KR19990008927A - Smart card - Google Patents

Abstract

Initiate a smart card. According to the present invention, a substrate member having a predetermined circuit pattern, a plurality of through-holes filled with a conductor and seated in a seating portion formed by cutting the substrate member, a chip base member having a predetermined circuit pattern, and a front surface of the chip base member An integrated circuit chip mounted on the chip and having a portion of the electrodes wire-bonded with a conductor filled in the through hole, and an external contact electrode member disposed on a rear surface of the chip base member to electrically connect with a conductor charged in the through hole. A smart card is provided. Since the electrical connection between the integrated circuit chip mounted on the front of the substrate and the external contact electrode to be exposed through the back panel is easily made, there is an advantage that can simplify the production of smart cards.

Description

Smart card

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a smart card, and more particularly, to a smart card with improved connection between electrodes of an integrated circuit chip and external contact electrodes.

Generally, a smart card refers to a card having an integrated circuit chip, and may be used as an electronic ID, a license, an electronic money, a credit card, and the like by inputting various information into the integrated circuit chip. For example, it can be used as an electronic identification card by entering personal information such as an address, name, social security number, driver's license number, medical insurance number, etc. into an integrated circuit chip. In another example, by depositing in a bank, information corresponding to the corresponding amount may be input to a chip, and used as an electronic money that enables payment by inquiring and subtracting the deposit information instead of cash at a trading store.

FIG. 1 is a schematic perspective view of a circuit board of a general smart card, and FIG. 2 is an overall exploded perspective view of the smart card.

Referring to FIG. 1, the smart card controls the overall operation of the smart card on the substrate 11 and at the same time, the integrated circuit chip 12 storing necessary information, and a display 13 displaying the information in text or image. ), A solar cell 14 for generating power required for a smart card, and a circuit pattern portion 15 for forming an electrical connection between the integrated circuit chip 12, the display 13, and the solar cell. . The keyboard 17 is provided on the circuit pattern unit 15, and the keyboard 17 has a control and information input / output function for the smart card. It is preferable that the substrate 11 is usually in the form of a film made of a synthetic resin material, and the display portion 13 usually uses a liquid crystal display device. The integrated circuit chip 12 may be installed on the film substrate 11 while being mounted on the chip base 16. Although not shown in the drawing, an external contact electrode is provided on the rear surface of the substrate 11. The external contact electrode has a function of a connection that can perform input or output of information on the integrated circuit chip 12 of the smart card. For example, when a smart card is used as electronic money, the amount information corresponding to the cash amount can be input from the bank through the external contact electrode, and the amount information corresponding to the payment amount is deducted from the transaction store.

Referring to FIG. 2, the front panel 21 is installed on the front surface of the substrate 11 described with reference to FIG. 1, and the rear panel 26 is installed on the rear surface of the substrate 11. The front panel 21 is provided with a display unit 23 provided on the substrate 11 and a display unit window 23 and a solar cell window 24 so that the solar cell 14 can be exposed to the outside. In addition, the keyboard window 25 is formed to expose the keyboard 17 to the outside. On the other hand, the rear panel 26 is formed with an external contact electrode window 27 for exposing the external contact electrode provided on the rear surface of the substrate 11 to the outside.

In the smart card having the structure as described above, conventionally, the electrical connection between the integrated circuit chip 12 and the external contact electrode is made through complicated wiring. This is because the integrated circuit chip 12 is installed on the front side of the substrate, while the external contact electrodes are installed on the back side of the substrate, and therefore, to interconnect them, electrical wiring between the front and back sides of the substrate is conducted using conductive means such as electrical wires. Had to form. The connection using electric wires makes the production of smart cards complicated and there is a problem of increasing the thickness thereof.

The present invention has been made to solve the above problems, an object of the present invention is to provide a smart card with improved electrical connection of the integrated circuit chip and the external contact electrode.

Another object of the present invention is to provide a smart card in which electrical connection to an external contact electrode is made through a conductor filling hole formed in an integrated circuit chip base.

Another object of the present invention is to provide a smart card in which electrical connection is made to an external contact electrode through a circuit pattern formed on a substrate.

