KR19980030905U - Lead pin fixing structure - Google Patents
Lead pin fixing structure Download PDFInfo
- Publication number
- KR19980030905U KR19980030905U KR2019960044051U KR19960044051U KR19980030905U KR 19980030905 U KR19980030905 U KR 19980030905U KR 2019960044051 U KR2019960044051 U KR 2019960044051U KR 19960044051 U KR19960044051 U KR 19960044051U KR 19980030905 U KR19980030905 U KR 19980030905U
- Authority
- KR
- South Korea
- Prior art keywords
- pin
- bond
- lead pin
- present
- head
- Prior art date
Links
- 239000011521 glass Substances 0.000 claims abstract description 7
- 239000011248 coating agent Substances 0.000 claims abstract description 3
- 238000000576 coating method Methods 0.000 claims abstract description 3
- 238000005452 bending Methods 0.000 abstract 1
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- FPWNLURCHDRMHC-UHFFFAOYSA-N 4-chlorobiphenyl Chemical compound C1=CC(Cl)=CC=C1C1=CC=CC=C1 FPWNLURCHDRMHC-UHFFFAOYSA-N 0.000 description 1
- 235000005311 Pandanus odoratissimus Nutrition 0.000 description 1
- 240000002390 Pandanus odoratissimus Species 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006664 bond formation reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
Abstract
본 고안은 LCD 등의 리이드핀의 취부구조에 관한 것으로 핀의 몸체부(23)의 본딩작업후의 변형을 방지하기 위해, 핀의 헤드부 상부와 하부에 피복하는 본드(10)의 피복두께를 동일하게 형성함과 동시에 본드(10)가 상글라스(5)의 측면(5A)과 접착하지 않도록 본드(10)를 형성한 것을 특징으로 한다. 또한 본 고안의 다른 실시예로서, 핀의 헤드부(22)와 몸체부(23) 사이에는, 헤드부(22) 하단에서부터 절곡되는 제1곡부(24)와 제1곡부(24)에 연속하여 절곡 형성한 제2곡부(25)를 형성한 것을 특징으로 한다.The present invention relates to a mounting structure of a lead pin, such as LCD, in order to prevent deformation after the bonding operation of the body portion 23 of the pin, the coating thickness of the bond 10 to be coated on the upper and lower head portion of the pin is the same. At the same time, the bond 10 is formed so that the bond 10 does not adhere to the side surface 5A of the upper glass 5. In addition, as another embodiment of the present invention, between the head portion 22 and the body portion 23 of the pin, in succession to the first curved portion 24 and the first curved portion 24 that is bent from the lower end of the head portion 22 It is characterized by forming the second curved portion 25 formed by bending.
Description
본 고안은 LCD 등의 리이드핀에 관한 것으로, 특히 리이드핀의 고정구조에 관한 것이다.The present invention relates to a lead pin such as an LCD, and more particularly to a fixing structure of the lead pin.
통상적으로 리이드핀은 상하 글라스의 평면과 동일한 수평형태로 설치되는 수평형 리이드핀과, 그에 수직한 수직형 리이드핀이 있다.Typically, the lead pins include a horizontal lead pin installed in the same horizontal shape as the plane of the upper and lower glass, and a vertical lead pin perpendicular thereto.
리이드핀의 일단은 글라스 상면에 형성한 ITO 패턴과 물려 고정되고 타단은 PCB(3)와 결합하게 된다. 이 경우 도 1에서 보듯이, 핀(2)의 하단이 수직으로 고정되지 못하고, 점선으로 도시한 바와 같이, 수직에서 좌 또는 우측으로 틀어지는 문제가 발생한다. 따라서 PCB(3)와의 결합을 위한 솔더링(Soldering) 작업이 매우 곤란한 문제가 있다.One end of the lead pin is fixed to the ITO pattern formed on the upper surface of the glass, and the other end is coupled to the PCB 3. In this case, as shown in Figure 1, the lower end of the pin (2) is not fixed vertically, as shown by the dotted line, there is a problem that is twisted from the vertical to the left or right. Therefore, there is a problem that the soldering (Soldering) for coupling with the PCB (3) is very difficult.
그 변형된 주된 원인을 분석해본 결과, 본드(1)의 부착시의 본드의 경화과정에서 또한 본드(1)의 점도 특성에 따라 그와 같은 핀(2)의 수직 변형이 생기게 됨을 확인하였다.As a result of analyzing the main cause of the deformation, it was confirmed that such vertical deformation of the pin 2 occurred in the curing process of the bond at the time of attachment of the bond 1 and also depending on the viscosity characteristic of the bond 1.
또다른 변형의 원인을 찾아본 결과, 도 1의 “A”부위와 “B”부위의 본딩이 균일하지 않을 경우에도 핀(2)이 수직으로 고정되지 못하고 변형이 발생됨을 확인하였다.As a result of finding another cause of deformation, it was confirmed that even when the bonding between the “A” and “B” parts of FIG. 1 is not uniform, the pin 2 is not vertically fixed and deformation occurs.
