KR19990009660A - Back cleaning device for semiconductor wafer, wafer cleaning device and wafer cleaning method using the same - Google Patents

Abstract

The present invention relates to a backside cleaning apparatus for a semiconductor wafer, a wafer cleaning apparatus using the same, and a wafer cleaning method for effectively cleaning the backside of a wafer.

A back cleaning apparatus for a wafer according to the present invention includes a first holder rotatably mounted, lifted and rotated on a chuck assembly, for adsorbing and fixing the back of the wafer, and rotatably penetrating and installed in the first holder. A first drive shaft including a brush, a second holder extending on the chuck assembly and provided with at least one to adsorb and fix the rear surface of the wafer, and a pen provided in the second holder and penetrated in the second holder. It is characterized by consisting of a configuration including two drive shafts.

Therefore, according to the present invention, the back surface of the wafer can be easily cleaned, thereby preventing process defects and increasing the production yield of the semiconductor device.

Description

Back cleaning device for semiconductor wafer, wafer cleaning device and wafer cleaning method using the same

The present invention relates to a backside cleaning apparatus for a semiconductor wafer, a wafer cleaning apparatus and a wafer cleaning method using the same, and more particularly, to a backside cleaning apparatus for a semiconductor wafer and a wafer cleaning apparatus and a wafer cleaning using the same. It is about a method.

In general, a wafer is manufactured as a semiconductor device as a process of photographing, diffusion, etching, chemical vapor deposition, and metal deposition is repeatedly performed.

These semiconductor devices are extremely sophisticated devices, which require strict process conditions, precise manufacturing techniques, and high levels of clean conditions to prevent damage to the wafer from various contaminants for increasing the production yield.

As described above, in performing the process, the clean state acts as a direct factor in the manufacturing yield to the semiconductor device, so that the wafer performs the cleaning process before or after each process.

As shown in FIG. 1, as the wafer cleaning apparatus 10 for cleaning the wafer, the rear surface of the wafer W is attracted by the holder 12, and the front surface thereof is positioned downward, and thus the wafer W is thus positioned. ) Is positioned close to the upper portion of the brush (B) provided at the upper end of the drive shaft (14), the wafer (W) by the high-speed rotation of the holder 12 and the cleaning liquid supplied through the cleaning liquid supply nozzle (18) The front of the is cleaned.

As another method, a wafer may be poured into a reservoir containing a cleaning liquid to bubble or rotate at a high speed, or a cleaning liquid may be sprayed at a predetermined pressure on the entire surface of the rotating wafer at a high speed.

The above-described wafer cleaning apparatus 10 generally cleans the entire surface of the wafer W while the rear surface of the wafer W is adsorbed, and through this process, the rear surface of the wafer W is also cleaned to some extent. In addition, the site that is adsorbed to the holder 12 during cleaning has a problem that is difficult to clean.

When the rear portion of the wafer remains contaminated in this way, it affects not only the corresponding process but also the next process, resulting in a process defect, and thus there is a problem that the manufacturing yield is reduced.

The present invention is to solve the conventional problems as described above, the object of which is to clean the back of the wafer easily to prevent the process defects, and to increase the manufacturing yield to the semiconductor device back cleaning device of the semiconductor wafer The present invention provides a wafer cleaning apparatus and a wafer cleaning method using the same.

1 is a front view schematically showing a conventional wafer cleaning apparatus.

2A and 2B are cross-sectional views illustrating a configuration and an operation relationship of a back surface cleaning apparatus of a wafer according to an embodiment of the present invention.

3 is a cross-sectional view showing the configuration and operation relationship of the wafer cleaning apparatus provided with the back surface cleaning apparatus of the wafer shown in FIGS. 2A and 2B.

4A and 4B are cross-sectional views showing the configuration and operation of the wafer backside cleaning apparatus according to another embodiment of the present invention.

FIG. 5 is a cross-sectional view showing the configuration and operation relationship of the wafer cleaning apparatus provided with the back surface cleaning apparatus of the wafer shown in FIGS. 4A and 4B.

※ Explanation of codes for main parts of drawing

10, 40, 80: wafer cleaner 12: holder

14: drive shaft

18, 36, 56a, 56b, 72, 92: cleaning liquid supply nozzle

20, 60: Wafer rear cleaner 22, 42, 62, 82: First holder

24, 44, 64, 84: chuck assembly 26, 46, 66, 86: first drive shaft

30, 50, 68, 88: second holder 32, 52, 70, 90: second drive shaft

58, 94: third drive shaft

The wafer cleaning apparatus according to the present invention for achieving the above object is a first holder for lifting, lowering and rotatable on the chuck assembly to adsorb and fix the central portion of the back of the wafer, and rotates in the first holder A first drive shaft, which is penetrated, installed, and provided with a brush at an end thereof, and penetrates and is installed in the second holder and the second holder which are formed on the chuck assembly to extend and adsorb and fix the rear surface of the wafer. And a second drive shaft provided with a brush at an end thereof.

In addition, the rear cleaning apparatus of the wafer according to another embodiment of the present invention for achieving the above object is installed on the chuck assembly rotatably, down and rotatable first holder for adsorbing and fixing the rear center portion of the wafer; A first drive shaft rotatably penetrating and installed in the first holder and having a brush at an end thereof, and at least one second holder and a side wall extending on the chuck assembly and installed to suck and fix the rear side of the wafer; At least one horizontal reciprocating motion in the direction of the center of the wafer is positioned by the first holder is characterized in that it comprises a configuration including a second drive shaft provided with a brush at the end.

On the other hand, the wafer cleaning apparatus of the present invention for achieving the above object is a first holder for adsorbing and fixing the center portion of the rear surface of the wafer that is rotatably mounted on the chuck assembly rotatably, and rotatable in the first holder A first drive shaft, which is penetrated and installed, and which has a brush at an end thereof, a second holder installed on the chuck assembly and at least one installed to adsorb and fix the back side of the wafer; And a second drive shaft provided with a brush at an end thereof, the lower drive of the wafer positioned by the first holder to enable rotation and horizontal movement, and a third drive shaft provided with a brush at an end thereof and positioned by the first holder. It is installed on the upper and lower side of the wafer to supply the cleaning liquid onto the wafer. It characterized by constituted by any configuration, including a cleaning liquid supply nozzle.

