KR102683374B1 - Lighting module and lighting apparatus having thereof - Google Patents

Abstract

A lighting module disclosed in an embodiment of the invention includes a substrate, a plurality of light emitting elements disposed on a first surface of the substrate; a resin layer covering the plurality of light emitting devices; first and second bonding parts disposed on a second side of the substrate; and first and second connectors connected to each of the first and second bonding parts, wherein the first and second bonding parts are electrically connected to the plurality of light emitting devices, and each of the first and second connectors is connected to the plurality of light emitting devices. , a bottom portion facing the first and second bonding portions; a support portion protruding from the bottom in a direction away from the second surface of the substrate; It may include a contact portion protruding from the support portion toward the second surface of the substrate.

Description

Lighting module and lighting device having the same {LIGHTING MODULE AND LIGHTING APPARATUS HAVING THEREOF}

An embodiment of the invention relates to a lighting module having a light-emitting element.

Embodiments of the invention relate to lighting modules that provide area light sources.

Embodiments of the invention relate to a lighting device having a lighting module.

Embodiments of the invention relate to a light unit or vehicle lamp having a lighting module or lighting device.

Typical lighting applications include backlights for displays and signage, as well as automotive lights.

Light-emitting devices, such as light-emitting diodes (LEDs), have advantages such as low power consumption, semi-permanent lifespan, fast response speed, safety, and environmental friendliness compared to existing light sources such as fluorescent lamps and incandescent lamps. These light emitting diodes are applied to various lighting devices such as various display devices, indoor lights, or outdoor lights.

Recently, lamps employing light-emitting diodes have been proposed as light sources for vehicles. Compared to incandescent lamps, light emitting diodes have an advantage in that they consume less power. However, because the emission angle of light emitted from a light emitting diode is small, when a light emitting diode is used as a vehicle lamp, there is a need to increase the light emitting area of the lamp using the light emitting diode.

Because light emitting diodes are small in size, they can increase the design freedom of lamps and are economical due to their semi-permanent lifespan.

Embodiments of the invention may provide a lighting module that provides a surface light source.

Embodiments of the invention may provide a lighting module in which a plurality of resin layers are disposed on a plurality of light-emitting devices.

Embodiments of the invention may provide a lighting module in which a phosphor is added to at least one of a plurality of resin layers disposed on a substrate and a light emitting device.

Embodiments of the invention can provide a lighting module having ink particles in at least one of a plurality of resin layers disposed on a substrate and a light emitting device.

Embodiments of the invention can provide a lighting module having phosphors and ink particles in a resin layer spaced apart from the substrate and the light emitting device.

Embodiments of the invention can provide a lighting module in which ink particles are added to the top layer of a plurality of resin layers disposed on a substrate and a light emitting device.

Embodiments of the invention provide a flexible lighting module having a plurality of light-emitting devices and a plurality of resin layers.

An embodiment of the invention provides a lighting module in which a plurality of bonding parts and a plurality of connectors are disposed on a second side of the substrate opposite to the first side.

Embodiments of the invention may provide a lighting module having a plurality of connectors coupled to a main board and electrically connected.

Embodiments of the invention provide a lighting module with improved light extraction efficiency and light distribution characteristics and a lighting device having the same.

A lighting module according to an embodiment of the invention includes a substrate, a plurality of light emitting elements disposed on a first surface of the substrate; a resin layer covering the plurality of light emitting devices; first and second bonding parts disposed on a second side of the substrate; and first and second connectors connected to each of the first and second bonding parts, wherein the first and second bonding parts are electrically connected to the plurality of light emitting devices, and each of the first and second connectors is connected to the plurality of light emitting devices. , a bottom portion facing the first and second bonding portions; a support portion protruding from the bottom in a direction away from the second surface of the substrate; It may include a contact portion protruding from the support portion toward the second surface of the substrate.

According to an embodiment of the invention, the support portion includes first and second support portions facing each other, and the bottom portion may include an elastic piece bent from the bottom portion and spaced apart from the second surface of the substrate.

According to an embodiment of the invention, the contact portion includes a first contact portion bent in an outward direction of the first support portion and extending in the direction of the substrate, and a second contact portion bent in an outward direction of the second support portion and extending in the direction of the substrate. may include.

According to an embodiment of the invention, the elastic piece may include first and second elastic pieces on both sides of the support portion that are bent from the bottom portion and extend in a direction that overlaps the bottom portion.

According to an embodiment of the invention, the first and second contact parts may include third and fourth elastic pieces bent from the ends of the first and second support parts.

According to an embodiment of the invention, first and second upper ends extending in directions adjacent to each other from the ends of the first and second supports, and first and second upper ends bent from the first and second upper ends toward the substrate. and ends, wherein the first and second ends may face each other on a central portion between the first and second supports.

According to an embodiment of the invention, the contact portion is spaced apart from the second surface of the substrate and may be obliquely bent from the first and second support portions.

According to an embodiment of the invention, the first and second connectors may include a metal frame.

According to an embodiment of the invention, the resin layer may include a first resin layer molding the light emitting devices, and a second resin layer including phosphor and ink particles on the surface of the first resin layer.

A lighting device according to an embodiment of the invention includes a circuit board having a plurality of light emitting elements on a first side, first and second bonding portions on a second side, and first and second bonding portions disposed on each of the first and second bonding portions. A lighting module including a second connector; and a main unit having a first through hole through which the first connector passes, a second through hole through which the second connector passes, and first and second electrode pads on a side opposite to the side facing the second side of the circuit board. It includes a substrate, and the lighting module includes a first resin layer covering the plurality of light emitting elements, and a second resin layer on the first resin layer, and each of the first and second connectors includes the first resin layer. and a bottom portion facing the second bonding portion; a support portion protruding from the bottom in a direction away from the second surface of the substrate; It includes a contact part protruding from the support part toward the second surface of the substrate, wherein the contact parts of the first and second connectors are in contact with the first and second electrode pads, and the bottom parts of the first and second connectors are in contact with the first and second electrode pads. It may be disposed between the second side of the circuit board and the main board.

Embodiments of the invention include at least one of phosphor and ink particles in the resin layer, thereby reducing hot spots and distributing light uniformly.

An embodiment of the invention provides a connector that is coupled and electrically connected to the main board to the lighting module, so that it can be easily coupled to the main board.

Embodiments of the invention combine the lighting module with the main board, thereby improving assembly of the lighting module and user convenience.

Figure 1 is a perspective view showing a lighting module according to an embodiment.
FIG. 2 is a cross-sectional view of the lighting module of FIG. 1 along the AA side.
Figure 3 is an exploded perspective view of the lighting module and connector of Figure 1.
Figure 4 is a perspective view of a lighting module having the connector of Figure 3;
Figure 5 is a detailed configuration diagram of the connector of Figure 3.
Figure 6 is an exploded perspective view of the lighting module and main board of Figure 4.
Figure 7 is an example in which a lighting module is coupled to the main board of Figure 6.
Figure 8 is a detailed view of the connection between the through hole of the main board and the connector of the lighting module in Figure 7.
Figure 9 is a perspective view showing a first modified example of a connector of a lighting module according to an embodiment of the invention.
Figure 10 is a perspective view showing a second modified example of a connector of a lighting module according to an embodiment of the invention.
Figure 11 is an example of a light emitting element of a lighting module according to an embodiment of the invention.
Figure 12 is a plan view of a vehicle to which a lamp having a lighting module according to an embodiment of the invention is applied.
Figure 13 is a diagram showing a lamp having a lighting module or lighting device according to an embodiment of the invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings.

