patent/KR19990013459A/en
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Publication of KR100284929B1 publication Critical patent/KR100284929B1/en

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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/02—Alloys based on gold
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Abstract

0.05-0.95중량%플라틴, 0.001-0.1중량%세륨-혼합금속 그리고 1-0.1중량%알카리토 금속으로되고 세륨-혼합금속을 포함하는 금-합금으로되어 있으며 여기서 적어도 50중량% 까지의 세륨-혼합금속이 세륨으로 되어 있는 그러한 미세와이어들은 유리한 강도/연신율-비율이 뛰어나고 있다. 이들은 와이어 결합을 위해서도 그리고 플립-칩의 접촉돌기부의 제조를 위해서도 적합하다.0.05-0.095% by weight platinum, 0.001-0.1% by weight cerium-mixed metal and 1-0.1% by weight alkaline-metal and a gold-alloy comprising cerium-mixed metal, wherein at least 50% by weight of cerium- Such fine wires having a mixed metal of cerium have an excellent strength / elongation-ratio. They are suitable for wire bonding and also for the manufacture of contact projections of flip-chips.

Description

금합금으로된 미세와이어, 이 와이어의 제조방법 및 그의 이용Fine wire made of gold alloy, method for producing this wire and use thereof

본 발명은 반도체 구성소자를 접촉하기 위하여 세륨-혼합금속을 포함하는 금-합금으로된 미세와이어, 이것의 제조방법 그리고 이의 이용에 관한 것이다.The present invention relates to microwires made of gold-alloy comprising cerium-mixed metals for contacting semiconductor components, methods for their preparation and their use.

- 역시 결합와이어로서 표시되며-반도체 구성소자들의 결합부들(Bonden)을 접촉하기에 적합한 와이어들은 좋은 전기적 성질들을 가지며 우수한 기계적 강도치를 가진다. 이 와이어들의 직경은 약 10 내지 60 마이크로메터에 놓여 있으며 그리고 통상적으로 약 20 내지 60 미이크로메터에 놓여 있으며 이것은 이용목적에 상응하게 선택된다.-Also represented as bond wires-wires suitable for contacting the bonds of semiconductor components have good electrical properties and good mechanical strength values. The diameter of these wires lies between about 10 and 60 micrometers and typically lies between about 20 and 60 micrometers and this is chosen according to the purpose of use.

상기 결합와이어들은 자주 고순도의 금으로되거나 또는 희토류금속을 함유하는 금합금으로부터 되어 있다.The bond wires are often made of gold of high purity or from gold alloys containing rare earth metals.

즉, 예를들면 DE 16 08 161C로부터는 일체로된 배선들(Schaltungen)에서 공급와이어들의 제조를 위하여 특히 세륨-혼합금속 또는 이트륨의 형태로된 하나의 또는 다수의 희토류금 속의 0.001-0.1%와 금으로부터된 합금의 이용이 공지되어 있다. 희토류금속들 또는 이트륨의 소량과의 금의 상기한 합금은 경도, 화학적내성 또는 전기저항과 같은 금들의 다른 성질들을 현저하게 영향하여지는 일이 없이 500℃ 까지의 가열온도에서 현저하게 개선된 강도- 및 연산율 거동을 가졌다.That is, for example, from DE 16 08 161C for the production of supply wires in integral wires (Schaltungen), in particular between 0.001-0.1% in one or several rare earth metals in the form of cerium-mixed metals or yttrium and The use of alloys from gold is known. The above alloys of gold with rare earth metals or small amounts of yttrium have significantly improved strength at heating temperatures up to 500 ° C. without significantly affecting other properties of the gold such as hardness, chemical resistance or electrical resistance. And computational behavior.

결합와이어를 위한 금-희토류금속-합금들은 역시 DE 3237 385 A(US 4 885 135), DE 39 36 281A(US 4 938 923), JP 5-179375A, JP 5-179376A, JP 6-11 2258A, EP 0743 679A 및 EP 0761 831A에서 기술되어 있다.Gold-rare earth metal-alloys for bonding wires are also DE 3237 385 A (US 4 885 135), DE 39 36 281A (US 4 938 923), JP 5-179375A, JP 5-179376A, JP 6-11 2258A, Are described in EP 0743 679A and EP 0761 831A.

DE 3237 385A는 특히 세륨과 그리고 주DJ진 경우에는 추가적으로 게르마늄, 베릴륨 및/또는 칼슘과 같은 희토류 금속 0.0003-0.01 중량%를 가지는 금합금으로 되었고 높은 인장강도를 가지는 미세금 합금 와이어에 관한 것이다.DE 3237 385A is particularly concerned with fine gold alloy wires of high tensile strength, made of cerium and, in the case of the main DJ, additionally gold alloys with 0.0003-0.01% by weight of rare earth metals such as germanium, beryllium and / or calcium.

DE 39 36 281A는 근소한 양의 란탄, 베릴륨, 칼슘 및 특히 백금 및/또는 파라듐과 같은 백금족의 원소들을 가지고 합금되어졌으며 고순도의 금으로부터된 반도체장치의 결합을 위한 금와이어를 기술하고 있다.DE 39 36 281A describes gold wires for alloying semiconductor devices made from high purity gold, alloyed with a slight amount of lanthanum, beryllium, calcium and especially platinum group elements such as platinum and / or palladium.

