KR19980044189A - Semiconductor device manufacturing method - Google Patents
Semiconductor device manufacturing method Download PDFInfo
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- KR19980044189A KR19980044189A KR1019960062234A KR19960062234A KR19980044189A KR 19980044189 A KR19980044189 A KR 19980044189A KR 1019960062234 A KR1019960062234 A KR 1019960062234A KR 19960062234 A KR19960062234 A KR 19960062234A KR 19980044189 A KR19980044189 A KR 19980044189A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8232—Field-effect technology
- H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
- H01L21/823437—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type with a particular manufacturing method of the gate conductors, e.g. particular materials, shapes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8232—Field-effect technology
- H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
- H01L21/823418—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type with a particular manufacturing method of the source or drain structures, e.g. specific source or drain implants or silicided source or drain structures or raised source or drain structures
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8232—Field-effect technology
- H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
- H01L21/823468—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type with a particular manufacturing method of the gate sidewall spacers, e.g. double spacers, particular spacer material or shape
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Abstract
본 발명은 폴리메탈공정에 있어서 게이트측벽의 형상을 균일하게 하고 게이트금속의 산화를 방지하여 소자의 신뢰성을 향상시키는데 적당한 반도체소자 제조방법을 제공하기 위한 것이다.The present invention is to provide a method for manufacturing a semiconductor device suitable for improving the reliability of the device by uniformizing the shape of the gate side wall and preventing oxidation of the gate metal in the polymetal process.
이를 위한 본 발명의 반도체소자 제조방법은 기판상에 제1, 제2절연층을 형성하고 상기 기판의 표면이 소정부분 노출되도록 상기 제1, 제2절연층을 선택적으로 제거하여 함몰부를 형성하는 공정과, 상기 함몰부를 포함한 전면에 게이트 전극층, 게이트금속층을 차례로 형성하여 상기 함몰부를 매립하고 상기 매립된 함몰부의 단차가 상기 제2절연층보다 낮도록 상기 게이트금속층과 게이트전극층을 연마하는 공정과, 상기 게이트금속층을 포함한 전면에 산화방지층을 형성하여 상기 단차를 갖는 함몰부를 완전히 매립하는 공정과, 상기 매립된 함몰부 주변의 게이트전극층, 게이트금속층, 산화방지층을 제외한 제2, 제1절연층을 제거하여 게이트패턴을 형성하는 공정과, 상기 게이트패턴 양측의 기판내에 소오스/드레인 불순물영역을 형성하는 공정을 포함하여 이루어진다.The semiconductor device manufacturing method of the present invention for this purpose is to form a recess by forming the first and second insulating layer on the substrate and selectively removing the first and second insulating layer to expose a predetermined portion of the surface of the substrate. And forming a gate electrode layer and a gate metal layer on the entire surface including the recess in order to bury the recess, and to polish the gate metal layer and the gate electrode layer so that the level of the buried recess is lower than that of the second insulating layer. Forming an anti-oxidation layer on the entire surface including the gate metal layer to completely fill the recessed portions, and removing the second and first insulating layers except for the gate electrode layer, the gate metal layer, and the anti-oxidation layer around the buried recess. Forming a gate pattern, and forming a source / drain impurity region in the substrate on both sides of the gate pattern. Is done.
Description
본 발명은 반도체 집접회로에 관한 것으로서 특히, 반도체소자의 트랜지스터 제조방법에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to semiconductor integrated circuits, and more particularly, to a method for manufacturing a transistor of a semiconductor device.
일반적으로 반도체소자의 집적화 추세에 따라 게이트나 전도선과 같은 전기배선의 면적과 배선사이의 접촉면적이 감소하게 되고 확산층으로 이루어지는 접합깊이도 측면확산을 감소시키기 위하여 얇게 형성하지 않으면 안된다.In general, according to the trend of integration of semiconductor devices, the area of contact between the wiring and the area of electrical wiring such as gates and conductive lines is reduced, and the junction depth formed by the diffusion layer must be thinly formed to reduce side diffusion.
이렇게 되면 결과적으로 배선저항이 증가하며 확산층의 판저항(sheet resistance) 및 접속저항이 증가하므로 전기적신호의 전달시간이 지연된다.As a result, the wiring resistance is increased and the sheet resistance and the connection resistance of the diffusion layer are increased, thereby delaying the transmission time of the electrical signal.
