KR102690504B1 - Surface treatment method for lead tab of secondary battery - Google Patents
Surface treatment method for lead tab of secondary battery Download PDFInfo
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- KR102690504B1 KR102690504B1 KR1020240057064A KR20240057064A KR102690504B1 KR 102690504 B1 KR102690504 B1 KR 102690504B1 KR 1020240057064 A KR1020240057064 A KR 1020240057064A KR 20240057064 A KR20240057064 A KR 20240057064A KR 102690504 B1 KR102690504 B1 KR 102690504B1
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- metal lead
- lead
- acid
- surface treatment
- treatment method
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- 238000000034 method Methods 0.000 title claims abstract description 72
- 238000004381 surface treatment Methods 0.000 title claims abstract description 27
- 229910052751 metal Inorganic materials 0.000 claims abstract description 69
- 239000002184 metal Substances 0.000 claims abstract description 69
- 238000004140 cleaning Methods 0.000 claims abstract description 31
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 29
- 238000010306 acid treatment Methods 0.000 claims abstract description 20
- 238000005530 etching Methods 0.000 claims abstract description 19
- 238000007747 plating Methods 0.000 claims abstract description 18
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 claims abstract description 16
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 14
- 239000007795 chemical reaction product Substances 0.000 claims abstract description 5
- 230000003746 surface roughness Effects 0.000 claims abstract description 5
- 239000006227 byproduct Substances 0.000 claims abstract description 4
- 239000002904 solvent Substances 0.000 claims abstract description 4
- 239000000243 solution Substances 0.000 claims description 20
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical class OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 11
- 239000007800 oxidant agent Substances 0.000 claims description 8
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims description 6
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical class Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 6
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 6
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical class OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 6
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 claims description 6
- 229910017604 nitric acid Inorganic materials 0.000 claims description 6
- 239000000126 substance Substances 0.000 claims description 6
- 238000005507 spraying Methods 0.000 claims description 4
- 239000003929 acidic solution Substances 0.000 claims description 3
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims description 3
- 150000001875 compounds Chemical class 0.000 claims description 3
- 239000004310 lactic acid Substances 0.000 claims description 3
- 235000014655 lactic acid Nutrition 0.000 claims description 3
- 230000003213 activating effect Effects 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 230000002378 acidificating effect Effects 0.000 description 7
- 239000007864 aqueous solution Substances 0.000 description 6
- 239000011651 chromium Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000007788 liquid Substances 0.000 description 5
- 238000001039 wet etching Methods 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 3
- 229910052804 chromium Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003792 electrolyte Substances 0.000 description 2
- 230000004913 activation Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000007499 fusion processing Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000004071 soot Substances 0.000 description 1
- 238000010186 staining Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- -1 that is Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/50—Current conducting connections for cells or batteries
- H01M50/531—Electrode connections inside a battery casing
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/30—Acidic compositions for etching other metallic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/50—Current conducting connections for cells or batteries
- H01M50/531—Electrode connections inside a battery casing
- H01M50/534—Electrode connections inside a battery casing characterised by the material of the leads or tabs
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Electrochemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
Abstract
개시되는 이차전지용 리드 탭 표면처리 방법은, 양측 표면에 니켈 도금층이 형성되고, 니켈 도금층에 크로메이트 피막층이 형성된 금속 리드의 표면 성질이 향상되도록 처리한다. 개시되는 이차전지용 리드 탭 표면처리 방법은, 크로메이트 피막층 형성 시 생성된 반응 생성물을 제거하여 금속 리드의 양측 표면 조도를 개선하는 식각 공정; 도금 용매를 활성화시켜 금속 리드 양측 표면에 남아 있는 잔조물을 제거해 금속 리드 양측 표면에 얼룩이 발생하지 않게 하는 세정 공정; 및 크로메이트 피막층 형성 시 잔존 가능한 부산물 제거 및 금속 리드의 양측 표면을 평탄화하는 산 처리 공정;을 포함한다. The disclosed surface treatment method for a lead tab for a secondary battery treats the surface properties of a metal lead in which a nickel plating layer is formed on both surfaces and a chromate film layer is formed on the nickel plating layer to improve the surface properties. The disclosed surface treatment method for a lead tab for a secondary battery includes an etching process to improve the surface roughness of both sides of a metal lead by removing reaction products generated when forming a chromate film layer; A cleaning process that activates the plating solvent to remove residues remaining on the surfaces of both sides of the metal lead to prevent stains from occurring on both surfaces of the metal lead; and an acid treatment process to remove by-products that may remain when forming the chromate film layer and to flatten both surfaces of the metal lead.