JP 5-179375A 및 JP 5-179376A는 결합을 위한 미세금합금와이어들에 관한것이며 이들은 고순도의 금과, 0.0003-0.005중량%의 알루미늄 내지 칼륨, 0.0003-0.003 중량% 칼슘 그리고 0.0003-0.003중량% 이트륨, 란탄, 세륨, 네오딤, 디스프로슘 및/또는 베릴륨으로 되어 있다.JP 5-179375A and JP 5-179376A relate to microalloy wires for bonding, which are high purity gold, 0.0003-0.005% by weight of aluminum to potassium, 0.0003-0.003% by weight of calcium and 0.0003-0.003% by weight of yttrium, Lanthanum, cerium, neodym, dysprosium and / or beryllium.

캐미컬업스트랙스 vol. 121, 89 287m에서 언급된 JP 6-112258A로부터 공지된 결합와이어는 1-30% 플라틴 및 0.0001-0.05%스칸듐, 이트륨 및/또는 희토류금속 그리고 주어진 경우에는 0.0001-0.05%베릴륨, 칼슘, 게르마늄, 닉켈, 철, 코발트 및/또는 은과의 금합금으로 되어 있다.Chemical Upstrates vol. Bonding wires known from JP 6-112258A mentioned at 121, 89 287m are 1-30% Platin and 0.0001-0.05% Scandium, Yttrium and / or Rare Earth Metals and in a given case 0.0001-0.05% Beryllium, Calcium, Germanium, It is a gold alloy with nickel, iron, cobalt and / or silver.

EP 0743 679A에서는 마찬가지로 플라틴을 함유하는 금-희토류금속합금이 제안되어졌다. 이 합금은 금과 근소한 양의 플라틴(0.0001-0.005중량%), 은, 마그네슘 및 유로퓸으로 되어 있으며 그리고 예를들면 또 0.0001-0.02중량%의 양으로 셀륨을 포함할 수 있다.In EP 0743 679A a gold-rare earth metal alloy likewise containing platinum has been proposed. This alloy is composed of gold and a slight amount of platinum (0.0001-0.005% by weight), silver, magnesium and europium and may contain, for example, cerium in an amount of 0.0001-0.02% by weight.

EP 0761 831 A에서는 플라틴 및/또는 파라듐을 함유하고 있는 금-희토류금속-합금으로된 미세와이어가 기재되어 있다. 이 합금은 0.1-2.2중량%의 플라틴 및/또는 파라듐, 0.0001-0.005중량%의 베릴륨, 게르마늄, 칼슘, 란탄, 이트륨 및/또는 유로퓸, 그리고 잔여는 금으로 되어 있다. 이 와이어는 하나의 도가니 내에서 상기 합금을 형성하는 원소들의 용해, 상기 도가니에 있는 합금융체의 하부로부터 상부에로 진척하는 냉각, 그리고 이어지는 압연, 인발 그리고 소둔에 의하여 제조된다. 이것은 3-8%의 팽창과 6800-9000 kgf/㎟의 탄성계수(Young module)를 가진다.EP 0761 831 A describes microwires of gold-rare earth metal-alloys containing platinum and / or palladium. The alloy is 0.1-2.2% by weight of platinum and / or paradium, 0.0001-0.005% by weight of beryllium, germanium, calcium, lanthanum, yttrium and / or europium, and the remainder gold. The wire is produced by melting the elements that form the alloy in one crucible, cooling progressing from the bottom to the top of the haptic in the crucible, followed by rolling, drawing and annealing. It has an expansion of 3-8% and a Young module of 6800-9000 kgf / mm2.

JP 7-335 685A(일본특허초록)으로부터 금, 0.1-0.8중량%플라틴 및 0.0003-0.001중량%칼슘, 베릴륨, 게르마늄, 희토류금속, 스트론튬, 바륨, 인듐 주석 및/또는 티탄으로된 결합와이어가 공지되어 있다.From JP 7-335 685A (Japanese Patent Abstract), a bonding wire composed of gold, 0.1-0.8% by weight platinum and 0.0003-0.001% by weight calcium, beryllium, germanium, rare earth metals, strontium, barium, indium tin and / or titanium Known.

JP 8-293 515A(일본특허초록)에서는 마찬가지로 금-플라틴-합금들로된 결합와이어에 관한 것이다. 이 금-합금들은 금 이외에 0.04-1.5 중량% 플라틴, 0.004-0.06 중량% 이트륨, 칼슘, 란탄 및/또는 세륨 그리고 주워진 경우에는 추가적으로 또 0.0005-0.05 중량% 알루미늄 및/또는 인듐을 포함한다.JP 8-293 515A (Japanese Patent Abstract) likewise relates to bonding wires made of gold-platin-alloys. These gold-alloys include, in addition to gold, 0.04-1.5% by weight platinum, 0.004-0.06% yttrium, calcium, lanthanum and / or cerium, and, if given, additionally 0.0005-0.05% by weight aluminum and / or indium.