However, the technical idea of the invention is not limited to some of the described embodiments, but may be implemented in various different forms, and as long as it is within the scope of the technical idea of the present invention, one or more of the components may be optionally used between the embodiments. It can be used by combination or substitution. In addition, terms (including technical and scientific terms) used in the embodiments of the present invention, unless specifically defined and described, are generally understood by those skilled in the art to which the present invention pertains. It can be interpreted as meaning, and the meaning of commonly used terms, such as terms defined in a dictionary, can be interpreted by considering the contextual meaning of the related technology. Additionally, the terms used in the embodiments of the invention are for describing the embodiments and are not intended to limit the invention. In this specification, the singular may also include the plural unless specifically stated in the phrase, and when described as "at least one (or more than one) of A and B and C", it is combined with A, B, and C. It can contain one or more of all possible combinations. Additionally, when describing the components of an embodiment of the present invention, terms such as first, second, A, B, (a), and (b) may be used. These terms are only used to distinguish the component from other components, and the essence, order, or order of the component is not determined by the term. And, when a component is described as being 'connected', 'coupled' or 'connected' to another component, the component is not only directly connected, coupled or connected to the other component, but also is connected to the other component. It may also include cases where other components are 'connected', 'coupled', or 'connected' by another component between them. Additionally, when described as being formed or disposed "on top or bottom" of each component, top or bottom refers not only to cases where two components are in direct contact with each other, but also to one This also includes cases where another component described above is formed or placed between two components. In addition, when expressed as "top (above) or bottom (bottom)", it can include not only the upward direction but also the downward direction based on one component.

The lighting device according to the invention can be applied to various lamp devices that require lighting, such as vehicle lamps, household lighting devices, or industrial lighting devices. For example, when applied to vehicle lamps, head lamps, side lights, side mirror lights, fog lights, tail lamps, brake lights, daytime running lights, vehicle interior lights, door scars, rear combination lamps, backup lamps Applicable to etc. The lighting device of the present invention can be applied to indoor and outdoor advertising devices, display devices, and various electric train fields. In addition, it can be applied to all lighting-related fields or advertising-related fields that are currently developed and commercialized or can be implemented according to future technological developments. It will be said that it is.

Figure 1 is a perspective view showing a lighting module according to an embodiment, Figure 2 is a cross-sectional view from the side A-A of the lighting module of Figure 1, Figure 3 is an exploded perspective view of the lighting module and connector of Figure 1, and Figure 4 is the connector of Figure 3. It is a perspective view of a lighting module having, and FIG. 5 is a detailed configuration diagram of the connector of FIG. 3.

Referring to FIGS. 1 and 2, the lighting module 100 includes a substrate 110, a plurality of light emitting devices 120 disposed on the first surface of the substrate 110, and a plurality of light emitting devices 120 disposed on the light emitting devices 120. It may include at least one or multiple resin layers 130 and 140.

The lighting module 100 may emit at least one light selected from blue, green, red, or yellow, and the light may be provided as a surface light source. The lighting module 100 can be applied to various lamp devices that require lighting, such as vehicle lamps, household lighting devices, and industrial lighting devices. For example, in the case of lighting modules applied to vehicle lamps, head lamps, side lights, side mirror lights, fog lights, tail lamps, turn signal lamps, back up lamps, and stop lamps. ), daytime running lights, vehicle interior lighting, door scarf, rear combination lamp, backup lamp, etc.

The substrate 110 may include an insulating or conductive material. The substrate 110 may be formed of a rigid or flexible material. The substrate 110 may be made of a transparent or opaque material. The board 110 may include, for example, at least one of a resin-based printed circuit board (PCB), a metal core PCB, a flexible PCB, a ceramic PCB, or an FR-4 board. .

The substrate 110 may include a first surface and a second surface opposite to the first surface. The first surface may be the upper surface of the substrate 110, and the second surface may be the lower surface of the substrate 110. The plurality of light emitting devices 120 and resin layers 1301 and 140 may be disposed on the first surface of the substrate 110. The first surface may include a horizontal plane, a convex curve, or a concave curve. The substrate 110 has a first wiring layer disposed on the first surface, and the first wiring layer has the plurality of light emitting devices 120 mounted thereon and connects the plurality of light emitting devices 120 in series or parallel. You can.

A reflective layer (not shown) may be disposed on the first surface of the substrate 110. The reflective layer may be disposed between the substrate 110 and the first resin layer 130. The reflective layer serves to guide the light generated from the light emitting device 120 upward. The reflective layer may include a white material. The reflective layer may include a resin material. The reflective layer may include a material such as PMMA, silicon, or epoxy, and may include at least one of, for example, TiO ₂ , SiO ₂ , and Al ₂ O ₃ therein.

A second wiring layer may be disposed on the second surface of the substrate 110. The second wiring layer may be electrically connected to the first wiring layer. The first and second wiring layers may be connected to each other through a via structure. The second wiring layer may include a plurality of bonding portions 111 and 113. The substrate 110 may include first and second bonding parts 111 and 113 on the second surface. The first and second bonding parts 111 and 113 may be spaced apart from each other, and the polarity of the power sources may be different.

The thickness of the substrate 110 may be 0.7 mm or less, for example, in the range of 0.3 mm to 0.7 mm. Since the substrate 110 is provided with a thin thickness, the thickness of the lighting module 100 may not be increased. Since the substrate 110 is provided with a thickness of 0.7 mm or less, it can support a flexible module. The thickness of the substrate 110 may be 0.1 times or less or in the range of 0.1 to 0.06 times the distance from the bottom of the substrate 110 to the top of the uppermost resin layer 140.

Here, the distance from the second surface of the substrate 110 to the top surface of the uppermost second resin layer 140 may be the module thickness. The thickness of the lighting module 100 may be 5.5 mm or less from the bottom of the substrate 110, may be in the range of 4.5 mm to 5.5 mm, or may be in the range of 4.5 mm to 5 mm. The thickness of the lighting module 100 may be the straight line distance between the second surface of the substrate 110 and the top surface of the second resin layer 140. The thickness of the lighting module 100 may be 220% or less of the thickness of the first resin layer 130, for example, in the range of 180% to 220%. Since the lighting module 100 is provided with a thickness of 5.5 mm or less, it can be provided as a flexible and slim surface light source module. In addition, the light emitted from the lighting module 100 having the above-described thickness can be provided with a uniform light distribution by a surface light source. In other words, the hot spots of the surface light source can be reduced and the light distribution can be improved.

The light emitting device 120 may be disposed on the substrate 110 . N light emitting devices 120 may be arranged in a first direction of the substrate 110, and M light emitting devices 120 may be arranged in a second direction perpendicular to the first direction. The N and M may be 1 or more, or one of N or M may be 1 or more and the other may be 2 or more. The light emitting devices 120 may be arranged at equal intervals from each other in the first and second directions, or at least one of them may be arranged at different intervals. For example, the separation distance between the light emitting devices 120 may be arranged to be the same to effectively implement a planar light source.

The light emitting device 120 may be provided as an LED chip and may emit blue, green, red, white, infrared, or ultraviolet light. For example, the light emitting device 120 may emit blue light in the range of 420 nm to 470 nm.

The light emitting device 120 may be provided as a compound semiconductor. The light emitting device 120 may be provided as, for example, a Group 2-6 compound semiconductor or a Group 3-5 compound semiconductor. For example, the light emitting device 120 includes at least two elements selected from aluminum (Al), gallium (Ga), indium (In), phosphorus (P), arsenic (As), and nitrogen (N). It can be.

The light emitting device 120 may include a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer. The first and second conductivity type semiconductor layers may be implemented with at least one of group 3-5 or group 2-6 compound semiconductors. For example, the first and second conductive semiconductor layers may include at least one selected from the group including GaN, AlN, AlGaN, InGaN, InN, InAlGaN, AlInN, AlGaAs, GaP, GaAs, GaAsP, AlGaInP, etc. . The first conductive semiconductor layer may be an n-type semiconductor layer doped with an n-type dopant such as Si, Ge, Sn, Se, or Te. The second conductive semiconductor layer may be a p-type semiconductor layer doped with a p-type dopant such as Mg, Zn, Ca, Sr, or Ba.

