KR19980057601U - Fibdy Chamber Gas Supply Regulator of Sputtering Equipment - Google Patents

Abstract

The present invention relates to a fibdy chamber gas supply control device of the sputtering equipment, and to detect the leakage of each component installed on the gas line to control the supply of gas appropriately, so that the manual valve, flow meter, Vortex occurs due to internal and external leakage of the first air valve and the second air valve, and the sputtering process is performed while particles are placed on the upper surface of the wafer to prevent a decrease in yield. The inspection time to find is shortened, and even if the leakage is severe, the pressure is checked in advance so that the vacuum pump may not be damaged.

Description

Fibdy Chamber Gas Supply Regulator of Sputtering Equipment

The present invention relates to a fibdy chamber gas supply control device of the sputtering equipment, in particular, by supplying the reaction gas to the fibdy chamber in the state that the reaction gas inside and outside the air valve and flow meter is generated turbulence inside the fibdy chamber The present invention relates to a fibdy chamber gas supply control device of a sputtering apparatus suitable for preventing a phenomenon in which a deposition occurs in a state where particles are stacked on an upper surface of a wafer, thereby lowering a yield.

1 is a schematic diagram of a structure of a fibdy chamber gas supply apparatus of a conventional sputtering equipment. As shown in FIG. 1, a conventional fibdy chamber gas supply apparatus is stored in an external gas supply tank (not shown). The reactant gas is transferred along the gas line 1 to the fibdy chamber 2 where the sputtering reaction occurs.

On the gas line 1, several accessory devices are installed in order from a gas supply tank (not shown) to the fibdy chamber 2, and a regulator for controlling the main pressure of the reaction gas is provided. (Not shown) and the first air controlled by a manual valve (3) for preventing or not supplying the reactive gas to the sputtering equipment, a flow meter (4) for adjusting the flow rate of the gas, and air supplied along the air line (5) That is the valve 6 and the second air valve 7.

The solenoid valve 10 connected to the control unit 8 by the signal line 9 is installed on the air line 5. The solenoid valve 10 is connected to the first air valve 6 according to a control signal sent from the control unit 8. The second air valve 7 is operated.

One side of the fibdy chamber 2 is provided with a pressure sensor 11 for detecting a vacuum state in the chamber 2 and transmitting it to the control unit 8 along a signal line 9 '. At the outer side of 2), a transfer chamber 12 for placing the wafer to be transferred to the fibdy chamber 2 is provided.

The fibdy chamber 2 and the transfer chamber 12 are separated by a separation valve (not shown), and the pressure connected to the control unit 8 by a signal line 9 'on one side of the transfer chamber 12. The sensor 11 'is installed to inform the controller 8 of the pressure inside the transfer chamber 12.

Referring to the operation of the fibdy chamber gas supply apparatus of the conventional sputtering equipment having the structure as described above are as follows.

When the wafer (not shown) enters the fibdy chamber 2 through the transfer chamber 12, the separation valve (not shown) is closed to separate the transfer chamber 12 and the fibdy chamber 2.

In this state, the reactant gas is supplied to the fibdy chamber 2 through the gas line 1, and the reactant gas passes through a regulator (not shown) from an external gas supply tank (not shown). The flow rate is adjusted while passing through the flow meter 4 via the adjusted and open manual valve (3).

Meanwhile, the first air valve 6 and the second air valve 7 are opened by the air supplied by opening the solenoid valve 10 controlled by the controller 8 to supply the reaction gas to the fibdy chamber 2. Inflow).

When the pressure measured by the pressure sensor 11 installed on one side of the fibdy chamber 2 reaches a predetermined reference pressure during this process, the controller 8 sends a signal to the solenoid valve 10 to provide a first signal. The air valve 6 and the second air valve 7 are closed, and then the sputtering process is performed.

However, the fibdy chamber gas supply apparatus of the conventional sputtering equipment having the structure as described above has the following problems.

First, when the internal leakage of the flow meter 4 installed on the gas line 1 and the internal and external leakage of the first and second air valves 6 and 7 occur, gas is filled in the A and B portions. When the first and second air valves 6 and 7 are simultaneously opened to supply gas in the state, a sputtering process is performed while particles are placed on the upper surface of the wafer while the vortex is formed inside the FVD chamber 2. It was a cause for the yield to fall.

In addition, in order to find the leak point in the case of such a leak, a lot of time was required because the vacuum pump (not shown) had to be operated while opening the air valves 6 and 7 sequentially from the fibdy chamber 2 side. If the degree is severe, the vacuum pump (not shown) may be damaged during the inflow of the reaction gas, thereby degrading performance.

Therefore, the object of the present invention devised by recognizing the problems described above can solve the problems as described above by appropriately controlling the supply of gas by detecting the leakage of each component installed on the gas line. It is to provide a fibdy chamber gas supply control device of the sputtering equipment.

1 is a device diagram schematically showing the structure of a fibdy chamber gas supply apparatus of a conventional sputtering equipment.

Figure 2 is a schematic diagram showing the structure of the fibdi chamber gas supply apparatus of the sputtering equipment having a fibdy chamber gas supply control device of the sputtering equipment according to an embodiment of the present invention.