JP6-112254A(일본특허초록)에는 금, 0.1-1중량%플라틴 및 0.0001-0.005 중량% 철, 실리콘, 베릴륨, 칼슘, 게르마늄, 이트륨, 스칸듐 및/또는 희토류금속들로된 혼합물로부터된 결합와이어의 제조가 제시되어진다. 이 혼합물은 용해되고 주입된다. 이것에 이어서 성형압연(Formwalzen) 소둔 그리고 25 마이크로메터의 직경을 가지는 와이어의 형성을 위하여 와이어 인발이 계속된다. 플라틴족금속의 추가에 의하여 결합와이어의 강도가 상승되며 이것으로 인하여 고온시험의 경우의 결합들이 더 적어진다.JP6-112254A (Japanese Patent Abstract) contains binding wires from a mixture of gold, 0.1-1% by weight platinum and 0.0001-0.005% by weight iron, silicon, beryllium, calcium, germanium, yttrium, scandium and / or rare earth metals. The preparation of is presented. This mixture is dissolved and injected. This is followed by wire drawing for Formwalzen annealing and the formation of a wire having a diameter of 25 micrometers. The addition of the platinum group metals increases the strength of the bond wires, which results in fewer bonds in high temperature tests.

JP 6-112256A(일본특허초록)에서는 금, 0.003-0.1중량%파라듐, 플라틴, 로듐, 이리듐, 오스뮴 및/또는 루테늄 및 0.0001-0.05중량%스칸듐, 이트륨 및/또는 희토류금속들이 제시되었다. 이 혼합물은 용해되고 주조되었다. 이어서 성형압연, 소둔 그리고 25 마이크로메터의 직경을 가지는 와이어의 형성을 위한 와이어 인발이 계속된다. 플라틴족 금속들으 추가에 의하여는 결합 와이어의 강도는 상승되며 이것으로 인하여 고온시험에서의 결합들이 더 적어진다.In JP 6-112256A (Japanese Patent Abstract), gold, 0.003-0.1% by weight palladium, platinum, rhodium, iridium, osmium and / or ruthenium and 0.0001-0.05% by weight scandium, yttrium and / or rare earth metals are presented. This mixture was dissolved and cast. This is followed by wire drawing for forming, annealing and forming wires with a diameter of 25 micrometers. The addition of platinum group metals increases the strength of the bond wires, which results in fewer bonds in the high temperature test.

JP 2-919 44A(일본특허초록)은 금 이외에 0.5-10중량%파라딘 및 0.0001 내지 0.02중량%란탄, 세륨 및/또는 칼슘을 함유하는 금-합금으로부터 되어 있으며 골드 범프스(Gold-Bumps)에 적합한 금-미세와이어에 관한 것이다.JP 2-919 44A (Japanese Patent Abstract) consists of gold-alloys containing 0.5-10% by weight paradine and 0.0001-0.02% by weight lanthanum, cerium and / or calcium in addition to gold and Gold-Bumps It relates to a gold-fine wire suitable for.

DE 4442 960C는 플립-칩-조립(Filp-Chip-Montage)을 위한 추선융기부들(Lothoecker (Bumps))와 이것의 제조방법에 관한 것이다. 이 추선융기부-코어들은 볼 범프(Ball-Bumps)로서 98 금 및 2%파타듐으로된 와이어재료를 사용하면서 기계적으로 제조되어 질 수 있다.DE 4442 960C relates to Loothoecker (Bumps) for Flip-Chip-Montage and a method of manufacturing the same. These ridge-cores can be made mechanically using wire materials of 98 gold and 2% palladium as ball bumps.

결합와이어들의 선택의 경우에는 특별한 화학적 및 물리적인 성질이외에 특히 역시 주어진 팽창의 경우에 가급적이면 높은 강도가 요구된다.In the case of the choice of bonding wires, besides the special chemical and physical properties, particularly high strength is required, especially in the case of given expansion as well.

그래서 본 발명은 DE 16 08 161C로부터 출발하여서, 가급적이면 우수한 강도/팽창-비를 가지는, 세륨-혼합금속을 함유하는 금-합금으로 되어 있으며 시초에서 특징지워진 종류의 미세와이어를 창안하는 과제를 기초로 하고 있다. 그밖에도 경제적으로 유리한 방법으로 미세와이어의 연속적인 제조를 가능하게하는 방법이 제시되어야 한다. 이 미세와이어는 와이어 결합을 위해서도 그리고 예를들면 DE 44 42 960C에서 기재된 바와같이 플립-칩-기술에 대한 소위 볼범프스(Ball-Bumps)의 제조를 위해서도 적합해야 한다.Thus, the present invention is based on the task of creating a microwire of the kind characterized by a gold-alloy containing a cerium-mixed metal, preferably having an excellent strength / expansion-ratio, starting from DE 16 08 161C. I am doing it. In addition, a method should be presented which enables the continuous production of microwires in an economically advantageous manner. This microwire should be suitable for wire bonding and also for the production of so-called Ball-Bumps for flip-chip technology as described, for example, in DE 44 42 960C.

세륨-혼합금속은 1989, 뉴욕 제 9판 625-슈트트갈트 게오르그티메 출판사의 룀프헤미렉시콘(Roempp Chemie Lexikon)에 의하면 45-60%세륨, 15-30%란탄, 10-20%네오딤, 4-6%프라세오딤 그리고 1-2%사마륨, 나아가서는 0.5-1%이트륨 및 자주 또 0.5-1%철 및 실리콘, 탄소, 인, 망간, 마그네슘 및 칼슘으로된 혼합물이며 1996, 제 10판 647의 룀프 헤미렉시콘에 의하면 50-60%세륨, 25-30%란탄, 10-15%네오딤, 4-6%프라세오딤 및 1% 철 그리고 또 또다른 희토류금속들의 근소한 비율들을 가지는 혼합물이다.Cerium-mixed metals are 45-60% cerium, 15-30% lanthanum, 10-20% neodym, 4, according to Roempp Chemie Lexikon of 1989, 9th edition 625-Stuttgart Georgtime, New York. -6% praseodymium and 1-2% samarium, even 0.5-1% yttrium and often also mixtures of 0.5-1% iron and silicon, carbon, phosphorus, manganese, magnesium and calcium, 1996, 10th edition 647 According to Gump Hemirexicon, a mixture of 50-60% cerium, 25-30% lanthanum, 10-15% neodim, 4-6% praseodymium and 1% iron and another rare earth metals.

