KR19980059240A - Testing device - Google Patents

Abstract

The present invention relates to a test device having a test socket for mounting a semiconductor chip or a semiconductor package and a test board for mounting the test socket for testing a semiconductor chip or a semiconductor package on which the semiconductor chip is mounted.

Are connected to the first wirings 17 and the respective first wirings 17 for applying an electrical signal to the bonding pads of the semiconductor chip 11 or the external teeth of the package 11 on which the semiconductor chip is mounted. Test sockets 10 formed of through holes 18 having second through holes 18 and second wires for applying an electrical signal, and a contact pin 19 is inserted into the through hole 18 so that each of the second wires and the first wires The test board 20 is configured to electrically connect the wires 17 to supply electrical signals to the first wires 17 of the plurality of test sockets 10.

Therefore, when the test socket is mounted on the test board, electrical contact between the test socket and the test board can be prevented, and the contact pins do not need to be soldered individually, so it can be easily tested in the reliability test.

Description

Testing device

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a test apparatus, and more particularly, to a test apparatus including a test socket on which a semiconductor chip or a semiconductor package is mounted and a test board on which the test socket is mounted, for testing a semiconductor chip or a semiconductor package on which the semiconductor chip is mounted. will be.

After fabrication of semiconductor chip is completed, various tests such as electrical test or burn-in test are conducted to check the reliability of the product.

The electrical test connects the I / O terminals of the bonding pads on the upper surface of the semiconductor chip with the test signal generation circuit to test whether the semiconductor chip operates normally and is disconnected.Burn IN test connects the input / output terminals with the test signal generation circuit. By connecting high temperature, high voltage, and high current than normal operating conditions, it tests the life and defect of semiconductor chip.

In order to perform the reliability test, which is an electrical test and a burn-in test, a socket for mounting a semiconductor chip or a semiconductor package and a test board for mounting the sockets are required.

1 is a configuration diagram of a conventional test socket and FIG. 2 is a configuration diagram of a test apparatus in which the test sockets of FIG. 1 are mounted on a test board.

The conventional test socket 1 of FIG. 1 includes a first body 3 on which a semiconductor chip or a package 2 is mounted, bonding pads of the semiconductor chip 2, or an exterior of the semiconductor package 2. A second body having an electrical signal connection passage 4 and contact pins 6 for supplying an electrical signal to the plurality of pins as leads and electrically connecting the contact pins 6 and the electrical signal connection passage 4 to each other; It consists of (5).

The test apparatus of FIG. 2 consists of a test board 7 having a plurality of test sockets 1 and printed circuits of wirings for applying electrical signals to pads of a semiconductor chip or external leads of a semiconductor package. . Contact pins 6 of each test socket 1 are connected to the test board 7 by soldering.

In recent years, as semiconductor chips become more and more dense, the size of the chip is gradually increasing. However, as the package volume is gradually reduced for high-density packaging, the test socket must also be smaller as the size of the package becomes smaller.

In a conventional test socket, when a small package is mounted or a semiconductor chip is mounted to test a semiconductor chip, a small test socket should be used. Misalignment can result in poor electrical contact between the test socket and the test board.

In addition, the conventional test socket has a problem in that the contact pins must be soldered in order to mount the test socket on the test board.

An object of the present invention is to prevent the electrical contact between the test socket and the test board when the small test socket is mounted on the test board even when using a small test socket, the test does not need to solder the contact pins individually It is to provide a test apparatus having a socket and a test board.

1 is a configuration diagram of a conventional test socket,

2 is a configuration diagram of a test apparatus in which test sockets of FIG. 1 are mounted on a test board;

3 is a configuration diagram of a test socket of the present invention;

4 is a plan view of a test socket of the present invention;

5 is a configuration diagram of a test apparatus in which test sockets of FIG. 3 are mounted on a test board.

In order to achieve the above objects, the test apparatus of the present invention is connected to first wirings and respective first wirings for applying an electrical signal to bonding pads of a semiconductor chip or external ribs of a package in which the semiconductor chip is mounted. Test sockets formed of through holes and second wires for applying an electrical signal, and contact pins are inserted into the through holes to electrically connect the respective second wires to the respective first wires. And a test board for connecting an electrical signal to the first wires of the plurality of test sockets.