따라서 이러한 시간지연 현상을 완화하기 위하여 트랜지스터의 소오스 및 드레인 확산영역과 게이트로 되는 실리콘패턴의 표면에 저 저항의 실리사이드층을 자기정합적으로 형성하는 기술이 살리사이드(salicide)기술로서 대표적인 기술로서는 Ti 살리사이드 기술이 제안되었다.Therefore, in order to alleviate this time delay phenomenon, a technique of forming a self-aligning silicide layer of low resistance on the surface of the source and drain diffusion regions of the transistor and the silicon pattern serving as a gate is a salicide technique. Salicide technology has been proposed.
즉, 실리콘기판위에 게이트절연막을 형성하고 게이트전극으로서 다결정 실리콘막을 증착하고 선택적으로 식각하여 게이트패턴을 형성한다.That is, a gate insulating film is formed on a silicon substrate, and a polycrystalline silicon film is deposited as a gate electrode and selectively etched to form a gate pattern.
이후, 절연막으로서 산화막을 증착하고 에치백하여 게이트패턴의 측벽에 사이드월 스페이서(sidewall spacer)를 형성한다.Thereafter, an oxide film is deposited and etched back as an insulating film to form sidewall spacers on sidewalls of the gate pattern.
한편 불순물이온을 게이트패턴 또는 게이트패턴과 사이드월 스페이서를 마그크층으로 이용하여 이온주입하고 열처리하므로서 소오스와 드레인영역을 형성한다.Meanwhile, source and drain regions are formed by ion implantation and heat treatment using impurity ions as a gate pattern or a gate pattern and a sidewall spacer as a mug layer.
전면에 Ti(티타늄) 등의 금속박막을 증착하고 700℃이하에서 질소 또는 불활성 분위기에서 열처리하여 소오스 및 드레인영역과 게이트패턴의 표면부에 선택적으로 반응을 일으키므로서 실리사이드층을 형성한다.A silicide layer is formed by depositing a metal thin film such as Ti (Ti) on the entire surface and heat-treating it under nitrogen or an inert atmosphere at 700 ° C. or lower to selectively react with the source and drain regions and the surface portion of the gate pattern.
여기서 열처리할 때 질소분위기를 이용하는 경우에는 실리사이드층의 표면이 부분적으로 질화막으로 변화하고 사이드월 스페이서 위의 금속막도 부분적으로 질화막으로 변화한다.In the case where the nitrogen atmosphere is used for the heat treatment, the surface of the silicide layer is partially changed to a nitride film, and the metal film on the sidewall spacer is also partially changed to a nitride film.
이후 질화막과 잔류된 Ti금속 박막등의 미반응 금속막을 NH4OH와 H2O2를 포함하는 용액을 사용하여 습식식각하므로서 선택적으로 제거한다.Thereafter, the unreacted metal film such as the nitride film and the remaining Ti metal thin film is selectively removed by wet etching using a solution containing NH 4 OH and H 2 O 2 .
따라서 실리사이드층만 선택적으로 잔류하게 되는데 여기에서는 비저항이 비교적 높은 C49 TiSi2상(Phase)이 형성되므로 비저항을 더욱 감소시키기 위하여 750∼850℃에서 별도의 열처리를 실시하므로서 C54 TiSi2상(Phase)으로 변화시킨다.Therefore, only the silicide layer remains selectively. In this case, C49 TiSi 2 phase (Phase) having a relatively high resistivity is formed, so that the C54 TiSi 2 phase (Phase) is further subjected to a separate heat treatment at 750 to 850 ° C. to further reduce the resistivity. Change.
그러나 이러한 살리사이드 공정을 적용하는데 있어서의 문제점은 다음과 같다.However, the problem in applying this salicide process is as follows.
첫째, 금속 실리사이드를 형성하고 미 반응된 금속 또는 금속 질화막을 선택적으로 제거할 때 과도식각을 하지 않으면 미 반응된 금속 또는 금속 질화막이 잔류하게 되므로 배선사이의 원하지 않는 합선(Short)이 발생된다.First, when the metal silicide is formed and the over-etching is not performed when the unreacted metal or metal nitride film is selectively removed, unreacted metal or metal nitride film is left, and thus an undesired short circuit between wires is generated.
과도식각을 적용하는 경우에는 금속 실리사이드와의 삭각 선택성의 확보가 요구된다.When the transient etching is applied, it is required to secure the selectivity of the cut with the metal silicide.
둘째, 미세화에 따라 Ti 또는 TiSi2의 응집반응이 일어나고 C54상으로서의 상전이(Phase transformation)반응이 억제되어 N형 게이트와 N형 확산층의 저항이 증가한다.Second, as a result of miniaturization, agglomeration of Ti or TiSi 2 occurs and phase transformation as a C54 phase is suppressed, thereby increasing resistance of the N-type gate and the N-type diffusion layer.