The active layer may be implemented as a compound semiconductor. For example, the active layer may be implemented with at least one of group 3-5 compound semiconductors or group 2-6 compound semiconductors. When the active layer is implemented as a multi-well structure, the active layer may include a plurality of well layers and a plurality of barrier layers arranged alternately, In _x Al _y Ga _{1 -x- y} N (0=x≤= 1, 0≤=y≤=1, 0≤=x+y≤=1) and may be disposed as a semiconductor material. For example, the active layer is selected from the group including InGaN/GaN, GaN/AlGaN, AlGaN/AlGaN, InGaN/AlGaN, InGaN/InGaN, AlGaAs/GaAs, InGaAs/GaAs, InGaP/GaP, AlInGaP/InGaP, InP/GaAs. It can contain at least one.

The light emitting device 120 may emit light through the top surface and at least one side, for example, it may emit light through the top surface and four sides. The light emitting device 120 may be disposed on the substrate 110 as a flip chip type.

Referring to FIG. 2, the first resin layer 130 may be disposed on the first surface of the substrate 110 and the light emitting device 120. The first resin layer 130 may be disposed on the top and side surfaces of the plurality of light emitting devices 120. The first resin layer 130 may include a top surface 131 and a side surface 132. The top surface 131 of the first resin layer 130 faces the top surface of the plurality of light emitting devices 120 and may be formed as a horizontal plane. The side surface 132 may face the side surfaces of the plurality of light emitting devices 120 .

The side surface 132 of the first resin layer 130 may be perpendicular to the upper surface of the substrate 110 or may include a curved surface. The side surface 132 may be provided as a curved surface with a predetermined curvature in the direction from the upper surface 131 to the substrate 110. Since the side surface 132 of the first resin layer 130 is disposed to face the light emitting device 120, the light emitted through the side surface 132 of the first resin layer 130 does not contribute to light distribution. Otherwise, it may be a loss. In order to reduce this loss of light, the side surface 132 of the first resin layer 130 may be provided as a curved surface that is convex outward from the center of the first resin layer 130. When the side surface 132 of the first resin layer 130 is formed as a curved surface, incident light can be refracted in the vertical direction.

As another example, the side surface 132 of the first resin layer 130 may extend vertically or obliquely from the top surface 131 toward the substrate.

The first resin layer 130 may have a curved boundary between the top surface 131 and the side surface 132. The curved portion may be continuously connected to the top surface 131 and the side surface 132 of the first resin layer 130. The curved portion may be arranged to overlap in the vertical direction with the light emitting device of the light emitting device 120 that is closest to the side 132 of the first resin layer 130.

The first resin layer 130 may be made of a transparent resin material, such as UV (Ultra violet) resin, silicone, or epoxy. For example, the UV resin may use a resin (oligomer type) whose main material is urethane acrylate oligomer. For example, urethane acrylate oligomer, a synthetic oligomer, can be used. The main material may further include monomers mixed with low boiling point diluted reactive monomers such as IBOA (isobornyl acrylate), HBA (Hydroxybutyl Acrylate), and HEMA (Hydroxy Metaethyl Acrylate), and a photoinitiator (such as 1-hydroxycyclohexyl) as an additive. Phenyl-ketone, Diphenyl), Diphwnyl (2,4,6-trimethylbenzoyl phosphine oxide), etc. or antioxidants can be mixed. The UV resin may be formed of a composition containing 10 to 21% of oligomers, 30 to 63% of monomers, and 1.5 to 6% of additives. In this case, the monomer may be composed of a mixture of 10 to 21% IBOA (isobornyl acrylate), 10 to 21% HBA (Hydroxybutyl Acrylate), and 10 to 21% HEMA (Hydroxy Metaethyl Acrylate). The additive can perform the function of initiating photoreactivity by adding 1 to 5% of a photoinitiator, and can be formed into a mixture that can improve yellowing by adding 0.5 to 1% of an antioxidant. The formation of the first resin layer 130 using the above-described composition allows the refractive index and thickness to be adjusted by forming a layer with a resin such as UV resin instead of a light guide plate, and at the same time, adhesive properties and reliability are achieved by using the above-described composition. and mass production speed can all be met.

The first resin layer 130 may further include a dispersing agent (beads or dispersing agent) therein. The dispersant may have a spherical shape, and its size may range from 4㎛ to 6㎛. The shape and size of the diffusion agent are not limited to this.

The content of the dispersant in the first resin layer 130 may be 5 wt% or less, for example, in the range of 2 wt% to 5 wt%. If the content of the diffusion agent is less than the above range, there is a limit to lowering the hot spot, and if it is greater than the above range, light transmittance may be reduced. Accordingly, by disposing the diffuser in the above amount in the first resin layer 130, it can diffuse light and reduce hot spots without reducing light transmittance. When a diffusion material or a light-blocking material is disposed in the second resin layer 140, the diffusion agent in the first resin layer 130 may be removed.

In the above, the first resin layer 130 is formed as one layer, but it is not limited to this and the first resin layer 130 may include two or more layers. The first resin layer 130 may include a light-transmitting layer containing no impurities and a diffusion layer containing a diffusion agent on the light-transmitting layer. Alternatively, a diffusion layer may be formed below the light transmitting layer.

The second resin layer 140 may be formed on the first resin layer 130. The second resin layer 140 may include a transparent material or a transparent insulating material. The second resin layer 140 may be molded on the surface of the first resin layer 130. The second resin layer 140 may be made of a resin material such as epoxy or silicone.

For example, the second resin layer 140 may be made of silicon, or may be made of silicon having different chemical bonds. Silicone is a polymer that combines the inorganic silicon and the organic carbon, and has physical properties such as thermal stability, chemical stability, wear resistance, and glossiness of inorganic materials and reactivity, solubility, elasticity, and processability, which are characteristics of organic materials. Silicon may include general silicon and fluorine silicon with an increased fluorine ratio. Increasing the fluorine ratio of fluorine silicon has the effect of improving moisture resistance.

The second resin layer 140 may include a top surface 141 and a side surface 143. The top surface may be disposed on the top surface 131 of the first resin layer 130, and the side surface 143 may be disposed on the side surface 132 of the first resin layer 130. The thickness of the second resin layer 140 on the side surface 143 and the thickness of the second resin layer 140 on the top surface 141 may be the same. The side surfaces 132 and 143 of the first and second resin layers 130 and 140 may extend in the direction of the substrate 110 in a curved, vertical, or inclined surface.

The first and second resin layers 130 and 140 are formed so that the side surfaces 132 and 143 have curved surfaces, so that the light emitting device 120 is disposed at the corner area of the second resin layer 140 and the outermost portion of the substrate 110. ) is reduced, and dark lines can be prevented from occurring at the boundary between the top surface 141 and the side surface 143 of the second resin layer 140.

The side surface 143 of the second resin layer 140 may be in contact with the first surface of the substrate 110. The bottom edge of the second resin layer 140 may be disposed on the top edge of the substrate 110. Since the second resin layer 140 extends to the edge of the upper surface of the substrate 110, the planar light source can be irradiated on the entire upper surface of the substrate 110. This is because the first and second bonding parts 111 and 113 for external connection are disposed on the second side of the substrate 110, so that the first side of the substrate 110 on which the first resin layer 130 is not formed is formed. may not provide installation space for connectors for external connections. The substrate 110 may be provided in unit module size. In addition, the side of the substrate 110 and the side of the first or second resin layers 130 and 140 may be disposed on the same plane, and these sides are cut surfaces and can be provided as a unit-sized lighting module 100. You can.

As another example, the second resin layer 140 may be provided without a side surface, and in this case, the side surface of the first resin layer 130 may be the outermost surface of the lighting module 100. Here, the unit module is an example in which the side of the first resin layer 130 is exposed from the second resin layer 140.

The second resin layer 140 may include a wavelength conversion means that receives light emitted from the light emitting device 120 and provides wavelength-converted light. For example, the second resin layer 140 may include at least one selected from phosphors or quantum dots. The phosphor or quantum dot may emit blue, green, or red light.