In addition, another embodiment of the wafer cleaning apparatus of the present invention for achieving the above object is a first holder for adsorbing and fixing the center portion of the back of the wafer that is rotatably mounted, lowered and rotated on the chuck assembly, and the first A first drive shaft rotatably penetrated and installed in the holder and provided with a brush at an end thereof, at least one second holder extending on the chuck assembly to absorb and fix the back side of the wafer; At least one second drive shaft having at least one horizontal reciprocating motion to a predetermined position in a center direction of the wafer to be positioned, and having a brush at an end thereof, and a horizontal motion at a lower portion of the wafer positioned by the first holder; 3rd ball installed and brushed at the end Installed on the upper and the lower side of the wafer is positioned by the shaft and the first holder is characterized in a constituted by any configuration, including a cleaning liquid supply nozzle for supplying a cleaning liquid.

In order to achieve the above object, a wafer cleaning method includes a first holder for adsorbing a rear center portion of a wafer, penetrating and installing a first drive shaft provided with a brush at an end thereof, and adsorbing the rear side of the wafer. A plurality of second holders are installed, and a second drive shaft having a brush attached to the end is penetrated and installed in the second holder. Injecting the wafer into the cleaning liquid, rotating the first drive shaft at a high speed to brush the central portion of the wafer back surface, removing the wafer from the cleaning liquid by a lifting motion of the chuck assembly, and drying the wafer for a predetermined time; Descending from the second holder Taking the wafer and immersing the wafer in a cleaning liquid; placing a brush installed at the end of the second drive shaft close to the back of the wafer and brushing by rotating at a high speed through the first holder; and raising and lowering the first holder. And removing the wafer from the cleaning liquid at a high speed rotation.

On the other hand, another embodiment of the wafer cleaning method for achieving the above object is provided with a first holder for adsorbing the center portion of the back of the wafer, the first drive shaft with a brush installed at the end through the first holder, A plurality of second holders for adsorbing the rear side of the wafer are provided, and a second drive shaft with a brush attached to the end is penetrated and installed in the second holder, and the cleaning liquid is supplied onto the wafer positioned by the first holder. Installing a cleaning liquid supply nozzle, supplying the cleaning liquid to the bottom surface of the wafer that is adsorbed on the second holder, and rotating the first drive shaft to brush the central portion of the wafer; and stopping the cleaning liquid supply to dry the wafer. And the first holder is lowered to form the second Taking over the wafer from the holder, placing a brush installed at the end of the second drive shaft close to the back of the wafer, supplying a cleaning liquid, and brushing the edge of the wafer by rotating the wafer at a high speed through the first holder; And stopping the supply of the cleaning liquid and drying the wafer at a high speed through the first holder.

On the other hand, another embodiment of the wafer cleaning method for achieving the above object is provided with a first holder for adsorbing the center portion of the back of the wafer, the first drive shaft with a brush installed at the end through and installed in the first holder And a plurality of second holders for adsorbing the rear side of the wafer, penetrating and installing a second drive shaft with a brush attached to an end thereof, and supplying a cleaning liquid onto the wafer positioned by the first holder. A cleaning liquid supply nozzle, a third drive shaft provided with a brush on a lower side of the wafer positioned by the first holder, and then supplying the cleaning liquid to the bottom surface of the wafer which is adsorbed and positioned on the second holder. 1 Brush the center of the wafer by rotating the drive shaft And stopping the supply of the cleaning liquid to dry the wafer, and lowering the first holder to take over the wafer from the second holder, and the front surface of the wafer is proximate to the upper portion of the brush provided at the end of the third drive shaft. And lowering the second drive shaft to position the brush installed at the end of the wafer to the rear of the wafer, supplying a cleaning liquid, and rotating the wafer at a high speed through the first holder to brush the edges of the front and rear surfaces of the wafer. And stopping the supply of the cleaning liquid and drying the wafer at a high speed through the first holder.

On the other hand, another embodiment of the wafer cleaning method for achieving the above object is provided with a first holder for adsorbing the center portion of the back of the wafer, the first drive shaft with a brush installed at the end through and installed in the first holder And a plurality of second holders for adsorbing the rear side of the wafer, and horizontal reciprocating motion of the second drive shaft provided with a brush at an end portion of the wafer at a predetermined position in the center direction of the wafer located by the first holder. And installing it so that the second holder sucks the back side of the wafer to be introduced, flips it over and puts it in the cleaning liquid contained in the container, and rotates the first drive shaft at a high speed to brush the wafer back center portion; By the lifting motion of the assembly Removing the wiper from the cleaning liquid and drying it for a predetermined time; taking over the wafer from the second holder to take down the wafer from the second holder; dipping the wafer into the cleaning liquid; and attaching a brush disposed at the end of the second drive shaft to the rear surface of the wafer. Positioning and brushing by rotating at high speed through the first holder and the step of lifting and removing the wafer from the cleaning liquid in the lifting motion and the high speed rotation of the first holder.

On the other hand, another embodiment of the wafer cleaning method for achieving the above object is provided with a first holder for adsorbing the center portion of the back of the wafer, the first drive shaft with a brush installed at the end through and installed in the first holder And a plurality of second holders for adsorbing the rear side of the wafer, and horizontal reciprocating motion of the second drive shaft with a brush at an end portion at a predetermined sidewall to a predetermined position in the center direction of the wafer located by the first holder. And the cleaning liquid supply nozzle is provided on the upper side of the wafer positioned by the first holder, and the cleaning liquid is supplied to the bottom surface of the wafer which is adsorbed by the second holder and rotates the first drive shaft. Brushing the central portion of the wafer, Stopping the semen supply and drying the wafer; the first holder is lowered to take over the wafer from the second holder, and the brush installed at the end of the second drive shaft is positioned close to the rear edge of the wafer, and then the cleaning liquid is removed. Supplying, rotating the wafer through the first holder at high speed to brush the edge of the wafer, and stopping supply of the cleaning liquid and drying the wafer by rotating the wafer at high speed through the first holder.