셋째, P형 확산층에서는 실리사이드 형성반응이 빠르므로 두껍게 형성되어 접합 누설전류(Junction leakage-current)가 증가한다.Third, since the silicide formation reaction is fast in the P-type diffusion layer, the junction leakage current is increased due to the thick formation.
넷째, 실리사이드를 형성하기 위한 첫번째 반응속도가 750℃이상으로 높은 경우에는 Si의 클라임-업(climb-up)현상이 일어나므로 저온과 고온의 2단계 열처리가 필요하다.Fourth, when the first reaction rate for forming the silicide is higher than 750 ° C., a climb-up phenomenon of Si occurs, and thus, two-step heat treatment of low temperature and high temperature is required.
이와같은 문제점을 해결하고 게이트저항을 더욱 낮추기 위하여 다결정실리콘 위에 텅스텐 및 비리어금속층을 적층하는 폴리메탈(Polt-metal)구조를 적용하기 위한 연구가 계속되고 있다.In order to solve such a problem and further lower the gate resistance, research into applying a poly-metal structure in which a tungsten and a vial metal layer are stacked on polycrystalline silicon is being continued.
상기 텅스텐은 비저항이 5.5μΩ/㎝의 약 두 배에 불과하며 녹는점이 3410℃이므로 고온공정에 대한 내열성이 우수한 것으로 평가된다.The tungsten has a specific resistance of only about 5.5 μΩ / cm and a melting point of 3410 ° C., which is evaluated to be excellent in heat resistance for high temperature processes.
이 경우에는 실리콘과 접촉되는 부분에서 실리사이드화 반응이 일어나서 텅스텐(W)이 텅스텐실리사이드(WSi2)로 변환하면 비저항이 증가하므로 이러한 반응을 억제하기 위하여 배리어 금속층이 필요하게 된다.In this case, a silicide reaction occurs in a portion in contact with silicon, and when the tungsten (W) is converted into tungsten silicide (WSi 2 ), a specific resistance increases, so that a barrier metal layer is required to suppress such a reaction.
이러한 배리어금속의 물질로서는 티타늄나이트라이드(TiN)와 같은 결정성물질이나 WNX와 같은 비정질물질을 적용한다.As the barrier metal material, a crystalline material such as titanium nitride (TiN) or an amorphous material such as WN X is used.
이와같은 텅스텐 폴리메탈을 적용한 반도체소자 제조방법을 첨부된 도면을 참조하여 설명하면 다음과 같다.Referring to the accompanying drawings, a method of manufacturing a semiconductor device to which such a tungsten polymetal is applied is as follows.
도 1a 내지 1h는 종래 반도체소자 제조방법을 나타낸 공정단면도이다.1A to 1H are cross-sectional views illustrating a conventional method for manufacturing a semiconductor device.
먼저, 도 1a에 도시한 바와같이 반도체기판(11)위에 필드영역과 활성영역을 정의하고 상기 필드영역의 반도체기판에 필드산화막(12)을 형성한다.First, as shown in FIG. 1A, a field region and an active region are defined on a semiconductor substrate 11, and a field oxide film 12 is formed on the semiconductor substrate of the field region.
그리고 상기 활성영역의 반도체기판(11)상에 게이트절연막(13)을 형성한다.A gate insulating film 13 is formed on the semiconductor substrate 11 in the active region.
도 1b에 도시한 바와같이 상기 필드산화막(12)을 포함한 반도체기판(11) 전면에 폴리실리콘층(14)을 형성한다.As shown in FIG. 1B, a polysilicon layer 14 is formed on the entire surface of the semiconductor substrate 11 including the field oxide film 12.
이어, 도 1c에 도시한 바와같이 상기 폴리실리콘층(14)상에 배리어금속층(15)을 형성하고 도 1d에 도시한 바와같이 상기 배리어금속층(15)상에 게이트금속층으로서 텅스텐막(16)을 형성한다.Subsequently, a barrier metal layer 15 is formed on the polysilicon layer 14 as shown in FIG. 1C, and a tungsten film 16 is formed as a gate metal layer on the barrier metal layer 15 as shown in FIG. 1D. Form.
이어 1e에 도시한 바와같이 상기 텅스텐막(16)상에 포토레지스트(도면에 도시하지 않음)를 도포한 후 노광 및 현상공정으로 상기 포토레지스트를 패터닝한다.Subsequently, as shown in 1e, a photoresist (not shown) is applied onto the tungsten film 16, and then the photoresist is patterned by an exposure and development process.
그리고 상기 패터닝된 포토레지스트를 마스크로 이용하여 그 하부의 텅스텐막(16), 배리어금속층(15) 그리고 폴리실리콘층(14)를 차례로 식각하여 게이트전극(100)을 형성한다.The tungsten layer 16, the barrier metal layer 15, and the polysilicon layer 14 are sequentially etched using the patterned photoresist as a mask to form the gate electrode 100.