The phosphor may be evenly disposed inside the second resin layer 140. The phosphor may include a phosphor of a fluoride compound, for example, at least one of an MGF-based phosphor, a KSF-based phosphor, or a KTF-based phosphor. The phosphors may emit different peak wavelengths, and the light emitted from the light emitting device 120 may emit different yellow and red colors or different red peak wavelengths.

When the phosphor is a red phosphor, the red phosphor may have a wavelength range from 610 nm to 650 nm, and the wavelength may have a width of less than 10 nm. The red phosphor may include a fluoride-based phosphor.

The composition of the phosphor according to the embodiment must basically comply with stoichiometry, and each element can be replaced with another element within each group on the periodic table. For example, Sr can be replaced with alkaline earth (II) group Ba, Ca, Mg, etc., and Y can be replaced with lanthanide group Tb, Lu, Sc, Gd, etc. In addition, Eu, etc., which is an activator, can be replaced with Ce, Tb, Pr, Er, Yb, etc. depending on the desired energy level, and the activator can be used alone or an activator can be additionally applied to modify the properties.

The quantum dot may include a group II-VI compound or a group III-V compound semiconductor, and may emit red light. The quantum dots are, for example, ZnS, ZnSe, ZnTe, CdS, CdSe, CdTe, GaN, GaP, GaAs, GaSb, InP, InAs, In, Sb, AlS, AlP, AlAs, PbS, PbSe, Ge, Si, CuInS ₂ , CuInSe ₂ , etc. and combinations thereof.

The second resin layer 140 may include ink particles therein. The ink particles may include at least one of metallic ink, UV ink, or curing ink. The size of the ink particles may be smaller than the size of the phosphor. The surface color of the ink particles may be any one of green, red, yellow, and blue. The types of ink include PVC (poly vinyl chloride) ink, PC (polycarbonate) ink, ABS (acrylonitrile butadiene styrene copolymer) ink, UV resin ink, epoxy ink, silicone ink, PP ( polypropylene) ink, water-based ink, plastic ink, and PMMA. It can be selectively applied among (poly methyl methacrylate) ink and PS ( polystyrene) ink. Here, the width or diameter of the ink particles may be 5㎛ or less, for example, in the range of 0.05㎛ to 1㎛. At least one of the ink particles may have a size smaller than the wavelength of light. The color of the ink particles may include at least one of red, green, yellow, and blue. For example, the phosphor emits red wavelengths, and the ink particles may contain red. For example, the red color of the ink particles may be darker than the color of the phosphor or the wavelength of light. The ink particles may have a color different from the color of light emitted from the light emitting device. The ink particles can have the effect of blocking or blocking incident light.

The second resin layer 140 may include at least two types of diffusion agent, ink particles, and phosphor. The second resin layer 140 may include ink particles and phosphors without a diffusion agent. The content of the phosphor may be added in the same amount as the resin material forming the second resin layer 140. The phosphor may be added at a ratio of 60% to 40% compared to 40% to 60% of the resin material of the second resin layer 140. For example, the phosphor and the resin material of the second resin layer 140 may be added at the same ratio, for example, mixed at 50% to 50%. The content of the phosphor may differ from the resin material of the second resin layer 140 by 20% or less or 10% or less.

In the embodiment, the content of the phosphor is added in the second resin layer 140 in an amount of 40 wt% or more or in the range of 40 wt% to 60 wt%, so that the color on the surface of the second resin layer 140 is the color of the phosphor. and can improve the diffusion and wavelength conversion efficiency of light. In addition, transmission of the wavelength of light emitted from the light emitting device 120, for example, blue light, through the second resin layer 140 can be reduced. Additionally, light extracted through the second resin layer 140 may be provided as a surface light source based on the wavelength of the phosphor.

The second resin layer 140 may be provided with a thickness thinner than the thickness of the first resin layer 130. If the second resin layer 140 is thick, light transmittance may decrease, and if it is thin, wavelength conversion efficiency may decrease.

The thickness of the second resin layer 140 may be, for example, in the range of 0.3 mm to 0.5 mm. The thickness of the second resin layer 140 may be 25% or less of the thickness of the first resin layer 130, for example, in the range of 16% to 25%. If the thickness of the second resin layer 140 is thicker than the above range, light extraction efficiency may decrease or module thickness may increase, and if it is smaller than the above range, it may be difficult to suppress hot spots or wavelength conversion efficiency may be reduced. . In addition, the second resin layer 140 is a layer for wavelength conversion and external protection, and if it is thicker than the above range, the ductility characteristics of the module may be reduced and the degree of design freedom may be reduced.

The phosphor added to the second resin layer 140 may include at least one or two of amber phosphor, yellow phosphor, green phosphor, red phosphor, or blue phosphor.

Since the second resin layer 140 includes a phosphor, the exterior color can be displayed as the color of the phosphor. The surface of the second resin layer 140 or the surface of the lighting module 100 may be provided as a red image when the light-emitting device 120 is turned off, and when the light-emitting device 120 is turned on, a predetermined image may be provided. Red light with luminous intensity can be diffused and provided as a red image of a planar light source. Depending on whether the light emitting device 120 is turned on or off, the color coordinates of the surface color may have different values within the color of the phosphor.

Phosphor and ink particles may be included in the second resin layer 140. The emission wavelength of the phosphor and the ink particles may include the same color or the same colored color. The color may be one of the colors of the phosphor. The content of the phosphor in the second resin layer 140 may range from 12 wt% to 23 wt%, and the content of the ink particles may range from 3 wt% to 13 wt%. Since the weight of the ink particles is smaller than that of the phosphor, the ink particles may be distributed in an area adjacent to the surface of the second resin layer 140 rather than the phosphor. Accordingly, the color of the surface of the second resin layer 140 can be provided as the color of ink particles. Transmission of light can be suppressed by these ink particles, and hot spots can be reduced.

When the ink particles are red, the light-emitting surface of the lighting module 100 may appear red when the light-emitting device 120 is not turned on. That is, the lighting module 100 is displayed as red when the light is turned on or not, thereby preventing the feeling of heterogeneity due to color difference.

The second resin layer 140 may include a first layer to which a phosphor is added and a second layer to which the ink particles are added, and the first layer includes the first resin layer 130 and the second layer. It can be placed between layers. By separately laminating the second layer containing the ink particles, the phosphor content of the first layer can be reduced.

Referring to FIGS. 3 and 4 , first and second bonding portions 111 and 113 may be disposed on the second surface of the substrate 110 of the lighting module 100. Each of the first and second bonding parts 111 and 113 may be electrically connected to the light emitting device 120. Each of the first and second bonding parts 111 and 113 may have a circular or polygonal shape, or may include a plurality of pad patterns. The distance between the first and second bonding parts 111 and 113 may be more than 1/2 of the length of the substrate 110. The first or second bonding portions 111 and 113 may be spaced a predetermined distance B1 from one edge or an edge in the longitudinal direction of the substrate 110 . The distance B1 may be smaller than the distance between the first and second bonding parts 111 and 113, and may be spaced apart by more than 5 mm, for example. The first and second bonding parts 111 and 113 can support different areas of the substrate 110, improve heat transfer efficiency, and facilitate circuit connection due to the above-mentioned separation distance.

The first and second bonding parts 111 and 113 are made of titanium (Ti), copper (Cu), nickel (Ni), gold (Au), chromium (Cr), tantalum (Ta), platinum (Pt), and tin ( It includes at least one of Sn), silver (Ag), and phosphorus (P).

The lighting module 100 may include a first connector 20 connected to the first bonding part 111 and a second connector 30 connected to the second bonding part 113. The first and second connectors 20 and 30 may be bonded to the first and second bonding parts 111 and 113, respectively, using conductive bonding members. The first and second connectors 20 and 30 may be made of metal, such as copper (Cu), nickel (Ni), gold (Au), chromium (Cr), tin (Sn), silver (Ag), Contains at least one of aluminum (Al). The connectors 20 and 30 may supply control signals or power to the light emitting device disposed on the first surface of the substrate 110.

The first and second connectors 20 and 30 may protrude in a vertical direction with respect to the second surface of the substrate 110. The first and second connectors 20 and 30 may have the same shape or structure, but are not limited thereto.