도 1은 연신율에 따르는 본 발명에 의한 미세 와이어의 그리고 비교를 위한 선행기술에 의한 미세와이어의 강도(인장강도) 대비도임.1 is a comparison of the strength (tensile strength) of the microwires according to the invention according to the elongation and of the microwires according to the prior art for comparison.

상기 과제의 해법을 나타내는 미세와이어는 본 발명에 따라서 금-합금은 0.05-0.95중량%플라틴, 0.001-0.1중량%세륨-혼합금속, 0-0.1중량%알칼리토금속, 나머지는 금으로 되어 있으며 그리고 적어도 50중량% 까지의 Cer-혼합금속이 세륨으로 되어 있는 것에 의하여 특징지워져 있다.According to the present invention, the microwire showing the solution of the above problem is made of gold-alloy according to the present invention, 0.05-0.95% by weight of platinum, 0.001-0.1% by weight of cerium-mixed metal, 0-0.1% by weight of alkaline earth metal, and the rest of gold. At least 50% by weight of the Cer-mixed metal is characterized by being cerium.

금-합금의 플라틴 함량이 0.25 내지 0.9중량%에 달한다면 상기 미세와이어는 특히 좋은 것으로 증명되어 왔다. 세륨-혼합-금속-함량은 0.001-0.01중량% 그리고 알칼리토금속-함량은 0.0001-0.01중량%에 유리하게 놓여 있다.The microwires have proved particularly good if the platinum content of the gold-alloy is between 0.25 and 0.9% by weight. The cerium-mixed-metal-content is advantageously placed at 0.001-0.01% by weight and alkaline earth metal-content at 0.0001-0.01% by weight.

결합와이어들에 대하여 통상적인 직경을 가지는 본 발명에 따르는 미세와이어는 결합을 위한 사용에 대하여 필요한 성질들을 가진다. 이것은 특히 연신율과 관련하여-그의 대단히 우수한 강도에 의하여 뛰어나고 있다. 놀라운 방법으로 합금형성물-세륨-혼합금속, 프라틴 및 주어진 경우에는 알칼리토금속의 종류 및 양의 본 발명에 따르는 선택은 미세금 속의 대단히 유리한 강도/팽창비율을 초래하며, 이것은 실질적으로 결합의 대단히 좋은 품질에 기여한다.The microwires according to the invention having a diameter typical for bonding wires have the properties necessary for use for bonding. This is particularly excellent in terms of elongation-by its very good strength. In a surprising way the choice according to the invention of the type and amount of alloying-cerium-mixed metals, pratins and given alkaline earth metals results in a very advantageous strength / expansion ratio in the micrometals, which substantially Contributes to good quality

도면에는 팽창(연신율)[%]에 의존하여, 본 발명(실시예 1 내지 5)에 따르는 몇 개의 미세와이어들의 그리고-비교를 위하여-DE 1608161C 로부터 공지된 선행기술(실시예 6)에 의한 미세와이어의 강도(인장강도)[MPa]가 표시되어 있다. 본 발명에 따르는 미세와이어들은 주어진 연신율의 경우에 더높은 강도를 가졌다.In the figure, depending on the expansion (elongation) [%], the fines according to the prior art (Example 6) known from DE 1608161C and for comparison-of several microwires according to the invention (Examples 1-5) The strength (tensile strength) [MPa] of the wire is indicated. The microwires according to the invention had higher strength for a given elongation.

본 발명에 따르는 미세와이어는 역시 그 자체가 개발중에 있는 고주파-결합에 대한 와이어결합을 위하여 그리고 플립-칩스(Flip-Chips) 의 접촉돌기부의 제조를 위하여 특별한 장점을 가지고 그의 유리한 성질로 인하여 사용되어 질 수 있다.The microwires according to the invention are also used due to their advantageous properties with particular advantages for wire bonding to high frequency-bonding, which is under development of itself, and for the manufacture of contact projections of flip-chips. Can lose.

상기한 과제의 해결은 또 세륨을 함유하는 금-합금으로 반도체 구성소자들의 접촉을 위한 미세와이어의 제조를 위한 방법으로 되어 있으며 이것은 본 발명에 따라서 금-합금이 0.05-0.95중량%플라틴, 0.001-0.1중량%세륨 혼합금속, 0-0.1중량%알칼리토금속, 나머지가 금이며 세륨-혼합금속은 적어도 50 중량%까지가 세륨으로부터 되어 있으며, 용융되고, 용융된 합금은 연속주조되고, 이 비렛트는 결합목적을 위하여 보통의 직경을 가지는 와이어에로 인발되고 그리고 이 와이어는 소둔되는 것에 의하여 특징지워진다.The solution to the above problem is also a method for the production of microwires for the contact of semiconductor components with a gold-alloy containing cerium, which is 0.05-0.95 wt% platinum, 0.001 according to the invention. -0.1 wt% cerium mixed metal, 0-0.1 wt% alkaline earth metal, the remainder being gold and up to at least 50 wt% cerium-mixed metal from cerium, molten, molten alloy is continuously cast, For joining purposes it is drawn to a wire of ordinary diameter and the wire is characterized by annealing.