On the other hand, another embodiment of the wafer cleaning method for achieving the above object is provided with a first holder for adsorbing the center portion of the back of the wafer, the first drive shaft with a brush installed at the end through and installed in the first holder And a plurality of second holders for adsorbing the rear side of the wafer, and horizontal reciprocating motion of the second drive shaft provided with a brush at an end portion of the wafer at a predetermined position in the center direction of the wafer located by the first holder. And a cleaning liquid supply nozzle for supplying a cleaning liquid on the wafer positioned by the first holder, and a third drive shaft provided with a brush under the wafer positioned by the first holder. Of the wafer to be adsorbed onto the second holder At the same time as supplying the cleaning liquid to the bottom surface and rotating the first drive shaft to brush the center portion of the wafer, stopping the cleaning liquid supply to dry the wafer, the first holder is lowered to remove the wafer from the second holder Taking over and positioning the front surface of the wafer so as to be close to the upper portion of the brush provided at the end of the third drive shaft; and placing the brush provided at the end of the second drive shaft to the rear edge portion of the wafer to horizontally move the wafer. Supplying a cleaning liquid from above and below, rotating the wafer at a high speed through the first holder to brush the edges of the front and rear surfaces of the wafer, and stopping the supply of the cleaning liquid and rotating the wafer through the first holder at a high speed. Let It comprises a step of drying.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

2A and 2B are cross-sectional views illustrating an operation relationship of a rear surface cleaning apparatus of a semiconductor wafer according to an embodiment of the present invention, which will be described in detail with reference to the drawings.

Referring to the configuration of the wafer cleaning apparatus 20 of the wafer according to the present invention, the first holder 22 formed to selectively suck and fix the center portion of the rear surface of the wafer W in a tubular shape whose end shape is wider in diameter. ) Is penetrated and installed in a central portion of the chuck assembly 24 so as to be lifted, lowered and rotated.

In addition, the first driving shaft 26 penetrates and is installed in the interior of the first holder 22 so as to be lifted, lowered and rotated, and the end of the first driving shaft 26 has a predetermined interval on the rear surface of the wafer W. Brush B is installed to be in close proximity.

In addition, the outer portion of the first drive shaft 26 and the brush B forms a gap at a predetermined interval on the inner wall of the first holder 22 described above, and a vacuum pressure is selectively provided through the gap to provide a wafer W. As shown in FIG. ) Will be adsorbed.

As described above, in forming the passage through which the vacuum pressure is transmitted, an additional vacuum hole may be formed at the end of the first holder.

On the other hand, on the chuck assembly 24, a plurality of second holders 30 formed to selectively adsorb the rear edge portion of the wafer W in the same shape as the first holder 22 are installed in parallel with the first holder 22. do.

Inside the second holder 30, a second drive shaft 32 having a brush B mounted at an end thereof is penetrated and installed to move up, down, and rotatably in the same manner as the first drive shaft 26. Vacuum pressure is selectively provided through the gap between the outer portion of the 32 and the brush B and the inner wall of the second holder 30 to adsorb the wafer W.

In addition, the vacuum pressure provided to the second holder may be formed in a shape in which the vacuum holes are separately formed and adsorbed.

On the other hand, a storage tank (not shown) formed to receive a predetermined amount of the cleaning liquid is provided under the wafer W which is adsorbed and positioned by the first holder 22 or the second holder 30.

According to the present invention having such a configuration, the wafer W introduced to perform the cleaning operation is absorbed by the second holder 30 so that the front surface of the wafer W faces downward as the chuck assembly 24 is driven. To the reservoir upper position where the cleaning operation is performed.

In this case, the first holder 22 is spaced apart from the rear surface of the wafer W as shown in FIG. 2A, and the brush B installed at the end of the first driving shaft 26 is the rear surface of the wafer W. As shown in FIG. At a distance from the adjacent position.

In this state, when the chuck assembly 24 is lowered to immerse the wafer W in the cleaning liquid contained in the reservoir, the first drive shaft 26 rotates so that the wafer W is moved by the brush B installed at the end. The central area is cleaned.

When the predetermined time elapses, the chuck assembly 24 is moved up and down to remove the wafer W from the cleaning liquid and to dry it.

Thereafter, when the rotation of the first driving shaft 26 is stopped, the first holder 22 is lowered into a shape of inserting the brush B provided at the end of the first driving shaft 26 and the first driving shaft 26 as described above, and the wafer. An end portion comes into contact with the rear surface of the wafer W, and the center portion of the wafer W is sucked by the vacuum pressure provided in this state.

As described above, the second holder 30 loses the suction force of the wafer W when the supply of the vacuum pressure stops, and the wafer W is turned over to the first holder 22. The wafer W is again contained in the cleaning liquid by the continuous downward movement of the one holder 22.

In addition, the above-described second drive shaft 32 is lowered together with the first holder 22 so that the lower portion of the brush B is located close to the rear surface of the wafer W, and then the rotation of the first holder 22 is performed. As a result, the brush B provided at the end of the second drive shaft 32 cleans the edge portion of the back surface of the wafer W. As shown in FIG.

Then, the first holder 22 and the second drive shaft 32 again move up and down a predetermined height to remove the wafer W from the cleaning liquid and rotate it again at a high speed for a predetermined time to dry the wafer W using centrifugal force.

Subsequently, the wafer W is taken over and unloaded by the second holder 30 again while the rotation of the first holder 22 is stopped, thereby completing the rear cleaning of the wafer W.