Each of the above-described first and second connectors 20 and 30 may be penetrated through through holes 61 and 63 disposed on the main board 60, as shown in FIG. 6. The first and second connectors 20 and 30 are inserted into and protrude from each through hole 61 and 63 of the main board 60, and the first and second connectors disposed on the outer surface of the main board 60 It may be in electrical contact with the two-electrode pads 65 and 67. The height of the first and second connectors 20 and 30 may be greater than the thickness of the main board 60.

The first connector will be described with reference to FIG. 5, and the configuration of the second connector will refer to the description of the first connector.

As shown in FIG. 5, the first connector 20 may include a bottom portion 21, support portions 25 and 26, and contact portions 27A and 28A. The bottom portion 21, the support portions 25 and 26, and the contact portions 27A and 28A may be integrally formed with a metal frame. The bottom portion 21 faces the first surface of the substrate 110 and may be bonded to the first bonding portion 111. A bottom hole 22 is disposed within the bottom portion 21, and the bottom hole 22 strengthens the rigidity of the bottom portion 21 and allows the bonding material to be bonded to the first bonding portion 111 to flow in. Thus, the bonding material can be prevented from being exposed to the outside of the connector.

The bottom portion 21 may include first and second elastic pieces 23 and 24 on both sides of the support portions 25 and 26. The support portions 25 and 26 may be disposed in an area between the first and second elastic pieces 23 and 24 in the horizontal direction. The first elastic piece 23 may be bent from one end of the bottom portion 21 in a direction that overlaps the upper surface of the bottom portion 21. The first elastic piece 23 may overlap the upper surface of the bottom 21 in a vertical direction. The first elastic piece 23 may be disposed at an angle of 5 degrees or more or an angle of 5 to 40 degrees with respect to the upper surface of the bottom portion 21.

The second elastic piece 24 may be bent from the other end of the bottom portion 21 in a direction that overlaps the upper surface of the bottom portion 21. The second elastic piece 24 may overlap the upper surface of the bottom 21 in a vertical direction. The second elastic piece 24 may be disposed at an angle of 5 degrees or more or an angle of 5 to 40 degrees with respect to the upper surface of the bottom portion 21. If the inclination angle of the first and second elastic pieces 23 and 24 is smaller than the above range, the elastic repulsion force may be small, and if it is larger than the above range, contact failure may occur due to pressing of the main board 60. The first and second elastic pieces 23 and 24 overlap in a vertical direction with the upper surface of the bottom portion 21 and may have an elastic repulsion force in the vertical direction.

6 to 8, when the first and second connectors 20 and 30 are coupled to the main board 60 through the through holes 61 and 63, the first and second elastic pieces ( 23 and 24 may provide a predetermined elastic repulsion force to the upper surface of the main substrate 60, that is, the surface facing the second surface of the substrate 110.

The support portions 25 and 26 of the first connector 20 may include a first support portion 25 and a second support portion 26 facing each other. The first and second supports 25 and 26 may protrude in a vertical direction from both ends of the first connector 20 or may protrude in a direction away from the substrate 110 . The distance between the first and second support parts 25 and 26 at the end area 29 may be closer than that at the area adjacent to the bottom part 21 . Since the gap between the first and second supports 25 and 26 gradually narrows at each end and are arranged to face each other, the ends of the first and second supports 25 and 26 support each other and the first and second supports 25 and 26 support each other. The tilt of the second supports 25 and 26 can be reduced.

As shown in FIG. 6, the maximum distance B3 between the first and second supports 25 and 26 may be smaller than the diameter B5 or width of the through holes 61 and 63 of the main board 60. . The distance B3 is 5 mm or less, for example, in the range of 3 mm to 5 mm. If it is smaller than the above range, there is a problem that it may be damaged by the height B4 of the connectors 20 and 30, and if it is larger than the above range, the coupling force increases. It may be insignificant. The maximum width (B3) of the supports (25, 26) is 50% or more of the height (B4) of the connectors (20, 30) or is arranged in the range of 50% to 80%, to stably support the connectors (20, 30). I can support it.

The first support portion 25 and the second support portion 26 may be disposed outside the area disposed between the first and second elastic pieces 23 and 24. The end area 29 between the first and second supports 25 and 26 is disposed in a direction perpendicular to the center of the bottom 21, and is disposed in a direction perpendicular to the center of the first and second supports 25 and 26. We can support each other. The area between the first and second supports 25 and 26 may be an empty area.

The contact portions 27A and 28A may include first and second contact portions 27A and 28A. The first contact portion 27A may be bent from the first support portion 25 toward the first surface of the substrate 110. The first contact portion 27A may overlap the first support portion 25 in the horizontal direction. The first contact portion 27A may include the third elastic piece 27, and the third elastic piece 27 is located between the first contact portion 27A and the end of the first support portion 25. A predetermined elastic repulsion force can be provided. The third elastic piece 27 may be bent from an end of the first support portion 25 toward the outside of the first support portion 25 and may extend along the outer surface of the first support portion 25 . The first contact portion 27A may be bent in a vertical direction from the end of the third elastic piece 27 toward the substrate 110. The third elastic piece 27 may have an elastic repulsion force in the vertical direction and may be spaced apart from the second elastic piece 24 by a predetermined distance.

The second contact portion 28A may be bent from the second support portion 26 toward the second surface of the substrate 110. The second contact portion 28A may overlap the second support portion 26 in the horizontal direction. The second contact portion 28A may include the fourth elastic piece 28, and the fourth elastic piece 28 is located between the second contact portion 28A and the end of the second support portion 26. A predetermined elastic repulsion force can be provided. The fourth elastic piece 28 may be bent from an end of the second support portion 26 toward the outside of the second support portion 26 and extend along the outer surface of the second support portion 26. The second contact portion 28A may be bent in a vertical direction from the end of the fourth elastic piece 28 toward the substrate. The fourth elastic piece 28 may have an elastic repulsion force in the vertical direction and may be spaced apart from the first elastic piece 23 by a predetermined distance.

Here, as shown in FIGS. 5 and 8, the distance between the first contact portion 27A and the second elastic piece 24 may be smaller than the thickness B6 of the main substrate 60. The distance between the first contact portion 28A and the first elastic piece 23 may be smaller than the thickness B6 of the main substrate 60. The lower ends of the first and second contact portions 27A and 28A may be spaced apart from a straight line extending from the upper ends of the first and second elastic pieces 23 and 24 at a predetermined distance B2. The gap B2 may be smaller than the thickness B6 of the main substrate 60, for example, 2 mm or more, for example, in the range of 2 mm to 5 mm. The gap B2 is determined by considering the height of the elastic reaction force of the first and second elastic pieces 23 and 24 and the main substrate 60, and the contact portions 27A and 28A and the electrode pads 65 and 67. Poor contact between teeth can be prevented.

6 to 8, when the first and second connectors 20 and 30 are inserted through the through holes 61 and 63 of the main board 60, the upper surface (or The third surface) is in contact with the first and second elastic pieces, and the first and second elastic pieces push the main substrate 60 in a direction away from the substrate 110.

Here, the first and second contact portions 27A and 28A may be in contact with the first and second electrode pads 65 and 67 respectively disposed on the lower surface (or fourth surface) of the main board 60. . That is, the first and second contact portions 27A and 28A provide a predetermined elastic repulsion force to the electrode pads 65 and 67 disposed on the lower surface of the main board 60 and contact the electrode pads 65 and 67. It can be. At this time, the ends of the first and second support parts 25 and 26 have a predetermined gap, so that a predetermined elastic repulsion force can be provided to the first and second contact parts 27A and 28A.

The first and second connectors 20 and 30 are coupled through the main board 60, so that the lighting module 100 can be easily driven and controlled through the main board 60. Additionally, the structure of the lighting module 100 can be slimmed and exposure of the first surface of the substrate 110 can be minimized. That is, the upper or lower surface area of the lighting module 100 may be the light emitting area of the lighting module 100.