Description
본 발명(Disclosure)은, 금속 리드에 대한 절연 필름의 접착성(부착력)을 강화할 수 있게 하는 이차전지용 리드 탭 표면처리 방법에 관한 것이다.The present invention (Disclosure) relates to a method of surface treatment of lead tabs for secondary batteries that can enhance the adhesiveness (adhesion) of an insulating film to a metal lead.
여기서는, 본 발명에 관한 배경기술이 제공되며, 이들이 반드시 공지기술을 의미하는 것은 아니다(This section provides background information related to the present disclosure which is not necessarily prior art).Here, background information related to the present invention is provided, and this does not necessarily mean prior art (This section provides background information related to the present disclosure which is not necessarily prior art).
일반적으로, 이차전지용 리드 탭은 이차전지를 사용하는 기기나 시스템의 구동을 위하여 외부 회로의 접속 단자로 사용된다. 이를 위해서, 리드 탭은 이차전지의 전극에 연결된다. Generally, lead tabs for secondary batteries are used as connection terminals for external circuits to drive devices or systems using secondary batteries. For this purpose, the lead tab is connected to the electrode of the secondary battery.
이러한 리드 탭은 금속 리드와, 금속 리드의 양측 표면에 융착되는 절연 필름으로 구성되고, 절연 필름은 이차전지의 케이스와의 밀봉과 절연을 위해서 고분자 수지로 제공된다. These lead tabs are composed of a metal lead and an insulating film fused to both surfaces of the metal lead, and the insulating film is made of polymer resin to seal and insulate the secondary battery case.
그러나 절연 필름과 금속 리드는 서로 다른 소재이기 때문에 절연 필름을 금속 리드에 견고하게 융착시키기에는 한계가 있었다. However, because the insulating film and the metal lead are different materials, there were limitations in firmly fusing the insulating film to the metal lead.
이러한 문제를 해결하고자, 금속 리드에 대해 화학적으로 표면을 처리하고 있다.To solve this problem, the surface of the metal lead is chemically treated.
일례로, 음극용 리드 탭의 금속 리드의 경우 구리(Copper)의 부식 취약성을 보완시키기 위해 양측 표면에 니켈(Ni)을 도금한 후, 절연 필름과의 접착성 향상을 위해 크로메이트(Chromate) 처리하여 니켈 도금층에 크로메이트 피막층을 형성하고 있다.For example, in the case of the metal lead of the lead tab for the cathode, nickel (Ni) is plated on both surfaces to compensate for the corrosion vulnerability of copper, and then chromated to improve adhesion to the insulating film. A chromate film layer is formed on the nickel plating layer.
그리고 후행하는 세정공정에서는 산화제를 포함한 산성계통의 습식 식각 원액으로 도금 잔존물을 제거한 후, 상온에서 DI 워터를 이용해 세척하고 있다. In the subsequent cleaning process, plating residues are removed using an acidic wet etching solution containing an oxidizing agent, and then cleaned using DI water at room temperature.
그러나, 전술한 세정공정을 거치는 과정에서 금속 리드의 양측 표면에 식각 얼룩(stain)이 발생하는 문제점이 있었을 뿐만 아니라 목표한 접착성능(부착력)이 확보되지 못하는 문제점이 있었다.However, in the process of going through the above-described cleaning process, there was a problem in that etching stains occurred on both surfaces of the metal lead, as well as a problem in that the target adhesive performance (adhesion) could not be secured.
한편, 목표한 접착성능(부착력)을 확보하기 위해 세정공정 이후 크롬(Cr)을 증착(PVD)하고 있으나, 이는 리드 탭 제조 단가를 상승시킬 뿐만 아니라 양산성이 저하되는 문제점이 있었다.Meanwhile, in order to secure the target adhesive performance (adhesion), chromium (Cr) is deposited (PVD) after the cleaning process, but this has the problem of not only increasing the manufacturing cost of the lead tab but also deteriorating mass production.