이어, 도 1f에 도시한 바와같이 상기 게이트전극(100)을 마스크로 이용한 저농도의 불순물 이온주입을 실시하여 LDD영역(17)을 형성한다.Subsequently, as shown in FIG. 1F, a low concentration of impurity ions are implanted using the gate electrode 100 as a mask to form the LDD region 17.
이어 도 1g에 도시한 바와같이 상기 게이트전극(100)을 포함한 반도체기판(11) 전면에 실리콘질화막을 증착하고 이를 에치백하여 상기 게이트전극(100) 양측면에 게이트측벽(18)을 형성한다.Subsequently, as illustrated in FIG. 1G, a silicon nitride film is deposited on the entire surface of the semiconductor substrate 11 including the gate electrode 100 and etched back to form gate sidewalls 18 on both sides of the gate electrode 100.
그리고 상기 게이트전극(100)과 게이트측벽(18)을 마스크로 이용한 고농도의 소오스/드레인용 불순물 이온주입을 실시하여 상기 게이트전극(100)양측의 반도체기판(11)내에 소오스/드레인 불순물영역(20, 21)을 형성한다.A high concentration of source / drain impurity ions are implanted using the gate electrode 100 and the gate side wall 18 as a mask, so that source / drain impurity regions 20 are formed in the semiconductor substrate 11 on both sides of the gate electrode 100. , 21).
이어, 상기 소오스/드레인 불순물여역(20, 21)을 포함한 반도체기판(11)전면에 절연층(22)을 형성하고 상기 절연층(22)을 선택적으로 제거하여 접속홀을 형성한다.Subsequently, an insulating layer 22 is formed on the entire surface of the semiconductor substrate 11 including the source / drain impurity regions 20 and 21, and the insulating layer 22 is selectively removed to form a connection hole.
그리고 상기 접속홀을 포함한 전면에 전도층(23)을 형성한 후 배선을 패터닝하면 종래 반도체소자의 제조공정이 완료된다.After the conductive layer 23 is formed on the entire surface including the connection hole, the wiring is patterned to complete the manufacturing process of the conventional semiconductor device.
그러나 이와같은 종래의 반도체소자 제조방법은 다음과 같은 문제점이 있었다.However, such a conventional method of manufacturing a semiconductor device has the following problems.
첫째, 텅스텐박막, 배리어금속막, 폴리실리콘막을 차례로 식각하여 적층구조의 게이트전극을 형성하므로 측벽의 프로파일이 불균일하다. 따라서 함몰부분이나 계단부분이 나타나기 쉽다.First, since the tungsten thin film, the barrier metal film, and the polysilicon film are sequentially etched to form a gate electrode having a stacked structure, the profile of the sidewall is uneven. Therefore, depressions or stairs are likely to appear.
둘째, 열공정에서 텅스텐박막이 산화되면 표면이 거칠어지는 현상이 발생하므로 이를 방지하기 위하여 실리콘질화막을 이용하여 게이트측벽을 형성해야 한다. 그러므로 실리콘질화막이 실리콘기판에 직접 접촉되므로 후속 열공정에 의하여 기판에 스트레스를 야기시킨다.Second, the surface is roughened when the tungsten thin film is oxidized in the thermal process, so that the gate side wall must be formed by using the silicon nitride film. Therefore, since the silicon nitride film is in direct contact with the silicon substrate, it causes stress on the substrate by a subsequent thermal process.
본 발명은 상기의 목적을 달성하기 위해 안출한 것으로 폴리메탈공정에 있어서 게이트전극의 형상을 균일하게 가공하는 동시에 텅스텐층 등의 게이트금속층의 이상 산화를 방지하고 저 저항을 유지하며 게이트측벽으로서 실리콘산화막을 적용할 수 있도록 하므로서 공정의 신뢰성을 개선시키는데 적당한 반도체소자 제조방법을 제공하는데 그 목적이 있다.The present invention has been made to achieve the above object, and in the polymetal process, the shape of the gate electrode is uniformly processed while preventing abnormal oxidation of the gate metal layer such as tungsten layer, maintaining low resistance, and forming a silicon oxide film as the gate side wall. It is an object of the present invention to provide a method for manufacturing a semiconductor device suitable for improving the reliability of the process by being able to apply.
도 1a 내지 1h는 종래 반도체소자 제조방법을 나타낸 공정단면도1A through 1H are cross-sectional views illustrating a method of manufacturing a conventional semiconductor device.