In the above-described configuration of the rear cleaning apparatus 20 of the wafer, the wafer W is introduced into the storage tank in which the cleaning liquid is contained. However, as shown in FIGS. 2A and 2B, the cleaning liquid is selectively supplied to the sidewalls. It is preferable to install and use the cleaning liquid supply nozzle 36.

Thus, the same code | symbol as the structure mentioned above is attached | subjected to the Example of the structure with which the washing | cleaning liquid supply nozzle 36 was installed, and the operation relationship which follows is demonstrated.

The wafer W injected for the rear surface cleaning of the wafer W is positioned so that the front surface of the wafer W faces downward by the driving of the chuck assembly 24 and the second holder 30. Conveyed to the position to be performed.

In this case, the first holder 22 is spaced apart from the rear surface of the wafer W as shown in FIG. 2A, and the brush B installed at the end of the first driving shaft 26 is the rear surface of the wafer W. As shown in FIG. At a distance from the adjacent position.

In this state, the cleaning liquid supply nozzle 36 installed on the sidewall of the rear cleaning apparatus 20 of the wafer injects the cleaning liquid to the rear surface of the wafer W at a predetermined pressure, and the first driving shaft 26 rotates to brush B ) To clean the central portion of the wafer (W).

When the predetermined time elapses, the cleaning liquid supply nozzle 36 stops supplying the cleaning liquid, and the first drive shaft 26 continuously rotates, and at the same time, the wafer W is dried.

Thereafter, when the rotation of the first driving shaft 26 is stopped, the first holder 22 is lowered to insert the brush B installed at the end of the first driving shaft 26 and the first driving shaft 26 as described above. The first drive shaft 26 and the sides of the brush B are attracted to the center portion of the wafer W by a vacuum pressure provided in a gap formed between the inner wall of the first holder 22.

In this state, the vacuum pressure provided to the above-described second holder 32 is cut off, and then, as shown in FIG. 2B, the vacuum pressure is positioned to be spaced apart from the rear surface of the wafer W by a predetermined height.

At this time, the brush B provided at the end of the second drive shaft 32 is in a state in which the brush B is proximately spaced from the rear surface of the wafer W.

In addition, the first holder 26 rotates at a high speed while the wafer W is attracted thereto, and the cleaning liquid supply nozzle 36 supplies the cleaning liquid to the brush B provided at the end of the second drive shaft 32. As a result, the edge portion of the back surface of the wafer W is cleaned.

When the predetermined time elapses, the cleaning liquid supply nozzle 36 stops supplying the cleaning liquid, and the first holder 26 rotates at a high speed to dry the wafer W by centrifugal force.

Thereafter, the wafer W is taken over and unloaded by the second holder 32 again while the rotation of the first holder 22 is stopped, thereby completing the rear cleaning of the wafer W.

On the other hand, as another embodiment for achieving the object of the present invention, the wafer cleaning apparatus 40 shown in Fig. 3 is implemented by applying the above-described configuration of the wafer rear cleaning apparatus 20 to the conventional wafer cleaning apparatus 10. It is sectional drawing which showed the example.

Referring to the configuration of the wafer cleaning apparatus 40 of the present invention according to this embodiment, the first holder 42 formed to selectively adsorb and fix the rear center portion of the wafer W in a tubular shape with a wide end shape ) Is installed in the center portion of the chuck assembly 44 so as to lift, lower and rotate.

In addition, the first drive shaft 46 penetrates and descends and is rotatably installed inside the first holder 42, and a brush B is provided at an end of the first drive shaft 46.

The first drive shaft 46 and the outer portion of the brush B form a gap with an inner wall of the first holder 42 at a predetermined interval, and the vacuum pressure is selectively provided through the gap to allow the wafer W to be provided. Will be adsorbed.

On the other hand, on the chuck assembly 44, a plurality of second holders 50 formed to selectively adsorb the rear edge portion of the wafer W in the same shape as the first holder 42 are installed in parallel with the first holder 42. do.

Inside the second holder 50, a second drive shaft 52 having a brush B mounted at an end thereof is penetrated therethrough in a manner similar to the above-described first drive shaft 46 so as to move up, down, and rotate.

Meanwhile, a third drive shaft 58 that is horizontally movable and rotatable is installed below the wafer W that is adsorbed by the first holder 42 or the second holder 50, and the third drive shaft 58 is rotated. At the upper end, a brush (B) which is positioned at a predetermined distance to the front surface of the wafer (W) is installed.

As described above, the cleaning liquid supply is formed to selectively supply the cleaning liquid to the front and rear surfaces of the sidewalls of the wafer cleaning apparatus 40 on the upper and lower sides of the wafer W, which are adsorbed by the first holder or the second holder. The nozzles 56a and 56b are provided.

Referring to the operation relationship according to the embodiment of this configuration, the wafer (W) that is injected to perform the cleaning operation is adsorbed to the second holder 50 so that the front surface is directed downward as the chuck assembly 44 is driven. To the position where the cleaning operation is performed.

In this case, the first holder 42 is spaced apart from the rear surface of the wafer W, and the brush B installed at the end of the first driving shaft 46 is positioned close to the rear surface of the wafer W at a predetermined interval.

In this state, the cleaning liquid is supplied through the upper cleaning liquid supply nozzle 56a provided on the sidewall of the wafer cleaning apparatus 40 and the first driving shaft 46 is rotated at the same time, so that the brush B is provided at the end of the first driving shaft 46. ) Cleans the central portion of the wafer (W).

When the cleaning operation has elapsed for a predetermined time, the upper cleaning liquid supply nozzle 56a stops supplying the cleaning liquid to dry the wafer W.

Thereafter, when the rotation of the first drive shaft 46 is stopped, the first holder 42 is lowered into a shape of inserting the brush B installed at the end of the first drive shaft 46 and the first drive shaft 46 as described above. The vacuum pressure provided through the gap allows the center portion of the wafer W to be adsorbed.

Subsequently, the vacuum pressure provided to the second holder 50 is cut off, so that the wafer W is turned over to the first holder.