본 발명(Disclosure)은, 크로메이트 피막층 형성 시 생성된 반응 생성물 및 잔존물의 제거 효율을 증대시켜 금속 리드 표면에 대한 표면 조도 및 표면 평탄화를 개선하여 절연 필름의 접착성(부착력)을 강화할 수 있게 하는 이차전지용 리드 탭 표면처리 방법의 제공을 목적으로 한다. The present invention (Disclosure) is a secondary method that enhances the adhesion (adhesion) of the insulating film by improving the surface roughness and surface flattening on the metal lead surface by increasing the removal efficiency of reaction products and residues generated during the formation of the chromate film layer. The purpose is to provide a surface treatment method for lead tabs for batteries.
여기서는, 본 발명의 전체적인 요약(Summary)이 제공되며, 이것이 본 발명의 외연을 제한하는 것으로 이해되어서는 아니 된다(This section provides a general summary of the disclosure and is not a comprehensive disclosure of its full scope or all of its features).Here, a general summary of the present invention is provided, and this should not be construed as limiting the scope of the present invention (This section provides a general summary of the disclosure and is not a comprehensive disclosure of its full scope or all of its features).
상기한 과제의 해결을 위해, 본 발명을 기술하는 여러 관점들 중 어느 일 관점(aspect)에 따르면, 양측 표면에 니켈 도금층이 형성되고, 니켈 도금층에 크로메이트 피막층이 형성된 금속 리드의 표면 성질이 향상되도록 처리하는 이차전지용 리드 탭 표면처리 방법으로, 크로메이트 피막층 형성 시 생성된 반응 생성물을 제거하여 금속 리드의 양측 표면 조도를 개선하는 식각 공정; 도금 용매를 활성화시켜 금속 리드 양측 표면에 남아 있는 잔존물을 제거해 금속 리드 양측 표면에 얼룩이 발생하지 않게 하는 세정 공정; 및 크로메이트 피막층 형성 시 잔존 가능한 부산물 제거 및 금속 리드의 양측 표면을 평탄화하는 산 처리 공정;을 포함할 수 있다.In order to solve the above problem, according to one aspect among several aspects describing the present invention, a nickel plating layer is formed on both surfaces and a chromate film layer is formed on the nickel plating layer to improve the surface properties of the metal lead. A lead tab surface treatment method for secondary batteries, which includes an etching process to improve the surface roughness of both sides of the metal lead by removing reaction products generated when forming a chromate film layer; A cleaning process that activates the plating solvent to remove residues remaining on the surfaces of both sides of the metal lead to prevent stains from occurring on both surfaces of the metal lead; and an acid treatment process to remove by-products that may remain when forming the chromate film layer and to flatten both surfaces of the metal lead.
본 발명의 일 관점(aspect)에 따른 이차전지용 리드 탭 표면처리 방법에서, 식각 공정은, 식각조 내부를 통과하는 금속 리드에 식각액을 분사하거나 금속 리드를 식각액에 침지하여 수행될 수 있다.In the surface treatment method for a lead tab for a secondary battery according to an aspect of the present invention, the etching process may be performed by spraying an etchant on a metal lead passing through the inside of an etching bath or by immersing the metal lead in an etchant.
본 발명의 일 관점(aspect)에 따른 이차전지용 리드 탭 표면처리 방법에서, 식각액은, 습식 식각용 화학용액 100중량부에 대하여 DI 워터가 110~130중량부 혼합되어 조성될 수 있다.In the lead tab surface treatment method for secondary batteries according to an aspect of the present invention, the etchant may be composed of 110 to 130 parts by weight of DI water mixed with 100 parts by weight of the chemical solution for wet etching.
본 발명의 일 관점(aspect)에 따른 이차전지용 리드 탭 표면처리 방법에서, 습식 식각용 화학용액은 산화제를 포함하는 산성계통의 수용액일 수 있다.In the method of surface treatment of a lead tab for a secondary battery according to an aspect of the present invention, the chemical solution for wet etching may be an acidic aqueous solution containing an oxidizing agent.
본 발명의 일 관점(aspect)에 따른 이차전지용 리드 탭 표면처리 방법에서, 산화제를 포함하는 산성계통의 수용액에는 할로겐화 화합물, 황산, 염산, 인산, 저농도 질산, 저농도 불산+유산 중에서 선택된 어느 하나가 더 포함될 수 있다.In the lead tab surface treatment method for secondary batteries according to an aspect of the present invention, the acidic aqueous solution containing an oxidizing agent further contains any one selected from a halogenated compound, sulfuric acid, hydrochloric acid, phosphoric acid, low-concentration nitric acid, and low-concentration hydrofluoric acid + lactic acid. May be included.