도 2a 내지 2k는 본 발명의 반도체소자 제조방법을 나타낸 공정단면도2A through 2K are cross-sectional views illustrating a method of manufacturing a semiconductor device of the present invention.
*도면의 주요부분에 대한 부호의 설명** Description of the symbols for the main parts of the drawings *
21 : 실리콘기판22 : 필드산화막21 silicon substrate 22 field oxide film
23 : 제1절연층24 : 제2절연층23: first insulating layer 24: second insulating layer
25 : 제1함몰부26 : 게이트절연막25: first recessed portion 26: gate insulating film
27 : 게이트전극층28 : 게이트금속층27: gate electrode layer 28: gate metal layer
28a : 게이트패턴29 : 배리어금속층28a: gate pattern 29: barrier metal layer
30 : 산화방지층31 : LDD영역30: antioxidant layer 31: LDD region
32 : 제3절연층32a : 측벽절연막32: third insulating layer 32a: sidewall insulating film
33, 34 : 소오스/드레인35 : 제4절연층33, 34: source / drain 35: fourth insulating layer
336 : 전도선336: conducting wire
상기의 목적을 달성하기 위한 본 발명의 반도체소자 제조방법은 기판상에 제1, 제2 절연층을 형성하고 상기 기판의 표면이 소정부분 노출되도록 상기 제1, 제2절연층을 선택적으로 제거하여 함몰부를 형성하는 공정과, 상기 함몰부를 포함한 전면에 게이트전극층, 게이트금속층을 차례로 형성하여 상기 함몰부를 매립하고 상기 매립된 함몰부의 단차가 상기 제2절연층보다 낮도록 상기 게이트금속층과 게이트전극층을 연마하는 공정과, 상기 게이트금속층을 포함한 전면에 산화방지층을 형성하여 상기 단차를 갖는 함몰부를 완전히 매립하는 공정과, 상기 매립된 함몰부 주변의 게이트전극층, 게이트금속층, 산화방지층을 제외한 제2, 제1절연층을 제거하여 게이트패턴을 형성하는 공정과, 상기 게이트패턴 양측의 기판내에 소오스/드레인 불순물영역을 형성하는 공정을 포함하여 이루어진다.The semiconductor device manufacturing method of the present invention for achieving the above object is to form a first, a second insulating layer on a substrate and to selectively remove the first, second insulating layer to expose a predetermined portion of the surface of the substrate Forming a recess, and sequentially forming a gate electrode layer and a gate metal layer on the entire surface including the recess, and filling the recess and polishing the gate metal layer and the gate electrode layer so that the step difference between the recesses is lower than that of the second insulating layer. And a step of forming an anti-oxidation layer on the entire surface including the gate metal layer to completely fill the recess having the step, and the second and the first except the gate electrode layer, the gate metal layer, and the anti-oxidation layer around the embedded recess. Forming a gate pattern by removing the insulating layer; and forming a source / drain impurity region in the substrate on both sides of the gate pattern. It includes a step of forming.
이하, 본 발명의 반도체소자 제조방법을 첨부된 도면을 참조하여 설명하면 다음과 같다.Hereinafter, a semiconductor device manufacturing method of the present invention will be described with reference to the accompanying drawings.
도 2a 내지 2k는 본 발명의 반도체소자 제조방법을 나타낸 공정단면도이다.2A to 2K are cross-sectional views illustrating a method of manufacturing a semiconductor device of the present invention.
먼저, 도 2a에 도시한 바와같이 활성영역과 필드영역으로 정의된 실리콘기판(21)의 필드영역에 필드산화막(22)을 형성한다.First, as shown in FIG. 2A, the field oxide film 22 is formed in the field region of the silicon substrate 21 defined as the active region and the field region.
상기 필드산화막(22)을 포함한 실리콘기판(21)전면에 제1절연층(23)을 200∼1000Å의 두께로 형성한다.A first insulating layer 23 is formed on the entire surface of the silicon substrate 21 including the field oxide film 22 to a thickness of 200 to 1000 Å.
그리고 상기 제1절연층(23)상에 식각선택성이 있는 제2절연층(24)을 3000∼10000Å의 두께로 형성한다.The second insulating layer 24 having an etch selectivity is formed on the first insulating layer 23 to have a thickness of 3000 to 10000 GPa.
이때 상기 제1절연층은 실리콘질화막층이고 제2절연층은 실리콘산화막층이다.In this case, the first insulating layer is a silicon nitride layer and the second insulating layer is a silicon oxide layer.
