KR19980026364A - Punch Actuator for Trim / Forming Equipment for Semiconductor Package Manufacturing - Google Patents

Punch Actuator for Trim / Forming Equipment for Semiconductor Package Manufacturing Download PDF

Info

Publication number
KR19980026364A
KR19980026364A KR1019960044786A KR19960044786A KR19980026364A KR 19980026364 A KR19980026364 A KR 19980026364A KR 1019960044786 A KR1019960044786 A KR 1019960044786A KR 19960044786 A KR19960044786 A KR 19960044786A KR 19980026364 A KR19980026364 A KR 19980026364A
Authority
KR
South Korea
Prior art keywords
trim
operating
punch
shaft
cam
Prior art date
Application number
KR1019960044786A
Other languages
Korean (ko)
Other versions
KR100210418B1 (en
Inventor
정명국
김정율
Original Assignee
황인길
아남산업 주식회사
정헌태
아남정공 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 황인길, 아남산업 주식회사, 정헌태, 아남정공 주식회사 filed Critical 황인길
Priority to KR1019960044786A priority Critical patent/KR100210418B1/en
Publication of KR19980026364A publication Critical patent/KR19980026364A/en
Application granted granted Critical
Publication of KR100210418B1 publication Critical patent/KR100210418B1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads

Abstract

본 발명은 반도체 패키지 제조용 트림/포밍 장비의 펀치 작동장치에 관한 것으로서, 하나의 모터에 의해 몰딩된 리드프레임 자재를 이송시킴과 동시에 트림/포밍 공정을 하도록 함으로서 정확한 작동 상태에 따른 제품의 불량을 방지하여 생산성을 향상시킴은 물론, 장비의 구조를 유.공압식이 아닌 기계식으로 간단하게 구성함으로서 장비의 고장을 방지하고, 정비를 용이하게 할 수 있는 것이다.The present invention relates to a punch operating device for trim / forming equipment for manufacturing a semiconductor package. The present invention provides a trim / forming process while simultaneously transferring lead frame material molded by a single motor, thereby preventing product defects according to accurate operating conditions. In addition to improving productivity, by simply configuring the structure of the equipment mechanically rather than hydraulic or pneumatic, it is possible to prevent equipment failure and facilitate maintenance.

Description

반도체 패키지 제조용 트림/포밍 장비의 펀치 작동장치Punch Actuator for Trim / Forming Equipment for Semiconductor Package Manufacturing

본 발명은 반도체 패키지 제조용 트림/포밍 장비의 펀치 작동장치에 관한 것으로서, 더욱 상세하게는 하나의 동력원으로 리드프레임을 이송시킴과 동시에 트림/포밍 공정을 할 수 있도록 함으로서 정확한 작동상태에 의한 작업불량을 방지하고, 생산성을 향상시키도록 된 반도체 패키지 제조용 트림/포밍 장비의 펀치 작동장치에 관한 것이다.The present invention relates to a punch operating device for trim / forming equipment for manufacturing a semiconductor package, and more particularly, it is possible to carry out a trim / forming process while simultaneously transporting a lead frame to a single power source, thereby preventing work defects caused by an accurate operating state. A punch actuator of trim / forming equipment for manufacturing a semiconductor package, which is intended to prevent and improve productivity.

일반적으로, 반도체 패키지 제조용 트림/포밍 장비는 몰딩된 리드프레임 자재를 공급하여 순차적으로 이송시키면서 트림/포밍 공정을 하도록 되어 있다. 이때, 상기 몰딩된 리드프레임 자재가 공급되면 리드프레임 자재를 이송수단에 의해 탑다이와 바텀다이가 설치된 위치까지 이송시켜 트림/포밍 공정을 한 다음에 계속해서 이송되어져 배출되는 것이다.In general, trim / forming equipment for manufacturing a semiconductor package is intended to perform a trim / forming process while supplying molded leadframe materials and sequentially transferring them. In this case, when the molded leadframe material is supplied, the leadframe material is transferred to the position where the top die and the bottom die are installed by the transfer means, and then trimmed and formed, and then continuously transferred and discharged.