The electrode pads 65 and 67 of the main board 60 are disposed on both sides of the first and second through holes 61 and 63, respectively, and are disposed on the first and second connectors 20 and 30. Contact defects with the first and second contact portions 27A and 28A can be reduced. Additionally, the maximum distance between the outer surfaces of the first and second supports 25 and 26 may be the same as the diameter of the through holes 61 and 63, or may have a difference of 0.5 mm or less. This means that the ends of the first and second support parts 25 and 26 may contact each other when inserted into the main board 60 and may be spaced apart from each other after insertion.

Figure 9 is a first modified example of the connector of the lighting module disclosed in Figures 4 and 5. For the contact structure of the connector according to the first modified example with the main board, refer to the description disclosed above.

9 and 6, the connector 20A may include a bottom portion 31, support portions 33 and 34, and contact portions 33A and 34A. The bottom portion 31, the support portions 33 and 34, and the contact portions 33A and 34A may be formed integrally with a metal frame. The bottom portion 31 faces the first surface of the substrate 110 and may be bonded to the first bonding portion 111. A bottom hole 32 is disposed within the bottom portion 31, and the bottom hole strengthens the rigidity of the bottom portion 31 and allows the bonding material bonded to the first bonding portion 111 to flow in. Bonding material can be prevented from being exposed to the outside of the connector.

The bottom portion 31 may include a plurality of elastic pieces 31A outside the support portions 33 and 34. The plurality of elastic pieces 31A may be bent in a direction away from the bottom 31 and the second surface of the substrate 110 and may be spaced apart from the first surface of the substrate 110 by a predetermined distance. The elastic piece 31A may have an elastic repulsion force in a vertical direction from the bottom portion 31.

The support portions 33 and 34 of the connector 20A may include a first support portion 33 and a second support portion 34. The first and second supports 33 and 34 may protrude in a vertical direction from both ends of the first connector 20. The first and second supports 33 and 34 may become narrower toward the ends, thereby providing elastic repulsion force at the ends of the first and second supports 33 and 34. The area A0 between the first and second supports 25 and 26 may be an empty area.

The end of the first support part 33 is a first upper part 37 bent in the direction of the second support part 34, and the end of the second support part 34 is bent in the direction of the first support part 33. 2It may include an upper part (38). The first and second upper portions 37 and 38 include first and second ends 37A and 38A bent in the direction of the substrate 110, and the first upper portion 37 and the second upper portion 38 ) is parallel to the second surface of the substrate 110, and the first and second ends 37A and 38A may be bent at a predetermined distance. Here, the first and second upper ends 37 and 38 have symmetrical shapes, the top view may be a hemisphere or a polygonal shape, and the height C8 of the first and second ends 37A and 38A is For a predetermined surface contact, may be more than twice the thickness of the metal frame provided as the connector 20A.

The first and second ends (37A, 38A) may overlap in the horizontal direction at a predetermined height (C8), so that the first and second ends (37A, 38A) are connected to the main board (60) by the connector ( When 20A) is inserted, they may contact and be spaced apart from each other, thereby providing elastic repulsion force to the first and second supports 33 and 34.

The first support portion 33 may include a first contact portion 33A, and the second support portion 34 may include a second contact portion 34A. The first contact portion 33A may be cut from the first support portion 33 and protrude outward. The first contact portion 33A may be spaced a predetermined distance from the end of the first support portion 33 and may be disposed to be inclined at a predetermined angle with respect to the first support portion 33. The area R1 where the first contact part 33A is cut may be an open area of the first support part 33.

The second contact portion 34A may be cut from the second support portion 34 and protrude outward. The second contact portion 34A may be bent from an area adjacent to the end of the second support portion 34 and disposed to be inclined at a predetermined angle with respect to the second support portion 34. The area R1 where the first contact part 33A is cut may be an open area of the first support part 33.

The first contact portion 33A may be cut in a direction away from the surface of the first support portion 33 with respect to the second support portion 34. The second contact portion 34A may be cut in a direction away from the surface of the second support portion 34 with respect to the first support portion 33. The height C5 of the cut portion of the first and second contact portions 33A and 34A may be lower than the height C4 of the connector 20A, and may be in the range of 40% to 80% of the height C4. can be placed.

The distance between the first and second contact portions 33A and 34A may be further apart than the through holes 61 and 63 of the main board 60. The first and second contact portions 33A and 34A are spaced a predetermined distance C6 from the plurality of elastic pieces 31A, and after the main substrate 60 is inserted, the electrode pad of the main substrate 60 (65,67). Accordingly, the first and second contact portions 33A and 34A connect the lighting module 100 through the main board 60, thereby reducing the problem of exposing other components or boards to the lighting module 100. there is.

Figure 10 is a second modified example of the connector of the lighting module of Figures 5 and 6. In describing Figure 10, the same configuration as Figures 5, 6, and 9 will be referred to the description disclosed above.

Referring to FIG. 10, the connector 20B may include a bottom portion 41, support portions 43 and 44, and contact portions 43A and 44A. The bottom portion 41 faces the first surface of the substrate 110 and may be bonded to the first bonding portion 111 . The bottom portion 41 may be provided without a bottom hole. The bottom portion 41 may include a plurality of elastic pieces 41A outside the support portions 43 and 44. The plurality of elastic pieces 41A may be bent from the bottom 41 and spaced apart from the first surface of the substrate 110 by a predetermined distance. The elastic piece 41A may have an elastic repulsion force in a vertical direction from the bottom portion 41.

The support portions 43 and 44 of the connector may include a first support portion 43 and a second support portion 44. The first and second supports 43 and 44 may protrude in a vertical direction from both ends of the first connector 20B. The first and second supports 43 and 44 may become narrower toward the ends, thereby providing elastic repulsion force at the ends of the first and second supports 43 and 44. The area A0 between the first and second supports 43 and 44 may be an empty area.

The end of the first support part 43 is a first upper part 47 bent in the direction of the second support part 44, and the end of the second support part 44 is bent in the direction of the first support part 43. 2It may include an upper part (48). The first and second upper portions 47 and 48 include first and second ends 47A and 48A bent in the direction of the substrate 110, and the first upper portion 37 and the second upper portion 38 ) is parallel to the second surface of the substrate 110, and the first and second ends 47A and 48A may be bent at a predetermined distance. The first and second ends 47A and 48A may overlap in the horizontal direction at a predetermined distance, so that the first and second ends 47A and 48A are connected to the main board 60 by the connector 20B. When inserted, they may contact and be spaced apart from each other, thereby providing elastic repulsion force to the first and second supports 43 and 44.

The first support portion 43 may include a first contact portion 43A, and the second support portion 44 may include a second contact portion 44A. The first contact portion may be cut from the first support portion 43 and protrude in an outward direction. The first contact portion 43A may be bent from an area adjacent to the end of the first support portion 43 and disposed to be inclined at a predetermined angle with respect to the first support portion 43. The area R1 where the first contact part 43A is cut may be an open area of the first support part 43.

The second contact portion 44A may be cut from the second support portion 44 and protrude outward. The second contact portion 44A may be bent from an area adjacent to the end of the second support portion 44 and disposed to be inclined at a predetermined angle with respect to the second support portion 44. The area where the first contact part 43A is cut may be an open area of the first support part 43.

The first contact portion 43A may be cut in a direction away from the surface of the first support portion 43 with respect to the second support portion 44. The second contact portion 44A may be cut in a direction away from the surface of the second support portion 44 with respect to the first support portion 43. The height of the cut portion of the first and second contact portions 43A and 44A may be lower than the height of the connector 20B and may be arranged in a range of 40% to 80% of the height of the connector.

The distance between the first and second contact portions 43A and 44A may be further apart than the through holes 61 and 63 of the main board 60. The first and second contact portions 43A and 44A are kept at a predetermined distance from the plurality of elastic pieces 41A, and after the main substrate 60 is inserted, the electrode pads 65, 67) can be contacted. Accordingly, the first and second contact parts connect the lighting module 100 through the main board 60, thereby reducing the problem of exposing other components or boards to the lighting module 100.