이어, 도 2b에 도시한 바와같이 상기 화학기계적 경면연마(CMP : Chemical Machanical Polishing)법으로 상기 제2절연층(24)을 연마하여 평탄화시킨다.Subsequently, as illustrated in FIG. 2B, the second insulating layer 24 is polished and planarized by the chemical mechanical polishing (CMP) method.
이때 사용되는 연마용액으로서는 알루미나(Al2O3) 또는 실리카(SiO2) 등의 연마제와 KOH, NH4OH 등의 환원제 그리고 암모늄하이드록사이드(NH4OH) 등의 첨가제가 혼합된 수용액을 적용한다.At this time, the polishing solution used is an aqueous solution mixed with an abrasive such as alumina (Al 2 O 3 ) or silica (SiO 2 ), a reducing agent such as KOH and NH 4 OH, and an additive such as ammonium hydroxide (NH 4 OH). do.
그리고 도 2c에 도시한 바와같이 상기 평탄화된 제2절연층(24)상에 포토레지스트(도면에 도시화지 않음)를 도포한 후 노광 및 현상공정을 통해 포토레지스트를 패터닝한다.As shown in FIG. 2C, a photoresist (not shown) is coated on the planarized second insulating layer 24, and then the photoresist is patterned through an exposure and development process.
이어, 패터닝된 포토레지스트를 마스크로 이용하여 제2절연층(24)과 제1절연층(23)을 선택적으로 제거하여 게이트패턴을 위한 제1함몰부(25)를 형성한다.Subsequently, the second insulating layer 24 and the first insulating layer 23 are selectively removed using the patterned photoresist as a mask to form the first recess 25 for the gate pattern.
그리고 산화성분위기에서 열처리하거나 실리콘산화막 등의 유전체막을 500Å 이하의 두께로 증착하여 게이트절연막(26)을 형성한다.The gate insulating film 26 is formed by heat treatment in an oxidizing atmosphere or by depositing a dielectric film such as a silicon oxide film to a thickness of 500 k [Omega] or less.
이어, 도 2d에 도시한 바와같이 제1게이트전극층(27)으로서 폴리실리콘층을 형성한 후 상기 폴리실리콘층(27)상에 텅스텐(W), 탄탈륨(Ta), 구리 등과 같은 녹는점이 높고 비저항이 낮은 금속물질을 게이트금속층(28)으로서 형성하여 상기 제1함몰무(25)를 매립한다.Subsequently, as shown in FIG. 2D, a polysilicon layer is formed as the first gate electrode layer 27, and then a melting point such as tungsten (W), tantalum (Ta), copper, and the like is high on the polysilicon layer 27 and has a specific resistance. This low metal material is formed as the gate metal layer 28 to bury the first recess 25.
이때 상기 게이트금속층(28)은 스퍼터링 또는 CVD방법을 이용하여 형성한다.In this case, the gate metal layer 28 is formed by sputtering or CVD.
한편 상기 게이트금속층(28)이 텅스텐과 같이 실리콘과 반응할 수 있는 물질인 경우에는 TiN, WN, Ta, TaN, Ti/TiN 등의 고융점금속이나 이들의 적층막을 형성하여 상기 제1게이트전극층(27)과 게이트금속층(28) 사이에 배리어금속층(29)을 개재시키는 것을 포함한다.On the other hand, when the gate metal layer 28 is a material capable of reacting with silicon such as tungsten, a high melting point metal such as TiN, WN, Ta, TaN, Ti / TiN, or a laminated film thereof is formed to form the first gate electrode layer ( Interposing a barrier metal layer 29 between the gate layer 27 and the gate metal layer 28.
여기서 상기 배리어금속층의 두께는 100∼1000Å의 범위가 되도록 하며 스퍼터링 또는 CVD법으로 형성한다.Here, the barrier metal layer has a thickness in the range of 100 to 1000 GPa and is formed by sputtering or CVD.
이어서, 도 2e에 도시한 바와같이 게이트금속층(28), 배리어금속층(29), 제1게이트전극층(27)을 화학기계적 경면연마(CMP)법으로 연마한다.Subsequently, as illustrated in FIG. 2E, the gate metal layer 28, the barrier metal layer 29, and the first gate electrode layer 27 are polished by chemical mechanical mirror polishing (CMP).
이때 상기 제1함몰부(25)에 매립된 제1게이트전극층(27), 배리어금속층(29), 게이트금속층(28)으로 이루어진 매립층이 상기 제2절연층(24)의 표면보다 낮게 되도록 과도연마한다.At this time, the overpolishing is performed so that the buried layer made up of the first gate electrode layer 27, the barrier metal layer 29, and the gate metal layer 28 embedded in the first recess 25 is lower than the surface of the second insulating layer 24. do.