Again, the first holder 42 is lowered by a predetermined height in a state of adsorbing the wafer W, and at this time, the front surface of the wafer W is fixed to an upper portion of the brush B provided in the above-described third drive shaft 58. Closely spaced.

In addition, the second driving shaft 52 is lowered to a position positioned at a predetermined interval on the rear surface of the wafer W, and in this state, the cleaning liquid is supplied through the upper and lower cleaning liquid supply nozzles 56a and 56b. The first holder 42 rotates the wafer W at a high speed to simultaneously clean the edges of the front and rear surfaces of the wafer W.

When a predetermined time elapses, the upper and lower cleaning liquid supply nozzles 56a and 56b block the cleaning liquid supply, and the first holder 42 is continuously rotated at a high speed to dry the wafer W.

Then, when the driving of the first holder 42 is stopped, the first holder 46 moves up and down, and the wafer W is turned over to the second holder 50, and then the chuck assembly 44 is driven. By unloading according to the cleaning operation is completed.

On the other hand, the back surface cleaning apparatus 60 of the wafer shown in Figures 4a and 4b is a cross-sectional view showing an operation relationship of another embodiment for achieving the above object, the configuration and operation relationship with reference to Figures 4a and 4b. Let's do it.

As shown in Fig. 4A, the first holder 62 formed to selectively suck and fix the rear center portion of the wafer W in a tubular shape having a wide end diameter is formed on the center portion of the chuck assembly 64. It is penetrated and installed to descend and rotate.

In addition, the first drive shaft 66 penetrates, descends, and rotatably penetrates and is installed inside the first holder 62. An end of the first drive shaft 66 is disposed at an end of the first holder 62 described above. A brush B formed to be positioned at a predetermined interval is mounted.

Then, a gap is formed between the brush B, the outer portion of the first drive shaft 66 and the inner wall of the first holder 62, and a vacuum pressure for adsorbing the wafer W is provided through the gap. Optionally provided to adsorb the wafer (W).

On the other hand, the second holder 68 is formed on the side of the first holder 62 to be moved by the driving means in accordance with the diameter of the wafer W and selectively sucks and fixes the rear edge portion of the wafer W. Plural numbers are installed.

The plurality of second holders 68 installed in this manner may be installed in two, and the second holders 68 may be installed in a line arranged together with the first holder 62 described above.

The side of the wafer W adsorbed by the first holder 62 and the plurality of second holders 68 described above is fixed to the second drive shaft 70 so that a horizontal reciprocating motion in the direction of the rear center of the wafer W is performed. It is preferable that a plurality of brushes B installed to be installed are provided, and the installation position of the second drive shaft 70 is installed in a direction crossing the second holder 68 arranged in a straight line.

Referring to the operation relationship according to the embodiment of this configuration, the wafer (W) that is injected to perform the cleaning operation is adsorbed by the second holder 68 so that the front surface is directed downward as the chuck assembly 64 is driven. To the position where the cleaning operation is performed.

In this case, the first holder 62 is spaced apart from the rear surface of the wafer W as shown in FIG. 4A, and the brush B installed at the end of the first driving shaft has a predetermined distance from the rear surface of the wafer W. In close proximity.

In this state, the chuck assembly 64 is lowered so that the wafer W is immersed in the cleaning liquid contained in the reservoir (not shown), and then rotates the first drive shaft 66 to the rear center portion of the wafer W. The brush B, which is installed in close proximity, cleans the center portion of the wafer W.

When the predetermined time elapses, the chuck assembly 64 is moved up and down, and the wafer W is removed from the aqueous solution and dried.

Thereafter, when the rotation of the first drive shaft 66 is stopped, the first holder 62 is lowered and provided to insert the brush B installed at the end of the first drive shaft 66 and the first drive shaft 66. Due to the vacuum pressure, the center portion of the wafer W is adsorbed.

In this state, the vacuum pressure provided to the above-described second holder 68 is stopped, and the first holder 62 takes over and lowers the wafer W from the second holder, so that the wafer W is again contained in the cleaning liquid. That is it.

In this state, the second drive shaft 70 provided on the side of the wafer W performs horizontal reciprocating motion toward the center of the wafer W, and the lower portion of the brush B fixed to the end of the second drive shaft 70. The horizontal reciprocating motion is performed in a state in which it is positioned at a predetermined interval above the edge portion of the back surface of the wafer (W).

The first holder 62 rotates the wafer W contained in the cleaning liquid to cause the brush B positioned as described above to clean the edge portion of the back surface of the wafer W. As shown in FIG.

Then, when the brush B attached to the second drive shaft 70 is spaced apart from the outside of the wafer W, the first holder 62 moves up and down a predetermined height to position the wafer W away from the cleaning liquid. The wafer W is dried by rotating at high speed in time.

When the drying is completed through this process, the first holder 62 moves up and down to take over the wafer W to the second holder 68, and the second holder 68 of the chuck assembly 64 is disposed. The cleaning operation of the wafer W is completed by unloading the wafer W in accordance with the driving.

In the above configuration of the back surface cleaning apparatus 60 of the wafer, the wafer W is introduced into the storage tank in which the cleaning liquid is accommodated. However, as shown in FIGS. 4A and 4B, the cleaning liquid is applied to the rear surface of the wafer W. As shown in FIG. It is preferable to install and use the cleaning liquid supply nozzle 72 formed to selectively supply.

The embodiment according to the configuration in which the cleaning liquid supply nozzle 72 is installed will be described with reference to FIGS. 4A and 4B, and the same reference numerals will be given to the same configuration, and the operation relations accordingly will be described.

The wafer W introduced for the rear cleaning is transferred to the position where the front surface is downwardly disposed by the second holder 68 and the cleaning operation is performed.

In this case, the first holder 62 is spaced apart from the rear surface of the wafer W as shown in FIG. 4A, and the brush B installed at the end of the first driving shaft 66 is the rear surface of the wafer W. As shown in FIG. At a distance from the adjacent position.