Figure 11 is a diagram showing an example of a light-emitting device of a lighting module according to an embodiment of the invention.

Referring to FIG. 11, the light emitting device disclosed in the embodiment includes a light emitting structure 225 and a plurality of electrodes 245 and 247. The light emitting structure 225 may be formed of a compound semiconductor layer of group II to VI elements, for example, a compound semiconductor layer of group III-V elements or a compound semiconductor layer of group II-VI elements. The plurality of electrodes 245 and 247 are selectively connected to the semiconductor layer of the light emitting structure 225 and supply power.

The light emitting device may include a substrate 221. The substrate 221 is disposed on the light emitting structure 225. The substrate 221 may be, for example, a light-transmitting, insulating, or conductive substrate. For example, the substrate 221 may be made of at least one of sapphire (Al ₂ O ₃ ), SiC, Si, GaAs, GaN, ZnO, Si, GaP, InP, Ge, and Ga ₂ O ₃ . A plurality of convex portions (not shown) may be formed on at least one or both of the top and bottom surfaces of the substrate 221 to improve light extraction efficiency. The side cross-sectional shape of each convex portion may include at least one of a hemispherical shape, a semi-elliptical shape, or a polygonal shape. This substrate 221 may be removed, but there is no limitation thereto.

At least one of a buffer layer (not shown) and a low-conductivity semiconductor layer (not shown) may be included between the substrate 221 and the light emitting structure 225. The buffer layer is a layer to alleviate the difference in lattice constant between the substrate 221 and the semiconductor layer, and can be selectively formed from group II to VI compound semiconductors. An undoped group III-V compound semiconductor layer may be further formed under the buffer layer, but the present invention is not limited thereto.

The light emitting structure 225 may be disposed under the substrate 221 and includes a first conductive semiconductor layer 222, an active layer 223, and a second conductive semiconductor layer 224. Another semiconductor layer may be further disposed on at least one of the above and below each of the layers 222, 223, and 224, but is not limited thereto.

The first conductive semiconductor layer 222 is disposed under the substrate 221 and may be implemented as a semiconductor doped with a first conductive dopant, for example, an n-type semiconductor layer. The first conductive semiconductor layer 222 includes a composition of In _x Al _y Ga _{1 -x- y} N (0≤x≤1, 0≤y≤1, 0≤x+y≤1). The first conductive semiconductor layer 222 may be selected from compound semiconductors of group III-V elements, such as GaN, AlN, AlGaN, InGaN, InN, InAlGaN, AlInN, AlGaAs, GaP, GaAs, GaAsP, and AlGaInP. . The first conductive dopant is an n-type dopant and includes dopants such as Si, Ge, Sn, Se, and Te. The active layer 223 is disposed under the first conductive semiconductor layer 222 and optionally includes a single quantum well, multiple quantum well (MQW), quantum wire structure, or quantum dot structure. It includes the cycle of the well layer and the barrier layer. The period of the well layer/barrier layer is, for example, InGaN/GaN, GaN/AlGaN, AlGaN/AlGaN, InGaN/AlGaN, InGaN/InGaN, AlGaAs/GaA, InGaAs/GaAs, InGaP/GaP, AlInGaP/InGaP, InP/GaAs Contains at least one of the pairs. The second conductive semiconductor layer 224 is disposed below the active layer 223. The second conductive semiconductor layer 224 is a semiconductor doped with a second conductive dopant, for example, In _x Al _y Ga _{1 -xy} N (0≤x≤1, 0≤y≤1, 0≤x+y≤ 1) It includes the composition formula. The second conductive semiconductor layer 224 may be made of at least one of compound semiconductors such as GaN, InN, AlN, InGaN, AlGaN, InAlGaN, AlInN, AlGaAs, GaP, GaAs, GaAsP, and AlGaInP. The second conductive semiconductor layer 224 is a p-type semiconductor layer, and the first conductive dopant is a p-type dopant and may include Mg, Zn, Ca, Sr, and Ba.

As another example of the light emitting structure 225, the first conductive semiconductor layer 222 may be implemented as a p-type semiconductor layer, and the second conductive semiconductor layer 224 may be implemented as an n-type semiconductor layer. A third conductive semiconductor layer having a polarity opposite to that of the second conductive type may be formed under the second conductive semiconductor layer 224. Additionally, the light emitting structure 225 may be implemented as any one of an n-p junction structure, a p-n junction structure, an n-p-n junction structure, and a p-n-p junction structure.

First and second electrodes 245 and 247 are disposed below the light emitting structure 225. The first electrode 245 is electrically connected to the first conductive semiconductor layer 222, and the second electrode 247 is electrically connected to the second conductive semiconductor layer 224. The first and second electrodes 245 and 247 may have a polygonal or circular bottom shape. A plurality of recesses 226 may be provided within the light emitting structure 225.

The light emitting device includes first and second electrode layers 241 and 242, a third electrode layer 243, and insulating layers 231 and 233. Each of the first and second electrode layers 241 and 242 may be formed as a single layer or multiple layers and may function as a current diffusion layer. The first and second electrode layers 241 and 242 include a first electrode layer 241 disposed below the light emitting structure 225; And it may include a second electrode layer 242 disposed below the first electrode layer 241. The first electrode layer 241 spreads the current, and the second electrode layer 241 reflects the incident light.

The first and second electrode layers 241 and 242 may be formed of different materials. The first electrode layer 241 may be formed of a light-transmitting material, for example, metal oxide or metal nitride. The first electrode layer 241 is, for example, indium tin oxide (ITO), ITO nitride (ITON), indium zinc oxide (IZO), IZO nitride (IZON), indium zinc tin oxide (IZTO), and indium aluminum zinc oxide (IAZO). , it can be selectively formed from indium gallium zinc oxide (IGZO), indium gallium tin oxide (IGTO), aluminum zinc oxide (AZO), antimony tin oxide (ATO), and gallium zinc oxide (GZO). The second electrode layer 242 is in contact with the lower surface of the first electrode layer 241 and may function as a reflective electrode layer. The second electrode layer 242 includes metal, such as Ag, Au, or Al. The second electrode layer 242 may partially contact the lower surface of the light emitting structure 225 when a portion of the first electrode layer 241 is removed.

As another example, the first and second electrode layers 241 and 242 may be stacked in an omni-directional reflector (ODR) structure. The non-directional reflective structure may be formed as a stacked structure of a first electrode layer 241 having a low refractive index and a second electrode layer 242 made of a highly reflective metal in contact with the first electrode layer 241. The electrode layers 241 and 242 may, for example, be made of a laminated structure of ITO/Ag. The omnidirectional reflection angle can be improved at the interface between the first electrode layer 241 and the second electrode layer 242.

As another example, the second electrode layer 242 may be removed and formed of a reflective layer made of another material. The reflective layer may be formed in a distributed Bragg reflector (DBR) structure, which includes a structure in which two dielectric layers with different refractive indices are alternately arranged, for example, a SiO ₂ layer. , Si ₃ N ₄ layer, TiO ₂ layer, Al ₂ O ₃ layer, and MgO layer may each be included. As another example, the electrode layers 241 and 242 may include both a distributed Bragg reflection structure and a non-directional reflection structure, and in this case, a light emitting device having a light reflectance of 98% or more can be provided. Since the light emitting device mounted in the flip manner emits light reflected from the second electrode layer 242 through the substrate 221, it can emit most of the light in the vertical direction. Light emitted from the side of the light emitting device may be reflected to the light emission area by a reflective member through an adhesive member according to an embodiment.

The third electrode layer 243 is disposed below the second electrode layer 242 and is electrically insulated from the first and second electrode layers 241 and 242. The third electrode layer 243 is made of metal, such as titanium (Ti), copper (Cu), nickel (Ni), gold (Au), chromium (Cr), tantalum (Ta), platinum (Pt), and tin (Sn). ), silver (Ag), and phosphorus (P). A first electrode 245 and a second electrode 247 are disposed below the third electrode layer 243.