본 발명에 따르는 방법은 용융된 합금이 원형의 횡단면을 가지는 비렛트에로 주조되고 이 와이어가 대략 300-700℃에서 소둔될 때 특히 좋은 것으로 증명되었다. 소둔에 의하여 먼저 단단한 와이어는 필요한 연신율을 얻는다. 이 합금의 용해와 주조는 공기에서, 예를들면 아르곤과 같은 보호개스하에서 또는 진공중에서 이룰수가 있다.The method according to the invention has proved to be particularly good when the molten alloy is cast into a bead having a circular cross section and the wire is annealed at approximately 300-700 ° C. By annealing, the hard wire first gets the required elongation. The dissolution and casting of this alloy can take place in air, for example under a protective gas such as argon or in vacuum.

본 발명에 따르는 방법에서는 0.25-0.9중량%의 플라틴함량을 가지는 금-합금의 용해가 선호된다; 0.001 내지 0.1중량%의 세륨-혼합금속-함량과 0.0001-0.01중량%의 알칼리토금속 함량이 대단히 유리한 것으로 나타났다.In the process according to the invention, the dissolution of gold-alloys having a platinum content of 0.25-0.9% by weight is preferred; Cerium-mixed metal-content of 0.001 to 0.1% by weight and alkaline earth metal content of 0.0001-0.01% by weight have been found to be extremely advantageous.

알칼리토금속으로서는 베릴륨, 마그네슘, 칼슘, 스트론튬, 바륨 또는 상기 요소들의 적어도 2개로된 혼합물이 첨가되어 질 수 있다. 특히 베릴륨 및 칼슘으로된 혼합물이 좋은 것으로 증명되어 왔으며, 여기서 대략 50중량% 베릴륨 및 대략 50중량% 칼슘으로 되어 있는 혼합물이 선호된다.As the alkaline earth metal, beryllium, magnesium, calcium, strontium, barium or a mixture of at least two of the above elements can be added. In particular mixtures of beryllium and calcium have proven to be good, where mixtures of approximately 50% beryllium and approximately 50% calcium are preferred.

합금내에서 플라틴이 부분적으로 또는 완전히 파라딘에 의하여 대체되어 있는 그러한 합금을 용제하는 것이 유리할 수가 있다.It may be advantageous to dissolve such alloys in which the platinum is partially or completely replaced by paradine in the alloy.

본 발명에 따르는 방법은 특히 이것이 연속적으로 안내되며 그리고 공정제품-주조된 비렛트 및 인발된 와이어가-대단히 균일한 그리고 불변하는 품질을 가지고 공급되는 것에 의하여 뛰어나고 있다.The process according to the invention is particularly excellent in that it is guided continuously and the process product—cast beads and drawn wire—is supplied with a very uniform and unchanging quality.

더 자세한 설명을 위하여 다음의 예들에서는 본 발명(실시예 1-5)에 따르는 미세와이어들 및 이들의 제조와 그리고-비교를 위하여-DE 16 08 161C로부터 공지된 선행기술(예 6)에 따르는 미세와이어가 기술되어졌다. 이 미세와이어들은 이들의 연신(연신율)[%]과 강도(인장강도)[MPa]에 의하여 특징지워진다. 예들에서 사용된 세륨-혼합금속은 50 중량% 이상의 세륨-함량을 가지는 시판제품이다.For further explanation, the following examples show the microwires according to the invention (Examples 1-5) and their preparation and-for comparison-the fines according to the prior art known from DE 16 08 161C (Example 6). Wire has been described. These fine wires are characterized by their elongation (elongation) [%] and strength (tensile strength) [MPa]. The cerium-mixed metal used in the examples is a commercial product having a cerium-content of at least 50% by weight.

예 1Example 1

0.25중량% 플라틴 및 0.003중량% 세륨-혼합금속(53.6%중량의 세륨함량을 가지는 시판제품)을 가지는 금-합금으로된 미세와이어Gold-alloy microwires with 0.25 wt% platinum and 0.003 wt% cerium-mixed metals (commercially available products having a cerium content of 53.6% by weight)

0.25중량% 플라틴, 0.003중량% 세륨-혼합금속 그리고 나머지로써 금으로 합금의 용융체가 선주시설에서 원형의 횡단면을 가지는 비렛트에로 주조된다. 이어서 상기 비렛트로부터는 30 마이크로메터의 직경을 가지는 와이어가 인발되며 그리고 이 와이어는 대략 300-600℃에서 개별적인 연신율 여하에 따라서 공기에서 소둔된다. 연신율[%]에 의존하여 측정된 강도치[MPa]는 표 1에 제시되어 있다.A molten alloy of 0.25 wt% platinum, 0.003 wt% cerium-mixed metal and, as a result, gold, is cast into a vitreat having a circular cross section at the shipyard. A wire having a diameter of 30 micrometers is then drawn from the viret and the wire is annealed in air at approximately 300-600 ° C. depending on the individual elongation. The strength values [MPa] measured depending on the elongation [%] are shown in Table 1.