그러나, 종래의 반도체 패키지 제조용 트림/포밍 장비는 리드프레임 자재를 순차적으로 이송시키는 동력원과, 트림/포밍을 위한 탑다이를 작동시키는 동력원이 각각 별도로 설치되어져, 다시 말해 리드프레임 자재를 탑다이와 바텀다이까지 이송시키는 이송수단으로 모터와 유압실린더 등이 각각 설치되고, 트림/포밍을 위한 탑다이를 작동시키는 동력원으로는 별도의 유압실린더가 설치되어 정확한 리드프레임 자재의 이송거리 및 리드프레임 자재가 이송된 후 작동하는 탑다이의 동작을 위해서는 센서의 감지에 의해 작동됨으로 센서의 오동작으로 인한 제품의 불량이 발생되며 생산성이 저하되는 등의 문제점이 있었던 것이다.However, in the conventional trim / forming equipment for manufacturing a semiconductor package, a power source for sequentially transferring lead frame materials and a power source for operating the top die for trim / forming are separately installed, that is, the top die and the bottom die are used. Motors and hydraulic cylinders are installed as transfer means to transfer up to each other, and a separate hydraulic cylinder is installed as a power source for operating the top die for trim / forming. For the operation of the top die, which is operated after the detection of the sensor, a product defect occurs due to a malfunction of the sensor, resulting in a decrease in productivity.

또한, 리드프레임 자재의 이송거리에 따른 탑다이의 동작상태를 정확하게 세팅시켜야만 오동작을 방지할 수 있는 것으로, 세팅이 정확하지 않을 경우에는 다량의 제품불량을 초래하기 때문에 숙련된 작업자로 하여금 세팅이 이루어져야 함으로 고임금으로 인한 단가상승의 요인이 되었던 것이다.In addition, it is necessary to set the operation state of the top die according to the feeding distance of the lead frame material correctly to prevent the malfunction. If the setting is not correct, it causes a large quantity of product defects. As a result, it was a factor in the increase in unit price due to high wages.

본 발명의 목적은 이와 같은 문제점을 해결하기 위하여 발명된 것으로서, 하나의 모터에 의해 몰딩된 리드프레임 자재를 이송시킴과 동시에 트림/포밍 공정을 하도록 함으로서 정확한 작동상태에 따른 제품의 불량을 방지하여 생산성을 향상시킴은 물론, 장비의 구조를 유.공압식이 아닌 기계식으로 간단하게 구성함으로서 장비의 고장을 방지하고, 정비를 용이하게 하도록 한 반도체 패키지 제조용 트림/포밍 장비의 펀치 작동장치를 제공함에 있다.An object of the present invention is to solve the above problems, and by carrying out the trim / forming process at the same time to transport the lead frame material molded by a single motor to prevent product defects in accordance with the exact operating conditions and productivity In addition, the present invention provides a punch operation device for trim / forming equipment for manufacturing a semiconductor package, which is designed to prevent equipment failure and facilitate maintenance by simply configuring the structure of the equipment mechanically rather than hydraulically or pneumatically.

도 1은 본 발명에 따른 트림/포밍 장비의 측면도.1 is a side view of a trim / forming equipment according to the present invention.

도 2는 본 발명에 따른 트림/포밍 장비의 전체 구성을 나타낸 평면도.Figure 2 is a plan view showing the overall configuration of the trim / forming equipment according to the present invention.

도 3은 본 발명의 구성을 나타낸 정면도.3 is a front view showing the configuration of the present invention.

*도면의 주요부분에 대한 부호의 설명** Description of the symbols for the main parts of the drawings *

10:동력전달부20:캠팔로우10: Power Delivery 20: Cam Follow

30:종동축40:로드30: driven shaft 40: rod

50:작동축60,70:제1,2캠50: working shaft 60, 70: first and second cam

80:다이고정부90:펀치작동부80: Digo government 90: Punch operation unit

이하, 본 발명을 첨부된 도면을 참조하여 상세히 설명하면 다음과 같다.Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