In this state, the cleaning liquid supply nozzle 72 provided on the sidewall of the rear cleaning apparatus 60 of the wafer is supplied by spraying the cleaning liquid to the rear surface of the wafer W, and the first drive shaft 66 is rotated so that the brush B is rotated. The central portion of the wafer (W) is cleaned through this.

When the predetermined time elapses, the cleaning liquid supply nozzle 72 stops supplying the cleaning liquid, and the first drive shaft 66 continuously rotates to dry the wafer W at the same time.

Then, when the rotation of the first drive shaft 66 is stopped, the first holder 62 is lowered to insert the brush B provided at the end of the first drive shaft 66 and the first drive shaft 66 as described above. The outer portion of the first drive shaft 66 and the brush B is attracted to the center portion of the wafer W by the vacuum pressure provided in the gap formed with the inner wall of the first holder 62.

In this state, the vacuum pressure provided to the above-described second holder 68 is cut off to take over the wafer W to the first holder 62, and then the first holder 62 absorbs the wafer W. It is lowered to the state, and is spaced apart from the 2nd holder 68 below.

At this time, the second drive shaft 70 performs the reciprocating motion in the direction of the center of the wafer (W), the lower portion of the brush (B) reciprocating by the second drive shaft 70 is the rear surface of the wafer (W) The reciprocating motion is performed in the proximity state at regular intervals.

Subsequently, the first holder 62 rotates at a high speed while the wafer W is attracted, and the cleaning liquid supply nozzle 72 supplies the cleaning liquid to the upper side of the rear surface of the wafer W by the second driving shaft 70. The brush B, which is reciprocated, cleans the rear edge portion of the wafer W.

When the predetermined time elapses, the cleaning liquid supply nozzle 72 stops the supply of the cleaning liquid, and the first holder 62 rotates at a high speed to dry the wafer W by centrifugal force.

Thereafter, the wafer W is taken over and unloaded by the second holder 68 again while the rotation of the first holder 62 is stopped, thereby completing the rear cleaning of the wafer W.

On the other hand, the wafer cleaning apparatus 80 shown in Fig. 5 is a sectional view showing an embodiment in which the configuration of the above-described back surface cleaning apparatus 60 of the wafer is applied to the conventional wafer cleaning apparatus 10, and the operation according to this embodiment is performed. The relationship will be described with reference to FIG.

The structure of the wafer cleaning apparatus 80 according to another embodiment of the present invention is formed to selectively adsorb and fix the rear center portion of the wafer W in a tubular shape having a wide end diameter as shown in FIG. 5. The first holder 82 is penetrated and installed in a central portion of the chuck assembly 84 so as to be lifted, lowered and rotated.

In addition, a first drive shaft 86 penetrates and is rotatably moved up, down, and rotatably in the interior of the first holder 82, and an end of the first holder 86 is formed at an end of the first drive shaft 86. A brush B formed to be positioned at a predetermined interval is mounted.

In addition, a gap is always formed between the brush B and the outer portion of the first drive shaft 86 and the inner wall of the first holder 82 at regular intervals, and the vacuum pressure for adsorbing the wafer W is selectively selected by the gap. Is passed to.

On the other hand, on the chuck assembly 84, the second holder 88 is installed in parallel with the first holder 82 to selectively suck the rear edge portion of the wafer (W) by the fixing means diameter of the wafer (W) According to this, a plurality of horizontal reciprocating motions are provided.

In addition, a second drive shaft 90 is installed at a sidewall predetermined position of the wafer cleaner 80 so as to allow horizontal reciprocating movement in the center direction of the wafer W positioned by the first holder 82. The brush B is attached to the end of this second drive shaft 90.

A third drive shaft 94 is provided below the wafer W, which is sucked and positioned by the first holder 82, and an upper end of the third drive shaft 94 with respect to the entire surface of the wafer W. Brush B is installed to be positioned at a predetermined interval close.

Meanwhile, as described above, the cleaning liquid may be selectively supplied to the front and rear surfaces of the wafer W to the sidewalls of the upper and lower wafer cleaning devices 80 of the wafer W, which are adsorbed by the first holder 82. The formed cleaning liquid supply nozzles 92a and 92b are provided.

Referring to the operation relationship according to the embodiment of this configuration, the wafer (W) that is injected to perform the cleaning operation is adsorbed by the second holder 88 so that the front surface is directed downward as the chuck assembly 84 is driven. To be transported to a position where a cleaning operation is performed.

In this case, the first holder 82 is spaced apart from the rear surface of the wafer W, and the brush B installed at the end of the first drive shaft 86 is proximately positioned at a predetermined distance from the rear surface of the wafer W.

In this state, the cleaning liquid is supplied through the upper cleaning liquid supply nozzle 92a provided on the side wall of the wafer cleaning apparatus 80 and the brush B provided at the end of the first driving shaft 86 by rotating the first driving shaft 86. Cleans the central portion of the wafer (W).

When the predetermined time elapses, the upper cleaning liquid supply nozzle 92a stops the cleaning liquid supply and then dries the wafer W.

Thereafter, when the rotation of the first drive shaft 86 is stopped, the first holder 82 is lowered into a shape of inserting the brush B installed at the end of the first drive shaft 86 and the first drive shaft 86 described above, and then brushing. A vacuum pressure is provided through the gap between the outer portion of the first drive shaft 86 and the inner wall of the first holder 82 including the outer portion of (B) to adsorb the center portion of the wafer W. As shown in FIG.

In addition, the vacuum pressure provided to the second holder 88 is cut off so that the wafer W is turned over to the first holder 82, and the first holder 82 has the third driving shaft in which the front surface of the wafer W is described above. The wafer W is lowered so as to be proximately spaced apart from the upper portion of the brush B provided at the upper end of the 94.

At this time, the second drive shaft 90 installed on the sidewall of the wafer cleaning apparatus 80 performs a horizontal reciprocating motion in the center direction of the wafer W in a range not in contact with the first holder 82. The brush B installed at the end of the 90 is horizontally reciprocated in a state in which the brush B is proximately spaced from the rear surface of the wafer W at a predetermined interval.