275 마이크로메터의 직경을 가지는 와이어에서 측정된, 실온에서의 비전기저항은 0.026 Ohm ㎟/m에 달했다.The non-electric resistance at room temperature, measured on a wire with a diameter of 275 micrometers, reached 0.026 Ohm mm 2 / m.

표 1Table 1

연신율 [%]Elongation [%] 강도[MPa]Strength [MPa] 1.4*1.62.12.22.73.45.76.88.41.4 * 1.62.12.22.73.45.76.88.4 423*400379346318276237234221423 * 400379346318276237234221

예 2Example 2

0.5중량%플라틴 및 0.003중량%세륨-혼합금속을 가지는 금-합금으로된 미세와이어Gold-alloy microwires with 0.5 wt% platinum and 0.003 wt% cerium-mixed metals

0.5중량%플라틴, 0.003중량%세륨-혼합금속 및 나머지로서 금으로된 합금의 용융체가 연속주조설비에서 원형횡단면을 가지는 비렛트에로 주조된다. 이어서 이 비렛트로부터 30 마이크로메터의 직경을 가지는 와이어가 인발되며 그리고 이 와이어는 얻고자하는 연신율 여하에 따라서 약 300-600℃에서 공기에서 소둔된다. 연신율[%]에 따라서 측정된 강도치[MPa]는 표 Ⅱ에 제시되었다.A melt of 0.5% by weight Platin, 0.003% by weight cerium-mixed metal and the alloy of gold as the remainder is cast into a vitreat having a circular cross section in a continuous casting plant. A wire having a diameter of 30 micrometers is then drawn from this vilet and the wire is annealed in air at about 300-600 ° C. depending on the elongation desired to be obtained. The strength values [MPa] measured according to the elongation [%] are shown in Table II.

275 마이크로메터의 직경을 가지는 와이어에서 측정된, 실온에서 비전기저항은 0.028 Ohm ㎟/m에 달했다.The non-electric resistance reached 0.028 Ohm mm 2 / m at room temperature, measured on a wire with a diameter of 275 micrometers.

표 ⅡTable II

연신율 [%]Elongation [%] 강도 [MPa]Strength [MPa] 1.4*1.41.71.91.92.12.32.62.63.33.53.74.64.75.35.86.17.17.29.79.910.91.4 * 1.41.71.91.92.12.32.62.63.33.53.74.64.75.35.86.17.17.29.79.910.9 426*378395369376343348307314266272260245236236228228224219215208204426 * 378395369376343348307314266272260245236236228228224219215208204

예 3Example 3

0.75중량%플라틴 및 0.003중량%세륨-혼합금속을 가지는 금속-합금으로된 미세와이어Microwires made of metal-alloy with 0.75 wt% platinum and 0.003 wt% cerium-mixed metal

0.75중량%플라틴, 0.003중량%세륨-혼합금속, 잔여가 금으로된 합금의 용융체가 연속주조설비에서 원형횡단면을 가지는 비렛트로 주조된다. 이어서 이 비렛트로부터 30 마이크로메터의 직경을 가지는 와이어가 인발되며 이 와이어는 얻고저하는 연신율 여하에 따라서 약 300-600℃에서 공기중에서 소둔되었다. 연신율 [%]에 따라서 측정된 강도 [MPa]가 표 Ⅲ에 주어졌다.A melt of 0.75% by weight platinum, 0.003% by weight cerium-mixed metal and alloy of residual gold is cast into a bead having a circular cross section in a continuous casting plant. Subsequently, a wire having a diameter of 30 micrometers was drawn from the vial, which was annealed in air at about 300-600 ° C. depending on the elongation attained. Intensity [MPa] measured according to elongation [%] is given in Table III.

275마이크로메터의 직경을 가지는 와이어에서 측정된 실온에서의 비전기 저항은 0.031 Ohm ㎟/mThe non-electric resistance at room temperature measured on a wire with a diameter of 275 micrometers is 0.031 Ohm mm2 / m

표 3TABLE 3

연신율 [%]Elongation [%] 강도 [MPa]Strength [MPa] 1.6*1.82.02.62.72.84.04.65.06.68.41.6 * 1.82.02.62.72.84.04.65.06.68.4 444*410386359322322252248241236221444 * 410386359322322252248241236221

예 4Example 4

0.9중량%플라틴 및 0.003중량%세륨-혼합금속을 가지는 금-합금으로된 미세와이어Gold-alloy microwires with 0.9 wt% platinum and 0.003 wt% cerium-mixed metals

0.9중량%플라틴, 0.003중량%세륨-혼합금속 및 잔여가 금으로된 합금의 용융체가 연속주조설비에서 원형의 횡단면을 가지는 비렛트로 주조되었다. 이어서 이 비렛트로부터 25 마이크로메터의 직경을 가지는 와이어가 그리고 30 마이크로메터의 직경을 가지는 와이어가 인발되었으며 그리고 각각의 와이어는 얻고자하는 연산율 여하에 따라서 약 300-600℃에서 공기에서 소둔되었다. 연신율[%]에 따라서 측정된 강도치들[MPa]이 표 Ⅳ에 제시되었다. 275 마이크로메터의 직경을 가지는 와이어에서 측정된, 실온에서의 비전기저항은 0.032 Ohm ㎟/m에 달했다.A melt of 0.9% by weight platinum, 0.003% by weight cerium-mixed metal and alloy of residual gold was cast into a bead having a circular cross section in a continuous casting plant. Subsequently, wires having a diameter of 25 micrometers and wires having a diameter of 30 micrometers were drawn from this vilet and each wire was annealed in air at about 300-600 ° C. depending on the desired calculation rate. Intensity values [MPa] measured according to elongation [%] are shown in Table IV. The non-electric resistance at room temperature, measured on a wire with a diameter of 275 micrometers, reached 0.032 Ohm mm 2 / m.