도 1은 본 발명에 따른 트림/포밍 장비의 측면도이고, 도 2는 본 발명에 따른 트림/포밍 장비의 전체 구성을 나타낸 평면도이며, 도 3은 본 발명의 구성을 나타낸 정면도로서, 모터(M)의 풀리(12)와 구동축(11)의 풀리(12)를 벨트(13)로 연결하여 동력을 전달하는 동력전달부(10)와, 상기 구동축(11)에 편심되게 설치되어 탑다이(21)를 상하로 동작시키는 캠팔로우(20)와, 상기 구동축(11)의 회전을 전달받아 회전되는 종동축(30)과, 상기 종동축(30)의 회전력을 전달받아 회전되고, 그 회전을 직선운동으로 전환하는 로드(40)와, 상기 로드(40)에 결합되어 작동하는 작동축(50)과, 상기 작동축(50)에 결합되어 작동되며 각각 제1,2캠홈(61)(71)이 설치된 제1,2캠(60)(70)과, 상기 제1캠(60)에 의해 상하로 동작하는 다이고정부(80)와, 상기 제2캠(70)에 의해 작동되어 몰딩된 리드프레임 자재의 타이바를 절단하는 펀치(91)를 동작시키는 펀치작동부(90)로 이루어지는 것이다.Figure 1 is a side view of the trim / forming equipment according to the present invention, Figure 2 is a plan view showing the overall configuration of the trim / forming equipment according to the present invention, Figure 3 is a front view showing the configuration of the present invention, the motor (M) A power transmission unit 10 for transmitting power by connecting the pulley 12 of the pulley 12 and the pulley 12 of the drive shaft 11 to the belt 13, and the top die 21 eccentrically installed on the drive shaft 11. Cam follower 20 to operate the up and down, the driven shaft 30 is rotated by receiving the rotation of the drive shaft 11, and is rotated under the rotational force of the driven shaft 30, the rotation is linear movement The rod 40 to switch to, the operating shaft 50 is coupled to the rod 40 to operate, and coupled to the operating shaft 50 is operated and the first and second cam grooves 61 and 71, respectively Lead frames which are operated and molded by the installed first and second cams 60 and 70, the Daigo government 80 operating up and down by the first cam 60, and the second cam 70.It consists of the punch operation part 90 which operates the punch 91 which cuts the tie bar of a material.

상기의 제1,2캠(60)(70)의 제1,2캠홈(61)(71)에는 힌지축(51)이 결합되어 다이고정부(80)와 펀치작동부(90)를 순차적으로 동작시키는 것으로, 상기 제1캠(60)에 의해 다이고정부(80)가 먼저 상부로 작동되어 다이(81)를 고정시킨 상태에서 제2캠(70)에 의해 펀치작동부(90)를 동작시켜 몰딩된 리드프레임 자재의 타이바를 절단하는 것이다.The hinge shaft 51 is coupled to the first and second cam grooves 61 and 71 of the first and second cams 60 and 70 so that the die fixing part 80 and the punch operation part 90 are sequentially formed. By operating the first cam 60, the die fixing unit 80 is first operated to the upper portion of the die 81 to operate the punch operating unit 90 by the second cam (70). Cutting the tie bar of the molded leadframe material.

모터(M)의 동작으로 구동축(11)이 회전되고, 이 구동축(11)의 회전으로 캠팔로우(20)가 편심 회전되면서 탑다이(21)를 상하로 동작시켜 트림/포밍 공정을 진행한다. 또한, 상기 구동축(11)의 회전은 종동축(30)을 회전시키고, 상기 종동축(30)의 회전력을 전달받아 회전운동을 직선운동으로 전환하는 로드(40)를 작동시키고, 상기 로드(40)의 작동에 의해 작동축(50)이 직선운동하며 상기 작동축(50)에는 각각 제1,2캠(60)(70)이 설치되어 있어 제1,2캠(60)(70)을 작동시킨다.The drive shaft 11 is rotated by the operation of the motor M, and the cam follower 20 is eccentrically rotated by the rotation of the drive shaft 11 to operate the top die 21 up and down to perform a trim / forming process. In addition, the rotation of the drive shaft 11 rotates the driven shaft 30, operates the rod 40 for converting the rotational movement into a linear movement by receiving the rotational force of the driven shaft 30, the rod 40 The operating shaft 50 is linearly moved by the operation of the first and second cams 60 and 70 are respectively installed on the operating shafts 50 to operate the first and second cams 60 and 70. Let's do it.