여기서 상기 화학기계적 경면연마법을 이용한 연마시 연마용액으로서는 알루미나(Al2O3)나 실리카(SiO2) 등의 연마제와 HNO3, H2SO4, K3Fe(CN)6, Fe(NO3)3, H2O2등의 산화제 그리고 암모늄하이드록사이드, 벤조트리아졸(Benzotriazol) 등의 첨가제가 혼합된 수용액을 적용한다.Here, the polishing solution in the polishing process using the chemical mechanical mirror polishing method is an abrasive such as alumina (Al 2 O 3 ) or silica (SiO 2 ) and HNO 3 , H 2 SO 4 , K 3 Fe (CN) 6 , Fe (NO 3 ) Aqueous solution containing oxidizing agent such as 3 , H 2 O 2 and additives such as ammonium hydroxide and benzotriazol is applied.
한편 매립층이 제2절연층(24)보다 낮게 되도록 과도연마하는 것은 표면이 드러나는 게이트금속층(28)이 주위의 산화성분위기에 노출되어 산화되는 것을 방지하기 위한 것이다.On the other hand, the over-polishing so that the buried layer is lower than the second insulating layer 24 is to prevent the gate metal layer 28 whose surface is exposed to be exposed and oxidized by the surrounding oxidative atmosphere.
이때 과도연마에 따른 리세스되는 높이는 100∼500Å의 범위가 되도록 조절한다.At this time, the height of the recess due to overpolishing is adjusted to be in the range of 100 to 500 kPa.
이어, 도 2f에 도시한 바와같이 상기 노출된 게이트금속층(28)을 포함한 전면에 산화방지층(30)을 형성하여 리세스영역을 매립한다.Subsequently, as shown in FIG. 2F, an oxide layer 30 is formed on the entire surface including the exposed gate metal layer 28 to fill the recess region.
이때 상기 산화방지층(30)의 두께는 1000Å이하로 조절한다.At this time, the thickness of the antioxidant layer 30 is adjusted to less than 1000Å.
그리고 도 2g에 도시한 바와같이 다시 화학기계적 경면연마(CMP)법을 이용하여 상기 제2절연층(24)의 표면이 노출될 때까지 상기 산화방치층(30)을 제거한다.As shown in FIG. 2G, the oxidation-preventing layer 30 is removed until the surface of the second insulating layer 24 is exposed by chemical mechanical mirror polishing (CMP).
이때 상기 리세스영역은 상기 산화방치층(30)으로 채워진다.At this time, the recess region is filled with the oxidation-resistant layer 30.
이와같은 공정을 게이트금속층(28)은 그 측면과 밑면은 상기 제1게이트전극층(27)과 배리어금속층(29)에 의해 둘러싸이고 표면을 산화방지층(30)에 의해 덮혀진다.In this process, the gate metal layer 28 is surrounded by the first gate electrode layer 27 and the barrier metal layer 29 and the surface thereof is covered by the antioxidant layer 30.
이어 도 2h에 도시한 바와같이 게이트금속층(28)과 그 주변을 둘러싸고 있는 물질(즉, 제1게이트전극층(27), 배리어금속층(29), 산화방지층(30))을 제외한 나머지 제2절연층(24)과 제1절연층(23)을 제거하여 게이트패턴(28a)을 형성한다.Subsequently, as shown in FIG. 2H, the second insulating layer except for the gate metal layer 28 and the material surrounding the periphery (that is, the first gate electrode layer 27, the barrier metal layer 29, and the anti-oxidation layer 30) is shown. The gate pattern 28a is formed by removing the 24 and the first insulating layer 23.
그리고 상기 게이트패턴(28a)을 마스크로 이용한 이온주입을 통해 상기 게이트패턴(28a)양측의 실리콘기판(21) 내에 LDD영역(31)을 형성한다.The LDD region 31 is formed in the silicon substrate 21 on both sides of the gate pattern 28a through ion implantation using the gate pattern 28a as a mask.
이어서, 도 2i에 도시한 바와같이 상기 게이트패턴(28a)을 포함한 전면에 제3절연층(32)을 형성한 후 에치백하여 도 2j에 도시한 바와같이 상기 게이트패턴(28a)의 양측면에 측벽절연막(32a)을 형성한다.Next, as shown in FIG. 2I, a third insulating layer 32 is formed on the entire surface including the gate pattern 28a and then etched back to form sidewalls on both sides of the gate pattern 28a as shown in FIG. 2J. The insulating film 32a is formed.