표 ⅣTable IV

연신율 [%]Elongation [%] 강도 [MPa]Strength [MPa] 1.8*1.91.92.52.73.13.13.33.94.05.07.710.01.8 * 1.91.92.52.73.13.13.33.94.05.07.710.0 460*424402369334280286293262253246228215460 * 424402369334280286293262253246228215

예 5Example 5

0.9중량%플라틴, 0.003중량%세륨-혼합금속, 0.01중량%베릴륨 및 0.001중량%칼슘을 가지는 금-합금으로된 미세와이어Gold-alloyed microwires with 0.9 weight percent platinum, 0.003 weight percent cerium-mixed metal, 0.01 weight percent beryllium and 0.001 weight percent calcium

0.5중량%플라틴, 0.003중량%세륨-혼합금속, 0.001중량%베릴륨, 0.001중량%칼슘 및 잔여분이 금으로된 합금의 용융체가 연속주조설비에서 원형횡단면을 가지는 비렛트에로 주조되었다. 이어서 이 비렛트로부터 30 마이크로메터의 직경을 가지는 와이어가 인발되며 그리고 얻고자하는 연신율 여하에 따라서 약 300-600℃에서 공기에서 소둔되었다. 연신율[%]에 따라서 측정된 강도[MPa]가 표 Ⅴ에 주어졌다.A melt of an alloy of 0.5% by weight Platin, 0.003% by weight cerium-mixed metal, 0.001% by weight beryllium, 0.001% by weight calcium and the remainder of gold was cast into a vitreat with a circular cross section in a continuous casting plant. A wire having a diameter of 30 micrometers was then drawn from this vilet and annealed in air at about 300-600 ° C. depending on the elongation desired to be obtained. The strength [MPa] measured according to the elongation [%] is given in Table V.

표 ⅤTable Ⅴ

연신율 [%]Elongation [%] 강도 [MPa]Strength [MPa] 3.64.04.24.44.75.27.38.63.64.04.24.44.75.27.38.6 364366336308314308281262364366336308314308281262

예 6 (비교)Example 6 (comparison)

DE 16 08 161C에 의한 세륨-혼합금속을 가지는 금-합금으로된 미세와이어.Gold-alloyed microwires with cerium-mixed metals according to DE 16 08 161C.

금 및 세륨-혼합금속으로된 합금의 용융체가 연속주조설비 내에서 원형의 횡단면을 가지는 비렛트에로 주조되었다. 이어서 이 비렛트로부터 25 마이크로메터의 직경을 가지는 와이어와 그리고 30 마이크로메터의 직경을 가지는 와이어가 인발되었으며 그리고 각각의 와이어는 얻고자하는 연신율여하에 따라 약 300-600℃에 제시되었다.A melt of an alloy of gold and cerium-mixed metal was cast into a virtue with a circular cross section in a continuous casting plant. Subsequently, wires having a diameter of 25 micrometers and wires having a diameter of 30 micrometers were drawn from this vilet and each wire was presented at about 300-600 ° C. depending on the elongation to be obtained.

275 마이크로메터의 직경을 가지는 와이어에서 측정된, 실온에서의 비전기 저항은 0.024 Ohm ㎟/m에 달했다.The non-electric resistance at room temperature, measured on a wire with a diameter of 275 micrometers, reached 0.024 Ohm mm 2 / m.

예 ⅥExample Ⅵ

연신율 [%]Elongation [%] 강도 [MPa]Strength [MPa] 1.4*2.03.43.64.04.56.68.01.4 * 2.03.43.64.04.56.68.0 365*326230224224222212175365 * 326230224224222212175

*단단함 * Rigidity

와이어 결합을 위해서도 그리고 플립-칩의 접촉돌기부의 제조를 위해서도 적합하다.It is also suitable for wire bonding and for the manufacture of contact projections of flip-chips.

Claims (17)