In this state, the first holder 82 rotates the wafer W at high speed, and the front and rear surfaces of the wafer W are provided through the cleaning liquid supply nozzles 92a and 92b provided on the upper and lower sides of the wafer W. By supplying the cleaning liquid to the wafer, the front surface of the wafer W and the rear edge portion of the wafer W are simultaneously cleaned.

When a predetermined time elapses, the upper and lower cleaning liquid supply nozzles 92a and 92b block the cleaning liquid supply, and the second driving shaft 90 is spaced apart from the outside of the wafer W. The first holder The reference numeral 82 rotates at high speed to dry the wafer W using centrifugal force.

Thereafter, when the driving of the first holder 82 is stopped, the first holder 82 moves up and down to take over the wafer W to the second holder 88 again, and then the chuck assembly 84 is driven. Unloading completes the cleaning operation.

According to the present invention having such a configuration, the back and front surfaces of the wafer are simultaneously cleaned to clean the process, thereby preventing process defects, thereby increasing the manufacturing yield of the semiconductor device.

Although the present invention has been described in detail only with respect to the described embodiments, it will be apparent to those skilled in the art that various modifications and variations are possible within the technical scope of the present invention, and such modifications and modifications are within the scope of the appended claims.

Claims (23)

A first holder rotatably mounted on the chuck assembly, the first holder configured to suck and fix the rear surface of the wafer; A first drive shaft rotatably penetrating and installed in the first holder and provided with a brush at an end thereof; At least one second holder extending on the chuck assembly and installed to absorb and fix a rear surface of the wafer; And A second drive shaft penetrating and installed in the second holder and provided with a brush at an end thereof; Back cleaning device for a semiconductor wafer, characterized in that comprises a. The method of claim 1, And the first holder is installed at a central portion of the chuck assembly to suck and fix the central portion of the rear surface of the wafer. The method of claim 1, And a plurality of the second holders are installed side by side with the first holder to adsorb and fix the back side of the wafer. The method of claim 3, wherein Back cleaning apparatus of the semiconductor wafer, characterized in that two second holder is installed. The method of claim 4, wherein And the second holder is disposed on both sides of the first holder in a line with respect to the radial direction of the wafer. The method of claim 1, And the first holder and the second holder alternately suck and fix the rear surface of the wafer. The method of claim 6, And a cleaning liquid supply nozzle for selectively supplying a cleaning liquid to a rear surface of the wafer selectively fixed to the first holder and the second holder. The method of claim 7, wherein And the cleaning liquid is pure water. The method of claim 1, And the first driving shaft is installed to be rotatable, lowered, and rotatable. The method of claim 1, And the second driving shaft is installed to be rotatable, lowered and rotatable. The method according to claim 9 or 10, The lower portion of the brush is a rear cleaning device of the semiconductor wafer, characterized in that located close to the back of the wafer at a predetermined interval. The method of claim 1, And the first holder has a tubular shape in which a lower end portion has a larger diameter. The method of claim 12, And an outer portion of the brush installed on the first drive shaft and the first drive shaft is formed to form a gap at a predetermined interval so as to facilitate the transfer of vacuum pressure between the inner wall of the first holder. The method of claim 1, And a vacuum hole is formed at an end of the first holder. A first holder rotatably mounted on the chuck assembly, the first holder configured to selectively suck and fix the rear surface of the wafer; A first drive shaft rotatably penetrating and installed in the first holder and provided with a brush at an end thereof; A plurality of second holders extending on the chuck assembly and installed to selectively suck and fix the wafer back side; And A second drive shaft provided with a brush at an end thereof, the horizontal reciprocating motion being installed in the center direction of the wafer positioned by the first holder on the side wall; Back cleaning device for a semiconductor wafer, characterized in that consisting of a configuration. A first holder for selectively sucking and fixing a rear surface of the wafer that is rotatably mounted, lowered and rotated on the chuck assembly; A first drive shaft rotatably penetrating and installed in the first holder and provided with a brush at an end thereof; A plurality of second holders extending on the chuck assembly and installed to selectively suck and fix the side of the wafer back surface; A second drive shaft penetrating and installed in the second holder and provided with a brush at an end thereof; A third drive shaft installed at a lower side of the wafer that is attracted and positioned by the first holder to enable a rotational movement and a horizontal movement, and a brush installed at an end thereof; Cleaning liquid supply nozzles provided on the upper and lower sides of the wafer positioned by the first holder to supply the cleaning liquid onto the wafer; Semiconductor wafer cleaning apparatus, characterized in that consisting of a configuration including. A first holder for selectively sucking and fixing a rear surface of the wafer that is rotatably mounted, lowered and rotated on the chuck assembly; A first drive shaft rotatably penetrating and installed in the first holder and provided with a brush at an end thereof; A plurality of second holders extending on the chuck assembly and installed to selectively suck and fix the wafer back side; A second drive shaft provided with a brush at an end thereof and capable of horizontal reciprocating movement to a predetermined position in a center direction of the wafer positioned at a predetermined sidewall; A third drive shaft installed at a lower portion of the wafer positioned by the first holder to enable horizontal movement and having a brush installed at an end thereof; And Cleaning liquid supply nozzles provided on the upper and lower sides of the wafer positioned by the first holder to supply the cleaning liquid; Semiconductor wafer cleaning apparatus, characterized in that consisting of a configuration including. A first holder for adsorbing the center portion of the wafer is provided, a first drive shaft provided with a brush is installed at the end of the wafer, and a plurality of second holders for adsorbing the wafer side are provided. Penetrating and installing a second drive shaft with a second holder attached thereto, and allowing the second holder to suck the rear surface of the wafer to be introduced, inverting the second driving shaft into the cleaning liquid contained in the container; Rotating the first drive shaft at a high speed to brush a wafer back center portion; Removing the wafer from the cleaning liquid by a lifting motion of the chuck