1 is a schematic perspective view showing a substrate of a typical smart card and components mounted thereon;

2 is a schematic exploded perspective view of a typical smart card.

3 is an exploded perspective view of a portion of a smart card according to an embodiment of the present invention.

4 is a schematic cross-sectional view of a portion of a smart card according to one embodiment shown in FIG.

5 is an exploded perspective view of a portion of a smart card according to another embodiment of the present invention.

FIG. 6 is a partially enlarged perspective view of a portion of the smart card shown in FIG. 5. FIG.

Brief description of the main parts of the drawing

11. Film substrate 12. Integrated circuit chip

13. Display 14. Solar cell

15. Circuit pattern section 16. Chip base

21. Front panel 26. Back panel

31. Substrate 32. Integrated Circuit Chip

35. Conductor filling hole 37. External contact electrode

38. Contact terminal 51. Board

52. Integrated circuit chip 53. Chip base

58. Terminal 60. Protective cover

In order to achieve the above object, according to the present invention, a substrate member having a predetermined circuit pattern, a plurality of through holes filled with a conductor and seated in a seating portion formed by cutting the substrate member and a chip base member having a predetermined circuit pattern An integrated circuit chip mounted on a front surface of the chip base member, wherein some of the electrodes are wire-bonded with a conductor filled in the through hole, and a rear surface of the chip base member to electrically connect with a conductor charged in the through hole. A smart card is provided that includes an external contact electrode member installed on the.

According to another feature of the present invention, a rear panel having a cutout portion is attached to a rear surface of the substrate member to expose the external contact electrode member to the outside.

According to another feature of the invention, one side of the substrate member is further provided with a solar cell for generating a drive power of the integrated circuit chip, a liquid crystal display element, a keyboard for controlling and input and output to the integrated circuit chip do.

The keyboard may also be integrated with the front panel in other embodiments, which is known in the art of conventional key button manufacturing.

According to another feature of the invention, the chip base member is fixed to the substrate member by inserting the connecting fine wire or the adhesive to the side of the chip base member and the seating portion side of the substrate member, respectively.

According to the present invention, there is also provided a substrate member having a predetermined circuit pattern, a chip base member having a predetermined circuit pattern seated on a chip base seating portion formed by cutting the substrate member and electrically connected to the circuit pattern of the substrate member; An integrated circuit chip mounted on the chip base member and having an electrode wire-bonded with respect to the circuit pattern of the chip base member, and seated on an external contact electrode seating portion formed by cutting the substrate member and electrically connected to the circuit pattern of the substrate member, respectively. A smart card is provided comprising an external contact electrode having a terminal to which it is connected.

According to another feature of the invention, between the circuit pattern of the chip base and the circuit pattern of the substrate member, and between the terminal of the external contact electrode and the circuit pattern of the substrate member are soldered by wire.

According to another feature of the present invention, there is further provided a protective cover member attached to the rear surface of the chip base member, and a rear panel member formed with a cutout to correspond to the application position and area of the protective cover member.

According to another feature of the invention, the wire connection portion between the terminal of the external contact electrode and the pattern of the substrate member, or the wire connection portion between the circuit pattern of the chip base member and the circuit pattern of the substrate member is molded with synthetic resin. do.

According to another feature of the invention, the wire connection portion to the terminal of the external contact electrode, or the wire connection portion between the circuit pattern of the chip base member and the circuit pattern of the substrate member is covered with a protective film.

Hereinafter, the present invention will be described in more detail with reference to the embodiments shown in the accompanying drawings.

FIG. 3 is a schematic partial exploded perspective view of an embodiment of a smart card according to the present invention, and FIG. 4 is a cross-sectional view of a chip base and a film substrate on which an integrated circuit chip is mounted.