그리고 게이트패턴(28a) 및 측벽절연막(32a)을 마스크로 이용하여 소오스/드레인용 불순물 이온주입을 실시하여 상기 게이트패턴(28a)양측의 실리콘기판(21)내에 LDD구조를 갖는 소오스/드레인 불순물영역(33, 34)을 형성한다.Source / drain impurity ions are implanted by using the gate pattern 28a and the sidewall insulating film 32a as a mask so that source / drain impurity regions having an LDD structure in the silicon substrate 21 on both sides of the gate pattern 28a are formed. (33, 34) are formed.
이어, 도 2k에 도시한 바와같이 게이트패턴(28a)을 포함한 전면에 제4절연층(35)을 형성한 후 감광막 마스크패턴(도면에 도시하지 않음)이용하여 건식식각, 습식식각 또는 이들을 조합하여 상기 제4절연층(35)을 식각하므로서 접속홀을 형성한다.Subsequently, as shown in FIG. 2K, the fourth insulating layer 35 is formed on the entire surface including the gate pattern 28a, and then dry etching, wet etching, or a combination thereof is formed using a photoresist mask pattern (not shown). The fourth insulating layer 35 is etched to form connection holes.
이때 상기 제4절연층(35)은 실리콘산화막 또는 실리콘질화막을 형성하고 CVD 법을 이용하여 3000Å이상의 두께를 갖도록한다.At this time, the fourth insulating layer 35 forms a silicon oxide film or a silicon nitride film and has a thickness of 3000 kPa or more using CVD.
그리고 상기 접속홀을 포함한 전면에 알루미늄(Al), 구리(Cu) 등을 주성분으로 하는 도전성물질을 증착한 후 패터닝하여 전도선(36)을 형성하면 본 발명의 반도체소자 제조공정을 완료한다.After the conductive material including aluminum (Al), copper (Cu), etc. as a main component is deposited on the entire surface including the connection hole, the conductive line 36 is formed by patterning the conductive material to complete the semiconductor device manufacturing process of the present invention.
이상 상술한 바와같이 본 발명의 반도체소자 제조방법은 다음과 같은 효과가 있다.As described above, the semiconductor device manufacturing method of the present invention has the following effects.
첫째, 폴리메탈공정을 적용함에 있어서 폴리실리콘층, 게이트금속층을 포함하는 매립층을 형성하고 단면을 연마하므로 게이트측벽의 프로파일을 균일하게 할 수 있다.First, in applying the polymetal process, the buried layer including the polysilicon layer and the gate metal layer is formed and the cross section is polished, thereby making it possible to make the profile of the gate sidewall uniform.
둘째, 실온에서 공정을 실시하므로 텅스텐층 등의 게이트금속층의 이상산화를 방지할 수 있다.Second, since the process is performed at room temperature, abnormal oxidation of the gate metal layer such as tungsten layer can be prevented.
셋째, 게이트측벽으로서 실리콘산화막을 적용할 수 있으므로 공정의 신뢰성을 향상시킨다.Third, since the silicon oxide film can be applied as the gate side wall, the reliability of the process is improved.
넷째, 폴리실리콘층과 게이트금속층 사이에 배리어금속층을 개재시키고 게이트금속층 표면에 산화방지층을 형성하므로서 게이트금속층이 산화방지층과 폴리실리콘층으로 둘러싸여지므로 게이트패턴을 가공하면 후속공정을 진행하더라도 게이트금속층이 산화되는 것을 막을 수 있다.Fourth, since the gate metal layer is surrounded by the anti-oxidation layer and the polysilicon layer by interposing a barrier metal layer between the polysilicon layer and the gate metal layer and forming an antioxidant layer on the surface of the gate metal layer, when the gate pattern is processed, the gate metal layer is oxidized. Can be prevented.
Claims (14)
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| Publication number | Priority date | Publication date | Assignee | Title |
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| KR100380282B1 (en) * | 2001-07-12 | 2003-04-18 | 주식회사 하이닉스반도체 | Gate of semiconductor device and the method of fabricating thereof |
| CN108711574A (en) * | 2012-03-13 | 2018-10-26 | 爱思开海力士有限公司 | Semiconductor devices and its manufacturing method |
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| CN105990235B (en) * | 2015-01-30 | 2019-05-28 | 中芯国际集成电路制造(上海)有限公司 | The forming method of semiconductor devices |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| KR100380282B1 (en) * | 2001-07-12 | 2003-04-18 | 주식회사 하이닉스반도체 | Gate of semiconductor device and the method of fabricating thereof |
| CN108711574A (en) * | 2012-03-13 | 2018-10-26 | 爱思开海力士有限公司 | Semiconductor devices and its manufacturing method |
| CN108711574B (en) * | 2012-03-13 | 2023-04-07 | 爱思开海力士有限公司 | Semiconductor device and method for manufacturing the same |
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