이때, 상기 제1,2캠(60)(70)에는 각각 제1,2캠홈(61)(71)이 설치되어 있고, 이 제1,2캠홈(61)(71)에는 힌지축(51)이 결합되어 제1,2캠홈(61)(71)을 따라 작동되어 다이고정부(80)와 펀치작동부(90)를 상하로 작동시키는 것으로, 상기 제1,2캠(60)(70)에 의해 작동되는 다이고정부(80)와 펀치작동부(90)는 몰딩된 리드프레임 자재의 타이바를 최종적으로 절단하여 낱개의 반도체 패키지를 제조하는 것이다. 즉, 탑다이(21)에 의해 트림/포밍 공정이 완료된 몰딩된 리드프레임 자재는 타이바에 의해 리드프레임 자재에 지지되어 있는데, 상기 다이고정부(80)가 먼저 작동되어 리드프레임 자재를 고정하고, 펀치 작동부(90)가 동작하여 펀치(91)로 상기 타이바를 절단함으로서 리드프레임 자재로부터 반도체 패키지를 분리하여 제조하는 것이다.In this case, first and second cam grooves 61 and 71 are respectively installed in the first and second cams 60 and 70, and hinge shafts 51 are formed in the first and second cam grooves 61 and 71, respectively. It is coupled to operate along the first and second cam grooves 61 and 71 to operate the Daigo government 80 and the punch operation unit 90 up and down, the first and second cams 60 and 70. The die-going unit 80 and the punch operation unit 90 operated by the final cutting the tie bar of the molded lead frame material to manufacture a single semiconductor package. That is, the molded leadframe material, which is trimmed / formed by the top die 21, is supported on the leadframe material by a tie bar, and the die fixing part 80 is operated first to fix the leadframe material, The punch operation unit 90 operates to cut the tie bar with the punch 91 to separate and manufacture the semiconductor package from the leadframe material.

이상의 설명에서와 같이 본 발명의 반도체 패키지 제조용 트림/포밍 장비의 펀치 작동장치에 의하면, 하나의 모터에 의해 몰딩된 리드프레임 자재를 이송시킴과 동시에 트림/포밍 공정을 하도록 함으로서 정확한 작동상태에 따른 제품의 불량을 방지하여 생산성을 향상시킴은 물론, 장비의 구조를 유.공압식이 아닌 기계식으로 간단하게 구성함으로서 장비의 고장을 방지하고, 정비를 용이하게 할 수 있는 효과가 있다.As described above, according to the punch operating device of the trim / forming apparatus for manufacturing a semiconductor package of the present invention, the lead frame material molded by one motor is transported and the trim / forming process is performed at the same time, thereby providing a product according to an accurate operating state. In addition to improving productivity by preventing defects, it is possible to prevent equipment failure and facilitate maintenance by simply configuring the structure of the equipment mechanically rather than hydraulically or pneumatically.

Claims (2)