Referring to the drawings, a chip base mounting portion 31a on which the chip base 33 on which the integrated circuit chip 32 is mounted is mounted is formed on the substrate 31. The chip base mounting portion 31a is formed by cutting the substrate 31, which is typically a film, to a predetermined size, and the chip base 33 may be fixed to the chip base mounting portion 31a through various means. In the exemplary embodiment shown in the drawing, the connecting fine wire 34 may be fixed by being inserted into the side of the chip base 33 and the side of the chip base seating portion 31a, respectively. In another embodiment, the size of the seating portion 31a may be cut to match the size of the chip base 33 and fixed using an adhesive.

The chip 32 is mounted on the upper surface of the chip base 33. A predetermined circuit pattern is formed on the chip base 33, and the electrode terminals of the chip 32 mounted on the upper surface of the chip base 33 and the circuit patterns of the chip base 33 are mutually connected by a wire bonding operation. Electrically connected. Here, some of the electrode terminals of the chip 32 must be electrically connected to the terminals of the external contact electrode 37. In the embodiment shown in the figure, the external contact electrode 37 has eight electrode terminals 38 on the rear facing side of the chip base 33. Although not shown in the drawings, the other surface of the external contact electrode 37 has electrode terminals corresponding to the electrode terminals 38.

According to a feature of the invention, the chip base 33 is formed with a filling hole for filling the conductor electrically connected to the terminal of the external contact electrode 37, the terminals 38 of the external contact electrode 37 are the filling hole It is connected to the conductor filling the. In more detail, the chip base 33 has eight filling holes 35 penetrating through the thickness thereof, and the filling holes 35 are filled with a conductor. The conductors filled in the electrodes of the integrated circuit chip 32 and the filling holes 35 are connected by wire bonding.

Since the spacing and position between the filling holes 35 formed in the chip base 33 coincide with the spacing and position of the contact terminal 38 formed in the outer contact electrode 37, the outer contact electrode 37 is a chip. When disposed on the rear surface of the base 33, the conductors filled in the filling hole 35 and the respective terminals 38 of the external contact electrodes 37 may contact each other, thereby making electrical connections. That is, since the external contact electrode 38 is disposed on the rear surface of the chip base 33, electrical connection between both sides can be made without using a separate wiring or circuit pattern.

5 and 6 are partially exploded perspective views of a smart card according to another embodiment of the present invention.

Referring to the drawings, the chip base 53 on which the integrated circuit chip 52 is mounted is provided on the chip base seating portion 51a formed on the film substrate 51, and the external contact electrode 57 is also the film substrate 51. It is provided in the external contact electrode seating portion (51b) formed in. The chip base mounting portion 51a and the external electrode mounting portion 51b are formed by cutting the substrate 51 in consideration of the size of the chip base 53 and the size of the external contact electrode 57, respectively. As described above, the chip base 53 and the external contact electrode are connected to the substrate 51 using an adhesive or a connecting wire.

The connection of the electrodes of the integrated circuit chip 52 to the external contact electrodes 57 is made by wire bonding and the circuit pattern formed on the substrate 59. In more detail, the integrated circuit chip 52 is wire-bonded with respect to the circuit pattern of the chip base 53, and the circuit pattern of the chip base 53 is used for a predetermined connection with the circuit pattern on the film substrate 51. Connected to the member. Since the circuit pattern of the chip base 53 and the circuit pattern 59 on the film substrate 51 are in the same plane, they can be easily connected as a conventional connecting member, for example, a general conductive wire can be connected by soldering welding. will be. Next, the circuit pattern 59 on the film substrate 51 and the terminal on the external contact electrode 57 can also connect a commonly used conductive wire by soldering welding.

The protective cover 60 is attached to the rear surface of the chip base 53. The protective cover 60 has a function of preventing external force applied to the integrated circuit chip 52 through the chip base 53 and firmly supporting the chip base 53 on the film substrate 51. The protective cover 60 may be formed of, for example, a thin steel sheet, and the thickness thereof may be formed to correspond to the thickness of the rear panel 26 (FIG. 2). Here, an incision must be formed in the size of the rear panel 26 corresponding to the area of the protective cover 60 so that the outer surface of the rear panel 26 and the outer surface of the protective cover 60 are in the same plane.

6 is a schematic enlarged perspective view showing that the circuit pattern on the substrate and the terminals of the external contact electrode are interconnected.