본 발명의 일 관점(aspect)에 따른 이차전지용 리드 탭 표면처리 방법에서, 세정 공정은, 세정조 내부를 통과하는 금속 리드에 세정액을 분사하거나 금속 리드를 세정액에 침지하여 수행될 수 있다.In the surface treatment method for a lead tab for a secondary battery according to an aspect of the present invention, the cleaning process may be performed by spraying a cleaning solution on a metal lead passing through the inside of a cleaning tank or immersing the metal lead in a cleaning solution.
본 발명의 일 관점(aspect)에 따른 이차전지용 리드 탭 표면처리 방법에서, 세정액은 온수일 수 있다.In the lead tab surface treatment method for secondary batteries according to one aspect of the present invention, the cleaning liquid may be hot water.
본 발명의 일 관점(aspect)에 따른 이차전지용 리드 탭 표면처리 방법에서, 세정액은 30~50℃의 온수일 수 있다.In the method of surface treatment of a lead tab for a secondary battery according to an aspect of the present invention, the cleaning liquid may be hot water of 30 to 50°C.
본 발명의 일 관점(aspect)에 따른 이차전지용 리드 탭 표면처리 방법에서, 산 처리 공정은, 산 처리조 내부를 통과하는 금속 리드에 처리용액을 분사하거나 금속 리드를 처리용액에 침지하여 수행될 수 있다.In the lead tab surface treatment method for secondary batteries according to an aspect of the present invention, the acid treatment process may be performed by spraying a treatment solution on the metal lead passing through the acid treatment tank or by immersing the metal lead in the treatment solution. there is.
본 발명의 일 관점(aspect)에 따른 이차전지용 리드 탭 표면처리 방법에서, 처리용액은 강산성 용액일 수 있다.In the lead tab surface treatment method for secondary batteries according to one aspect of the present invention, the treatment solution may be a strongly acidic solution.
본 발명의 일 관점(aspect)에 따른 이차전지용 리드 탭 표면처리 방법에서, 처리용액은 황산(H2SO4) 또는 질산(HNO3)일 수 있다.In the lead tab surface treatment method for secondary batteries according to an aspect of the present invention, the treatment solution may be sulfuric acid (H 2 SO 4 ) or nitric acid (HNO 3 ).
본 발명에 따르면, 종래와 같이 크롬(Cr)을 증착(PVD)하지 않고도 절연 필름의 접착성(부착력)을 강화할 수 있기 때문에 금속 리드(L) 제조 비용을 현저하게 절감할 수 있게 하는 효과를 제공하게 된다.According to the present invention, the adhesiveness (adhesion) of the insulating film can be strengthened without depositing (PVD) chromium (Cr) as in the past, thereby providing the effect of significantly reducing the manufacturing cost of the metal lead (L). I do it.
본 발명에 따르면, 절연 필름의 접착성(부착력)이 강화할 수 있기 때문에 종래 전해액 유출로 기인하는 화재 가능성을 현저하게 감소시킬 수 있을 뿐만 아니라 파우치형 이차전지를 안정적으로 제조할 수 있게 하는 효과를 제공하게 된다.According to the present invention, the adhesiveness (adhesion) of the insulating film can be strengthened, which not only significantly reduces the possibility of fire caused by leakage of conventional electrolyte, but also provides the effect of stably manufacturing pouch-type secondary batteries. I do it.
도 1은 본 발명에 따른 이차전지용 리드 탭 표면처리 방법을 개략적으로 나타낸 도면.1 is a diagram schematically showing a method of surface treatment of a lead tab for a secondary battery according to the present invention.
이하, 본 발명에 따른 이차전지용 리드 탭 표면처리 방법을 구현한 실시형태를 도면을 참조하여 자세히 설명한다.Hereinafter, an embodiment implementing the surface treatment method for a lead tab for a secondary battery according to the present invention will be described in detail with reference to the drawings.
본 발명은, 양측 표면에 니켈 도금층이 형성되고, 니켈 도금층에 크로메이트 피막층이 형성된 금속 리드(L)의 표면 성질이 향상되도록 처리(surface treatment)하여 금속 리드(L)와 절연 필름(도시되지 않음) 사이의 접착성(부착력)을 강화할 수 있게 한다.In the present invention, a nickel plating layer is formed on both surfaces and a chromate film layer is formed on the nickel plating layer by surface treatment to improve the surface properties of the metal lead L and an insulating film (not shown). It allows to strengthen the adhesiveness (adhesion) between them.