Explanation of symbols on the main parts of the drawings

1: gas line 1 ': branch gas line

2: 5D Chamber 3: Manual Valve

4: flow meter 5: air line

6: first air valve 7: second air valve

8, 8 ': control unit 9, 9': signal line

10: solenoid valve 11, 11 ': pressure sensor

12: transfer chamber 13: branch air valve

14 first pressure sensor 15 second pressure sensor

16: third pressure sensor

FIVD of sputtering equipment in which a manual valve, a flow meter, and a first air valve and a second air valve are installed on a gas line for supplying gas to a FIVDI chamber adjacent to a transfer chamber in order to achieve the object of the present invention as described above. In the chamber gas supply device, a branch gas line branched from the gas line and connected to the transfer chamber between the first air valve and the second air valve, and installed on the branch gas line and controlled by a controller. A branch air valve is installed between the manual valve and the flow meter on the gas line, between the flow meter and the first air valve, and between the branch point of the branch gas line and the second air valve. It characterized in that it comprises a first pressure sensor and a second pressure sensor and a third pressure sensor for sending a signal to the The blood beudi chamber gas supply control device of the putter ring device is provided.

Hereinafter, the present invention will be described in detail based on an embodiment of the present invention shown in the accompanying drawings.

FIG. 2 is an apparatus diagram schematically showing a structure of a fibdy chamber gas supply apparatus of a sputtering apparatus having a fibdy chamber gas supply control apparatus of a sputtering apparatus according to an embodiment of the present invention. A branch gas line 1 'branched from the gas line 1 between the first air valve 6 and the second air valve 7 is connected to the transfer chamber 12, and on the branch gas line 1'. A branch air valve 13 is installed to open and close the flow of gas through the branch gas line 1 '.

The branch air valve 13 is controlled by a solenoid valve 10 which is connected and controlled by a signal line 9 to the control unit 8 'like the first and second air valves 6 and 7.

A first pressure sensor 14 is installed between the manual valve 3 and the flow meter 4 and connected to the control unit 8 'by the signal line 9'. Similarly, the flow meter 4 and the The second pressure sensor 15 is located between the first air valve 6, and the third pressure sensor is located between the point where the branched gas line 13 on the gas line 1 branches and the second air valve 7. 16 is provided and connected to the control section 8 'by the signal line 9'.

Referring to the operation of the present invention has a structure as described above are as follows.

Conventionally, when gas is introduced into the gas line 1, the first air valve 6 and the second air valve 7 are opened at the same time. However, in the present invention, the manual valve 3 is opened in a gas inlet state. However, when the reaction gas in which the flow rate is controlled by the flow meter 4 is introduced, the first air valve 6 is first opened by the controller 8 'and the first, second, and third pressure sensors 14, 15, In case 16) sends the normal pressure value to the controller 8 ', the second air valve 7 is further opened.

If the pressure in the gas line 1 is normal, no leakage through each of the air valves 6 and 7 and the flow meter 4 and the manual valve 3 does not exist. It is not formed so that the yield decrease by the particles does not occur.

On the other hand, if there is a leak, the vacuum state of the C and D parts worsens, so that the pressure increases. As a result, when the measured value of the third pressure sensor 16 is greater than or equal to the reference value, the controller 8 'may control the second air valve ( 7) without opening the branch air valve 13 to open the gas flow to the transfer chamber 12 and to display it to the outside.

In this way, under the condition that turbulence occurs, the gas is not supplied into the FVD chamber 2 so that the yield is prevented from being lowered.

On the other hand, if there is a leak on the gas line (1) it is necessary to check to find the leak point, such a check process is carried out as follows.

First, the first air valve 6 and the second air valve 7 are different from the one in which the flowmeter 4 is completely opened with the manual valve 3 closed and the conventional air valves 6 and 7 are pumped by opening one by one. The pumps are sufficiently pumped by operating the vacuum pump (not shown) of the FIVE D chamber (2), and the set values of the flowmeter (4) are set to zero, and the first air valve (6) and the second air valve (7) are opened. ).

In this state, the leakage point can be easily known by the measured values of the first, second, and third pressure sensors 14, 15, and 16. When the value of the first pressure sensor 14 is high, a manual valve (3) It may be determined that the internal or external leakage or the external leakage state of the connection portion with the flow meter 4, and when the value of the second pressure sensor 15 is high, the internal or external leakage of the flow meter 4 or the first air valve ( 6) It can be judged as a leakage state inside and outside.

In addition, when the measured value of the third pressure sensor 16 is high, it may be determined that the first and second air valves 6 and 7 leak inside and outside.

At this time, in the case of measuring the first pressure sensor 14, it should be measured while the manual valve 3 is closed. The high and low values of the respective pressure sensors 14, 15, and 16 are measured by the transfer chamber 12 and the blood pressure. The determination is made by comparing the measured values of the pressure sensors 11 and 11 'of the CD chamber 2 with each other.

Vortex is generated by internal and external leakage of a manual valve, a flow meter, a first air valve, and a second air valve installed on a gas line by a fibdy chamber gas supply control device of the sputtering device of the present invention having the structure as described above. The sputtering process is performed in a state where particles are placed on the upper surface of the wafer, thereby preventing the yield from being lowered.

In addition, when there is such a leak, the inspection time is shortened because the air valves need to be opened and pumped only once, without the need to operate and pump the vacuum pump while sequentially opening the air valves on the fibdy chamber to find the leak point.

In addition, when the degree of leakage is severe, the pressure state is checked in advance so that the vacuum pump may not be damaged.

Claims (1)

A fibdy chamber gas supply apparatus for sputtering equipment, in which a manual valve, a flow meter, and a first air valve and a second air valve are installed on a gas line for supplying gas to a fibdy chamber adjacent to a transfer chamber, the first air valve and A branching gas line branched from the gas line and connected to the transfer chamber between the second air valves, a branch air valve installed on the branching gas line and controlled by a control unit; and a manual valve on the gas line; A first pressure sensor and a second pressure installed between the flowmeter and between the flowmeter and the first air valve, and between the branching gas line and the second air valve, respectively, to signal to the controller by a signal line. Fibdy chamber gas supply control device of the sputtering equipment comprising a sensor and a third pressure sensor