본 고안은 상기한 문제점을 분석 및 감안하여 안출한 것으로, 핀의 취부시 끝 단부의 변형 발생을 방지하여 PCB의 접속이 원할하도록 한 것으로 이하 본 고안의 구성 및 작용을 상술한다.The present invention has been made in consideration of the above-described problems, to prevent the occurrence of deformation of the end when mounting the pin so that the connection of the PCB to the desired will be described in detail below the configuration and operation of the present invention.
도 1은 종래의 리이드핀의 설치상태를 보여주는 도면.1 is a view showing an installation state of a conventional lead pin.
도 2는 본 고안에 따른 리이드핀(20)의 고정구조도.2 is a fixed structure diagram of the lead pin 20 according to the present invention.
도 3은 본 고안의 다른 실시예.3 is another embodiment of the present invention.
*도면의 주요 부분에 대한 부호의 설명** Description of the symbols for the main parts of the drawings *
10,1:본드20,21,2:핀10, 1: Bond 20, 21, 2: Pin
22:헤드부23:몸체부22: head part 23: body part
24:제1곡부25:제2곡부24: first valley 25: second valley
본 고안의 주요구성은, 핀의 헤드부 상부와 하부에 피복하는 본드(10)의 피복두께를 동일하게 형성함과 동시에 본드(10)가 상글라스(5)의 측면(5A)과 접착하지 않도록 본드(10)를 형성한 것을 특징으로 한다.The main constitution of the present invention is to form the same coating thickness of the bond 10 to be coated on the upper and lower portions of the head of the pin and to prevent the bond 10 from adhering to the side surface 5A of the upper glass 5. The bond 10 is formed.
본 고안의 다른 실시예는, 핀의 헤드부(22)와 몸체부(23) 사이에는, 헤드부(22) 하단에서부터 절곡되는 제1곡부(24)와 제1곡부(24)에 연속하여 절곡 형성한 제2곡부(25)를 형성한 것을 특징으로 한다.Another embodiment of the present invention, between the head portion 22 and the body portion 23 of the pin, bent in succession to the first curved portion 24 and the first curved portion 24 that is bent from the lower end of the head portion 22 The formed second curved portion 25 is formed.
도 2는 본 고안에 따른 핀(20)의 설치상태를 보여주는 도면이다.2 is a view showing an installation state of the pin 20 according to the present invention.
본 고안에서는 핀(20)을 하글라스(4) 끝단에서 삽입한 후, 본드(10)를 상, 하가 균일한 두께로 감싸도록 도포함과 동시에 상부의 본드는 상글라스(5)의 측면과 직접 접촉하지 않도록 본드를 형성시켰다.In the present invention, after the pin 20 is inserted at the end of the halas 4, the upper and lower bonds are coated to cover the bond 10 with a uniform thickness at the same time. The bond was formed so as not to be in direct contact.
만약 본드가 상글라스(5)의 측면(5A)과 접촉하여 결합되면, 본드가 경화시 상글라스(5)를 끌어당기게 되어 셀 내부에 기포가 발생하는 중대한 결점이 생기고 또한 상, 하 보드의 부착력에 따른 인장 강도(stress)의 차이가 생겨 핀(20)의 하단끝이 수직하게 설치되지 못하고 틀어지게 된다.If the bond is brought into contact with the side surface 5A of the upper glass 5, the bond attracts the upper glass 5 during curing, which causes a serious defect that bubbles are generated inside the cell, and also the adhesion force of the upper and lower boards. Due to the difference in tensile strength (stress) caused by the lower end of the pin 20 is not vertically installed is twisted.
또한 위에서 언급한 바와 같이 본드(10)의 상부쪽(A 부위)과 하부쪽(B 부위)의 본딩 두께 차이가 발생하여도 부착력 차이로 그 부위가 약하게 되어 인장 작용차이가 발생하여 본드의 경화시 핀(20)이 수직으로 놓이지 못하고 틀어지게 된다.In addition, as mentioned above, even if a difference in bonding thickness between the upper side (part A) and the lower side (part B) of the bond 10 occurs, the portion becomes weak due to the difference in adhesion force, and thus a tensile action difference occurs. The pins 20 do not lay vertically and are twisted.
도 3은 본 고안에 따라 핀의 끝단이 틀어지지 않게 고정하는 또 다른 실시예이다. 본 다른 실시예에서는 핀(21)의 형상을 달리하였다. 즉 핀(21)의 헤드부(22)와 몸체부(23)의 연결되는 부위를 2번 라운드지게 절곡형성시켰다. 즉 하방으로 오목한 제1곡부(24)에 연속하여 상방으로 다시 볼록한 제2곡부(25)를 형성시켰다.3 is another embodiment of fixing the end of the pin is not twisted in accordance with the present invention. In another embodiment, the shape of the pin 21 is changed. In other words, the portion connecting the head portion 22 and the body portion 23 of the pin 21 was formed to be bent twice. That is, the 2nd curved part 25 which was convex upward again was formed continuously in the 1st curved part 24 recessed downward.