In addition, the test socket is an electrical signal connection path for supplying electrical signals to a plurality of pins, which are a first body on which a semiconductor chip or a package on which a semiconductor chip is mounted, bonding pads of a semiconductor chip, or external leads of a semiconductor package, and an electrical signal. A socket board comprising first wirings for supplying an electrical signal to the connecting passage and through holes connected to the respective first wirings, and a second body electrically connecting the electrical signal connecting passage to the socket board. It is characterized by one.

Hereinafter, a test apparatus of the present invention will be described in detail with reference to the accompanying drawings.

3 is a configuration diagram of the test socket of the present invention, FIG. 4 is a plan view of the test socket of the present invention, and FIG. 5 is a configuration diagram of a test apparatus mounted with the test sockets of FIG.

In the test apparatus of FIG. 5, the first wirings 17 and each of the first wirings 17 for applying an electrical signal to the bonding pads of the semiconductor chip 11 or the external ribs of the package 11 on which the semiconductor chip is mounted are provided. Test sockets 10 composed of through holes 18 connected to the first wirings 17 and second wirings for applying an electrical signal are inserted into the through holes 18. It consists of a test board 20 for electrically connecting the respective second wirings and the first wirings 17 to supply electrical signals to the first wirings 17 of the plurality of test sockets 10. .

The test socket 10 of FIGS. 3 and 4 has a bonding of the first body 13 and the semiconductor chip 11 having a region 12 on which the semiconductor chip 11 or the package 11 on which the semiconductor chip is mounted is mounted. Electrical signal connecting passage 14 for supplying electrical signals to the plurality of pins, which are pads or external leads of the semiconductor package 11, first wirings 17 for supplying electrical signals to the electrical signal connecting passage 14 ) And a second board for electrically connecting the socket board 16 and the electrical signal connecting passage 14 and the socket board 16, each having a through hole 18 connected to the first wirings 17. It is composed of a body (15).

When the electrical signal is applied to the second wires of the test board 20 and the contact pins 19 are inserted into the through holes 18 for the reliability test, the second wires and the upper surface of the socket board 16 are formed. The first wires 17 are electrically connected to each other. The electrical signal connection path 14 of the first wirings 17 and the test socket 10 may be a plurality of bonding pads of the semiconductor chip 11 in the first body 13 or external leads of the semiconductor package 11. Supply electrical signals to the pins.

Therefore, the test apparatus of the present invention inserts the contact pins 19 into the through holes 18 for the reliability test, so that an electrical signal applied to the test board 20 is applied to the bonding pads or the semiconductor package of the semiconductor chip 11. Since the external leads of (11) are supplied to the plurality of pins, when the test socket 10 is mounted on the test board 20, electrical contact failure between the test socket 10 and the test board 20 can be prevented. There is no need to solder contact pins individually.

The present invention can prevent electrical contact between the test socket and the test board when the test socket is mounted on the test board, and can be easily tested during the reliability test because there is no need to solder the contact pins.

Claims (2)

A test apparatus for testing the reliability of a semiconductor chip or a semiconductor package on which the semiconductor chip is mounted, the test apparatus comprising: an electrical signal for applying an electrical signal to bonding pads of the semiconductor chip or externals of the package on which the semiconductor chip is mounted; Test sockets having one wires and through holes connected to the respective first wires, and second wires for applying an electrical signal, and inserting contact pins into the through holes, And a test board electrically connecting interconnections and the respective first wirings to supply electrical signals to the first wirings of the plurality of test sockets. The test socket of claim 1, wherein the test socket includes a plurality of pins that are a first body for mounting the semiconductor chip or a package on which the semiconductor chip is mounted, bonding pads of the semiconductor chip, or external leads of the semiconductor package. Electrical signal connection path for supplying electrical signals, A socket board comprising first wirings for supplying an electrical signal to the electrical signal connecting passage and through holes connected to the respective first wirings, and electrically connecting the electrical signal connecting passage and the socket board. A test apparatus comprising a second body for connecting.