여기서, 금속 리드(L)는 음극용 리드 탭에 사용되는 것으로, 금속 리드(L)는 구리(Cu) 재질을 주성분으로 할 수 있다.Here, the metal lead (L) is used in the lead tab for the negative electrode, and the metal lead (L) may be made of copper (Cu) as its main component.
또한, 금속 리드(L)는 띠 형태로 제공될 수 있으며, 롤(roll) 형태로 보빈에 권취되어 제공될 수 있다.Additionally, the metal lead (L) may be provided in the form of a strip or may be wound on a bobbin in the form of a roll.
한편, 금속 리드(L)의 양측 표면에 니켈 도금층을 형성하고, 니켈 도금층에 크로메이트 피막층을 형성하는 것을 본 발명에서는 특별히 한정하지 않는다. 즉, 금속 리드(L)이 양측 표면에 니켈 도금층이 형성되고 니켈 도금층에 크로메이트 피막층이 형성된다면 어떠한 방법을 사용하더라도 무방하다. Meanwhile, the present invention does not specifically limit the formation of a nickel plating layer on both surfaces of the metal lead (L) and the formation of a chromate film layer on the nickel plating layer. That is, any method may be used as long as a nickel plating layer is formed on both surfaces of the metal lead L and a chromate film layer is formed on the nickel plating layer.
도 1은 본 발명에 따른 이차전지용 리드 탭 표면처리 방법을 개략적으로 나타낸 도면으로, 본 발명은 식각 공정(S1), 세정 공정(S2) 및 산 처리 공정(S3)을 포함한다. Figure 1 is a diagram schematically showing a method of surface treatment of a lead tab for a secondary battery according to the present invention, which includes an etching process (S1), a cleaning process (S2), and an acid treatment process (S3).
여기서, 금속 리드(L)는 롤 투 롤(roll-to-roll) 방식으로 식각 공정(S1), 세정 공정(S2) 및 산 처리 공정(S3)을 순차적으로 거치며, 이를 위해서 식각 공정(S1) 이전에는 롤 형태로 권취된 금속 리드(L)를 풀어내는 언와이더(10; unwinder)가 설치될 수 있으며, 산 처리 공정(S3) 이후에는 금속 리드(L)를 롤 형태로 권취되게 하는 리와인더(20; rewinder)가 설치될 수 있다. Here, the metal lead (L) sequentially undergoes an etching process (S1), a cleaning process (S2), and an acid treatment process (S3) in a roll-to-roll manner. For this, the etching process (S1) is performed. An unwinder (10) may be installed to unwind the metal lead (L) previously wound in the form of a roll, and after the acid treatment process (S3), a rewinder to wind the metal lead (L) in the form of a roll. (20; rewinder) can be installed.
누구나 알 수 있듯이, 언와이더(10)는 본 발명에 따른 공정이 수행되는 동안 일정한 속도로 금속리드(L)를 연속적으로 풀어서 공급할 수 있게 하며, 리와인더(20)는 산 처리 공정(S3)을 통과하는 금속 리드(L)를 공급받아 일정한 속도로 권취할 수 있게 한다. As anyone can see, the unwinder 10 allows the metal lead (L) to be continuously unwound and supplied at a constant speed while the process according to the present invention is performed, and the rewinder 20 performs the acid treatment process (S3). It receives the passing metal lead (L) and allows it to be wound at a constant speed.
하기에는 본 발명에 따른 이차전지용 리드 탭 표면처리 방법을 상세히 설명한다. Below, the surface treatment method for a lead tab for a secondary battery according to the present invention will be described in detail.
먼저, 식각 공정(S1)은 크로메이트 피막층 형성 시 생성된 반응 생성물을 제거하여 금속 리드(L)의 양측 표면 조도를 개선하기 위한 공정이다.First, the etching process (S1) is a process to improve the surface roughness of both sides of the metal lead (L) by removing reaction products generated when forming the chromate film layer.
식각 공정(S1)에서는 언와이더(10)에서 풀려 나오는 금속 리드(L)가 통과하는 식각조(110)가 마련되고, 식각조(110) 내부를 통과하는 금속 리드(L)에 분사 또는 금속 리드(L)가 침지(dipping)되는 식각액(120)이 마련된다. In the etching process (S1), an etching bath 110 is prepared through which the metal lead (L) released from the unwider 10 passes, and the metal lead (L) passing through the inside of the etching bath 110 is sprayed or metal An etchant 120 in which the lead L is dipped is provided.