반도체 구성소자들의 접촉을 위한, 세륨-혼합금속을 함유하고 있는 금-합금으로된 미세와이어dp 있어서,There is a fine wire dp of gold-alloy containing cerium-mixed metal for contacting semiconductor components, 이 금-합금은 0.05-0.95중량%플라틴, 0.001-0.1중량%세륨-혼합금속, 0.1 중량%알카리토금속 그리고 적어도 50중량% 까지가 세륨으로된 희토류금속으로 되어 있는 것을 특징으로 하는 미세와이어.The gold-alloy comprises 0.05-0.95 wt% platinum, 0.001-0.1 wt% cerium-mixed metal, 0.1 wt% alkaline earth metal and at least 50 wt% rare earth metal of cerium. 제 1항에 있어서,The method of claim 1, 금-합금의 플라틴 함량은 0.25-0.9중량%에 달하는 것을 특징으로 하는 미세와이어.The fine wire, characterized in that the platinum-platin content of the gold-alloy reaches 0.25-0.9% by weight. 제 1항 또는 제 2항에 있어서,The method according to claim 1 or 2, 금-합금의 세륨-혼합금속 함량은 0.001-0.1중량%에 달하는 것을 특징으로 하는 미세와이어.The cerium-mixed metal content of the gold-alloy is a fine wire, characterized in that up to 0.001-0.1% by weight. 제 1항 내지 제 3항 중의 어느 한 항에 있어서,The method according to any one of claims 1 to 3, 금-합금의 알칼리토금속 함량은 0.0001-0.01 중량%에 달하는 것을 특징으로 하느 미세와이어.The alkaline earth metal content of the gold-alloy is 0.0001-0.01% by weight of microwires. 제 1항 내지 제 4항중의 어느 한 항에 있어서,The method according to any one of claims 1 to 4, 알칼리토금속은 베릴륨 및 칼슘으로된 혼합물인 것을 특징으로 하는 미세와이어.Alkaline earth metal is a fine wire, characterized in that the mixture of beryllium and calcium. 제 1항 내지 제 5항 중의 어느 한 항에 있어서,The method according to any one of claims 1 to 5, 플라틴은 부분적으로 또는 완전히 파라듐에 의하여 대체되어 있는 것을 특징으로 하는 미세와이어.Platinum is a microwire, characterized in that partly or completely replaced by palladium. 제 1항 내지 제 6항 중의 한항에 의한 반도체 구성소자들의 접촉을 위하여 세륨-혼합금속을 포함하고 있는 금-합금으로된 미세와이어의 제조방법에 있어서,In the method for producing a micro-wire made of a gold-alloy containing a cerium-mixed metal for contacting the semiconductor components according to any one of claims 1 to 6, 0.05-0.95중량%플라틴, 0.001-0.1중량%셀륨-혼합금속, 0-0.1중량%알칼리토금속, 잔여가 금이며 여기서 금속은 적어도 50중량%를 가지기까지 세륨으로 되어 있는 그러한 금-합금이 용융되고, 이 용융된 합금은 연속주조되고, 이 비렛트는 결합목적을 위하여 통상적인 직경을 가지는 비렛트로 인발되고 그리고 이 와이어는 소둔되는 것을 특징으로 하는 방법.0.05-0.95 weight percent platinum, 0.001-0.1 weight percent celium-mixed metal, 0-0.1 weight percent alkali earth metal, the remainder being gold, where such gold-alloy is molten such that the metal is cerium to at least 50 weight percent And the molten alloy is continuously cast, the beads are drawn into a bead having a normal diameter for bonding purposes and the wire is annealed. 제 7항에 있어서,The method of claim 7, wherein 용융된 합금은 원형의 횡단면을 가지는 비렛트에로 주조되는 것을 특징으로 하는 방법.The molten alloy is cast into a vial having a circular cross section. 제 7항 또는 제 8항에 있어서,The method according to claim 7 or 8, 0.25-0.9중량%의 플라틴 함량을 가지는 금-플라틴-희토류금속-합금이 용융되는 것을 특징으로 하는 방법.A gold-platin-rare earth metal-alloy having a platinum content of 0.25-0.9% by weight is melted. 제 7항 내지 제 9항중 어느 한 항에 있어서,The method according to any one of claims 7 to 9, 0.001-0.01중량%의 세륨-혼합금속-함량을 가지는 금속-합금이 용융되는 것을 특징으로 하는 방법.A metal-alloy having a cerium-mixed metal-content of 0.001-0.01% by weight is melted. 제 7항 내지 제 10항 중의 어느 한 항에 있어서,The method according to any one of claims 7 to 10, 0.0001-0.01중량%의 알칼리토금속-함량을 가지는 금-합금이 용융되는 것을 특징으로 하는 방법.A gold-alloy having an alkaline earth metal-content of 0.0001-0.01% by weight is melted. 제 7항 내지 제 11항 중의 어느 한 항에 있어서,The method according to any one of claims 7 to 11, 알칼리토금속으로서 베릴륨 및 칼슘의 혼합물로 포함하는 금-합금이 용융되는 것을 특징으로 하는 방법.A gold-alloy comprising a mixture of beryllium and calcium as alkaline earth metal is melted. 제 7항 내지 제 12항 중의 어느 한 항에 있어서,The method according to any one of claims 7 to 12, 플라틴이 부분적으로 또는 완전히 파라듐에 의하여 대체되는 그러한 금-합금이 용융되는 것을 특징으로 하는 방법.And a gold-alloy in which the platinum is partially or completely replaced by palladium. 제 7항 내지 제 13항 중의 어느 한 항에 있어서,The method according to any one of claims 7 to 13, 와이어는 300-700℃에서 소둔되는 것을 특징으로 하는 방법.The wire is annealed at 300-700 ° C. 와이어결합을 위하여 제 1항 내지 제 6항 중의 한 항에 의한 미세와이어의 이용.Use of the microwire according to any one of claims 1 to 6 for wire bonding. 고주파수 사용하에 와이어 결합을 위해 제 15항에 의한 이용.Use according to claim 15 for wire bonding under high frequency use. 플립-칩-기술에서 반도체 구성소자들의 결합을 위하여 제 1항 내지 제 6항 중의 어느 한 항에 의한 미세와이어의 이용.Use of a microwire according to any one of claims 1 to 6 for coupling semiconductor components in flip-chip technology.
KR1019980024269A 1997-07-07 1998-06-26 Fine wire made of gold alloy, method of making and using this wire KR100284929B1 (en)

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