The insulating layers 231 and 233 block unnecessary contact between the first and second electrode layers 241 and 242, the third electrode layer 243, the first and second electrodes 245 and 247, and the layers of the light emitting structure 225. The insulating layers 231 and 233 include first and second insulating layers 231 and 233, and the first insulating layer 231 is disposed between the third electrode layer 243 and the second electrode layer 242. The second insulating layer 233 is disposed between the third electrode layer 243 and the first and second electrodes 245 and 247.

The third electrode layer 243 is connected to the first conductive semiconductor layer 222. The connection portion 244 of the third electrode layer 243 protrudes as a via structure through the lower portion of the first and second electrode layers 241 and 242 and the light emitting structure 225 and contacts the first conductive semiconductor layer 222. do. The connection portions 244 may be arranged in plural numbers. A portion 232 of the first insulating layer 231 extends along the recess 226 of the light emitting structure 225 around the connection portion 244 of the third electrode layer 243, and the third electrode layer 243 and blocks the electrical connection between the first and second electrode layers 241 and 242, the second conductive semiconductor layer 224, and the active layer 223. An insulating layer may be disposed on the side of the light emitting structure 225 to protect the side, but this is not limited.

The second electrode 247 is disposed below the second insulating layer 233 and contacts at least one of the first and second electrode layers 241 and 242 through an open area of the second insulating layer 233. becomes or is connected. The first electrode 245 is disposed below the second insulating layer 233 and is connected to the third electrode layer 243 through an open area of the second insulating layer 233. Accordingly, the protrusion 248 of the second electrode 247 is electrically connected to the second conductive semiconductor layer 224 through the first and second electrode layers 241 and 242, and the protrusion 246 of the first electrode 245 ) is electrically connected to the first conductive semiconductor layer 222 through the third electrode layer 243.

FIG. 12 is a plan view of a vehicle to which a vehicle lamp to which a lighting module is applied according to an embodiment is applied, and FIG. 13 is a diagram showing a vehicle lamp to which a lighting module or lighting device is applied according to an embodiment.

12 and 13, in the vehicle 900, the tail light 800 includes a first lamp unit 812, a second lamp unit 814, a third lamp unit 816, and a housing 810. can do. Here, the first lamp unit 812 may be a light source to serve as a turn signal, the second lamp unit 814 may be a light source to serve as a sidelight, and the third lamp unit 816 may be a light source to serve as a brake light. It may be a light source for use, but is not limited thereto. At least one or all of the first to third lamp units 812, 814, and 816 may include the lighting module disclosed in the embodiment. The housing 810 accommodates the first to third lamp units 812, 814, and 816, and may be made of a light-transmissive material. At this time, the housing 810 may have a curve depending on the design of the vehicle body, and the first to third lamp units 812, 814, and 816 may implement a surface light source that may have a curved surface depending on the shape of the housing 810. You can. These vehicle lamps can be applied to a turn signal lamp of a vehicle when the lamp unit is applied to a tail light, brake light, or turn signal lamp of a vehicle.

The lighting device according to the above-described embodiment(s) may be coupled to a vehicle lamp, and, for example, when applied to a vehicle's tail light, brake light, or turn signal lamp, may be applied to a vehicle's turn signal lamp.

The features, structures, effects, etc. described in the embodiments above are included in at least one embodiment of the present invention and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects, etc. illustrated in each embodiment can be combined or modified and implemented in other embodiments by a person with ordinary knowledge in the field to which the embodiments belong. Therefore, contents related to such combinations and modifications should be construed as being included in the scope of the present invention.

In addition, although the above description has been made focusing on the examples, this is only an example and does not limit the present invention, and those skilled in the art will understand the above examples without departing from the essential characteristics of the present embodiment. You will be able to see that various modifications and applications are possible. For example, each component specifically shown in the examples can be modified and implemented. And these variations and differences in application should be construed as being included in the scope of the present invention as defined in the appended claims.

Claims (10)

Board,
a plurality of light emitting devices disposed on a first surface of the substrate;
a resin layer covering the plurality of light emitting devices;
first and second bonding parts disposed on a second side of the substrate; and
It includes first and second connectors connected to each of the first and second bonding parts,
The first and second bonding parts are electrically connected to the plurality of light emitting devices,
Each of the first and second connectors,
a bottom facing the first and second bonding parts;
a support portion protruding from the bottom in a direction away from the second surface of the substrate;
It includes a contact portion protruding from the support portion toward the second surface of the substrate,
The support portion includes first and second supports facing each other,
The bottom portion includes an elastic piece bent from the bottom portion and spaced apart from the second surface of the substrate,
The elastic piece is a lighting module including first and second elastic pieces bent from the bottom on both sides of the support portion and extending in a direction overlapping with the bottom. According to paragraph 1,
The contact part is a lighting module including a first contact part bent outwardly of the first support part and extending in the direction of the substrate, and a second contact part bent in an outward direction of the second support part and extending in the direction of the substrate. According to paragraph 1,
A lighting module wherein the contact portion is spaced apart from the second surface of the substrate and is obliquely bent from the first and second support portions. According to paragraph 2,
The first and second contact portions include third and fourth elastic pieces bent from ends of the first and second support portions. Board;
a plurality of light emitting devices disposed on a first surface of the substrate;
a resin layer covering the plurality of light emitting devices;
first and second bonding parts disposed on a second side of the substrate; and
It includes first and second connectors connected to each of the first and second bonding parts,
The first and second bonding parts are electrically connected to the plurality of light emitting devices,
Each of the first and second connectors,
a bottom facing the first and second bonding parts;
a support portion protruding from the bottom in a direction away from the second surface of the substrate;
It includes a contact portion protruding from the support portion toward the second surface of the substrate,
The support portion includes first and second supports facing each other,
The bottom portion includes an elastic piece bent from the bottom portion and spaced apart from the second surface of the substrate,
It includes first and second upper ends extending in directions adjacent to each other from the ends of the first and second supports, and first and second ends bent from the first and second upper ends toward the substrate,
The first and second ends face each other on a central portion between the first and second supports. According to clause 5,
The contact part is a lighting module including a first contact part bent outwardly of the first support part and extending in the direction of the substrate, and a second contact part bent in an outward direction of the second support part and extending in the direction of the substrate. According to any one of claims 1 to 5,
The first and second connectors are lighting modules formed of a metal frame. According to any one of claims 1 to 5,
The resin layer is a lighting module including a first resin layer molding the light emitting elements, and a second resin layer including phosphor and ink particles on the surface of the first resin layer. A lighting module including a circuit board having a plurality of light emitting elements on a first side and first and second bonding portions on a second side, and first and second connectors disposed on each of the first and second bonding portions; and
A main board having a first through hole through which the first connector passes, a second through hole through which the second connector passes, and first and second electrode pads on a side opposite to the side facing the second side of the circuit board. Includes,
The lighting module includes a first resin layer covering the plurality of light emitting devices, and a second resin layer on the first resin layer,
Each of the first and second connectors,
a bottom facing the first and second bonding parts;
a support portion protruding from the bottom in a direction away from the second surface of the circuit board; and
It includes a contact portion protruding from the support portion toward a second surface of the circuit board,
The contact portions of the first and second connectors contact the first and second electrode pads,
Bottom portions of the first and second connectors are disposed between the second side of the circuit board and the main board,
The support portion includes first and second supports facing each other,
The bottom portion includes an elastic piece bent from the bottom portion and spaced apart from the second surface of the circuit board,
The lighting device includes first and second elastic pieces on both sides of the support portion, where the elastic piece is bent from the bottom portion and extends in a direction that overlaps the bottom portion. According to clause 9,
The contact portion includes a first contact portion bent outward of the first support portion and extending toward the circuit board, and a second contact portion bent toward the outer portion of the second support portion and extending toward the circuit board,
A lighting device wherein the first and second contact portions include third and fourth elastic pieces bent from ends of the first and second support portions.