식각액(120)은 습식 식각용 화학용액(wet chemical) 100중량부에 대하여 3차수, 즉 비이온화물(De Ionized Water; '이하 DI 워터'라 한다)이 110~130중량부 혼합되어 조성될 수 있다.The etchant 120 can be formed by mixing 110 to 130 parts by weight of tertiary water, that is, de-ionized water (hereinafter referred to as DI water), with respect to 100 parts by weight of a chemical solution for wet etching (wet chemical). there is.
바람직하게는, 습식 식각용 화학용액은 산화제를 포함하는 산성계통의 수용액일 수 있다, Preferably, the chemical solution for wet etching may be an acidic aqueous solution containing an oxidizing agent.
더욱 바람직하게는, 산화제를 포함하는 산성계통의 수용액에는 할로겐화 화합물, 황산, 염산, 인산, 저농도 질산, 저농도 불산+유산 중에서 선택된 어느 하나가 더 포함될 수 있다.More preferably, the acidic aqueous solution containing the oxidizing agent may further include any one selected from halogenated compounds, sulfuric acid, hydrochloric acid, phosphoric acid, low-concentration nitric acid, and low-concentration hydrofluoric acid + lactic acid.
여기서, 산화제를 포함하는 산성계통의 수용액 100중량부에 대하여 DI 워터가 110중량부 미만으로 혼합되면, 제조되는 금속 리드의 표면이 균일하지 않게 제공될 수 있다. Here, if less than 110 parts by weight of DI water is mixed with 100 parts by weight of an acidic aqueous solution containing an oxidizing agent, the surface of the manufactured metal lead may be uneven.
또한, 산화제를 포함하는 산성계통의 수용액 100중량부에 대하여 DI 워터가 130중량부를 초과하여 혼합되면, 후행하는 세정공정(S2)에서 잔존물의 제거가 원활하지 않아 긴 원형 또는 원형 형태의 얼룩(Stain)이 발생하여 표면 불량이 발생하게 된다.In addition, if more than 130 parts by weight of DI water is mixed with 100 parts by weight of an acidic aqueous solution containing an oxidizing agent, the remaining residues are not removed smoothly in the subsequent cleaning process (S2), resulting in long or circular stains. ) occurs, resulting in surface defects.
한편, 식각 공정(S1)에서 식각조(110)의 길이는 금속 리드(L)이 이송 속도에 의해 가변될 수 있으며, 일례로 식각조(110)는 40~50㎝일 수 있으며, 금속 리드(L)는 45~80s의 침지 시간을 기준하여 이송될 수 있다.Meanwhile, in the etching process (S1), the length of the etching bath 110 may vary depending on the transfer speed of the metal lead (L). For example, the etching bath 110 may be 40 to 50 cm, and the metal lead (L) may be 40 to 50 cm long. L) can be transported based on an immersion time of 45 to 80 s.
세정 공정(S2)은 도금 용매를 활성화시켜 금속 리드(L)의 양측 표면에 남아 있는 잔존물을 제거해 금속 리드(L)의 양측 표면에 얼룩(stain)이 발생하지 않게 하기 위한 공정이다.The cleaning process (S2) is a process to activate the plating solvent to remove residues remaining on both surfaces of the metal lead (L) to prevent stains from occurring on both surfaces of the metal lead (L).
세정 공정(S2)에서는 식각 공정(S1)을 통과한 금속 리드(L)가 통과하는 세정조(130)가 마련되며, 세정조(130) 내부를 통과하는 금속 리드(L)에 분사 또는 금속 리드(L)가 침지되는 세정액(140)이 마련된다.In the cleaning process (S2), a cleaning tank 130 is provided through which the metal lead (L) that has passed the etching process (S1) passes, and the metal lead (L) passing through the inside of the cleaning tank 130 is sprayed or sprayed onto the metal lead (L). A cleaning liquid 140 in which (L) is immersed is prepared.
세정액(140)은 30~50℃의 온수로 마련되는데, 세정액의 온도가 30℃ 미만이면 활성화가 진행되지 않고 이로 인하여 얼룩 불량이 발생하며, 세정액의 온도가 50℃를 초과하면 표면처리 불량으로 얼룩이 발생하거나 그을음이 발생한다.The cleaning liquid 140 is prepared with hot water at a temperature of 30 to 50°C. If the temperature of the cleaning liquid is less than 30°C, activation does not proceed, resulting in defective stains. If the temperature of the cleaning solution exceeds 50°C, staining occurs due to poor surface treatment. or soot is generated.