Referring to the drawings, circuit patterns 59 are formed on the substrate 51, and the external contact electrode 57 is seated on a mounting portion formed on the substrate 51. The terminals 58 of the external contact electrode 57 and the terminals of the circuit patterns 59 are connected by a wire 63 to thereby make an electrical connection.

Optionally, a synthetic resin molding may be used to ensure the tightness of the connection between both ends of the connecting wire 63 and the terminals. That is, the rigidity of a connection is improved by apply | coating a synthetic resin material, such as an epoxy resin, to the part which the terminal part of the connection wire 63 and the terminal contacted. In addition, as indicated by the imaginary line indicated by the reference numeral 61, by attaching the protective film 61 so as to cover the connecting portion of the external contact electrode 57 and the substrate 51, the firmness of the connecting portion may be improved. Although not shown in the drawings, the application of the synthetic resin molding and protective film may be applied to the wire connection portion for the circuit pattern of the chip base 53 and the circuit pattern of the substrate 51.

According to the present invention, a smart card in which an integrated circuit chip and an external contact electrode are interconnected makes it easy to make an electrical connection between an integrated circuit chip mounted on the front of the substrate and an external contact electrode to be exposed through the rear panel. There is an advantage to simplify the production of. In addition, the external force applied to the integrated circuit chip from the outside of the rear panel can be blocked by an external contact electrode or a protective cover, and has the advantage of reducing the thickness of the substrate by minimizing complicated wire wiring.

Although the present invention has been described with reference to one embodiment shown in the accompanying drawings, this is only an example, and those skilled in the art may understand that various modifications and equivalent other embodiments are possible therefrom. There will be. Therefore, the true scope of protection of the present invention should be defined only by the appended claims.

Claims (9)

A substrate member having a predetermined circuit pattern formed thereon, A chip base member seated on a seating portion formed by cutting the substrate member and having a plurality of through holes filled with a conductor and a predetermined circuit pattern; An integrated circuit chip mounted on a front surface of the chip base member, wherein some of the electrodes are wire-bonded with a conductor filled in the through hole, And an external contact electrode member provided on the rear surface of the chip base member so as to electrically connect with a conductor filled in the through hole. The smart card according to claim 1, wherein a rear panel having a cutout portion is attached to a rear surface of the substrate member to expose the external contact electrode member to the outside. The semiconductor device of claim 1, further comprising a solar cell configured to generate driving power of the integrated circuit chip, a liquid crystal display, and a keyboard to control and input and output the integrated circuit chip. Featured smart card. The smart chip according to claim 1, wherein the chip base member is fixed by inserting connection wires or adding an adhesive to the side of the chip base member and the seating portion of the substrate member with respect to the substrate member, respectively. Card. A substrate member having a predetermined circuit pattern formed thereon, A chip base member seated on the chip base seating portion formed by cutting the substrate member, the chip base member having a predetermined circuit pattern electrically connected to the circuit pattern of the substrate member; An integrated circuit chip mounted on the chip base member and having an electrode wire bonded to a circuit pattern of the chip base member; And an external contact electrode seated on the external contact electrode seating portion formed by cutting the substrate member, the external contact electrode having terminals electrically connected to circuit patterns of the substrate member. 6. The smart card according to claim 5, wherein the circuit pattern of the chip base and the circuit pattern of the substrate member and the terminal of the external contact electrode and the circuit pattern of the substrate member are soldered and connected by wire. The method of claim 5, A protective cover member attached to a rear surface of the chip base member; Smart card, characterized in that it further comprises a back panel member formed with a cutout to correspond to the application position and area of the protective cover member. The wire connecting portion between the terminal of the external contact electrode and the pattern of the substrate member, or the wire connecting portion between the circuit pattern of the chip base member and the circuit pattern of the substrate member is molded with a synthetic resin. Featured smart card. The smart card according to claim 6, wherein the wire connection portion to the terminal of the external contact electrode or the wire connection portion between the circuit pattern of the chip base member and the circuit pattern of the substrate member is covered with a protective film.