assembly and drying the wafer for a predetermined time; Lowering the first holder to take over the wafer from the second holder to immerse the wafer in a cleaning liquid; Brushing the brush installed at the end of the second drive shaft in proximity to the rear surface of the wafer and rotating at a high speed through the first holder; And Removing the wafer from the cleaning liquid by a lifting motion and a high speed rotation of the first holder and drying the wafer; Semiconductor wafer cleaning method characterized in that it comprises a. A first holder for adsorbing the center portion of the wafer is provided, a first drive shaft provided with a brush is installed at the end of the wafer, and a plurality of second holders for adsorbing the wafer side are provided. A cleaning liquid supply nozzle which penetrates and installs a second drive shaft provided with a second driving shaft to the second holder, and supplies a cleaning liquid to the wafer positioned by the first holder, and is attached to the second holder. Supplying a cleaning liquid to a bottom surface and simultaneously rotating the first drive shaft to brush a central portion of the wafer; Stopping the supply of the cleaning liquid to dry the wafer; Lowering the first holder to take over the wafer from the second holder, placing a brush installed at an end of the second driving shaft close to a rear surface of the wafer, and supplying a cleaning liquid; Rotating the wafer through the first holder at a high speed to brush the edge of the wafer; And Stopping the supply of the cleaning liquid and drying the wafer at a high speed through the first holder; Semiconductor wafer cleaning method characterized in that it comprises a. A first holder for adsorbing the center portion of the wafer is provided, a first drive shaft provided with a brush is installed at the end of the wafer, and a plurality of second holders for adsorbing the wafer side are provided. The second drive shaft with the piercer installed in the second holder, a cleaning liquid supply nozzle for supplying the cleaning liquid on the wafer positioned by the first holder, and a lower side of the wafer positioned by the first holder. Brushing a center portion of the wafer by installing a third drive shaft having a brush installed thereon, supplying a cleaning liquid to a bottom surface of the wafer which is attached to the second holder and rotating the first drive shaft; Stopping the supply of the cleaning liquid to dry the wafer; Lowering the first holder to take over the wafer from the second holder and positioning the front of the wafer proximate to an upper portion of the brush provided at the end of the third drive shaft; Lowering the second drive shaft so that a brush installed at an end thereof is positioned close to a rear surface of the wafer, and then supplying a cleaning liquid; Rotating the wafer at a high speed through the first holder to brush edge portions of the front and rear surfaces of the wafer; And Stopping the supply of the cleaning liquid and drying the wafer at a high speed through the first holder; Semiconductor wafer cleaning method characterized in that it comprises a. A first holder for adsorbing the center portion of the wafer is provided, a first drive shaft provided with a brush penetrates and is installed in the first holder, and a plurality of second holders for adsorbing the side of the wafer are provided. A second drive shaft provided with a brush at an end thereof so as to horizontally reciprocate to a predetermined position in a direction of the center of the wafer positioned by the first holder to allow the second holder to adsorb the rear surface of the wafer to be introduced; Inverting and injecting the cleaning liquid contained in the container; Rotating the first drive shaft at a high speed to brush a wafer back center portion; Removing the wafer from the cleaning liquid by a lifting motion of the chuck assembly and drying the wafer for a predetermined time; Lowering the first holder to take over the wafer from the second holder to immerse the wafer in a cleaning liquid; Brushing the brush installed at the end of the second drive shaft in proximity to the rear surface of the wafer and rotating at a high speed through the first holder; And Removing the wafer from the cleaning liquid by a lifting motion and a high speed rotation of the first holder and drying the wafer; Semiconductor wafer cleaning method characterized in that it comprises a. A first holder for adsorbing the center portion of the wafer is provided, a first drive shaft provided with a brush penetrates and is installed in the first holder, and a plurality of second holders for adsorbing the side of the wafer are provided. A second drive shaft provided with a brush at an end thereof so as to allow horizontal reciprocating movement to a predetermined position in a center direction of the wafer positioned by the first holder, and supply a cleaning liquid to an upper side of the wafer positioned by the first holder. Installing a nozzle, supplying a cleaning liquid to a bottom surface of the wafer which is adsorbed by the second holder, and rotating the first drive shaft to brush the central portion of the wafer; Stopping the supply of the cleaning liquid to dry the wafer; Lowering the first holder to take over the wafer from the second holder, placing a brush installed at an end of the second driving shaft close to a rear edge of the wafer, and supplying a cleaning liquid; Rotating the wafer through the first holder at a high speed to brush the edge of the wafer; And Stopping the supply of the cleaning liquid and drying the wafer at a high speed through the first holder; Semiconductor wafer cleaning method characterized in that it comprises a. A first holder for adsorbing the center portion of the wafer is provided, a first drive shaft provided with a brush penetrates and is installed in the first holder, and a plurality of second holders for adsorbing the side of the wafer are provided. A second drive shaft provided with a brush at an end thereof so as to allow horizontal reciprocating motion to a predetermined position in a center direction of the wafer positioned by the first holder, and supply a cleaning liquid onto the wafer positioned by the first holder. A cleaning liquid supply nozzle is provided, and a third drive shaft provided with a brush is provided below the wafer positioned by the first holder, and the cleaning liquid is supplied to the bottom surface of the wafer which is adsorbed and positioned on the second holder. Center portion of the wafer by rotating the first drive shaft A step of brushing; Stopping the supply of the cleaning liquid to dry the wafer; Lowering the first holder to take over the wafer from the second holder and positioning the front surface of the wafer so as to be close to an upper portion of the brush installed at the end of the third drive shaft; Supplying a cleaning liquid from above and below the wafer by horizontally moving the brush installed at the end of the second drive shaft near the rear edge of the wafer; Rotating the wafer at a high speed through the first holder to brush edge portions of the front and rear surfaces of the wafer; And Stopping the supply of the cleaning liquid and drying the wafer at a high speed through the first holder; Semiconductor wafer cleaning method characterized in that it comprises a.