한편, 세정 공정(S2)에서 세정조(130)의 길이는 금속 리드(L)이 이송 속도에 의해 가변될 수 있으며, 일례로 세정조(130)는 40~55㎝일 수 있으며, 금속 리드(L)는 45~80s의 침지 또는 세정시간을 기준으로 이송될 수 있다. Meanwhile, in the cleaning process (S2), the length of the cleaning tank 130 may vary depending on the transfer speed of the metal lead (L). For example, the cleaning tank 130 may be 40 to 55 cm, and the metal lead (L) may be 40 to 55 cm long. L) can be transported based on an immersion or cleaning time of 45 to 80 s.
산 처리 공정(S3)은 크로메이트 피막층 형성 시 잔존 가능한 부산물 제거 및 금속 리드(L)의 양측 표면을 평탄화하는 공정이다. The acid treatment process (S3) is a process of removing by-products that may remain during the formation of the chromate film layer and planarizing the surfaces of both sides of the metal lead (L).
산 처리 공정(S3)에서는 세정 공정(S2)을 통과한 금속 리드(L)가 통과하는 산 처리조(150)가 마련되고, 산 처리조(150) 내부를 통과하는 금속 리드(L)에 분사 또는 금속 리드(L)가 침지되는 처리용액(160)이 마련된다. In the acid treatment process (S3), an acid treatment tank 150 is provided through which the metal lead (L) that has passed the cleaning process (S2) passes, and the acid treatment tank (150) is sprayed onto the metal lead (L) that passes through the inside of the acid treatment tank (150). Alternatively, a processing solution 160 in which the metal lead L is immersed is provided.
처리용액(160)은 부식성과 발연성이 있는 강산성 용액, 바람직하게는 황산(H2SO4) 또는 질산(HNO3)일 수 있다.The treatment solution 160 may be a strongly acidic solution that is corrosive and flammable, preferably sulfuric acid (H 2 SO 4 ) or nitric acid (HNO 3 ).
한편, 산 처리 공정(S3)에서 산 처리조(150)의 길이는 금속 리드(L)이 이송 속도에 의해 가변될 수 있으며, 일례로 산 처리조(150)는 42~55㎝일 수 있으며, 금속 리드(L)는 40~80s의 침지 시간을 기준으로 이송될 수 있다.Meanwhile, in the acid treatment process (S3), the length of the acid treatment tank 150 may vary depending on the transfer speed of the metal lead (L). For example, the acid treatment tank 150 may be 42 to 55 cm, The metal lead (L) can be transported based on an immersion time of 40 to 80 s.
여기서, 산 처리 공정(S3)을 통과한 표면 처리된 금속 리드(L)는 리와인더(20; rewinder)에 롤 형태로 권취된다. Here, the surface-treated metal lead (L) that has passed the acid treatment process (S3) is wound in the form of a roll in a rewinder (20).
그리고 표면 처리된 금속 리드(L)는 롤 투 롤 방식으로 건조 공정을 거친 후 절연 필름 융착 공정으로 안내되어 절연 필름이 융착된다.Then, the surface-treated metal lead (L) undergoes a drying process using a roll-to-roll method and is then guided to an insulating film fusion process, where the insulating film is fused.
이와 같은 본 발명에 따르면, 종래와 같이 크롬(Cr)을 증착(PVD)하지 않고도 절연 필름의 접착성(부착력)을 강화할 수 있기 때문에 금속 리드(L) 제조 비용을 현저하게 절감할 수 있게 한다.According to the present invention, the adhesiveness (adhesion) of the insulating film can be strengthened without chromium (Cr) deposition (PVD) as in the prior art, thereby significantly reducing the manufacturing cost of the metal lead (L).
또한, 본 발명에 따르면, 절연 필름의 접착성(부착력)이 강화할 수 있기 때문에 종래 전해액 유출로 기인하는 화재 가능성을 현저하게 감소시킬 수 있을 뿐만 아니라 파우치형 이차전지를 안정적으로 제조할 수 있게 한다.In addition, according to the present invention, the adhesiveness (adhesion) of the insulating film can be strengthened, which not only significantly reduces the possibility of fire due to leakage of the conventional electrolyte, but also enables the stable production of pouch-type secondary batteries.