모터의 풀리와 구동축의 풀리를 벨트로 연결하여 동력을 전달하는 동력전달부와, 상기 구동축에 편심되게 설치되어 탑다이를 상하로 동작시키는 캠팔로우와, 상기 구동축의 회전을 전달받아 회전되는 종동축과, 상기 종동축의 회전력을 전달받아 회전되고, 그 회전을 직선운동으로 전환하는 로드와, 상기 로드에 결합되어 작동하는 작동축과, 상기 작동축에 결합되어 작동되며 각각 제1,2캠홈이 설치된 제1,2캠과, 상기 제1캠에 의해 상하로 동작하는 다이고정부와, 상기 제2캠에 의해 작동되어 몰딩된 리드프레임 자재의 타이바를 절단하는 펀치를 동작시키는 펀치동작부로 이루어지는 것을 특징으로 하는 반도체 패키지 제조용 트림/포밍 장비의 펀치 작동장치.A power transmission unit for transmitting power by connecting the pulley of the motor and the pulley of the drive shaft with a belt, a cam follower eccentrically installed on the drive shaft to operate the top die up and down, and a driven shaft that is rotated by the rotation of the drive shaft. And, a rod that is rotated by receiving the rotational force of the driven shaft, the rod converts the rotation into a linear movement, an operating shaft coupled to the rod, and coupled to the operating shaft to operate the first and second cam grooves, respectively. A first and second cams installed, a Daigo unit operating up and down by the first cam, and a punch operation unit for operating a punch for cutting a tie bar of a lead frame material which is operated by the second cam and molded. Punching device for trim / forming equipment for manufacturing semiconductor packages. 청구항 1에 있어서, 상기 제1,2캠의 제1,2캠홈에는 힌지축이 결합되어 다이고정부와 펀치작동부를 동작시키는 것을 특징으로 하는 반도체 패키지 제조용 트림/포밍 장비의 펀치 작동장치.The punch operating device of claim 1, wherein a hinge shaft is coupled to the first and second cam grooves of the first and second cams to operate the die fixing unit and the punch operating unit.
KR1019960044786A 1996-10-09 1996-10-09 Punch operating apparatus of trim/form apparatus KR100210418B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019960044786A KR100210418B1 (en) 1996-10-09 1996-10-09 Punch operating apparatus of trim/form apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019960044786A KR100210418B1 (en) 1996-10-09 1996-10-09 Punch operating apparatus of trim/form apparatus

Publications (2)

Publication Number Publication Date
KR19980026364A true KR19980026364A (en) 1998-07-15
KR100210418B1 KR100210418B1 (en) 1999-07-15

Family

ID=19476750

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960044786A KR100210418B1 (en) 1996-10-09 1996-10-09 Punch operating apparatus of trim/form apparatus

Country Status (1)

Country Link
KR (1) KR100210418B1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030042747A (en) * 2001-11-23 2003-06-02 주식회사 씨피씨 Multi in-line drive type press apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030042747A (en) * 2001-11-23 2003-06-02 주식회사 씨피씨 Multi in-line drive type press apparatus

Also Published As

Publication number Publication date
KR100210418B1 (en) 1999-07-15

Similar Documents

Publication Publication Date Title
KR920009930B1 (en) Automatic supply device of constituting material of tire in molding machine
US5361486A (en) System of machining devices
KR20030060058A (en) Work transfer method and work transfer equipment
CN208262284U (en) Shape extrusion pipelining equipment
CN108155274B (en) LED pin forming and detecting system
KR19980026364A (en) Punch Actuator for Trim / Forming Equipment for Semiconductor Package Manufacturing
KR100435248B1 (en) Device for sheets conveyance
KR0182072B1 (en) Cam structure of trim/foaming for manufacturing semiconductor packag
KR100241633B1 (en) Mechanical Press Machine for Forming Semiconductor Package
CN211161620U (en) Linear type stainless steel fork automatic feeding stamping device
KR100210234B1 (en) Press apparatus for lead mold of semiconductor package
KR100212398B1 (en) Power transmission structure of trim/forming machine for semiconductor package
KR100212393B1 (en) Onloader apparatus of trim/forming machine for semiconductor package
KR102041914B1 (en) Inversion apparatus for box manufacturing
KR0138349Y1 (en) Clutch for trimming and forming for manufacturing semiconductor
CN214078936U (en) Stable feeding mechanism of hardware stamping processing equipment
KR200159410Y1 (en) Push road device of exit area for semiconductor package manufacturing machine
CN220411941U (en) Steering device for box-type materials
KR0182070B1 (en) Tension control apparatus of timing belt of semiconductor package manufacturing equipment
CN214866513U (en) Punching device for electric power aluminum product production
CN208929665U (en) The double-deck production line
US20230312153A1 (en) Lifting mechanism with interlock and method
CN213763620U (en) Conveying device of stamping pipe cutting equipment
CN219004348U (en) Automatic feeding, feeding and conveying runner machine for multiple steel shell punching machines
KR100244086B1 (en) On loader apparatus of trim/forming equipment for semiconductor package fabricating

Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
LAPS Lapse due to unpaid annual fee