상기한 핀(21)의 구조에 의하면, 비록 도 1 또는 도 2의 본드(1,10)의 취부구조에 의해 리이드 핀이 영향을 받더라도 그 영향이 핀의 몸체부(23)에까지 미치는 것을 방지할 수 있다.According to the structure of the pin 21 described above, even if the lead pin is affected by the mounting structure of the bonds 1 and 10 of FIG. 1 or 2, the influence of the pin 21 on the body portion 23 of the pin can be prevented. Can be.
즉 본드(1,10)에 의해 핀(21)의 헤드부(22)가 영향을 받더라도, 헤드부(22)의 그 변형이 바로 핀의 몸체부(23)에 전달되는 것이 아니고, 1차적으로는 제1곡부(24)에 그 변형이 영향을 받게 되고 그런후 2차적으로 제2곡부(25)가 변형을 받으므로 최종적으로 제2곡부(25)의 변형에 따른 몸체부(23)에의 변형은 극소 또는 거의 없게 되는 상태가 된다. 또한 제1 및 제2곡부(24,25) 형성에 의하면, 헤드부와 몸체부 사이의 집중하중 발생 또는 스트레스의 발생을 방지하고 외부에 의한 힘을 받을때 힘의 분산효과도 있어 그 연결부위에서의 파손도 방지할 수 있는 효과가 있다.That is, even if the head portion 22 of the pin 21 is affected by the bonds 1 and 10, the deformation of the head portion 22 is not directly transmitted to the body portion 23 of the pin, but primarily. Since the deformation is affected by the first curved portion 24 and the second curved portion 25 is secondarily deformed, the deformation to the body portion 23 according to the deformation of the second curved portion 25 is finally performed. Is in a state where there are few or few. In addition, according to the formation of the first and second bent portions 24 and 25, it is possible to prevent the occurrence of concentrated load or stress between the head portion and the body portion, and there is also a dispersion effect of the force when the external force is applied. Damage can also be prevented.
이상과 같은 본 고안에 의하면, 리이드 핀의 고정시 핀의 몸체부에 변형을 주지 않아 PCB와의 결합작업이 용이한 효과가 있다. 특히 본 고안의 다른 실시예에 의하면, 본드에 의한 변형을 더욱 방지할 수 있고 또한 몸체부와 헤드부 사이 연결부위의 강도를 향상시켜 파손도 방지할 수 있는 효과가 있다.According to the present invention as described above, when the lead pin is fixed, there is no deformation in the body portion of the pin there is an effect of easy coupling with the PCB. In particular, according to another embodiment of the present invention, the deformation caused by the bond can be further prevented, and the strength of the connecting portion between the body portion and the head portion can be improved to prevent damage.
또한 본 고안에 따른 본드의 형성구조에 의하면 셀의 중대결점의 하나인 기포가 발생하는 것을 방지할 수 있는 뛰어난 효과도 있다.In addition, according to the bond formation structure according to the present invention there is an excellent effect that can prevent the generation of bubbles, which is one of the major drawbacks of the cell.
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019960044051U KR19980030905U (en) | 1996-11-30 | 1996-11-30 | Lead pin fixing structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019960044051U KR19980030905U (en) | 1996-11-30 | 1996-11-30 | Lead pin fixing structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR19980030905U true KR19980030905U (en) | 1998-08-17 |
Family
ID=53986117
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019960044051U KR19980030905U (en) | 1996-11-30 | 1996-11-30 | Lead pin fixing structure |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR19980030905U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100541277B1 (en) * | 1998-08-26 | 2006-03-14 | 삼성전자주식회사 | Backlight Assembly of Liquid Crystal Display |
| KR100719826B1 (en) * | 1998-07-10 | 2007-05-18 | 가부시키가이샤 엔프라스 | Surface light source device of side light type and liquid crystal display |
| KR100863505B1 (en) * | 2002-05-23 | 2008-10-15 | 삼성전자주식회사 | Backlight assembly and liquid crystal display device having the same |
-
1996
- 1996-11-30 KR KR2019960044051U patent/KR19980030905U/en not_active Application Discontinuation
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100719826B1 (en) * | 1998-07-10 | 2007-05-18 | 가부시키가이샤 엔프라스 | Surface light source device of side light type and liquid crystal display |
| KR100541277B1 (en) * | 1998-08-26 | 2006-03-14 | 삼성전자주식회사 | Backlight Assembly of Liquid Crystal Display |
| KR100863505B1 (en) * | 2002-05-23 | 2008-10-15 | 삼성전자주식회사 | Backlight assembly and liquid crystal display device having the same |
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