본 발명의 본질적인(intrinsic) 기술적 사상은 이상에서 설명된 실시형태에 의해 그 실시 가능 형태가 제한되지 않으며, 통상의 기술자에 의해 치환 또는 변경의 방법으로 용이하게 제안될 수 있는 범위를 포섭함을 밝힌다.It is stated that the essential technical idea of the present invention is not limited to the embodiments described above and includes a range that can be easily suggested by a person skilled in the art by way of substitution or modification. .
또한, 본 발명의 설명에서 사용된 용어는 설명의 편의를 위하여 선택한 것이므로, 본 발명의 본질적인(intrinsic) 기술적 사상을 파악하는 데 있어서, 사전적 의미에 제한되지 않고 본 발명의 기술적 사상에 부합되는 의미로 적절히 해석되어야 한다.In addition, the terms used in the description of the present invention are selected for convenience of explanation, and therefore, in understanding the essential technical idea of the present invention, they are not limited to dictionary meanings but have meanings that are consistent with the technical idea of the present invention. It should be interpreted appropriately.
Claims (11)
상기 크로메이트 피막층 형성 시 생성된 반응 생성물을 제거하여 상기 금속 리드의 양측 표면 조도를 개선하는 식각 공정;
도금 용매를 활성화시켜 상기 금속 리드 양측 표면에 남아 있는 잔존물을 제거해 상기 금속 리드 양측 표면에 얼룩이 발생하지 않게 하는 세정 공정; 및
상기 크로메이트 피막층 형성 시 잔존 가능한 부산물 제거 및 상기 금속 리드의 양측 표면을 평탄화하는 산 처리 공정;을 포함하며,
상기 식각 공정은,
식각조 내부를 통과하는 상기 금속 리드를 식각액에 침지하여 수행되되,
상기 식각액은 할로겐화 화합물, 황산, 염산, 인산, 저농도 질산, 저농도 불산+유산 중에서 선택된 어느 하나 및 산화제가 포함된 습식 식각액 화학용액 100중량부에 대하여 DI 워터가 110~130중량부 혼합되며,
상기 세정공정은,
세정조 내부를 통과하는 상기 금속 리드를 30~50℃의 온수인 세정액에 침지하여 수행되는 이차전지용 리드 탭 표면처리 방법.
A lead tab surface treatment method for secondary batteries in which a nickel plating layer is formed on both surfaces and a chromate film layer is formed on the nickel plating layer to improve the surface properties of the metal lead,
an etching process to improve surface roughness on both sides of the metal lead by removing reaction products generated when forming the chromate film layer;
A cleaning process to remove residues remaining on both surfaces of the metal lead by activating the plating solvent to prevent stains from occurring on both surfaces of the metal lead; and
It includes an acid treatment process to remove by-products that may remain when forming the chromate film layer and to flatten both surfaces of the metal lead,
The etching process is,
This is performed by immersing the metal lead passing through the inside of the etching bath in an etchant,
The etchant is a mixture of 110 to 130 parts by weight of DI water per 100 parts by weight of a wet etchant chemical solution containing any one selected from halogenated compounds, sulfuric acid, hydrochloric acid, phosphoric acid, low-concentration nitric acid, low-concentration hydrofluoric acid + lactic acid, and an oxidizing agent,
The cleaning process is,
A method of surface treatment of a lead tab for a secondary battery, which is performed by immersing the metal lead passing through the inside of the cleaning tank in a cleaning solution that is hot water of 30 to 50 ℃.
상기 산 처리 공정은,
산 처리조 내부를 통과하는 상기 금속 리드에 처리용액을 분사하거나 상기 금속 리드를 상기 처리용액에 침지하여 수행되는 이차전지용 리드 탭 표면처리 방법.
In claim 1,
The acid treatment process is,
A lead tab surface treatment method for a secondary battery performed by spraying a treatment solution on the metal lead passing through an acid treatment tank or immersing the metal lead in the treatment solution.
상기 처리용액은 강산성 용액인 이차전지용 리드 탭 표면처리 방법.
In claim 9,
A lead tab surface treatment method for secondary batteries in which the treatment solution is a strongly acidic solution.
상기 처리용액은 황산(H2SO4) 또는 질산(HNO3)인 이차전지용 리드 탭 표면처리 방법.In claim 9,
The treatment solution is sulfuric acid (H 2 SO 4 ) or nitric acid (HNO 3 ). A lead tab surface treatment method for secondary batteries.
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